JPS624975Y2 - - Google Patents

Info

Publication number
JPS624975Y2
JPS624975Y2 JP11841679U JP11841679U JPS624975Y2 JP S624975 Y2 JPS624975 Y2 JP S624975Y2 JP 11841679 U JP11841679 U JP 11841679U JP 11841679 U JP11841679 U JP 11841679U JP S624975 Y2 JPS624975 Y2 JP S624975Y2
Authority
JP
Japan
Prior art keywords
resin
recess
sealed
filled
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11841679U
Other languages
Japanese (ja)
Other versions
JPS5635721U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11841679U priority Critical patent/JPS624975Y2/ja
Publication of JPS5635721U publication Critical patent/JPS5635721U/ja
Application granted granted Critical
Publication of JPS624975Y2 publication Critical patent/JPS624975Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Switch Cases, Indication, And Locking (AREA)
  • Casings For Electric Apparatus (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

【考案の詳細な説明】 この考案は、ケース内に収納された電気部品を
充填樹脂にて封止する樹脂封止形電気機器に関す
るものである。
[Detailed Description of the Invention] This invention relates to a resin-sealed electrical device in which electrical components housed in a case are sealed with a filled resin.

従来、第5a図のようなリードスイツチ15や
外部導出用リード線16をケース17の内部に収
納し、その後、ケース17内に、たとえばエポキ
シ樹脂のようなシール材18を充填して、上記リ
ードスイツチ15や外部導出用リード線16を密
封する場合、第5b図のようにシール材18の量
が多くなつて、ケース17の外部に流出したり、
第5c図のようにシール材18の量が少ないため
に、リードスイツチ15が露出して密封効果を損
ない易く、そのため、樹脂注入量の調整を綿密に
行なわなければならない作業上の問題があつた。
Conventionally, a reed switch 15 and an external lead wire 16 as shown in FIG. When sealing the switch 15 and the external lead wire 16, the amount of sealing material 18 increases and may leak out of the case 17 as shown in FIG. 5b.
As shown in Fig. 5c, since the amount of sealing material 18 is small, the reed switch 15 is exposed and the sealing effect is easily impaired, which creates a problem in work in which the amount of resin injection must be carefully adjusted. .

他方、第6a図のようなリレー20において、
ベース21とこのベース21を貫通して、外方へ
突出する外部端子22との間をシール材で密封す
る場合でも、第6b図のようにシール材18の量
が多くなつて、ケース23の外部に流出したり、
第6c図のようにシール材18の量が少ないため
に、密封効果を損ない易く、そのため、樹脂注入
量の調整を綿密に行なわなければならない作業上
の問題があり、しかも封止状態にばらつきを生じ
る欠点があつた。
On the other hand, in the relay 20 as shown in FIG. 6a,
Even when the space between the base 21 and the external terminal 22 that penetrates through the base 21 and protrudes outward is sealed with a sealing material, the amount of the sealing material 18 increases as shown in FIG. Leaked outside or
As shown in Fig. 6c, since the amount of sealing material 18 is small, the sealing effect is easily impaired, and therefore there is a problem in the work that the amount of resin injection must be carefully adjusted, and furthermore, there is no variation in the sealing state. There were some drawbacks.

この考案は上記欠点を改善するためになされた
もので、シール材の注入量、つまり樹脂注入量の
調整を綿密に行なわなくても、ばらつきのない適
正な封止状態を容易に得ることができる樹脂封止
形電気機器を提供することを目的とする。
This idea was made to improve the above-mentioned drawbacks, and it is possible to easily obtain a proper sealing state without variations without carefully adjusting the amount of sealant injection, that is, the amount of resin injection. The purpose is to provide resin-sealed electrical equipment.

以下、この考案の実施例を図面にしたがつて説
明する。
Embodiments of this invention will be described below with reference to the drawings.

第1a図および第1b図において、1は近接ス
イツチを構成するケースで、その樹脂充填用の第
1の凹所2内に、リードスイツチ3や外部導出用
リード線4などが収納されている。5は上記第1
の凹所2に隣接して形成された第2の凹所であ
り、この第2の凹所5は後述するように、第1の
凹所2内に充填されるエポキシ樹脂のようなシー
ル材のあふれた分を、オーバフローにて受け入れ
るためのもので、上記両凹所2,5間に形成され
る仕切壁6の高さは、第1の凹所2の開口縁2a
よりも低くしてある。
In FIGS. 1a and 1b, reference numeral 1 denotes a case constituting a proximity switch, in which a reed switch 3, a lead wire 4 for leading out to the outside, etc. are housed in a first recess 2 for filling with resin. 5 is the first above
A second recess 5 is formed adjacent to the recess 2, and as will be described later, the second recess 5 is filled with a sealing material such as an epoxy resin filled in the first recess 2. The height of the partition wall 6 formed between the two recesses 2 and 5 is equal to the opening edge 2a of the first recess 2.
It is lower than that.

上記構成において、第2図で示すように、エポ
キシ樹脂のような合成樹脂シール材7を第1の凹
所2内に注入し、その液面が上昇して仕切壁6の
上端をオーバフローし、シール材7のあふれた分
7aが第2の凹所5に流れ込む時点で、上記の注
入を停止すれば、適正な封止状態を得ることがで
きる。
In the above configuration, as shown in FIG. 2, a synthetic resin sealing material 7 such as an epoxy resin is injected into the first recess 2, and the liquid level rises and overflows the upper end of the partition wall 6. If the above-mentioned injection is stopped when the overflowing portion 7a of the sealing material 7 flows into the second recess 5, a proper sealing state can be obtained.

つまり、シール材7が仕切壁6をオーバフロー
した際、充填樹脂の適正量、すなわち適確な封止
状態を示すことになる。
In other words, when the sealing material 7 overflows the partition wall 6, it indicates an appropriate amount of filled resin, that is, an appropriate sealing state.

第3図はこの考案の他の実施例を示すもので、
8はリレーのような電気部品9を収納したケー
ス、10はベースで、このベース10を貫通し
て、上記電気部品9の外部端子11が外部へ突出
しており、ケース8の開口部8aの内側に樹脂充
填用の第1の凹所2が形成され、ベース10の中
央部に第2の凹所5を設け、上記両凹所2,5間
に形成される仕切壁6の高さを、第1の凹所2の
開口縁2a、つまりケース8の開口縁よりも低く
してある。
Figure 3 shows another embodiment of this invention.
8 is a case housing an electrical component 9 such as a relay; 10 is a base; an external terminal 11 of the electrical component 9 protrudes outside through the base 10; A first recess 2 for resin filling is formed in the base 10, a second recess 5 is provided in the center of the base 10, and the height of the partition wall 6 formed between the two recesses 2 and 5 is set as follows. It is lower than the opening edge 2a of the first recess 2, that is, the opening edge of the case 8.

したがつて、第4図で示すように、合成樹脂シ
ール材7を第1の凹所2内に注入し、その液面が
上昇して仕切壁6の上端をオーバフローし、シー
ル材7のあふれた分7aが第2の凹所5に流れ込
む時点で、上記の注入を停止すれば、適正な封止
状態を得ることができる。
Therefore, as shown in FIG. 4, the synthetic resin sealing material 7 is injected into the first recess 2, and the liquid level rises and overflows the upper end of the partition wall 6, causing the sealing material 7 to overflow. If the above-mentioned injection is stopped at the point when the portion 7a flows into the second recess 5, a proper sealed state can be obtained.

以上のように、この考案によれば、樹脂充填側
の面が外部に開口された第1の凹所に隣接して、
その開口縁よりも低い仕切壁をもつた第2の凹所
を形成し、第1の凹所に注入される樹脂が、上記
仕切壁を越えてあふれ、そのあふれた分を第2の
凹所で受け入れるようにしたから、樹脂注入量の
調整を綿密に行なわなくても、ばらつきのない適
正な封止状態を容易に得ることができ、もつて作
業性の向上と、安定した封止状態を確保すること
ができる。
As described above, according to this invention, the surface on the resin filling side is adjacent to the first recess opened to the outside,
A second recess is formed with a partition wall lower than the opening edge, and when the resin injected into the first recess overflows over the partition wall, the overflow is poured into the second recess. Since the resin is accepted at can be secured.

【図面の簡単な説明】[Brief explanation of the drawing]

第1a図はこの考案による樹脂封止形電気機器
の一例を近接スイツチについて示す概略的な断面
図、第1b図はその平面図、第2図は樹脂充填状
態の同断面図、第3図はこの考案による樹脂封止
形電気機器の他の例をリレーについて示す断面
図、第4図は樹脂充填状態の同断面図、第5a図
ないし第5c図は従来の近接スイツチとその樹脂
充填状態の概略的な断面図、第6a図ないし第6
c図は従来のリレーとその樹脂充填状態の概略的
な断面図である。 2……樹脂充填用の第1の凹所、2a……開口
縁、3,9……電気部品、5……第2の凹所、6
……仕切壁、7,7a……樹脂。
Fig. 1a is a schematic sectional view showing an example of a resin-sealed electric device according to this invention with respect to a proximity switch, Fig. 1b is a plan view thereof, Fig. 2 is a sectional view of the same in a resin-filled state, and Fig. 3 is a Another example of the resin-sealed electric device according to this invention is a cross-sectional view showing a relay, FIG. 4 is a cross-sectional view of the same in a resin-filled state, and FIGS. 5a to 5c are a conventional proximity switch and its resin-filled state. Schematic cross-sectional views, Figures 6a to 6
Figure c is a schematic cross-sectional view of a conventional relay and its resin-filled state. 2... First recess for resin filling, 2a... Opening edge, 3, 9... Electrical component, 5... Second recess, 6
...Partition wall, 7,7a...Resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ケース内に収納された電気部品を充填樹脂にて
封止する樹脂封止形電気機器において、樹脂充填
側の面が外部に開口された第1の凹所と、第1の
凹所に隣接してその開口縁よりも低い仕切壁をも
つて形成された第2の凹所とを具備し、第1の凹
所に注入される樹脂が上記仕切壁を越えてあふれ
る分を第2の凹所へ受け入れるように構成したこ
とを特徴とする樹脂封止形電気機器。
In a resin-sealed electric device in which electrical components housed in a case are sealed with a filled resin, the resin-filled side has a first recess that is open to the outside, and a first recess that is adjacent to the first recess. and a second recess formed with a partition wall lower than the opening edge of the opening. 1. A resin-sealed electrical device characterized by being configured to be received by
JP11841679U 1979-08-27 1979-08-27 Expired JPS624975Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11841679U JPS624975Y2 (en) 1979-08-27 1979-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11841679U JPS624975Y2 (en) 1979-08-27 1979-08-27

Publications (2)

Publication Number Publication Date
JPS5635721U JPS5635721U (en) 1981-04-07
JPS624975Y2 true JPS624975Y2 (en) 1987-02-04

Family

ID=29350618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11841679U Expired JPS624975Y2 (en) 1979-08-27 1979-08-27

Country Status (1)

Country Link
JP (1) JPS624975Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173165A (en) * 2004-12-13 2006-06-29 Matsushita Electric Ind Co Ltd Electronic apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4924893B2 (en) * 2007-06-27 2012-04-25 Tdk株式会社 Coil component manufacturing method and coil component manufacturing apparatus
JP5119983B2 (en) * 2008-03-04 2013-01-16 株式会社デンソー Electronic circuit equipment
JP5624876B2 (en) * 2010-12-27 2014-11-12 新電元工業株式会社 Containment case and electrical equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173165A (en) * 2004-12-13 2006-06-29 Matsushita Electric Ind Co Ltd Electronic apparatus
JP4492335B2 (en) * 2004-12-13 2010-06-30 パナソニック電工株式会社 Electronics

Also Published As

Publication number Publication date
JPS5635721U (en) 1981-04-07

Similar Documents

Publication Publication Date Title
US6212755B1 (en) Method for manufacturing insert-resin-molded product
US3772452A (en) An encapsulated electrical device
JPS624975Y2 (en)
JP3797021B2 (en) Power semiconductor device
JPS6037627A (en) Sealed electromagnetic relay
JPS5824464Y2 (en) Hybrid integrated circuit device
JPH0241890Y2 (en)
JPH0530377Y2 (en)
JPS63248211A (en) Electronic component and its manufacture
JPS6029169Y2 (en) storage battery
JPH0723952Y2 (en) Resin sealing structure
JPS6035155Y2 (en) Seal structure of electrical equipment
JPH033953Y2 (en)
JPS5918604Y2 (en) lead relay
JPH0310605Y2 (en)
JPS6312374Y2 (en)
JPS6215977Y2 (en)
JPS6050058B2 (en) semiconductor equipment
JPH0638352Y2 (en) Electromagnetic relay
JPS6031144Y2 (en) Proximity switch case
JPS6020929Y2 (en) Sealing frame structure for electrical circuit elements
JPS6325625Y2 (en)
JPS5930505Y2 (en) waterproof ballast
JPH0416338Y2 (en)
JPH0575153U (en) Hermetically sealed enclosure