JPS6237950A - Electronic-part mounting package - Google Patents

Electronic-part mounting package

Info

Publication number
JPS6237950A
JPS6237950A JP60177165A JP17716585A JPS6237950A JP S6237950 A JPS6237950 A JP S6237950A JP 60177165 A JP60177165 A JP 60177165A JP 17716585 A JP17716585 A JP 17716585A JP S6237950 A JPS6237950 A JP S6237950A
Authority
JP
Japan
Prior art keywords
main body
flange
lid
package
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60177165A
Other languages
Japanese (ja)
Inventor
Koji Nose
幸之 野世
Hitoo Iwasa
仁雄 岩佐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP60177165A priority Critical patent/JPS6237950A/en
Publication of JPS6237950A publication Critical patent/JPS6237950A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/124—Tongue and groove joints
    • B29C66/1246—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove
    • B29C66/12461—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove being rounded, i.e. U-shaped or C-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
    • B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
    • B29C66/1312—Single flange to flange joints, the parts to be joined being rigid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/242—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours
    • B29C66/2424—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain
    • B29C66/24243—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral
    • B29C66/24244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B29C66/30223—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/542—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining hollow covers or hollow bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • B29C66/73941—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset characterised by the materials of both parts being thermosets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

PURPOSE:To enhance airtight property, by providing a flange type at the bonding parts of a main body and a cap, providing protruded and recessed coupling surfaces at the bonding parts, and bonding the bonding parts by ultrasonic wave fusion. CONSTITUTION:A cap 3 is provided with a recessed hole 7 and a flange 11 as in a main body 2. A V shaped or U shaped protruded wall 13 is formed around the periphery of the lower surface of the flange 11. The surfaces of the flanges 11 of the main body 2 and the cap 3 are made to face each other, and the protruded wall 13 is coupled to the flange groove 12. When ultrasonic wave vibration is applied, the protruded wall 13 is fused. The main body 2 and the flange groove 12 are welded. Thus airtight property is enhanced.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体装置を搭載するプラスチック型パッケ
ージの構造に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the structure of a plastic package for mounting a semiconductor device.

従来の技術 情報消去可能型半導体記憶素子を搭載するだめのプラス
チック型パンケージでは、通常、本体側に半導体記憶素
子が搭載しうる大きさの空洞を設けて、空洞部の底面に
は半導体記憶素子を接合するダイパッド部と、パッケー
ジ外部と半導体記憶素子との間での電気信号の伝達を行
うだめのリード線接続用インナーリード先端部とを露出
させている。このダイパッド部とインナーリード先端部
の表面は、金や銀の薄いメッキ層または、アルミニウム
のクラッド層が施されており、ダイパッド部に銀ペース
トや錫−鉛ハンダで半導体記憶素子が搭載され、半導体
記憶素子の入出力信号端子とインナーリードのメッキ部
は金またはアルミニウムからなる細線で接続されている
。この状態で、空洞部の蓋に用いる石英ガラスもしくは
グラスチ３　・−、 ツクと熱膨張率が近いアルミナガラスが空洞部に嵌め適
寸れ、空洞部側壁プラスチック面とガラス側壁面とが接
着剤で接着される。そして接着剤が、加熱丑たは、光照
射によって硬化され、従来の中空型プラスチックパッケ
ージが達成される。Conventional plastic pancakes for mounting erasable semiconductor memory devices usually have a cavity large enough to accommodate the semiconductor memory device on the main body side, and the semiconductor memory device is mounted on the bottom of the cavity. The die pad portion to be bonded and the inner lead tip portion for connecting lead wires for transmitting electrical signals between the outside of the package and the semiconductor memory element are exposed. The surfaces of the die pad and the tips of the inner leads are coated with a thin gold or silver plating layer or an aluminum cladding layer, and a semiconductor memory element is mounted on the die pad using silver paste or tin-lead solder. The input/output signal terminal of the memory element and the plated portion of the inner lead are connected with a thin wire made of gold or aluminum. In this state, quartz glass or alumina glass, which has a coefficient of thermal expansion similar to that of Glasti 3--, used for the lid of the cavity, is fitted into the cavity to the appropriate size, and the plastic side wall surface of the cavity and the glass side wall surface are bonded with adhesive. Glued. The adhesive is then cured by heating or light irradiation to achieve a conventional hollow plastic package.

発明が解決しようとする問題点 従来技術においては、空洞部の蓋に、石英やアルミナ等
の高価なガラス材料を必要とし、またそれらの接着には
パノケージプラスチノクやガラスと異る接着剤を用いて
おり、その接着部での熱膨張係数の差から耐熱ザイクル
性や耐湿性の信頼性に問題があった。Problems to be Solved by the Invention In the prior art, expensive glass materials such as quartz and alumina are required for the lid of the cavity, and adhesives different from panocage plastic or glass are used to bond them. However, due to the difference in thermal expansion coefficient at the bonded part, there was a problem with the reliability of heat cycle resistance and moisture resistance.

問題点を解決するだめの手段 本発明では、前述の問題を解決すべく、パッケージの本
体と蓋をプラスチックで構成し、プラスチックには、熱
可塑性プラスチックを用い、蓋側にはポリカーボネート
やアクリルを含む耐熱性透明プラスチックを用いる。さ
らに、パッケージの本体と蓋の接続にはフランジ型形状
の接合部をそなえ、同接合部の超音波溶融接着法を用い
る。これにより上記問題は解決できる。Means to Solve the Problem In the present invention, in order to solve the above-mentioned problem, the main body and lid of the package are made of plastic, and the plastic is made of thermoplastic, and the lid side is made of polycarbonate or acrylic. Use heat-resistant transparent plastic. Furthermore, a flange-shaped joint is provided to connect the main body of the package and the lid, and an ultrasonic melt bonding method is used for the joint. This solves the above problem.

作　　用 パンケージを構成する本体及び蓋に熱可塑性プラスチッ
クを用いることで、機械的振動に」：る接合部の溶融化
接着が可能となる。さらに接続のだめのプラスチック発
熱は部分的で、パッケージ内部に搭載した半導体素子に
殆んど熱を伝えることなく、本構造が達成できる。By using thermoplastic plastic for the main body and lid that make up the pan cage, it is possible to melt and bond the joints against mechanical vibration. Furthermore, the heat generated by the plastic at the connection point is only local, and this structure can be achieved without transmitting almost any heat to the semiconductor element mounted inside the package.

実施例 以下に本発明の実施例を撮像半導体素子用中空、型プラ
スチックパッケージの構造を例にとって第１図と第２図
を参照しながら説明する。Embodiments Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2, taking the structure of a hollow plastic package for an imaging semiconductor device as an example.

中空型パッケージは、半導体素子１を封入する容器とし
て、本体２と蓋３とから構成されており、本体２は、ポ
リフェニルサルファーからなる熱可塑性プラスチック（
以下ＰＰＳ樹脂と記す）で、蓋３ば、アクリル（以下Ａ
Ｌ樹脂と記す）やポリカーボネイト（以下ＰＣ樹脂と記
す）からなる熱可塑性プラスチックを用いる。中空ノく
ツケージの本体２は半導体素子１が搭載でき、さらに本
体２５ベー／ 中に埋め適寸れた、リードフレーム４のインｆ　−リー
ド５と半導体素子１との間を金属細線６で接続する作業
が出来る程度の大きさの矩形の窪み穴７を設ける。この
窪み穴７の底面は、半導体素子搭載部８とインナーリー
ド５の先端部表面が、ＰＰＳ樹脂面とほぼ同一平面に露
出している。ここで使用するリードフレーム４の材質は
、鉄−ニッケル合金（４２アロイ）やコバールや銅合金
を用いる。The hollow package is composed of a main body 2 and a lid 3 as a container for enclosing the semiconductor element 1. The main body 2 is made of thermoplastic plastic (polyphenyl sulfur).
The lid 3 is made of acrylic (hereinafter referred to as PPS resin) (hereinafter referred to as A).
A thermoplastic made of polycarbonate (hereinafter referred to as PC resin) or polycarbonate (hereinafter referred to as PC resin) is used. The main body 2 of the hollow socket cage can be loaded with the semiconductor element 1, and the semiconductor element 1 and the inf-leads 5 of the lead frame 4, which are embedded in the main body 25 bases and have an appropriate size, are connected by a thin metal wire 6. A rectangular depression hole 7 of a size that allows the work to be performed is provided. On the bottom surface of the recessed hole 7, the semiconductor element mounting portion 8 and the front end surfaces of the inner leads 5 are exposed on substantially the same plane as the PPS resin surface. The material of the lead frame 4 used here is iron-nickel alloy (42 alloy), Kovar, or copper alloy.

そして、リードフレーム４が窪み穴７の底面に露出する
部分の表面は、０．５〜３７ｚｍ程度の厚みの金や銀メ
ッキもしくはアルミニウム箔をクラ、ｙドした表面加工
層９を形成する０ 半導体素子１の入出力信号端子部である主としてアルミ
ニウムからなるポンプイングツくラド１゜と表面加工層
９との電気的接続は、アルミニウム。The surface of the portion of the lead frame 4 exposed at the bottom of the recessed hole 7 is coated with gold, silver plating, or aluminum foil with a thickness of about 0.5 to 37 mm to form a surface processed layer 9. The electrical connection between the input/output signal terminal portion of the element 1, the pumping pad 1° mainly made of aluminum, and the surface processed layer 9 is made of aluminum.

金もしくはパラジウムからなる金属細線６を用いて、超
音波法や熱圧着法により行う。さらに、中空型パッケー
ジの窪み穴７の全周囲の側壁部には適当な幅と厚みのフ
ランジ１１を設け、そのクラ６　ベー／ ンジ接合面の全周にはｖ形、Ｕ形あるいは角形の溝１２
を５０〜２００μｍの深さに形成する。This is carried out using a thin metal wire 6 made of gold or palladium by an ultrasonic method or a thermocompression bonding method. Furthermore, a flange 11 of appropriate width and thickness is provided on the side wall around the entire circumference of the hollow hole 7 of the hollow package, and a V-shaped, U-shaped, or square groove is provided on the entire periphery of the joint surface of the cavity 7. 12
is formed to a depth of 50 to 200 μm.

つぎに、蓋３は、先に述べたＡＬ樹脂やＰＣ樹脂のよう
な可視光透過性の透明樹脂で、本体２と同一寸法に射出
や押し出し法で成形する。蓋３は本体２と同様に凹形の
窪み穴７とフランジ１１を設ける。そしてフランジ１１
の下面全周にはｖ形やＵ形あるいは角形のフランジ凸形
壁１３を１ｏ○〜３００μｍの高さに形成する。このフ
ランジ凸形壁１３は、本体２側のフランジ接合面の溝１
２と同一位置に形成し、本体２と蓋３のフランジ１１０
面を対向させ、フランジ凸形壁１３はフランジ溝１２に
は捷り込むようにする。Next, the lid 3 is made of a transparent resin that transmits visible light, such as the above-mentioned AL resin or PC resin, and is molded to the same dimensions as the main body 2 by injection or extrusion. Like the main body 2, the lid 3 is provided with a concave recess 7 and a flange 11. and flange 11
A V-shaped, U-shaped, or square flange convex wall 13 is formed at a height of 100 to 300 μm around the entire lower surface of the flange. This flange convex wall 13 is formed by the groove 1 on the flange joint surface on the main body 2 side.
2 and the flange 110 of the main body 2 and the lid 3.
The surfaces of the flange convex walls 13 are arranged to face each other, and the flange convex walls 13 are cut into the flange grooves 12.

この状態で、本体２を固定して蓋３側から超音波振動や
高周波誘導を加えてやると、フランジ凸形壁１３は溶融
して本体２フランジ溝１２と溶着でき、透明窓を有する
中空型プラスチックパッケージの気密封止が達成できる
。In this state, when the main body 2 is fixed and ultrasonic vibration or high frequency induction is applied from the lid 3 side, the flange convex wall 13 melts and can be welded to the flange groove 12 of the main body 2, forming a hollow shape with a transparent window. Hermetic sealing of plastic packages can be achieved.

発明の効果 本発明によると、次のような効果がある０７へ− （１）ハノケージ構成部品が安価である。Effect of the invention According to the present invention, to 07 which has the following effects- (1) Hanokage components are inexpensive.

（２）ハラケージが軽量である。(2) The Hara cage is lightweight.

（３）本体と蓋の接続が溶着法であるだめ、気密性が高
い。(3) Since the main body and lid are connected by welding, airtightness is high.

（４）半導体ＥＰＲＯＭや撮像素子など広い用途で適用
しうる。(4) It can be applied to a wide range of applications such as semiconductor EPROMs and image pickup devices.

（樽　部分加熱を用いるため、半導体素子への熱的影響
が少々い。(Keg) Since partial heating is used, there is a slight thermal effect on the semiconductor elements.

【図面の簡単な説明】[Brief explanation of the drawing]

１・・・・半導体素子、２・・・・・・本体、３・・・
・蓋、４・・・・・・リードフレーム、５・・・・イン
ナーリード、６・・・・・金属細線、７・・・窪み穴、
８・・・・・・半導体素子搭載部、９・・・・・表面加
工層、１ｏ・・・・・ボンデインクハソド、１１・・・
・・・フランジ、１２・・・・・・フランジ溝、１３・
・・・・・フランジ凸形壁○代理人の氏名　弁理士　中
　尾　敏　男　ほか１名第１図 ２−一一本ブト 第２図1...Semiconductor element, 2...Main body, 3...
・Lid, 4... Lead frame, 5... Inner lead, 6... Fine metal wire, 7... Recessed hole,
8...Semiconductor element mounting portion, 9...Surface processing layer, 1o...Bonde ink layer, 11...
...Flange, 12...Flange groove, 13.
...Flange convex wall○ Name of agent: Patent attorney Toshio Nakao and one other person Figure 1 2-11 Butto Figure 2

Claims (4)

【特許請求の範囲】[Claims] （１）本体および蓋からなる電子部品用樹脂型パッケー
ジであって、本体および蓋の互いの接合部分をフランジ
型構造結合になしたことを特徴とする電子部品搭載用パ
ッケージ。(1) A resin-type electronic component package consisting of a main body and a lid, characterized in that the joints of the main body and the lid are formed into a flange-type structural connection. （２）パッケージの本体及び蓋のフランジ型形状接合部
が、Ｖ形、Ｕ形もしくは直角を含む多角形の凹凸嵌合面
で密接されたことを特徴とする特許請求の範囲第１項記
載の電子部品搭載用パッケージ。(2) The flange-shaped joint portion of the main body and the lid of the package is closely connected by a concave-convex fitting surface having a V-shape, a U-shape, or a polygon including a right angle. Package for mounting electronic components. （３）パッケージの本体または蓋のどちらか一方または
両者に、予め金属製リードを挿入することを特徴とする
特許請求の範囲第１項または第２項記載の電子部品搭載
用パッケージ。(3) The electronic component mounting package according to claim 1 or 2, wherein a metal lead is inserted in advance into either or both of the main body and the lid of the package. （４）本体と蓋が熱可塑性または熱硬化性樹脂からなる
ことを特徴とする特許請求の範囲第１項、第２項または
第３項記載の電子部品搭載用パッケージ。(4) The electronic component mounting package according to claim 1, 2, or 3, wherein the main body and the lid are made of thermoplastic or thermosetting resin.
JP60177165A 1985-08-12 1985-08-12 Electronic-part mounting package Pending JPS6237950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60177165A JPS6237950A (en) 1985-08-12 1985-08-12 Electronic-part mounting package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60177165A JPS6237950A (en) 1985-08-12 1985-08-12 Electronic-part mounting package

Publications (1)

Publication Number Publication Date
JPS6237950A true JPS6237950A (en) 1987-02-18

Family

ID=16026317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60177165A Pending JPS6237950A (en) 1985-08-12 1985-08-12 Electronic-part mounting package

Country Status (1)

Country Link
JP (1) JPS6237950A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5151773A (en) * 1990-03-30 1992-09-29 Hitachi, Ltd. Electronic circuit apparatus comprising a structure for sealing an electronic circuit
FR2711462A1 (en) * 1993-08-11 1995-04-28 Siemens Matsushita Components Electrical component made in the manner of a chip.
US5436492A (en) * 1992-06-23 1995-07-25 Sony Corporation Charge-coupled device image sensor
JPH09237901A (en) * 1996-02-28 1997-09-09 S I I R D Center:Kk Semiconductor device
US5889323A (en) * 1996-08-19 1999-03-30 Nec Corporation Semiconductor package and method of manufacturing the same
US5927505A (en) * 1995-07-24 1999-07-27 Lsi Logic Corporation Overmolded package body on a substrate
US5977622A (en) * 1997-04-25 1999-11-02 Lsi Logic Corporation Stiffener with slots for clip-on heat sink attachment
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
WO2002001630A2 (en) * 2000-06-28 2002-01-03 Eads Deutschland Gmbh Hermetic high frequency module and method for producing the same
EP1576652A2 (en) * 2002-06-19 2005-09-21 Foster-Miller, Inc. Chip package sealing method
EP1096563A3 (en) * 1999-10-27 2006-05-24 Nihon Dempa Kogyo Co., Ltd. Semiconductor package with premolded parts

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5151773A (en) * 1990-03-30 1992-09-29 Hitachi, Ltd. Electronic circuit apparatus comprising a structure for sealing an electronic circuit
US5436492A (en) * 1992-06-23 1995-07-25 Sony Corporation Charge-coupled device image sensor
FR2711462A1 (en) * 1993-08-11 1995-04-28 Siemens Matsushita Components Electrical component made in the manner of a chip.
US5927505A (en) * 1995-07-24 1999-07-27 Lsi Logic Corporation Overmolded package body on a substrate
JPH09237901A (en) * 1996-02-28 1997-09-09 S I I R D Center:Kk Semiconductor device
US5889323A (en) * 1996-08-19 1999-03-30 Nec Corporation Semiconductor package and method of manufacturing the same
US5977622A (en) * 1997-04-25 1999-11-02 Lsi Logic Corporation Stiffener with slots for clip-on heat sink attachment
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
EP1096563A3 (en) * 1999-10-27 2006-05-24 Nihon Dempa Kogyo Co., Ltd. Semiconductor package with premolded parts
WO2002001630A3 (en) * 2000-06-28 2002-11-21 Eads Deutschland Gmbh Hermetic high frequency module and method for producing the same
US6958669B2 (en) 2000-06-28 2005-10-25 Eads Deutschland Gmbh Hermetic high frequency module and method for producing the same
WO2002001630A2 (en) * 2000-06-28 2002-01-03 Eads Deutschland Gmbh Hermetic high frequency module and method for producing the same
EP1576652A2 (en) * 2002-06-19 2005-09-21 Foster-Miller, Inc. Chip package sealing method
EP1576652A4 (en) * 2002-06-19 2008-08-20 Foster Miller Inc Chip package sealing method
US7476566B2 (en) 2002-06-19 2009-01-13 Foster-Miller, Inc. Electronic and optoelectronic component packaging technique
US7972901B2 (en) 2002-06-19 2011-07-05 Foster-Miller, Inc. Chip package sealing method

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