JPS63106788A - Manufacture of active matrix driven-type device - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention uses an active matrix array substrate in which a large number of active elements such as switching elements are arranged in a matrix on an insulating substrate. The present invention relates to a method of manufacturing an active matrix drive type device that drives a driven material such as F4 (EL material F4) or sequentially scans a sensor material (for example, a photoelectric conversion material).

Thin film transistor (TPT) as an active element below conventional technology
A method for manufacturing a liquid crystal display device in which a liquid crystal material is driven using an active matrix array substrate having the following will be described as an example.

FIG. 5 is an explanatory diagram of a conventional active matrix array substrate used for manufacturing a liquid crystal display device. 100 is a light-transmitting insulating substrate, 101 is a first wiring, 10
2 is the second wiring. Reference numeral 501 denotes TPT, which is connected to the first wiring and the second wiring, and has a transparent pixel electrode 5.
00 and a capacitor 502 (this is a 4×6 matrix for explanatory purposes, but in an actual TV display, tens of thousands to hundreds of thousands of pixel electrodes are fabricated). The capacitor 502 is also connected to a common electrode distribution uA105 that extends over the entire image display section (area surrounded by a broken line EFGH). Reference numerals 111, 112, and 115 are external connection terminals for connecting the first wiring, the second wiring, and the common electrode wiring to circuits outside the substrate, respectively.

Then, the two substrates, the active matrix array substrate and the counter substrate with counter electrodes shown in FIG. After that, liquid crystal is sealed in the gap between the substrates, and the substrate 100 is placed along the broken line ABCD.
A liquid crystal display device is manufactured by cutting the film, attaching a polarizing plate, and connecting external connection terminals to an external drive circuit. When manufacturing a liquid crystal display device using an active matrix array substrate in this way, defects may occur due to static electricity generated during the process (a phenomenon in which TFTs are destroyed by static electricity or their characteristics change, resulting in image defects). There is.

Therefore, the active matrix array substrate shown in FIG. 5 has been devised to suppress the occurrence of defects due to static electricity that occurs during the manufacturing process of a liquid crystal display device. That is, by providing the interconnection wiring 506 that connects the external connection terminals 111 and 112 with each other, static electricity applied from the outside is dispersed to a large number of wirings, and the substrate 100 is cut along the broken line ABCD to connect the first wiring. and the second wiring 1
The occurrence of defects due to static electricity can be suppressed until the books are separated one by one. (For the above configuration, for example,
(See Japanese Patent No. 885'57) Problems to be Solved by the Invention If a break occurs in the first wiring or the second wiring, a defective image will result. Therefore, from the viewpoint of productivity and cost, it is important to inspect the active matrix array substrate alone for disconnections and to screen out defective substrates before assembling a liquid crystal display device. However, in a conventional active matrix array board with anti-static measures as shown in FIG. tfA101 and second wiring 10
Continuity testing is carried out by touching each of the two ends of each wire with the test needle of the testing device, and this testing device has high accuracy and reliability to accurately test a large number of wires with a long testing time. Rather, the time and cost required for inspection are increased, and the merit of screening out defective boards is diminished. Furthermore, in FIG. 5, the wiring 506 is only connected to one side of the wiring 101 and 102 in order to conduct a continuity test.
However, if adjacent wires are connected at both ends of the wires 101 and 102 to make them more resistant to static electricity, it would be impossible to inspect for disconnection.

Further, in the configuration shown in FIG. 5, the first wiring 101 and the second wiring 1
Even if there is a short circuit between 02 and 02, it cannot be detected by prior electrical inspection.

That is, there is a problem in that if the special measures against static electricity shown in FIG. 5 are taken, defective boards cannot be selected by electrical inspection.

In addition, with regard to static electricity countermeasures, with conventional methods, there is no protection against static electricity from the time the board is cut until the connection to the external circuit is completed. In particular, if a method involving mechanical contact such as a diamond cutter is used for the cutting operation, the cutting operation itself generates static electricity, causing defects, and countermeasures against static electricity when cutting the substrate become a problem.

Furthermore, in actual production, it is more advantageous in terms of material cost and productivity to create multiple active matrix arrays on one substrate and then cut and separate them to produce a large number of active matrix array substrates at once. There are many things like that. In this case, orientation treatment (surface treatment) is performed after cutting the substrate.
Then, the bonding work with the opposing substrate is performed. This process involves issues such as rubbing, which is commonly used as an alignment treatment, printing of bonding material (adhesive) for bonding opposing substrates together, encapsulation of liquid crystals, cleaning associated with these processes, and countermeasures against static electricity during storage. Therefore, if you leave the interconnection wiring 506 for static electricity countermeasures at the time of initial cutting,
After the above operations, it becomes necessary to cut the substrate again, which increases the number of steps.

In view of the above points, the present invention makes it possible to easily perform disconnection inspection and short circuit inspection while taking measures against static electricity.Furthermore, it enables static electricity measures to remain even after cutting the board, and takes static electricity measures independently of cutting the board. The purpose of the present invention is to improve productivity (yield, throughput, etc.) and reduce costs by creating a configuration that can release the active matrix array substrate. Below, in Fig. 5, the area outside the broken line EFGH and the broken line ABCD
(hereinafter referred to as the inner region of Among the ends of the two first wirings, the end part on the side that is not connected by the third wiring is connected by a fourth wiring via a non-linear element such as a diode or a transistor, and the same is done. The second wiring has the same configuration as the first wiring, and in addition to this, an active matrix is used that allows the third wiring and fourth wiring to be cut and separated by etching at any time independently of cutting the substrate. The method involves creating an array substrate and using it to manufacture a liquid crystal display device.

Operation When performing production using an active matrix array substrate to which the above technical means of the present invention has been applied, current will not flow through the fourth wiring unless a voltage equal to or higher than a threshold is applied to the nonlinear element connected thereto.

Therefore, since the wiring group made up of the first wiring is one long wiring that is continuously meandered by the third wiring, the inspection needle of the inspection device is contacted only once to both ends of this wiring, and the voltage below the threshold value is If you perform a continuity test, you can complete the disconnection test for hundreds of wires at once. Of course, the second wiring can also be inspected for disconnection all at once. In addition, in response to the inflow of high voltage charges such as static electricity, a voltage higher than the threshold is applied to the non-linear element connected to the fourth wiring, and current also flows to the fourth wiring via the non-linear element. Because of the flow, the large electric charges are quickly dispersed over the entire substrate, making it difficult for the TPT for image display to be destroyed or to have its characteristics fluctuated. In other words, it is possible to perform a simultaneous disconnection inspection of the first wiring and the second wiring even when static electricity countermeasures have been taken, and furthermore, the connection between the wiring for static electricity countermeasures can be left independent of the cutting of the board. Since static electricity countermeasures can be removed at any time through a relatively simple etching process, you can freely perform board cutting, surface treatment, or bonding with other parts without worrying about static electricity, which can lead to defects caused by static electricity. It becomes possible to provide a flexible manufacturing process that reduces costs and improves productivity while suppressing production costs.

Embodiments Hereinafter, embodiments of the present invention will be explained with reference to the drawings. FIG. 1 shows an active matrix array substrate used in a first embodiment of the present invention. 100 is an insulating substrate;
The first wiring 101 and the second wiring 102 are made of an insulating thin film (
(not shown). Also, the broken line EF
The image display section surrounded by GH has exactly the same configuration as that shown in FIG. 5, and has TFTs as active elements arranged in a matrix near the intersection of the first wiring and the second wiring. The gate electrode of the TPT is connected to the first wiring 101, the source electrode is connected to the second wiring 102, the drain electrode is connected to the pixel electrode and a capacitor for signal storage, and the capacitor is also connected to the common electrode wiring 105. ing. A wiring group of four first wirings is connected to a third wiring tJI 10 on the outer periphery of the active matrix array substrate.
3 and the fourth wiring 1 via the diode 107
They are alternately connected by connections according to ゜4. Reference numeral 106 indicates a portion for cutting the third wiring and the fourth wiring by etching at an arbitrary point after cutting the substrate.

Note that two diodes having a positive voltage threshold are connected in series and used as a ring diode. 111a and 111b are external connection terminals for connecting the first wiring to an external circuit, and if you apply a test needle to these and conduct a continuity test with a voltage below the threshold of the diode 107, the first wiring 111a-a if there is no disconnection in
-b-c-d-e-f Since current flows through the path of g h-111b, by checking this conduction state, it becomes possible to perform a simultaneous disconnection test for the four wiring groups. Similarly, the wiring group of the six second wirings has external connection terminals 112a and 112b.
By inspecting the continuity state between the wires, it is possible to perform a simultaneous disconnection test.

Fig. 2 shows the fourth diode via the ring diode in Fig. 1.
The arrangement! The configuration of fjA104 will be explained. Second
In Figure (a), 101 is a first wiring, 107 is a diode, and 106 is a portion for cutting the wiring by etching at an arbitrary point after cutting the substrate. Figure 2 (b
) is an actual plan view of a portion corresponding to FIG. 2(a). Figures 2(c) and 2(d) are respectively shown in Figure 2(b).
) is a sectional view taken along the An line and the CD line. 100 is an insulating substrate, and in this case a glass substrate is used. The main parts of the first wiring 101 and the fourth wiring (portions other than the diodes) are formed simultaneously using CryVJJIQ. 201 is SiNx thin film and TI? M! between the gate insulating film of T and the first wiring and the second wiring! It is used for edges. 202 is an amorphous silicon thin film T
It is used as a semiconductor layer for PT. Reference numeral 203 denotes the source/drain electrodes of the TPT made of a material (for example, AI) different from the material of the fourth wiring, Cr, and these form the TPT in the amorphous silicon mJIQ 202 part along with the gate electrode made of the Cr thin film. (FIG. 2(d) is a cross-sectional view of the TPT, which is formed at the same time as the TPT of the image display section). And T
A diode 107 is realized by connecting the gate electrode of PT and the source 7FL (fi. In this case, the source/drain electrode 203 is made of the same material as the second wiring and is formed at the same time. The SiNx thin film 201 at the 106th section is selectively removed to expose a part of the fourth wiring.With this configuration, a connection is formed by the fourth wiring via the link diode. The connection by wiring is also formed in a configuration in which the diodes in Fig. 2 are omitted.When the active matrix array substrate with the above configuration is immersed in a Cr etching solution, 106 parts of the Cr wiring are exposed. Only the melt is removed, and the connection between adjacent first or second wires can be easily separated at any time by etching.

Therefore, when manufacturing a liquid crystal display device using the active matrix display substrate shown in Fig. 1, although it is possible to inspect for disconnections all at once, it is difficult to prevent charges from flowing in from the outside at high voltages due to static electricity. is quickly dispersed over the entire substrate, making it difficult for the TPT of the image display section to be destroyed or its characteristics to fluctuate.

Then, after cutting the substrate, aligning it (surface treatment), bonding it to the counter substrate, and sealing the liquid crystal, an electrical short circuit between the third wiring and the fourth wiring is connected at any time to prevent static electricity. It is also possible to separate the film by etching, providing a flexible manufacturing process that is less prone to electrostatic damage. Note that in the configuration of this embodiment, the connection by the third wiring 103 and the fourth wiring via the diode 107 are connected.
No extra 9 film formation and patterning were performed to form the 104 connection, and the additional steps compared to the case where no static electricity countermeasures were taken were etching to cut the 3rd and 4th wiring. This is an extremely effective method, as it only involves cleaning associated with the process, and although static electricity countermeasures are taken, the increase in the number of cleaning steps in the overall manufacturing of liquid crystal display devices is very small.

Next, a second embodiment of the present invention will be described.

FIG. 3 shows an active matrix array substrate used in the second embodiment. The configuration of the image display section surrounded by the broken 11JEFGt1 section is exactly the same as that of the first embodiment, but a fourth arrangement via a ring diode is provided at the outer periphery of the active matrix array substrate. The connections made by the A104 are connected not only between adjacent wires, but also to the wires 300 that are routed around the entire board, resulting in a configuration in which static electricity is more quickly dispersed. (Note that the wiring 300 is between the common electrode wiring 05
), and in this example, the first
The wiring 101 and the second wiring ftjA 102 are also connected to the fourth wiring 104 via a ring diode! 1Ji300
Even if charge flows in from the outside, if a voltage difference of more than twice the threshold of the diode occurs between the first wiring and the second wiring, current will flow immediately and the image will be connected. The structure is such that electrostatic damage due to the potential difference between the gate electrode (connected to the first wiring) and source electrode (connected to the second wiring) of the TPT in the display section is extremely unlikely to occur. .

Therefore, even when manufacturing a liquid crystal display device using the active matrix array substrate shown in Fig. 3, it is possible to inspect for disconnections all at once, but the charges flowing in from the outside are quickly dispersed throughout the substrate, and the active elements due to static electricity are Destruction and changes in properties are less likely to occur. In addition, it is possible to separate the electrical short circuit between the third wiring and the m4 wiring by etching at any time independently of cutting the board, and as in the first embodiment, it is possible to remove the electrical short circuit between the third wiring and the m4 wiring. We can provide the manufacturing process.

Next, a third embodiment of the present invention will be described.

FIG. 4 shows an active matrix array substrate used in the third embodiment. The configuration of the image display section surrounded by the broken line EFGH is exactly the same as that of the first embodiment.
At the outer periphery of the active matrix array substrate,
A wiring group of four first wirings 101, a wiring group of six second wirings 102, and a common electrode wiring UA 105 are connected to each other through a ring diode to form a fourth wiring 104.
b, 104c, and 104d (however, 104b, 104c, and 104d are actually composed of n stages of link diodes in series; this is the connection between the first wiring and the second wiring). This is to reduce the voltage applied to the ring diode per stage and ensure reliable inspection when inspecting short circuits between the common electrode wiring and common electrode wiring (short circuits will result in poor images). In this case as well, a voltage of more than one time the threshold of the diode is not applied between the gate electrode and the source electrode of the TPT in the image display section, making it difficult for electrostatic breakdown to occur between the gate electrode and the source electrode. Therefore, when manufacturing a liquid crystal display device using the active matrix array substrate shown in FIG. 4, it is possible to select defective substrates by performing a batch inspection for disconnections and short circuits, but it is also possible to quickly dispose of charges flowing in from outside. It is dispersed throughout the board, making it difficult for active elements to be destroyed or their characteristics to fluctuate due to static electricity. Further, it becomes possible to separate the electrical short circuit between the third wiring and the fourth wiring by etching at any time independently of cutting the substrate, and it is possible to provide a flexible manufacturing process in which electrostatic damage is less likely to occur.

In addition, in the above three embodiments of the present invention, the first wiring 101 and the second wiring 102 are expressed as 10 in total for the sake of explanation, but in reality, an active matrix having several 100 to several 1000 wirings is used. In principle, exactly the same thing can be done for the array substrate. In addition, in the above example of the third can, there is no first wiring, second wiring, or wiring material connected to them on the cutting line ABCD, so the wiring is directly connected to the cutter used to cut the board, or to the carrier or container that holds the board after cutting. The probability of material contact is much smaller than in conventional cases.
Electrostatic damage from cutters, jigs, and containers is also reduced.

Effects of the Invention As described above, by using the active matrix array substrate of the present invention, it is possible to inspect for disconnections at any point independent of the cutting of the substrate, while also preventing damage to active elements due to static electricity and changes in characteristics. It also reduces the occurrence of fluctuations, suppresses the occurrence of defects caused by static electricity, reduces costs, and improves productivity, making it extremely effective in practical terms.

In addition, in the above three embodiments of the present invention, when only one active matrix array substrate is made from one substrate, the outside of the cutting line ABCD is not related to the liquid crystal display device to be realized, so cutting the substrate is not necessary. There is no problem even if the cutting operation is not performed at all, and in this case, the cutting operation can be omitted and the process can be simplified.

[Brief explanation of the drawing]

FIG. 1 is a plan view of the main parts of an active matrix array substrate according to the first embodiment of the present invention, and FIG. 2 is an explanation of the connection by the fourth wiring via the ring diode between the first wirings in FIG. 1. FIG. 2(a) is a circuit diagram, FIG. 2(b) is a plan view of the main part, and FIG. 2(c) and FIG. 2(d) are the AB line of FIG. and cross-sectional view along CD line, 3rd
The figure is a plan view of main parts of an active matrix array substrate of a second embodiment, FIG. 4 is a plan view of main parts of an active matrix array substrate of a third embodiment, and FIG. 5 is a main part of a conventional active matrix array substrate. FIG. 100... Substrate, 101... First wiring, 102...
...Second wiring, 103...Third wiring, 104...
・Fourth wiring, 105... Common electrode wiring, 107...
·diode. Name of agent: Patent attorney Toshio Nakao Idiot 1 figure 2 (his) 恢ku':J'*5 UM,.

Claims (7)

[Claims] (1) It has a plurality of first wirings and a plurality of second wirings intersecting with each other via an insulating layer, and is electrically connected to the first wiring and the second wiring. Active elements are arranged in a matrix, and adjacent wires of a group of wires belonging to the first wire or the second wire are connected to each other by a third wire or via a non-linear element near the end of the wire. using an active matrix array substrate configured such that the wires are connected to each other by a fourth wire connected to each other, and the wire group is made into a continuous meandering wire by a connection by the third wire; Cutting work, surface treatment work, or joining work with other parts is performed on the material, and then the connection by the third wiring and the connection by the fourth wiring via the non-linear element are separated by etching. A method of manufacturing a featured active matrix drive type device. (2) After forming the third wiring and the fourth wiring, an insulating layer is formed, and then the insulating layer is selectively formed so that at least a portion of the third wiring and the fourth wiring is exposed. Using an active matrix array substrate of the configuration,
Claim 1, characterized in that the connection by the third wiring and the connection by the fourth wiring via the non-linear element are separated by removing the material of the exposed portion of the wiring by etching. A method for manufacturing an active matrix driven device as described in . (3) It is characterized by using an active matrix array substrate in which the portions of the third wiring and the fourth wiring excluding the non-linear elements are formed simultaneously with either the first wiring or the second wiring. A method of manufacturing an active matrix drive type device according to claim 1. (4) Claim 1, characterized in that an active matrix array substrate is used in which the first wiring and the second wiring are connected by a fourth wiring via a non-linear element.
A method for manufacturing an active matrix driven device as described in . (5) A common electrode wiring is connected to the active element via a capacitor, and the common electrode wiring and the first wiring or the common electrode wiring and the second wiring are connected by a third wiring, or The method of manufacturing an active matrix drive type device according to claim 1, characterized in that an active matrix array substrate connected by a fourth wiring via a non-linear element is used. (6) A method of manufacturing an active matrix drive type device according to claim 1, characterized in that an active matrix array substrate is used in which the fourth wiring via a non-linear element is wiring via a diode. (7) The method for manufacturing an active matrix drive type device according to claim 6, wherein the fourth wiring through a diode is wiring through a ring diode.