JPS6251796U - - Google Patents

Info

Publication number
JPS6251796U
JPS6251796U JP14234285U JP14234285U JPS6251796U JP S6251796 U JPS6251796 U JP S6251796U JP 14234285 U JP14234285 U JP 14234285U JP 14234285 U JP14234285 U JP 14234285U JP S6251796 U JPS6251796 U JP S6251796U
Authority
JP
Japan
Prior art keywords
printed circuit
cooling air
chassis
circuit board
duct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14234285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14234285U priority Critical patent/JPS6251796U/ja
Publication of JPS6251796U publication Critical patent/JPS6251796U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案に係るプリント基板冷却ユニ
ツトの一実施例を示す構成図、第2図は第1図の
ユニツト1個分を示す平面図及び側面図、第3図
はこの考案の他の一実施例を示すプリント基板冷
却ユニツトの平面図及び側面図、第4図は従来の
プリント基板冷却装置を示す構成図である。 図において、1はプリント基板、2は半田付面
、3は部品取付面、4は電気部品、5はガイド、
6はカードバスケツト、7は冷却空気供給口、8
は冷却空気排出口、9は冷却空気、10はプリン
ト基板冷却ユニツト、11はシヤーシ、12は冷
却空気入口、23は冷却空気出口、である。なお
、図中、同一符号は同一、又は相当部分を示す。
Fig. 1 is a configuration diagram showing one embodiment of a printed circuit board cooling unit according to this invention, Fig. 2 is a plan view and side view showing one unit of Fig. A plan view and a side view of a printed circuit board cooling unit showing one embodiment, and FIG. 4 is a configuration diagram showing a conventional printed circuit board cooling device. In the figure, 1 is a printed circuit board, 2 is a soldering surface, 3 is a component mounting surface, 4 is an electrical component, 5 is a guide,
6 is a card basket, 7 is a cooling air supply port, 8 is a
1 is a cooling air outlet, 9 is a cooling air, 10 is a printed circuit board cooling unit, 11 is a chassis, 12 is a cooling air inlet, and 23 is a cooling air outlet. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 枠構造のシヤーシの両側に2枚のプリント基板
を半田付面を対向させて固定し、冷却空気用ダク
トを形成するとともにこのダクトを通る冷却空気
の出入口を前記シヤーシに設けたことを特徴とす
るプリント基板冷却ユニツト。
Two printed circuit boards are fixed to both sides of a chassis having a frame structure with their soldered surfaces facing each other to form a cooling air duct, and the chassis is provided with an inlet/outlet for cooling air passing through the duct. Printed circuit board cooling unit.
JP14234285U 1985-09-17 1985-09-17 Pending JPS6251796U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14234285U JPS6251796U (en) 1985-09-17 1985-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14234285U JPS6251796U (en) 1985-09-17 1985-09-17

Publications (1)

Publication Number Publication Date
JPS6251796U true JPS6251796U (en) 1987-03-31

Family

ID=31050986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14234285U Pending JPS6251796U (en) 1985-09-17 1985-09-17

Country Status (1)

Country Link
JP (1) JPS6251796U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173199A (en) * 1989-11-22 1991-07-26 Internatl Business Mach Corp <Ibm> Three dimensonal microelectronic package and its manufacture
JP2004128358A (en) * 2002-10-04 2004-04-22 Nec Toshiba Space Systems Ltd Heat radiating electrical apparatus
WO2012141339A1 (en) * 2011-04-13 2012-10-18 日本電気株式会社 Electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173199A (en) * 1989-11-22 1991-07-26 Internatl Business Mach Corp <Ibm> Three dimensonal microelectronic package and its manufacture
JP2004128358A (en) * 2002-10-04 2004-04-22 Nec Toshiba Space Systems Ltd Heat radiating electrical apparatus
WO2012141339A1 (en) * 2011-04-13 2012-10-18 日本電気株式会社 Electronic device

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