JPS6262073A - Device for controlling temperature of poppet valve - Google Patents
Device for controlling temperature of poppet valveInfo
- Publication number
- JPS6262073A JPS6262073A JP19947485A JP19947485A JPS6262073A JP S6262073 A JPS6262073 A JP S6262073A JP 19947485 A JP19947485 A JP 19947485A JP 19947485 A JP19947485 A JP 19947485A JP S6262073 A JPS6262073 A JP S6262073A
- Authority
- JP
- Japan
- Prior art keywords
- piston
- hollow chamber
- valve
- temperature
- poppet valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lift Valve (AREA)
- Temperature-Responsive Valves (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は内燃機関の排気部や高温配管の絞り部などに用
いられるポペット弁に係り、特にポペット弁に中空室を
形成し、その中空室内に冷媒を封入してポペット弁の温
度を制御するポペット弁の温度制御装置に関するもので
ある。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a poppet valve used in the exhaust section of an internal combustion engine or the throttle section of high-temperature piping, and in particular, a hollow chamber is formed in the poppet valve, and The present invention relates to a poppet valve temperature control device that controls the temperature of the poppet valve by sealing a refrigerant into the poppet valve.
［従来の技術］
従来、内燃機関に使用されるポペット弁は燃焼排ガスに
より加熱されるため、ポペット弁内に中空室を形成し、
その中空室内に゛冷媒を封入し、ボベツ１〜弁へΩ入熱
により蒸発した冷媒を冷却器（凝縮器）で冷却し、凝縮
した冷媒を中空室内に戻してポペット弁の温度上昇を防
止している。 −
この液体封入式のポペット弁の温度調節は、冷却器の冷
却水の流量や水温などを調節することによって行ってい
る。[Prior Art] Conventionally, poppet valves used in internal combustion engines are heated by combustion exhaust gas, so a hollow chamber is formed inside the poppet valve.
A refrigerant is sealed in the hollow chamber, and the refrigerant evaporated by Ω heat input to the poppet valve is cooled by a cooler (condenser), and the condensed refrigerant is returned to the hollow chamber to prevent the temperature of the poppet valve from rising. ing. - The temperature of this liquid-filled poppet valve is controlled by adjusting the flow rate and water temperature of the cooling water in the cooler.
［発明が解決しようとする問題点］
しかしながら、冷却器の冷却能力はもともと大きく、そ
の流聞や温度などを大巾に変えても冷媒（封入液）の湿
度はほとんど変えることはできず、冷却過大となり、ポ
ペット弁は低温腐食を起こしたり、冷却による熱応力の
過大を招くことに八り°易い。[Problems to be solved by the invention] However, the cooling capacity of the cooler is originally large, and even if the temperature or other factors are changed drastically, the humidity of the refrigerant (filled liquid) can hardly be changed. If it becomes too large, the poppet valve is likely to suffer from low-temperature corrosion or excessive thermal stress due to cooling.
［発明の目的］
本発明は、上記事情を考慮してなされたもので、入熱変
動などに応じてポペット弁の温度を一定に保つことがで
きるポペット弁の温度制御装置を提供することを目的と
する。[Object of the Invention] The present invention was made in consideration of the above circumstances, and an object of the present invention is to provide a temperature control device for a poppet valve that can maintain a constant temperature of the poppet valve in response to fluctuations in heat input, etc. shall be.
［発明の概ｇ５］
本発明は、上記の目的を達成するために、ボペット弁に
冷媒を封入する中空室を形成し、そのボベツ１−弁に、
中空室内の容積を可変にするピストンを設けたもので、
入熱の変動によりピストンを動かし、その中空室内の容
積を変えて中空室内の圧力を変え、その冷媒の蒸発温度
を制御することで、ポペット弁の温度を一定に制御でき
るようにしたものである。 ゛
［実施例］
以下本発明に係るポペット弁の温度制御装置の好適一実
施例を添付図面に基づいて説明する。[Summary of the invention g5] In order to achieve the above object, the present invention forms a hollow chamber in which a refrigerant is sealed in a boppet valve, and in the boppet valve,
It is equipped with a piston that changes the volume inside the hollow chamber.
The temperature of the poppet valve can be controlled at a constant level by moving the piston based on changes in heat input, changing the volume within the hollow chamber, changing the pressure within the hollow chamber, and controlling the evaporation temperature of the refrigerant. . [Embodiment] A preferred embodiment of the poppet valve temperature control device according to the present invention will be described below with reference to the accompanying drawings.
第１図はポペット弁１の弁棒２の案内筒３で冷却する場
合を示し、ポペット弁１に冷媒液４を封入する中空ｖ５
が形成される。中空室５は、弁傘部６から弁棒２の下部
にかけて冷媒液４を貯溜する液部５ａと、その液部５ａ
から蒸発４ｂＬ、た冷媒ガスを冷却し、凝縮液４ａとし
て液部５ａに戻す蒸気部５ｂとから構成される。またこ
の弁棒２下部の中空室５には、遮熱管７が設けられる。FIG. 1 shows the case where the valve stem 2 of the poppet valve 1 is cooled by the guide tube 3, and the poppet valve 1 has a hollow v5 in which the refrigerant liquid 4 is sealed.
is formed. The hollow chamber 5 includes a liquid part 5a that stores the refrigerant liquid 4 from the valve head part 6 to the lower part of the valve stem 2, and the liquid part 5a.
and a vapor section 5b which cools the refrigerant gas and returns it to the liquid section 5a as condensed liquid 4a. Further, a heat shielding pipe 7 is provided in the hollow chamber 5 below the valve stem 2 .
弁棒２の外周は冷却器となる弁棒案内筒３により摺動自
在に設けられ、その案内筒３内に冷却水８が供給され、
中空室５の蒸気部５ｂの蒸発冷媒が冷却されるようにな
っている。また案内筒３の上部には・ポペット弁１を揺
動させる動弁部９が設けられる。The outer periphery of the valve stem 2 is slidably provided by a valve stem guide tube 3 serving as a cooler, and cooling water 8 is supplied into the guide tube 3.
The evaporative refrigerant in the vapor section 5b of the hollow chamber 5 is cooled. Further, a valve operating section 9 for swinging the poppet valve 1 is provided at the upper part of the guide tube 3.
弁棒２の上部は開口され、そこにシールリング１０を介
してピストン１１が挿入される。ピストン１１の上部は
、連結棒１２を介してダイヤフラム１３に接続され、そ
のダイヤフラム１３が支持部材１４を介して固定部１５
に固定され、ダイヤフラム１３により図示の２点鎖線１
１ａまでピストン１１が移動されるようになっている。The upper part of the valve stem 2 is opened, and a piston 11 is inserted therein via a seal ring 10. The upper part of the piston 11 is connected to a diaphragm 13 via a connecting rod 12, and the diaphragm 13 is connected to a fixed part 15 via a support member 14.
, and the diaphragm 13 connects the two-dot chain line 1 shown in the figure.
The piston 11 is moved up to 1a.
ダイヤフラム１３は、そのダイヤフラム１３内に空気を
供給−してダイヤフラム１３を空気圧力で最大、図示の
２点鎖１１３ａまで伸長させるための加圧電磁弁Ｖ１が
接続されると共にそのダイヤフラム１３内の空気を抜く
ための減圧電磁弁ｖ２が接続される。The diaphragm 13 is connected to a pressurizing solenoid valve V1 for supplying air into the diaphragm 13 to extend the diaphragm 13 with air pressure to a maximum of the two-point chain 113a shown in the figure. A pressure reducing solenoid valve v2 for removing the air is connected.
ピストン１０は中空に形成され、その内に冷却水１６を
供給する給水弁Ｖ３が接続され、またピストン１０内の
冷却水１６を排水するための排水弁Ｖ４が接続される。The piston 10 is formed hollow, and a water supply valve V3 for supplying cooling water 16 is connected therein, and a drain valve V4 for draining the cooling water 16 inside the piston 10 is connected therein.
またピストン１０内には中空室５内に冷媒液４を供給す
るための冷媒補給管１７が設けられ、その冷媒補給管１
７に、冷媒を供給する補給弁Ｖ５及び中空室５内の蒸発
冷媒や空気を抜き取るための放出弁■６が接続される。Further, a refrigerant supply pipe 17 for supplying refrigerant liquid 4 into the hollow chamber 5 is provided in the piston 10, and the refrigerant supply pipe 1
7 is connected to a replenishment valve V5 for supplying refrigerant and a discharge valve V6 for removing evaporated refrigerant and air from the hollow chamber 5.
またピストン１０の下部には中空室５内の圧力と温度を
検出する圧力・温度センサ１８が設けられ、その検出出
力１９が制御装Ｒ２０に入力されるようになっている。Further, a pressure/temperature sensor 18 for detecting the pressure and temperature inside the hollow chamber 5 is provided at the lower part of the piston 10, and its detection output 19 is inputted to the control device R20.
制御装置２０には内燃機関の燃料ラック位置（燃料供給
量）し１回転数Ｎ及び燃焼ガス温度Ｈが入力され、また
ポペット弁１の弁傘部６の例えば弁フエース部６ａに設
けた温度検出器２１の検出出力Ｔ−Ｔが入力され、これ
ら各入力値に基づいて制御装＠２０が加圧電磁弁■１及
び減圧電磁弁ｖ２を開閉制御してダイヤフラム１３の伸
縮長さを制御し、ピストン１１の位置を制御すると共に
合弁Ｖ３〜ｖ６を制御するようになっている。The fuel rack position (fuel supply amount) of the internal combustion engine, the number of revolutions N, and the combustion gas temperature H are input to the control device 20, and the control device 20 also receives temperature detection information provided on the valve face portion 6a of the valve head portion 6 of the poppet valve 1, for example. The detection output T-T of the diaphragm 21 is input, and based on these input values, the control device @20 controls the opening and closing of the pressurizing solenoid valve 1 and the pressure reducing solenoid valve v2 to control the expansion and contraction length of the diaphragm 13, It controls the position of the piston 11 and the joint valves V3 to V6.
次に本発明の詳細な説明する。Next, the present invention will be explained in detail.
制御装置２ｏには、内燃機関の燃料ラック位置り９回転
数Ｎ及び燃焼ガス温度Ｈが入力されると共に中空室５内
の圧力及び温度が圧力・温度センサ１８よ−り入力され
、これら入力により制御装置２０が加圧電磁弁ｖ１及び
減圧電磁弁ｖ２を開閉してダイヤフラム１３を適宜伸縮
させピストン１１の位置を調整し、中空室５内の圧力（
容積）を制御することで、そのポペット弁１の温度を制
御する。The fuel rack position 9 rotation speed N and combustion gas temperature H of the internal combustion engine are input to the control device 2o, and the pressure and temperature inside the hollow chamber 5 are also input from the pressure/temperature sensor 18. The control device 20 opens and closes the pressurizing solenoid valve v1 and the pressure reducing solenoid valve v2, expands and contracts the diaphragm 13 as appropriate, adjusts the position of the piston 11, and adjusts the pressure in the hollow chamber 5 (
By controlling the volume (volume), the temperature of the poppet valve 1 is controlled.
すなわち制御装置２０内には燃料ラック位置し。That is, a fuel rack is located within the control device 20.
回転数Ｎ、ガス温度Ｈに対応した中空室５内の圧力、湿
度′などが予め記憶されており、これら値と検出した圧
力・温度を比較し、その大小によってピストン１１を押
し下げて中空室５内の圧力を高めるか、ピストン１１を
上昇させて圧力を低くするかしてその中空室５内の圧力
を制御して冷媒の蒸発温度を制御することでポペット弁
１の温度制御を行う。この場合、弁傘部６の温度検出器
２１よりの検出温度により、制御装置２０が予め記憶し
ていた最適温度（ＴＯ）と直接比較して中空室５内の圧
力を制御するようにしてもよい。The pressure, humidity, etc. in the hollow chamber 5 corresponding to the rotational speed N and the gas temperature H are stored in advance, and these values are compared with the detected pressure and temperature, and depending on the magnitude, the piston 11 is pushed down and the hollow chamber 5 is The temperature of the poppet valve 1 is controlled by increasing the pressure inside the hollow chamber 5 or lowering the pressure by raising the piston 11 to control the pressure inside the hollow chamber 5 and control the evaporation temperature of the refrigerant. In this case, the pressure inside the hollow chamber 5 may be controlled by directly comparing the temperature detected by the temperature detector 21 of the valve head portion 6 with the optimum temperature (TO) stored in advance in the control device 20. good.
このように中空室５内の圧力を制御することで、すなわ
ち、中空室５の圧力を高めると冷媒の蒸発温度を高くで
き、その分ボベツ１〜弁１の温度を高くでき、また圧力
を低くすれば蒸発温度が下がり、ポペット弁１の温度を
低くすることができる。By controlling the pressure in the hollow chamber 5 in this way, that is, by increasing the pressure in the hollow chamber 5, the evaporation temperature of the refrigerant can be increased, the temperature of the valve 1 to the valve 1 can be increased accordingly, and the pressure can be lowered. This will lower the evaporation temperature and lower the temperature of the poppet valve 1.
また制御装置２０は他の電磁弁■３〜Ｖ６を開閉制御し
、ピストン１１内の冷却氷山を制御すると共に中空室５
内へ封入する冷媒通や中空室５内の空気や冷媒を抜くよ
うになっている。In addition, the control device 20 controls the opening and closing of other solenoid valves 3 to V6 to control the cooling iceberg in the piston 11 and also controls the cooling iceberg in the hollow chamber 5.
The refrigerant sealed therein is passed through and the air and refrigerant in the hollow chamber 5 are vented.
第２図は本発明の他の実施例を示すもので、ピストン１
１の下部に、中空室５内の冷媒を冷却するフィン付冷却
管２２を一体に接続したものである。FIG. 2 shows another embodiment of the present invention, in which a piston 1
A finned cooling pipe 22 for cooling the refrigerant in the hollow chamber 5 is integrally connected to the lower part of the hollow chamber 5.
本例においてはピストン１１の上部にネジボックス２３
を接続し、そのネジボックス２３を固定部１５に対して
回転しないようかつ上下摺動自在に設け、ネジボックス
２３に、ネジ２４を螺合すると共にそのネジ２４を固定
台２５に取り付けたモータ２６に連結し、モータ２６の
回転でピストン１１を昇降させるようにしたものである
。In this example, a screw box 23 is provided on the top of the piston 11.
A motor 26 is connected to the screw box 23, and the screw box 23 is provided so as not to rotate with respect to the fixing part 15 but can be slid up and down, and a screw 24 is screwed into the screw box 23, and the screw 24 is attached to the fixing base 25. The piston 11 is raised and lowered by the rotation of the motor 26.
また図には示していないが、ピストン１１内に給水する
給水管２７には給水弁が接続され、その排水管２８には
排水弁が接続され、夫々制御装置２０により開閉制御さ
れるようになっている。Although not shown in the figure, a water supply valve is connected to the water supply pipe 27 that supplies water into the piston 11, and a drain valve is connected to the drain pipe 28, and the opening and closing of these valves are controlled by the control device 20. ing.
またピストン１１内には、給水管２７からの冷却水が排
水管２８に直接流れ出さないよう仕切板２９が設けられ
、冷却水が図示の矢印のように流れ、フィン付冷却管２
２内に給水できるようになっている。フィン付冷却管２
２の下端には中空室５内の圧力及び温度を検出する圧力
・温度センサ１８が設けられ、その出力１９が制御装置
ｉ！１２０に入力されるようになっている。Furthermore, a partition plate 29 is provided inside the piston 11 so that the cooling water from the water supply pipe 27 does not flow directly into the drain pipe 28, and the cooling water flows in the direction of the arrow shown in the figure.
Water can be supplied within 2. Fined cooling pipe 2
2 is provided with a pressure/temperature sensor 18 for detecting the pressure and temperature inside the hollow chamber 5, and its output 19 is sent to the control device i! 120.
この第２図の実施例においても、制御装Ｗ１２０に燃料
ラック位置し２回転数Ｎ、ガス温度Ｈが入力され、また
圧力・温度センサ１８の検出出力１９及び弁傘部６の温
度検出器２１の検出出力Ｔ・王が入力され、それに応じ
て中空室５内の圧力を制御すべくモータ２６を回転させ
、ネジ２４よリネジボックス２３を昇降させてピストン
１１の位置を調整し、その中空室５内の圧力を制御する
ようになっている。In the embodiment shown in FIG. 2 as well, the fuel rack position, the number of revolutions N, and the gas temperature H are inputted to the control unit W120, and the detection output 19 of the pressure/temperature sensor 18 and the temperature detector 21 of the valve head portion 6 are inputted to the control unit W120. The detection output T is input, and the motor 26 is rotated to control the pressure inside the hollow chamber 5 accordingly, the screw box 23 is raised and lowered by the screw 24, the position of the piston 11 is adjusted, and the position of the piston 11 is adjusted. The pressure inside the chamber 5 is controlled.
尚中空室５内へ冷媒を供給或は中空室５がら空気や冷媒
を取り除く補給弁及び放出弁は図では省略したが第１図
と同様に接続されている。Note that the replenishment valve and discharge valve for supplying refrigerant into the hollow chamber 5 or removing air and refrigerant from the hollow chamber 5 are not shown in the figure, but are connected in the same manner as in FIG. 1.
第３図は、本発明のさらに他の実施例を示すもので、冷
却器となるベロー３０付ピストン１１をポペット弁１の
中空室５内に挿入したものである。FIG. 3 shows still another embodiment of the present invention, in which a piston 11 with a bellows 30 serving as a cooler is inserted into the hollow chamber 5 of the poppet valve 1.
ピストン１１は、その上部が間口し、その外周にはっは
部３１を有し、そのつば部３１にシールリング３２が設
けられてシリンダ３３に摺動自在に設けられると共につ
ば部３１の下部にピストン１１を上方に押圧するスプリ
ング３４が設けられる。The piston 11 has an opening at its upper part and a flange part 31 on its outer periphery, and a seal ring 32 is provided on the flange part 31 so as to be slidable on the cylinder 33. A spring 34 is provided that presses the piston 11 upward.
シリンダ３３にはピストン１１内に冷却水を供給する給
水管２７が接続され、その給水管２７に給水弁■３が接
続され、またシリンダ３３にピストン１１内に給水され
た冷却水を排水するための排水管２８が接続されると共
に排水弁■４が接続される。ピストン１１内には給水管
２′７からの冷却水が下方のベロー３０に流れるよう仕
切板２９が設けられる。A water supply pipe 27 for supplying cooling water into the piston 11 is connected to the cylinder 33, and a water supply valve (3) is connected to the water supply pipe 27. The drain pipe 28 is connected, and the drain valve 4 is also connected. A partition plate 29 is provided within the piston 11 so that cooling water from the water supply pipe 2'7 flows to the bellows 30 below.
中空室５内へ冷奴等を補給或は放出する補給管１７はシ
リンダ３３の上部からピストン１１内を挿通し、その先
端１７ａがベロ−３０上部のピストン１１より中空室５
に開口するよう設けられ、その補給管１７に冷媒液の補
給弁■５と中空ｖ５内の空気や冷媒ガスを抜き取る放出
弁■６が接続される。A supply pipe 17 for supplying or discharging cold tofu etc. into the hollow chamber 5 is inserted into the piston 11 from the upper part of the cylinder 33, and its tip 17a is inserted into the hollow chamber 5 from the piston 11 at the upper part of the bellows 30.
The replenishment pipe 17 is connected to a replenishment valve 5 for refrigerant liquid and a discharge valve 6 for removing air and refrigerant gas from the hollow v5.
ベロー３０の下部には遮熱板３０ａを介して圧力センサ
１８ａ及び温度センサ１８ｂが設けられ、その各出力Ｐ
ｏ 、Ｔｏが制御装置２０に入力されるようになってい
る。A pressure sensor 18a and a temperature sensor 18b are provided at the bottom of the bellows 30 via a heat shield plate 30a, and each output P
o and To are input to the control device 20.
この第３図の実施例においては、給水弁Ｖ３及び排水弁
ｖ４の開閉を制御装置２０が制御してそのピストン１１
内の冷却水圧力を斜部することでピストン１１がスプリ
ング３４に抗して押し下がるＲとベロ−３０自体が伸長
する長さにより、中空室５内の圧力を制御し、冷媒の蒸
発温度を変えてポペット弁１の温度を制御する・ように
なっている。また蒸発冷媒はベロー３０により冷却され
る。In the embodiment shown in FIG. 3, the control device 20 controls the opening and closing of the water supply valve V3 and the drain valve V4, and the piston 11
The piston 11 is pushed down against the spring 34 by diagonally controlling the pressure of the cooling water inside the hollow chamber 5, and the extension length of the tongue 30 itself controls the pressure inside the hollow chamber 5 and the evaporation temperature of the refrigerant. The temperature of the poppet valve 1 is controlled by changing the temperature. Further, the evaporative refrigerant is cooled by the bellows 30.
第４図は本発明のさらに他の実施例を示し、ポペット弁
１の弁棒２側の中空室５内でピストン１１を上下動自在
に設けて中空室５内の圧力を制御するようにしたもので
ある。FIG. 4 shows still another embodiment of the present invention, in which a piston 11 is provided in the hollow chamber 5 on the valve stem 2 side of the poppet valve 1 so as to be movable up and down to control the pressure in the hollow chamber 5. It is something.
すなわち、ピストン１１の上部外周には、シールリング
３５を有するつば部３６を有し、このつば部３６で中空
室５が仕切られ、上方に冷却室３７が形成される。つば
部３６の下部は、座３８で支持されたバネ３９により支
持される。That is, the upper outer periphery of the piston 11 has a collar portion 36 having a seal ring 35, the hollow chamber 5 is partitioned by the collar portion 36, and a cooling chamber 37 is formed above. The lower part of the collar 36 is supported by a spring 39 supported by a seat 38.
弁棒２の外周にはポベツ１〜弁１の上下動を案内し、か
つ冷却室３７を介してピストン１１内に冷却水を供給す
るための水室４０が設けられる。氷室４０の上下にはシ
ールリング４１が設けられ、氷室４０の上部に夫々冷却
水人口４２と冷却水出口４３が設けられ、その冷却水入
口４２に給水管２７が接続されると共に給水弁Ｖ３が接
続され、また冷却水出口４３に排水管２８が接続される
と共に排水弁ｖ４が接続される。A water chamber 40 is provided on the outer periphery of the valve rod 2 to guide the vertical movement of the valve 1 to the valve 1 and to supply cooling water into the piston 11 via a cooling chamber 37. Seal rings 41 are provided at the top and bottom of the ice chamber 40, and a cooling water port 42 and a cooling water outlet 43 are provided at the top of the ice chamber 40, respectively, and a water supply pipe 27 is connected to the cooling water inlet 42, and a water supply valve V3 is connected to the cooling water inlet 42. In addition, the drain pipe 28 and the drain valve v4 are connected to the cooling water outlet 43.
弁棒２には氷室４０とピストン１１上部の冷却室３７を
連通する連通口４４が設けられ、また冷却室３７の上部
からピストン１１内を通って給水側と排水側とに仕切る
仕切板２９が設けられる。The valve stem 2 is provided with a communication port 44 that communicates between the ice chamber 40 and the cooling chamber 37 above the piston 11, and a partition plate 29 that passes through the piston 11 from the top of the cooling chamber 37 to partition the water supply side and the drainage side. provided.
この第４図の実施例においては、給水管２７からの冷却
水は、水室４０に入り、水室４０から連通口４４を通っ
て冷却室３７に入り、仕切板２９により図示の矢印のよ
うにピストン１１内を流れて蒸発冷媒を冷却したのち他
方の連通口４４から水室４０に流れ、排水管２８より排
水される。In the embodiment shown in FIG. 4, the cooling water from the water supply pipe 27 enters the water chamber 40, passes through the communication port 44 from the water chamber 40, enters the cooling chamber 37, and is separated by the partition plate 29 as indicated by the arrow in the figure. After flowing through the piston 11 and cooling the evaporative refrigerant, it flows into the water chamber 40 from the other communication port 44 and is drained from the drain pipe 28.
また図には示していないが、ピストン１１の下方には圧
力・温度センサが設けられており、その出力が制御装置
２０に入力され、制御装置２０が給水弁ｖ３と排水弁Ｖ
４の開度を制御し、冷却室３７内の水圧を調整してピス
トン１１を上下動させることで、中空室５内の圧ノ〕（
容積）を変え、冷媒の蒸発温度を制御するようになって
いる。Further, although not shown in the figure, a pressure/temperature sensor is provided below the piston 11, the output of which is input to the control device 20, and the control device 20 controls the water supply valve v3 and the drain valve V3.
4, the water pressure in the cooling chamber 37 is adjusted, and the piston 11 is moved up and down, thereby reducing the pressure in the hollow chamber 5.
The evaporation temperature of the refrigerant is controlled by changing the volume of the refrigerant.
すなわち、−冷却室３７内の圧力が高ければバネ３９の
力に抗してピストン１１を下方に押し下げて中空室５内
の圧力を高め、逆に圧力が低ければバネ力及び中空室５
内の蒸気圧で上方に押し上げられて中空室５内の圧力を
下げ、その蒸発温度を制御する。That is, if the pressure in the cooling chamber 37 is high, the piston 11 is pushed down against the force of the spring 39 to increase the pressure in the hollow chamber 5, and conversely, if the pressure is low, the spring force and the hollow chamber 5 are increased.
The vapor pressure inside the hollow chamber 5 pushes it upward, lowering the pressure inside the hollow chamber 5 and controlling its evaporation temperature.
［発明の効果］
以上詳述してきたことから明らかなように本発明によれ
ば次のごとき優れた効果を発揮する。[Effects of the Invention] As is clear from the detailed description above, the present invention exhibits the following excellent effects.
（１） 中空室内の容積を可変にするピストンを設け
たので、中空室内の封入冷媒の蒸発温度を制御でき、冷
却熱量を減少させることなくポペット弁の温度制御がで
きる。(1) Since a piston is provided that changes the volume within the hollow chamber, the evaporation temperature of the refrigerant sealed within the hollow chamber can be controlled, and the temperature of the poppet valve can be controlled without reducing the amount of cooling heat.
（２） ポペット弁の傘部の温度レベルを略一定に保
つことができるため、従来のような過冷却によるサルフ
ァアタックを防止でき、また熱応力を低減できる。(2) Since the temperature level of the umbrella portion of the poppet valve can be maintained at a substantially constant level, sulfur attacks due to overcooling, which are conventional, can be prevented and thermal stress can be reduced.
（３） ポペット弁の長寿命化が達成できる。(3) Longer life of the poppet valve can be achieved.
第１図は本発明のポペット弁の温度制御装置の一実施例
を示す断面図、第２図、第３図、第４図は夫々本発明の
他の実施例を示を断面図である。
図中、１はポペット弁、４は冷媒液、５は中空室、１１
はピストンである。
第１図
第２図
第３図FIG. 1 is a cross-sectional view showing one embodiment of the poppet valve temperature control device of the present invention, and FIGS. 2, 3, and 4 are cross-sectional views showing other embodiments of the present invention. In the figure, 1 is a poppet valve, 4 is a refrigerant liquid, 5 is a hollow chamber, 11
is a piston. Figure 1 Figure 2 Figure 3
Claims (1)
ット弁に、中空室内の容積を可変にするピストンを設け
たことを特徴とするポペット弁の温度制御装置。A temperature control device for a poppet valve, characterized in that a hollow chamber is formed in the poppet valve to seal a refrigerant, and the poppet valve is provided with a piston that makes the volume inside the hollow chamber variable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19947485A JPS6262073A (en) | 1985-09-11 | 1985-09-11 | Device for controlling temperature of poppet valve |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19947485A JPS6262073A (en) | 1985-09-11 | 1985-09-11 | Device for controlling temperature of poppet valve |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6262073A true JPS6262073A (en) | 1987-03-18 |
Family
ID=16408396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19947485A Pending JPS6262073A (en) | 1985-09-11 | 1985-09-11 | Device for controlling temperature of poppet valve |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6262073A (en) |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6415588A (en) * | 1987-07-09 | 1989-01-19 | Kyushu Nippon Electric | Mass flow controller |
| US7738050B2 (en) | 2007-07-06 | 2010-06-15 | Semiconductor Energy Laboratory Co., Ltd | Liquid crystal display device |
| US7736933B2 (en) | 2007-07-27 | 2010-06-15 | Semiconductor Energy Laboratory Co., Ltd | Method for manufacturing photoelectric conversion device |
| US7888167B2 (en) | 2008-04-25 | 2011-02-15 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and method for manufacturing the same |
| US7998801B2 (en) | 2008-04-25 | 2011-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film transistor having altered semiconductor layer |
| US8030147B2 (en) | 2007-09-14 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film transistor and display device including the thin film transistor |
| US8053294B2 (en) | 2008-04-21 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film transistor by controlling generation of crystal nuclei of microcrystalline semiconductor film |
| US8119468B2 (en) | 2008-04-18 | 2012-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor and method for manufacturing the same |
| US8138032B2 (en) | 2008-04-18 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film transistor having microcrystalline semiconductor film |
| US8178398B2 (en) | 2007-07-27 | 2012-05-15 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of display device |
| US8187956B2 (en) | 2007-12-03 | 2012-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing microcrystalline semiconductor film, thin film transistor having microcrystalline semiconductor film, and photoelectric conversion device having microcrystalline semiconductor film |
| US8207010B2 (en) | 2007-06-05 | 2012-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing photoelectric conversion device |
| US8258025B2 (en) | 2009-08-07 | 2012-09-04 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing microcrystalline semiconductor film and thin film transistor |
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| US8839818B2 (en) | 2009-05-27 | 2014-09-23 | Advantest Corporation | Valve device and temperature adjusting system for electronic device |
| US9177761B2 (en) | 2009-08-25 | 2015-11-03 | Semiconductor Energy Laboratory Co., Ltd. | Plasma CVD apparatus, method for forming microcrystalline semiconductor film and method for manufacturing semiconductor device |
| US9808677B2 (en) | 2012-04-18 | 2017-11-07 | World Golf Systems Limited | Ball game apparatus |
| CN111594626A (en) * | 2019-02-20 | 2020-08-28 | 浙江三花制冷集团有限公司 | Temperature sensing driving device and flow regulating valve using same |
-
1985
- 1985-09-11 JP JP19947485A patent/JPS6262073A/en active Pending
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6415588A (en) * | 1987-07-09 | 1989-01-19 | Kyushu Nippon Electric | Mass flow controller |
| JPH0542591B2 (en) * | 1987-07-09 | 1993-06-29 | Kyushu Nippon Electric | |
| US8207010B2 (en) | 2007-06-05 | 2012-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing photoelectric conversion device |
| US8300168B2 (en) | 2007-06-15 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Display device comprising an antioxidant film formed on a microcrystalline semiconductor film wherein the antioxidant film has a recessed portion overlapping a channel region |
| US8111362B2 (en) | 2007-07-06 | 2012-02-07 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
| US7738050B2 (en) | 2007-07-06 | 2010-06-15 | Semiconductor Energy Laboratory Co., Ltd | Liquid crystal display device |
| US8334537B2 (en) | 2007-07-06 | 2012-12-18 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device |
| US8842230B2 (en) | 2007-07-06 | 2014-09-23 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
| US8462286B2 (en) | 2007-07-06 | 2013-06-11 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
| US8325285B2 (en) | 2007-07-06 | 2012-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
| US8178398B2 (en) | 2007-07-27 | 2012-05-15 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of display device |
| US7736933B2 (en) | 2007-07-27 | 2010-06-15 | Semiconductor Energy Laboratory Co., Ltd | Method for manufacturing photoelectric conversion device |
| US8030147B2 (en) | 2007-09-14 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film transistor and display device including the thin film transistor |
| US8304779B2 (en) | 2007-11-01 | 2012-11-06 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, and display device having the thin film transistor |
| US8591650B2 (en) | 2007-12-03 | 2013-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming crystalline semiconductor film, method for manufacturing thin film transistor, and method for manufacturing display device |
| US8187956B2 (en) | 2007-12-03 | 2012-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing microcrystalline semiconductor film, thin film transistor having microcrystalline semiconductor film, and photoelectric conversion device having microcrystalline semiconductor film |
| US8525170B2 (en) | 2008-04-18 | 2013-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor and manufacturing method thereof |
| US8138032B2 (en) | 2008-04-18 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film transistor having microcrystalline semiconductor film |
| US8119468B2 (en) | 2008-04-18 | 2012-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor and method for manufacturing the same |
| US8053294B2 (en) | 2008-04-21 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film transistor by controlling generation of crystal nuclei of microcrystalline semiconductor film |
| US7998801B2 (en) | 2008-04-25 | 2011-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film transistor having altered semiconductor layer |
| US7888167B2 (en) | 2008-04-25 | 2011-02-15 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and method for manufacturing the same |
| US8410354B2 (en) | 2008-05-09 | 2013-04-02 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and manufacturing method thereof |
| US8839818B2 (en) | 2009-05-27 | 2014-09-23 | Advantest Corporation | Valve device and temperature adjusting system for electronic device |
| US8258025B2 (en) | 2009-08-07 | 2012-09-04 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing microcrystalline semiconductor film and thin film transistor |
| US9177761B2 (en) | 2009-08-25 | 2015-11-03 | Semiconductor Energy Laboratory Co., Ltd. | Plasma CVD apparatus, method for forming microcrystalline semiconductor film and method for manufacturing semiconductor device |
| US9808677B2 (en) | 2012-04-18 | 2017-11-07 | World Golf Systems Limited | Ball game apparatus |
| CN111594626A (en) * | 2019-02-20 | 2020-08-28 | 浙江三花制冷集团有限公司 | Temperature sensing driving device and flow regulating valve using same |
| CN111594626B (en) * | 2019-02-20 | 2023-05-16 | 浙江三花商用制冷有限公司 | Temperature-sensing driving device and flow regulating valve using same |
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