JPS6241096A - Preparation of integrated circuit card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for producing an IC card incorporating an IC module.

(Description of Prior Art) In recent years, various types of cards have been used in banks, department stores, credit companies, etc., and attempts have been made to use IC cards that have a built-in IC module with a large storage capacity and high secrecy. There is.

This IC card has the same size and thickness as a magnetic card equipped with a magnetic stripe, and at first glance appears to have the same form as a magnetic card, but it has an IC module built into the predetermined position of the card, and an IC module on the surface of the card. An electrode hole is provided to expose the electrode of the module, a card display is provided so that the issuing company and type of the IC card can be identified at a glance, and an electrode hole is provided to match the electrode hole. It is made up of laminated sheets that protect the card display.

The above-mentioned IC card is made from card sheet materials such as a front transparent sheet material, a front sheet material, a center core sheet material, a back sheet material, and a back transparent sheet material having a size multiple times the card size, To create it, (a) forming holes for electrodes at predetermined positions in each of the plurality of card parts in the above-mentioned front side transparent sheet material and front side sheet layer separately; (b) forming each of the above-mentioned front side sheet material and back sheet material; A process of printing card display on a plurality of card parts, (c) A process of making frame holes to accommodate IC modules in predetermined positions of a plurality of card parts of the center core sheet material, (d) Five processed sheets. The front transparent sheet material,
A step of stacking the front sheet material, center core sheet material, back sheet material, and back transparent sheet material in this order, and fitting the IC module into the frame hole of the center core sheet material; Aligning the position of the card part; (f) Applying heat and pressure to the five stacked sheets to stack the five sheets at once; (g) Starting from a predetermined position of the stacked sheets. IC cut into card size
The process involved obtaining an IC card with a built-in module.

(Problems to be Solved by the Invention) As mentioned above, an IC card has the same form as a magnetic card at first glance, but it has an IC module built into the card, and information can be read/received to/from the IC. In order to write data, the positions of the electrodes of the IC module and the terminals of the reader/writer must have a predetermined relationship.

Therefore, in a magnetic card, the magnetic stripe provided on the card surface should be provided at a predetermined position from the edge of the card so as to have a predetermined positional relationship with the head of the reader/writer of the magnetic card. In the case of an IC card, even if the electrode hole for exposing the electrode of the IC module provided on the front side of the card is provided at a predetermined position from the edge of the card, the I
If the position of the C module deviates from the specified position,
Poor contact with the IC card's reader/writer terminals may occur, or conversely, even if the IC module is installed in the specified position, the reader/writer may be damaged if the electrode hole on the front side is shifted from the specified position. IC may cause poor contact with the terminal.
Providing electrode holes and frame holes in the three sheets that are the laminated materials of the card, the front transparent sheet material, the front sheet material, and the center core sheet material, requires high processing precision, and five sheets are stacked one on top of the other. Holes for electrodes in each sheet material when laminated together,
It required a lot of effort to perfectly align the frame holes and the card display printing and to stack the cards.

Moreover, in the production of the above-mentioned IC cards, even if each sheet material is precisely processed and printed with the electrode holes, frame holes, card display, etc. and is superimposed, the lamination conditions such as adhesive and/or heat When laminating by applying pressure, due to the difference in the degree of expansion and contraction of each sheet material, even if the lamination condition of some card parts is good, the lamination condition of other parts is poor, and this reduces the production efficiency. Worse and more expensive I
This was uneconomical because the other IC cards in which the C module was built had to be defective.

In particular, when applying lamination conditions, five sheets were stacked one on top of the other, so there were many gaps between the sheet materials, and although each sheet material was in a planar state macroscopically, various factors It has unevenness and the lamination conditions are not transmitted uniformly.
In addition, it is necessary to eliminate air bubbles that occur on the surface of each sheet layer, so heat
It was necessary to use heat and pressure rollers with high pressure settings.

As a result, the degree of expansion and contraction of each sheet material increases, leading to an increase in the number of defective products, and even if the IC card is laminated in good condition, the IC module built into it is destroyed by heat and pressure, further increasing the number of defective products. Was.

In addition, during the processing, printing, stacking, and other handling of the five sheet materials, static electricity generated on the sheet materials and other factors may cause minute dust to adhere to the sheet materials, and this dust is difficult to detect before lamination. Furthermore, since it is difficult to remove, IC cards have to be manufactured with dust mixed in, resulting in the generation of defective cards.

The defective cards mentioned above are discovered during post-molding inspection and disposed of, resulting in poor IC card production efficiency and yield.
This was very uneconomical because the IC cards to be disposed of contained expensive materials.

(Method for Solving the Problems) Therefore, the present invention was made in view of the above-mentioned problems, and in a method for producing an IC card with a built-in IC module, a predetermined size larger than the card size is processed as a processing unit size. Then, a card display is printed on the back side of a front transparent sheet material of a predetermined size having a size equal to or larger than this processing unit size or at a predetermined position on the surface of the front sheet material, and the front transparent sheet material is superimposed on the surface of the front sheet material, The process of creating a card front sheet by laminating under lamination conditions, then cutting into processing unit size sheets, and providing holes for electrodes to expose the electrodes of the IC module at predetermined positions.A sheet to be used as the center core of the card. A center made by having the same size as the processing unit size sheet, and providing a frame hole approximately the same size as the IC module size at a predetermined position on this sheet in a predetermined relationship with the electrode hole on the card front sheet. Core sheet creation process: Lay the backside transparent sheet material on a backside sheet material of a predetermined size that is more than twice the size of the processing unit size sheet, apply M4 layer conditions to w4FmL, and then convert it into a processing unit size sheet. A step of creating a card back sheet by cutting, stacking the card front sheet, center core sheet, and card back sheet of the processing unit size created in each of the above steps so that each transparent sheet material is exposed; The process of creating a temporarily bound laminated sheet where lamination conditions are applied to the edge side of the processing unit size sheets, partial lamination is performed and temporary binding is performed, and an IC module is installed in the frame hole of the center core sheet before and after temporary binding of the temporary bound laminated sheet. A step of creating a laminated sheet with a built-in IC module in which laminating conditions are applied to the unlaminated portion of the provisionally bound fa-layer sheet that will become the card portion, and the laminated sheet with a built-in IC module is laminated. be.

(Operations and Effects) In this invention, five sheets including a sheet printed with a card display are laminated on a predetermined number of sheets to form three sheets, and each sheet is made into an accurate processing unit size. Since the processing unit size includes a process of forming holes for electrodes and forming holes for frames, at this stage, we remove sheets with lamination defects, poor positioning, defects in dust, etc., and produce three sheets of good quality. Moreover, since the three sheets are of the same processing unit size, they can be stacked without causing any positional defects, and since these three sheets are temporarily bound, the card part When laminating conditions are applied to the stacking conditions, there is less risk of malpositioning of the IC module frame holes, electrode holes, and printing, and there is also less risk of the IC module housed in the frame falling off. It is easier to handle, and since three sheets are laminated, there are fewer gaps between the sheet layers, so the IC module can be laminated without excessive adhesion conditions, and each unit processing size can be adjusted. Since the positions of the sheets match, it can be easily cut from a predetermined position, and good quality IC cards can be produced efficiently and with a high yield, making it very economical.

(Example) The present invention will be described with reference to drawings showing examples of the invention. FIG. 1 is an explanatory diagram of the method for producing an IC card of the present invention. The IC card according to the present invention includes an IC module and a front transparent sheet material 10 made of a synthetic resin sheet. Front sheet material 20, center core sheet material 30,
It is created from a back sheet material 40 and a back transparent sheet material 50.

Each sheet material is in the form of a roll or sheet as shown in FIG. 1, but it is not limited to the shape of a roll or sheet as long as it is a processing unit size of a predetermined size larger than the card size. Next, the present invention will be explained along with the processing steps of these sheet materials.

The front transparent sheet material 10 and the front sheet material 20 have the same width and a size that is more than twice the processing unit size, and the front sheet material 20 has a predetermined position of each processing unit size as a card part, A card display print 21' is sequentially applied to the surface of the section by the printing unit 21 and transferred, and the front transparent sheet material 10 is superimposed on the printed surface of the front sheet material 20, and lamination conditions are applied by heat and pressure rollers 22 and 22, and the front side is The transparent sheet material 10 and the front sheet material 20 are laminated.

Next, the sheet is cut into processing unit size sheets 24 by the cutting device 23 as shown in FIG. 2(A). In this embodiment, the processing unit size sheet 24 is provided with one card portion C, but the processing unit size may be increased and a plurality of card portions may be provided. In addition, when each of the above-mentioned sheet materials is in the form of a sheet, card display printing 21' is performed on the card portions of a plurality of processing unit sizes of a predetermined sheet material, and then both sheet materials are overlapped and laminated to form a processing unit size sheet 24. It may be cut into pieces.

The above-mentioned processing unit size sheet 24 is transported by a belt 25, and when it has progressed to a predetermined position, it is stopped at a predetermined position by a stopper that senses this and descends, and a both-side width aligner 26, and is then stopped at a predetermined position by an electrode hole-making machine. 27, an electrode hole 27' is made at a predetermined position as shown in FIG. 2(A). Next, if a defective position at 7', dust, air bubbles, etc. is detected, the sorter 29 moves to the dotted line position, and if the item is dropped onto the tray 29' as a defective item and the sorter R29 does not operate, it is selected as a good item. The roller 6 serves as the card front sheet 24'.
carried by 4.

Note that the card display printing 21' is used to detect the positional defect.
If you print the cutting position register marks (marks) and perforation position register marks when carrying out the process, it will be easier to detect the marks, and you can also visually sort out pass/fail sheets instead of using a sensor.

The center core sheet material 30 is transported by rollers 31 and 32, cut by a cutting device 33 into processing unit size sheets 34 of the same size as the card front sheet 24' of the processing unit size described above, transported by a belt 35, and cut into processing unit size sheets 34 of the above processing unit size. It is stopped at a predetermined position by a stopper and a width adjusting machine 36 similar to that shown in FIG. It will be done. Next, the product is transported by the belt 35', and if dust, air bubbles, or dirt is detected by the sensor 38, the sorter 39 moves to remove the product from the tray 3 as a defective product.
9', and the good products are carried by rollers 65 as center core sheets 34'.

The back sheet material 40 and the back transparent sheet material 50 are rolls having the same width as the front sheet material 20 and the first transparent sheet material 10 described above, and a card is displayed at a predetermined position on the back of the card portion C of the back sheet material 40. Printing 41' is printing unit 41
Performed by. The back side transparent sheet material 50 is superimposed on this printed surface, and lamination conditions are applied by heat and pressure rollers 42, 42, so that the back side sheet material 40 and the end side transparent sheet material 50 are laminated. Next, the sheet is cut into processing unit size sheets 44 by the cutting device 43 as shown in FIG. In this case, by the movement of the sorter 49, defective products are dropped onto a tray 49', and good products are transferred as a card back sheet 44' onto a belt 61 having pressing tools 62, 62.

Further, the rollers 64 and 65 are configured to supply one card front sheet 24' center core sheet i to 34' each time the sheet material pressing tool 62 passes. Therefore, as the card back sheet 44' is sequentially transferred, the center core sheet 34' is superimposed thereon, and the card front sheet 24' is roughly superimposed thereon. With these three sheets stacked together, the stopper and width l! The binding machine 36 adjusts the arrangement, and the temporary stitching machine 6
7, heat and pressure, which are lamination conditions, are applied along the stacked edges or inside the edges in a dotted manner, and the sheets are partially laminated to form a temporarily bound laminated sheet 54 having a temporarily bound portion 67'. At this time, if the temporarily bound laminated sheet 54 has a binding position defect, it is removed as a defective product.

Then, when stopped by the stopper 68, the vacuum 6
9, the ends of the card front sheets 1 to 24' are suctioned and turned over, and the IC module 99 is fitted into the frame hole 37' of the center core sheet 34'.

The thickness of this IC module 99 is the center core sheet 34.
It is processed to be the same thickness or slightly thinner than '.

Thereafter, the paper is transferred to a laminating device consisting of a heat and pressure roller 70 and a transfer table 70', and the temporary stitching 8! Lamination conditions such as heat and pressure are applied to the unlaminated portion of the i-layer sheet 54, which will become the card portion, to form a laminated sheet 54' with a built-in IC module.

Next, the IC card 10 is transferred by the belt 71, stopped at a predetermined position by the stopper and width adjustment 11172, and cut into card size by the card punching machine 73.
0 is led into tray 74 and advanced in sequence.

The surface and cross-sectional views of the above-mentioned IC card are shown in Figure 4 (a) and (b).
As shown in FIG. 1, the thickness of each sheet material is selected as required and the card is processed to a desired thickness of 0.7 to 1.5 mm. Furthermore, in the figure, lines are used to represent the spaces between the laminated sheets, but these lines become unnecessary because the sheets are integrated depending on the laminating conditions.

In the above description, the cutting of the processing unit size sheet of each sheet material and the processing of the electrode holes 27', the frame holes 37', etc. are performed separately, but these processing and cutting may be performed at the same time.

In the above, after the card front sheet 24', center core sheet 34', and card back sheet 44' are obtained, the card front sheet 24' and the center core sheet 34' are removed.
Or center core sheet 34' and card back sheet 44
After applying lamination conditions to these sheets and laminating them, the card back sheet 44' or the card front sheet 24' is overlaid, and in this overlapping process, the temporary stitching machine 67 is used in the same manner as in the above-mentioned process. The IC card 74 may be produced by partially laminating and performing the same steps as described above.

In addition, although the lamination conditions described above apply heat and pressure, it is also possible to use an adhesive and appropriate pressure, or heat and pressure.If each sheet material is PVC-based, the adhesive used is cyanoacrylate. By using a solvent-free type such as , it is possible to prevent bubble defects from occurring. In particular, the process using an adhesive as a lamination condition is preferably used for laminating the card front sheet 24', center core sheet 34, and card back sheet 44'.

In addition, in this lamination, as shown in FIG. 3(A), electrode holes 27' provided in the card front sheet 24' are
was covered with a thin adhesive tape T of 35 μm or less with adhesive from the transparent sheet material 10 side, and then a pressure of 2 to 5 KCI/ci was sequentially applied from the partially laminated side as shown in Figure 3 (b). By applying appropriate heat and repeatedly applying pressure to stack the layers, the adhesive M will not stick to the electrodes P of the IC module and will not protrude from the electrode holes 27'.

Furthermore, in the above description, the card front sheet 24' center core sheet 34' and the card back sheet 44' were made to have the same processing unit size, and the alignment of each sheet was performed at their edges, but the card front sheet 24' ′
, the center core sheet 34', and the card back sheet 44', four are provided on the sides as shown in FIG. If the sheets are conveyed through guide pins G provided in the sheet, positioning of each sheet becomes easy, and the conveyance of each sheet when applying pressure is also stabilized.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of the method for producing an IC card of the present invention;
Figure 2 (A) is a perspective view of the front sheet of the card, and Figure 2 (B) is a perspective view of the front sheet of the card.
FIG. 4 is a perspective view of a center core sheet, FIG. 4 is an explanatory diagram of a method of applying lamination conditions, FIG. 4A is a perspective view of an IC card produced according to the present invention, and FIG. 10 is a front transparent sheet material, 20 is a front sheet material, 24'
is the card front sheet, 30 is the center core sheet material, 34
' is the center core sheet, 40 is the back sheet material, 44' is the card back sheet, 50 is the back transparent sheet material, 99 is I
C module, 100 is an IC card.

Claims (6)

[Claims] (1) In a method for producing an IC card with a built-in IC module, a predetermined size larger than the card size is used as the processing unit size, and the back side of the front transparent sheet material or the front sheet material of a predetermined size larger than the processing unit size. A card display is printed at a predetermined position on the surface of the front sheet, a front transparent sheet material is superimposed on the surface of the front sheet material, laminated under lamination conditions, and then cut into processing unit size sheets, and an IC module is placed at a predetermined position. The process of creating a card front sheet by providing electrode holes to expose the electrodes, the sheet to be the center core of the card is the same size as the processing unit size sheet, and the predetermined relationship with the electrode holes of the card front sheet is made. A step of creating a center core sheet by providing a frame hole of approximately the same size as the IC module size at a predetermined position of this sheet, Overlapping transparent sheet materials,
A process for creating a card back sheet by laminating them under lamination conditions and then cutting them into processing unit size sheets; A processing unit size card front sheet, center core sheet, and card created through each of the above steps; The process of creating a temporary binding laminated sheet in which back sheets are overlapped so that each transparent sheet material is exposed, lamination conditions are applied to the edge side of the processing unit size sheets, partial lamination is performed, and temporary binding is performed, and the above temporary binding lamination is performed. a step of installing an IC module in the frame hole of the center core sheet before and after temporary binding of the sheets; a step of creating a laminated sheet with a built-in IC module in which a lamination condition is applied to the unlaminated portion of the temporary laminated sheet that will become the card portion, and the laminated sheet is laminated; A method for making an IC card, comprising the step of cutting the laminated sheet with a built-in IC module into a card size from a predetermined position to form a card with a built-in IC module. (2) A patent claim comprising the step of creating a temporarily bound laminated sheet by overlapping and laminating a card front sheet or card back sheet and a center core sheet, and partially laminating this and a card back sheet or card front sheet at the overlapping edge side. A method for producing an IC card as described in Scope 1. (3) A method for producing an IC card according to claim 1, wherein the IC card is produced by laminating a card front sheet or card back sheet made of a synthetic resin material and a center core sheet using a solvent-free adhesive. (4) After covering the electrode holes provided on the card front sheet from the transparent sheet material side with a thin adhesive sheet,
The method for producing an IC card according to claim 2, wherein the IC card is produced by laminating the IC card with a center core sheet. (5) Claim 1 states that adhesive is poured into the partially laminated side between the card front sheet or the card back sheet and the center core sheet, and each sheet is laminated by applying pressure sequentially from the partially laminated side. How to create an IC card. (6) A process of providing guide holes in the same position when the card front sheet, center core sheet, and card back sheet of the processing unit size are overlapped, and the stacking of each sheet is done at the edge of the processing unit size. The IC according to claim 1, further comprising the step of aligning the sheets, passing a guide pin through the guide hole of each sheet, aligning each sheet, and applying lamination conditions using an adhesive.
How to create cards.