JPS6254666A - Polishing surface plate - Google Patents

Abstract

PURPOSE:To enable to obtain a polished surface with less polishing spots by forming concentrally or helically such grooves which are large in distance between the adjacent grooves and deep on the polishing face of a polishing surface plate and, forming helically across these, such grooves which are small in distance between the adjacent grooves and shallow. CONSTITUTION:A work 8 mounted on a holder 7 is positioned on a polishing surface plate body 12, and the body 12 is rotated on its rotating axis center C, while abrasive liquid 9 mixed with abrasive grains being supplied, thus polishing work is carried out. Then, supply of the abrasive liquid 9 is stopped, and the abrasive liquid with no abrasive grain being mixed is supplied instead. With the aids of centrifugal force of the polishing surface plate body 12 and the work 8 on the holder 7 rotating on its rotating axis (d), fallen off and/or excessive abrasive grains are washed out into small and shallow grooves 6, and then into large and deep grooves, and exhausted out of the surface plate body 12, thus polishing work is carried out with the stable abrasive grains. A polished surface is therefore free from polishing spots resulting from the fallen off or the excess abrasive grains, thus a good polished surface is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a polishing surface plate devised for obtaining a polished surface with fewer polishing scratches during polishing in which the polishing surface plate is attached to a polishing machine.

In the conventional polishing process using a polishing surface plate, as shown in FIG. It is embedded in the polishing surface plate 1, and countless cutting edges are formed on the polishing surface of the polishing surface plate. As a result, the abrasive grains that have become cutting edges perform the polishing process.

Furthermore, embedded abrasive grains are said to repeatedly fall off and form. The above is an overview of the polishing process using the polishing surface plate.

Problems to be Solved by the Invention In order to obtain a polished surface with fewer polishing scratches during polishing using a polishing surface plate, it is necessary to eliminate polishing scratches caused by dropped abrasive grains or extra abrasive grains that are not directly related to the machining process. The challenge is to eliminate it. FIG. 8 shows how the fallen abrasive grains 4 are caught between the polishing surface plate 1 and the workpiece 2 and damage the workpiece 2. Also, polishing scratches caused by extra abrasive grains that are not directly related to processing can be caused by the same as the falling abrasive grains mentioned above.
As shown in FIG. 8, it is thought that the particles get caught between the workpiece and the polishing surface plate and cause polishing scratches.

Means for Solving the Problems The present invention aims to reduce the abrasive scratches caused by the above-mentioned causes.
By forming concentrically or spirally deep grooves with a large distance between the grooves on the polishing surface of the polishing surface plate body, and further forming shallow grooves with a small distance between the grooves in a spiral shape to intersect with the grooves, This solves the above problem.

Operation A workpiece is placed on the polishing surface plate of the present invention, and after polishing by supplying a polishing liquid mixed with abrasive grains, by subsequently supplying a polishing liquid not mixed with abrasive grains, the workpiece is removed. Abrasive grains and excess abrasive grains that are not directly related to processing are washed away into shallow spiral grooves with a small distance between grooves and deep concentric or spiral grooves with a large distance between grooves, and are further flushed out of the polishing surface plate through the grooves. By discharging, it prevents polishing scratches caused by dropped abrasive grains and extra abrasive grains that are not directly related to processing, and also reduces polishing scratches by promoting the polishing process with stable abrasive grains embedded in the polishing surface plate. A polished surface is obtained.

Example Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic diagram showing a state in which deep grooves 5 with large distances between grooves are formed concentrically on the polishing surface of the polishing surface plate main body 12, and shallow grooves 6 with small distances between grooves are formed in a spiral shape. be.

Figure 2 shows grooves 5 with large and deep grooves on the polishing surface of the polishing surface plate.
' is formed in a spiral shape, and the groove 6' is further shallower with a smaller distance between the grooves.
FIG. 2 is a schematic diagram showing a state in which the grooves 5, 6, 5' and 6' shown in FIGS. 1 and 2 intersect with each other.

FIG. 3 is a half-sectional view of the polishing surface plate, and FIG. 4 is an enlarged view of the deep grooves with a large distance between the grooves and the shallow grooves with a small distance between the grooves formed on the polishing surface.

The polishing method and operation of the embodiment described in FIGS. 1 to 4 will be explained with reference to FIG. The workpiece 8 attached to the holder 7 is placed on the polishing surface plate main body 12, and the polishing surface plate main body 1
The workpiece 8 is polished by supplying polishing liquid 9 mixed with abrasive grains while rotating around the rotation axis C. After that, the supply of polishing liquid 9 is stopped, and then the abrasive grains are By supplying the unmixed polishing liquid 10, it comes into contact with the rotating centrifugal force of the polishing surface plate main body 12 and the polishing surface of the polishing surface plate, and rotates around the rotation axis d of the holder 7. It's rotating.

Due to the action of the workpiece 8 attached to the holder 7, dropped abrasive grains and excess abrasive grains not directly related to processing are removed between the shallow spiral grooves 6 with a small distance between the grooves and the deep concentric grooves with a large distance between the grooves. It is washed away in a spiral groove and further discharged to the outside of the polishing surface plate main body 12 through the groove. Furthermore, the effects of the large and deep grooves 5 and the small and shallow grooves 6 will be explained with reference to FIG.

FIG. 6 is a partially enlarged view of the large deep groove 6, the small shallow groove 6, and the workpiece 8 attached to the holder 7. When the abrasive grains embedded in the peaks of the small and shallow grooves 60 fall off due to polishing pressure, etc., the fallen abrasive grains 11 fall into the small and shallow grooves 6.

As explained in FIG. 8 above, if the polishing surface plate does not have grooves on its main body, the abrasive grains will get caught up in the workpiece and cause damage to the workpiece. The abrasive grains 11 fall into the grooves, thereby preventing scratches on the workpiece, and the abrasive grains not directly related to processing also fall into the grooves, thereby preventing abrasive scratches.

Next, when a polishing liquid containing no abrasive grains is supplied, as shown in FIG. Due to the centrifugal force of the polishing surface plate and the rotating action of the workpiece, the abrasive grains are flowed from the small and shallow grooves 6 to the deep grooves 6 so as to wash away the abrasive particles that have fallen into the small and shallow grooves, and are finally polished. It is discharged outside the board body 12.

As mentioned above, the dropped abrasive grains and extra abrasive grains not directly related to the processing fall into the shallow grooves and are discharged through the larger grooves, thereby preventing polishing scratches on the abrasive grains and preventing the abrasive particles from being embedded in the polishing surface plate. Stable abrasive grains facilitate polishing and provide a polished surface with fewer scratches.

Effects of the Invention The present invention effectively discharges fallen abrasive grains and excess abrasive grains not directly related to processing by forming small, shallow grooves and large, deep grooves in a spiral or concentric pattern on the polishing surface of a polishing surface plate. This has the effect of providing a polished surface with fewer polishing scratches.

[Brief explanation of the drawing]

1 and 2 are plan views of the polishing surface plate according to an embodiment of the present invention, FIG. 3 is a half-sectional view of the same polishing surface plate, and FIG. 4 is an enlarged view of the same large deep groove and small shallow groove, Fig. 6 is a schematic diagram showing the state of the polishing process, Fig. 6 is an enlarged view explaining the effect of the groove, and Figs. FIG. 5... Deep groove, 6... Small shallow groove, 7... Holder, 8... Workpiece, 9... Grind. Polishing liquid mixed with grains, 10...
... Polishing liquid with no abrasive particles mixed in, 11 ... Fallen abrasive grains, 12 ... Polishing surface plate body. Name of agent: Patent attorney Toshio Nakao and 1 other person 1st
Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] A polishing surface plate in which concentric or spiral grooves with large distances between grooves are formed on the polishing surface of the polishing surface plate body, and shallow grooves with short distances between grooves are formed in a spiral manner to intersect with the grooves. .