JPS6246318Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to a heat dissipation device that is built into an electrical device such as an amplifier to dissipate heat generated inside a power transistor, and is particularly applicable to thin amplifiers. This paper attempts to propose a useful heat dissipation device.

As shown in FIG. 1, in a conventional heat dissipation device, a heat dissipation plate 1 having a large number of fins 2, 2 is incorporated and fixed inside an amplifier 3, for example, while a top plate 4 and a bottom plate adjacent to the heat dissipation plate 1 are fixed. A large number of air holes 6, 7, ... are provided in a part of the air hole 5, and the air holes 6, 7,...
The heat generated inside the heating element 8 such as a power transistor arranged inside the amplifier 3 is carried on the air convection formed through the amplifier 3, and the heat is dissipated to the outside.

Incidentally, in general, an amplifier used in a so-called component type stereo device is used with so-called tape decks or radio receivers arranged above and below the amplifier.

For example, as shown by broken lines in the figure, tape decks 9 and radio receivers 10 are stacked above and below the amplifier 3. Therefore, in the conventional heat dissipation device, which has a structure in which air convection for heat dissipation is created through the air holes 6 and 7 formed in the top plate 4 and the bottom plate 5, air enters through the air holes 7 in the bottom plate 5. Although it is possible to form a convection current in which air is released from the air holes 6 of the upper plate 4 to the outside, the air holes 6 of the upper plate 4,...
The flow of air trying to be discharged from the amplifier 3 is obstructed by the bottom plate of, for example, a tape deck 9 placed on top of the amplifier 3, and therefore the heat from the heating element 8 cannot be sufficiently dissipated to the outside. It was hot.

In addition, recently there has been a trend to reduce the height and width of amplifiers 3, etc., and in the case of such thin amplifiers 3, etc., a heatsink with rectangular fins 2, etc. has a rectangular shape. In addition, in the case of stereo equipment that stacks thin amplifiers 3, etc., the space between the upper and lower equipment becomes narrower, so conventional heat dissipation equipment with the structure described above has problems with efficiency. A good heat dissipation effect could not be achieved, and as a result, the temperature inside the amplifier 3 often rose abnormally.

The present invention has been proposed in view of these conventional drawbacks.

FIG. 2 is a longitudinal sectional view showing a preferred embodiment of the heat radiating device according to the present invention, and FIG. 3 is a partially cutaway perspective view showing the heat radiating device in an exploded manner.

In this embodiment, for example, an outer casing 11 of an amplifier, etc.
An example is shown in which a large number of air holes 14, 15, . . . are formed in both the side plate 12 and the bottom plate 13 adjacent thereto. Inside the outer casing 11,
A mounting board 17 having a heating element 16 that generates heat internally or externally, such as a power transistor or a power rectifying element, is arranged at an angle. The mounting board 17 is fixed to the outer casing 11 at both end portions, for example, with set screws.

In a space surrounded by the mounting board 17 and the outer casing 11, that is, a substantially triangular prism-shaped space 18, a plurality of heat dissipating plates 19, 19, . formed and arranged. Each of these heat radiating plates 19, 19, . . . is formed in a triangular shape, and is designed to create partitions at a predetermined interval (l ₁ in FIG. 3) within the space 18. One side of each of the heat sinks 19, 19, . . . has a large number of grooves 20, 20, . The heat dissipating plates 19, 19, . . . and the mounting board 17 are integrally fixed to each other. Therefore, each heat sink 19,1
9, . . . are perpendicular to the surface of the mounting board 17, and are integrally arranged in parallel with each other at a predetermined distance _l1 .

As shown in FIG. 4, each of the heat sinks 19, 1
The length l ₄ of one side of the side where ₉ , . Therefore, the space 18 is partitioned by the heat sinks 19, . . . so that adjacent space portions are almost completely sealed.

The heat dissipating plates 19, . . . and the mounting board 17 are fixed to each other by, for example, welding them together in a furnace.

Each heat sink 1 fixed on the mounting board 17
The spacing l ₁ between the air holes 14 , 15 , . . . ₉ , _19, . and the distance between adjacent heat sinks 19, 19,...
Each air hole 14, 15, . . . is arranged so as to be located within l ₁ .

As described above, the adjacent heat sinks 19, 19,...
Since the air holes 14, 15, . As shown by the arrows, the air passes through the air holes 15, 15, . After bending,
Each air hole 1 further formed in the side plate 12 from there
4, 14, . . . and is immediately released to the outside. Therefore, air convection can be improved, and heat generated inside the heating element 16 such as a power transistor can be efficiently dissipated to the outside together with the air convection.

That is, in the above-mentioned air convection, the heated air absorbs the heat generated inside the heating element 16 via the mounting board 17 and is heated by the outer casing part 1.
It does not flow into the inside of 1. Therefore, other parts of the heating element 16 inside the outer casing 11 are not heated by this heated air.

Furthermore, in the above embodiment, the intervals l ₂ and l ₁ between the air holes 14, 15, . . . and the heat sinks 19, 19, .
The interval may be widened or narrowed, or may be partially widened or narrowed depending on the mounting position of 6.

As described above, the present invention provides air holes in the side and bottom plates of the outer casing, and tilts the mounting board to which the heating element is attached inside the outer casing toward the side plate with respect to the bottom plate. At the same time, a plurality of heat dissipating plates arranged perpendicularly to the bottom plate form a space at a predetermined interval in a space surrounded by the mounting board, the side plate, and the bottom plate. Therefore, in the present invention, air flows in through the air hole formed in the bottom plate, this air is heated by the mounting board, and then passes through the space at the predetermined interval to form the air in the side plate. It is discharged from the hole. Such air convection absorbs heat from the heating element by cooling the mounting board and the heat sink.

That is, in electrical equipment such as an amplifier to which the heat dissipation device of the present invention is applied, the air that has been heated by absorbing heat from the internal heating element is used to absorb heat from the internal heating element and heat the air in which other parts that make up the electrical equipment are housed. It is discharged without passing through the inside of the outer casing. Therefore, the heated air does not heat the other components.

In addition, since the heated air is discharged from the side plate of the outer casing, even if another electrical device is placed close to the top of this electrical device, the heated air will not be able to be discharged. I never get caught.

Further, by providing the mounting board at an angle toward the side plate, it is possible to easily reduce the thickness of the outer casing, and to guide the air convection to realize smooth convection.

The present invention provides a heat radiating device as described above that can efficiently dissipate heat from a heating element to the outside of an outer casing.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal section showing a conventional heat dissipation device.
Figure 2 and the following diagrams show an embodiment of the heat dissipation device according to the present invention. Figure 2 is a vertical cross-sectional view of the heat dissipation device, and Figure 3 is a partial view of the state before the mounting board is assembled into the outer casing. A broken perspective view and FIG. 4 are perspective views showing the state before each heat sink is fixed to the mounting board. 11... Outer casing, 12... Side plate, 13... Bottom plate, 14, 15... Air hole, 16... Heating element, 1
7...Mounting board, 18...Space, 19...Each heat sink, 21...Top plate.

Claims (1)

[Scope of utility model registration request] A mounting board to which a heating element is attached is provided inside the outer casing having air holes formed in the side plate and the bottom plate, respectively, and is inclined toward the side plate with respect to the bottom plate, and the mounting board, the side plate, and the bottom plate are provided. A heat radiating device characterized in that a plurality of heat radiating plates are arranged upright with respect to the bottom plate to form a space at a predetermined interval in a space surrounded by.