JPS63140669U - - Google Patents
Info
- Publication number
- JPS63140669U JPS63140669U JP3253087U JP3253087U JPS63140669U JP S63140669 U JPS63140669 U JP S63140669U JP 3253087 U JP3253087 U JP 3253087U JP 3253087 U JP3253087 U JP 3253087U JP S63140669 U JPS63140669 U JP S63140669U
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- conductor patterns
- bonding structure
- conductor
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案による基板の接合構造の実施例
を、接合前の状態にて示す斜視図、第２図は第１
図のＢ―Ｂ断面図、第３図は第２図に示す基板が
接合され半田付けされた状態を示す断面図、第４
図、第５図はその他の実施例を示す断面図、第６
図は基板を接合し熱源を近づけて半田を溶解させ
た状態を示す断面図、第７図は従来の基板の接合
構造を接合前の状態にて示す断面図、第８図は第
７図に示す基板が接合され半田付けされた状態を
示す断面図である。
１１……フレキシブルリード基板、１２，１３
，１４……フレキシブルリード基板の導体パター
ン、１６，２３……半田メツキ、１８……プリン
ト基板、１９，２０，２１……プリント基板の導
体パターン。
FIG. 1 is a perspective view showing an embodiment of the substrate bonding structure according to the present invention in a state before bonding, and FIG.
Figure 3 is a cross-sectional view showing the state in which the boards shown in Figure 2 are joined and soldered;
Figure 5 is a sectional view showing another embodiment, Figure 6 is a sectional view showing another embodiment.
The figure is a cross-sectional view showing the state in which the boards are bonded and the heat source is brought close to melt the solder, Figure 7 is a cross-sectional view showing the conventional board bonding structure before bonding, and Figure 8 is the same as in Figure 7. FIG. 3 is a cross-sectional view showing a state in which the illustrated substrates are joined and soldered. 11...Flexible lead board, 12, 13
, 14... Conductor pattern of flexible lead board, 16, 23... Solder plating, 18... Printed circuit board, 19, 20, 21... Conductor pattern of printed board.
Claims (1)
を開けて形成されており、両基板が重ね合わされ
て両基板の導体パターンどうしが半田付けされて
成る基板の接合構造において、前記導体パターン
には、隣接する導体パターンよりも幅寸法の小さ
いものが含まれていることを特徴とする基板の接
合構造。 In a substrate bonding structure in which a plurality of conductor patterns are formed at intervals on each of a pair of substrates, and the two substrates are overlapped and the conductor patterns on both substrates are soldered to each other, the conductor patterns include: A board bonding structure characterized by including a conductor pattern having a width smaller than that of an adjacent conductor pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3253087U JPS63140669U (en) | 1987-03-05 | 1987-03-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3253087U JPS63140669U (en) | 1987-03-05 | 1987-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63140669U true JPS63140669U (en) | 1988-09-16 |
Family
ID=30839292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3253087U Pending JPS63140669U (en) | 1987-03-05 | 1987-03-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63140669U (en) |
-
1987
- 1987-03-05 JP JP3253087U patent/JPS63140669U/ja active Pending
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