JPS63136532A - 半導体基板熱処理装置 - Google Patents
半導体基板熱処理装置Info
- Publication number
- JPS63136532A JPS63136532A JP28284386A JP28284386A JPS63136532A JP S63136532 A JPS63136532 A JP S63136532A JP 28284386 A JP28284386 A JP 28284386A JP 28284386 A JP28284386 A JP 28284386A JP S63136532 A JPS63136532 A JP S63136532A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- substrate
- hot
- plate
- guide hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000007669 thermal treatment Methods 0.000 title 1
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 239000000428 dust Substances 0.000 abstract description 7
- 239000000725 suspension Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【発明の詳細な説明】
［産業上の利用分野１
本発明は半導体製造工程において、半導体基板の熱処理
を行う半導体基板熱処理装置に関するものて必る。
を行う半導体基板熱処理装置に関するものて必る。
［従来の技術］
従来、このような装置は第３図に示すように、水平にａ
設され湿度コントロールされたプレート１にレール２に
より１（０人された半導体基ｉ反３を該プレート１上に
真空口２から真空引きして真空吸着させ熱処理を行う（
１う造のものである。
設され湿度コントロールされたプレート１にレール２に
より１（０人された半導体基ｉ反３を該プレート１上に
真空口２から真空引きして真空吸着させ熱処理を行う（
１う造のものである。
［発明が解決しようとする問題点］
上述した従来の半導体単板熱処理装置は、プレート］と
半導体基板３か吸着状態で処理されるため、プレート１
上にゴミ、異物か付着していると、半導体基板３の吸着
面に付着し次工稈ての処理に悪影響を与え、ざらにプレ
ート１と基板３の接触によりゴミか発生するという欠点
がある。
半導体基板３か吸着状態で処理されるため、プレート１
上にゴミ、異物か付着していると、半導体基板３の吸着
面に付着し次工稈ての処理に悪影響を与え、ざらにプレ
ート１と基板３の接触によりゴミか発生するという欠点
がある。
本発明の目的は前記問題点を解消し、半導体尺板をプレ
ー［−と非接触で熱処理する半）９体基板熱処理装置を
提供することにある。
ー［−と非接触で熱処理する半）９体基板熱処理装置を
提供することにある。
［問題点を解決するための手段］
本発明は温度コンｌ−ロールされたプレート上に半導体
基板を搭載して該基板の熱処理を行なう半導体基板熱処
理装置において、前記プレートの上面に半導体基板を収
容する基板カイト孔を設け、該単板カイト孔の底部に、
半導体基板を空気圧により浮ｊか保持する熱風の吹出口
を設けたことを特徴とする半導体基板熱処理装置で必る
。
基板を搭載して該基板の熱処理を行なう半導体基板熱処
理装置において、前記プレートの上面に半導体基板を収
容する基板カイト孔を設け、該単板カイト孔の底部に、
半導体基板を空気圧により浮ｊか保持する熱風の吹出口
を設けたことを特徴とする半導体基板熱処理装置で必る
。
［実施例］
次に本発明の一実施例について図面を参照して説明する
。
。
第１図、第２図において、平行に敷設された搬送レール
２に半導体基板３を支持するクランプ４を設け、レール
２．２の間にプレート１を設け、プレート１上にクラン
プ４を受は入れる凹部１ａを設ける。プレー１−１には
内部に複数個の加熱用じ一ター５を埋設し、かつ複数個
の熱風吹出口６を垂設する。さらにプレート１上面に基
板ガイド孔８を設け、該ガイド孔８の底部に前記熱風吹
出口６を開口する。尚、導入口１０から取入れた気体を
プレート１内に設けられた温度制御室ってヒーター５に
より加熱湿度コントロールし、これを熱風として熱風吹
出口６から吹き出す。
２に半導体基板３を支持するクランプ４を設け、レール
２．２の間にプレート１を設け、プレート１上にクラン
プ４を受は入れる凹部１ａを設ける。プレー１−１には
内部に複数個の加熱用じ一ター５を埋設し、かつ複数個
の熱風吹出口６を垂設する。さらにプレート１上面に基
板ガイド孔８を設け、該ガイド孔８の底部に前記熱風吹
出口６を開口する。尚、導入口１０から取入れた気体を
プレート１内に設けられた温度制御室ってヒーター５に
より加熱湿度コントロールし、これを熱風として熱風吹
出口６から吹き出す。
実施例におい一〇、塁板３が搬送レール２にてａ。
ｂ方向に移送され基板ガイド孔８にセットされる。
第２図に示すように熱風吹出口６からはあらかじめ温度
制御された必要量の熱風を吹出して基板３を浮選さぜる
。
制御された必要量の熱風を吹出して基板３を浮選さぜる
。
以上の説明から明らかなように基板３はプレー１へ１と
非接触の状態で熱処理されるために塞板裏面へのゴミ付
着がなく、接触によるゴミの発生もなくなる。
非接触の状態で熱処理されるために塞板裏面へのゴミ付
着がなく、接触によるゴミの発生もなくなる。
［発明の効果］
以上説明したように本発明は半導体種板をプレーＩ・よ
り浮遊させて熱処理する＠造としたため、半導体基板へ
のゴミ、異物の付着をなくし、さらに接触によるゴミの
発生もなくすことができる効果を有するものでおる。
り浮遊させて熱処理する＠造としたため、半導体基板へ
のゴミ、異物の付着をなくし、さらに接触によるゴミの
発生もなくすことができる効果を有するものでおる。
第１図（ａ）は本発明の一実施例を示す平面図、（ｂ）
は同断面図、第２図は第１図の拡大断面図、第３図（ａ
）は従来装置の平面図、（ｂ）は同断面図である。 １・・・プレート、２・・・レール、３・・・半導体基
板、４・・・クランプ、５・・・ヒーター、６・・・熱
風吹出口、８・・・基板ガイド孔 特許出願人 九州日本電気株式会社 第１図 （ｂ） 第１図 （ａ＞ （ｂ） 第３図
は同断面図、第２図は第１図の拡大断面図、第３図（ａ
）は従来装置の平面図、（ｂ）は同断面図である。 １・・・プレート、２・・・レール、３・・・半導体基
板、４・・・クランプ、５・・・ヒーター、６・・・熱
風吹出口、８・・・基板ガイド孔 特許出願人 九州日本電気株式会社 第１図 （ｂ） 第１図 （ａ＞ （ｂ） 第３図
Claims (1)
- （１）温度コントロールされたプレート上に半導体基板
を搭載して該基板の熱処理を行なう半導体基板熱処理装
置において、前記プレートの上面に半導体基板を収容す
る基板ガイド孔を設け、該基板ガイド孔の底部に、半導
体基板を空気圧により浮遊保持する熱風の吹出口を設け
たことを特徴とする半導体基板熱処理装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28284386A JPS63136532A (ja) | 1986-11-27 | 1986-11-27 | 半導体基板熱処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28284386A JPS63136532A (ja) | 1986-11-27 | 1986-11-27 | 半導体基板熱処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63136532A true JPS63136532A (ja) | 1988-06-08 |
Family
ID=17657792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28284386A Pending JPS63136532A (ja) | 1986-11-27 | 1986-11-27 | 半導体基板熱処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63136532A (ja) |
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