JPS62284707A - Wafer breaking device - Google Patents
Wafer breaking deviceInfo
- Publication number
- JPS62284707A JPS62284707A JP61128960A JP12896086A JPS62284707A JP S62284707 A JPS62284707 A JP S62284707A JP 61128960 A JP61128960 A JP 61128960A JP 12896086 A JP12896086 A JP 12896086A JP S62284707 A JPS62284707 A JP S62284707A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- breaking device
- wafer breaking
- chip
- shuttle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims description 35
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３発明の詳細な説明
〔産業上の利用分野〕
本発明は、半導体製造でのウェハーをチップ毎に分ｕＪ
ｆるウェハーブレーキング工程において使用するウェ
ハーブレーキング装置に係り、特にそのウェハーブレー
キング機構に関する。Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention is a method for dividing wafers into chips in semiconductor manufacturing.
The present invention relates to a wafer breaking device used in a wafer breaking process, and particularly relates to its wafer breaking mechanism.
従来のウェハーブレーキング機構を第２図を用いて説明
する。A conventional wafer breaking mechanism will be explained using FIG. 2.
円形のフレームリングに片面粘着テープを用いて固定し
たウェハー１を、図（α）に示すように、ウェハー表面
保護用紙２．Ｓｉ製ゴム風船３と、アンダートレー５．
シャトル６との間に置く。A wafer 1 fixed to a circular frame ring using single-sided adhesive tape is coated with wafer surface protection paper 2. Si rubber balloon 3 and undertray 5.
Place it between it and shuttle 6.
この状態のまま、図（ｂ）に示すように、Ｓｉ製ゴム風
船３にエアーを送り、これを膨張させ、ウェハー１をシ
ャトル６側へと押し付ける。ここで、図（１−）に示す
ように、シャトル６を移動する。このとき、シャトル６
の端面７を利用して、ウェハーの切断線の一方向（紙面
では垂直方向）の分割を行なう。この後、さきに分割し
た方向と直角方向の分割を行なうため、Ｓｉ製風船３．
シャトル６を図（α）の状態に戻し、ウニノＳ−１自体
を水平方向に９０°回転し、再度図（α）から（Ｃ）の
作業を行なう。In this state, as shown in Figure (b), air is sent to the Si rubber balloon 3 to inflate it and press the wafer 1 toward the shuttle 6 side. Here, the shuttle 6 is moved as shown in Figure (1-). At this time, shuttle 6
The end face 7 of the wafer is used to divide the wafer in one direction (vertical direction in the drawing) along the cutting line. After this, the Si balloon 3.
Return the shuttle 6 to the state shown in figure (α), rotate Unino S-1 itself by 90 degrees in the horizontal direction, and perform the operations shown in figures (α) to (C) again.
以上のようにして、各チップ毎に切断線を入れられたウ
ェハーは、チップ毎に分割できる。As described above, the wafer with cutting lines cut into each chip can be divided into chips.
しかし、従来のウェハーブレーキング機構では、各チッ
プ毎に切断線を入れられたウェハーの、チップ端面に沿
りたＸ−Ｙ方向の分割をそれぞれ行なう必要があり、ウ
ェハー１枚当たりの処理時間が大きいという問題を有し
ていた。However, in the conventional wafer breaking mechanism, it is necessary to divide the wafer into which a cutting line has been inserted for each chip in the X-Y direction along the chip end face, which reduces the processing time per wafer. The problem was that it was large.
上記問題点を解決するために、本発明のウェハーブレー
キング装置は、ブレーカー部に、ウェハーの能動面上に
圧力をかけて成る押圧機を設け、更に底面部に脹らんだ
球面状のガイドを設ける。In order to solve the above-mentioned problems, the wafer breaking device of the present invention is provided with a presser that applies pressure on the active surface of the wafer in the breaker section, and a swollen spherical guide on the bottom surface. establish.
次に、これらの間にウェハーをサンドイッチ状にはさみ
、各チップ毎に切断線に沿った分割を一度に行ない、ウ
ェハー１枚当たりの処理時間を従来よりも短縮する。Next, the wafer is sandwiched between these chips, and each chip is divided at once along the cutting line, thereby reducing the processing time per wafer compared to the conventional method.
本発明の実施例を第１図を用いて説明する。 An embodiment of the present invention will be described with reference to FIG.
円形のフレームリングに片面粘着テープを用いて固定し
たウェハー１を、図（α）に示すように、なだらかに脹
らんだ球面状のガイド４と、ウェハー表面保護用紙２．
Ｓｉ製ゴム風船３との間に、サンドインチ状に置く。A wafer 1 fixed to a circular frame ring using single-sided adhesive tape is attached to a gently swollen spherical guide 4 and a wafer surface protection paper 2, as shown in Figure (α).
Place it in a sandwich shape between it and the Si rubber balloon 3.
次に、図（ｂ）に示すように、Ｓｉ製ゴム風船３にエア
ーを送り込み、これを膨張させる。ここで、Ｓｉ製ゴム
風船３が門張すると、ウェハー１は球面状のガイド４の
傾斜面に沿って押し付けられる。これによって、図（ｃ
）に示すようＧこ、球面上のガイド４の傾斜面に押し付
けられたウェハーは、球面状のガイド４によりカの分散
が適当にとられ、各チップ毎の切断線に沿ったＸ−Ｙ方
向の分割が、一度で行なうことができる。Next, as shown in Figure (b), air is fed into the Si rubber balloon 3 to inflate it. Here, when the Si rubber balloon 3 is inflated, the wafer 1 is pressed along the inclined surface of the spherical guide 4. By this, figure (c
As shown in ), the wafer pressed against the inclined surface of the spherical guide 4 is distributed in the X-Y direction along the cutting line of each chip, with the force being appropriately distributed by the spherical guide 4. division can be done at once.
以上のような実施例において、球面状のガイド４と、Ｓ
ｉ製ゴム風船３とを組み合わせ、これらの間にウェハー
をサンドイッチ状に置いた構成で、各チップ毎への分割
が、一度で行なえる。In the embodiments described above, the spherical guide 4 and the S
By combining a rubber balloon 3 manufactured by i and a wafer sandwiched between them, each chip can be divided at once.
以上述べたように本発明によれば、Ｓｉ製風船よりなる
押圧機と、脹らんだ球面上のガイドとを組み合わせた機
構により、ウェハーの分割が従来よりも短時間で行なう
ことができ、装置としての能力の向上が図れる。As described above, according to the present invention, wafers can be divided in a shorter time than before by using a mechanism that combines a pressure machine made of a Si balloon and a guide on a swollen spherical surface. You can improve your abilities as a person.
第１図（α）〜（ｃ）は、本発明のウェハーブレーキン
グ機構の説明図である。第２図（α）〜＜ｃ＞は従来の
ウェハーブレーキング機構の説明間である。
１・・・・・・ウェハー
２・・・・・・ウェハー表面保護用紙
５・・・・・・ｓｉ製ゴム風船
４・・・・・・球面状のガイド
５・・・・・・アンダートレイ
６・・・・・・シャトル
７・・・・・・シャトル端面
８・・・・・・エアー
（６）
ｔａン（ｂ）（し）
第１図 第２図FIGS. 1(α) to (c) are explanatory diagrams of the wafer breaking mechanism of the present invention. FIG. 2(α) to <c> are explanations of a conventional wafer breaking mechanism. 1...Wafer 2...Wafer surface protection paper 5...Si rubber balloon 4...Spherical guide 5...Undertray 6...Shuttle 7...Shuttle end face 8...Air (6)
tan (b) (shi) Figure 1 Figure 2
Claims (1)
ンドイッチにしてチップ状態にする、ウェハーブレーキ
ング装置において、ウェハーブレーキング装置のブレー
カー部に、ウェハーの能動面上に圧力をかけて成る押圧
機を設け、更に底面部に脹らんだ球面状のガイドを設け
、ウェハーをチップ面に分割することを特徴とする、ウ
ェハーブレーキング装置。In a wafer breaking device that sandwiches semiconductor wafers with cut lines for each chip and turns them into chips, the breaker section of the wafer breaking device is equipped with a presser that applies pressure on the active surface of the wafer. 1. A wafer breaking device, further comprising a swollen spherical guide provided on the bottom portion of the wafer breaking device to divide the wafer into chip surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61128960A JPS62284707A (en) | 1986-06-03 | 1986-06-03 | Wafer breaking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61128960A JPS62284707A (en) | 1986-06-03 | 1986-06-03 | Wafer breaking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62284707A true JPS62284707A (en) | 1987-12-10 |
Family
ID=14997668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61128960A Pending JPS62284707A (en) | 1986-06-03 | 1986-06-03 | Wafer breaking device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62284707A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223360A (en) * | 1999-01-28 | 2000-08-11 | Tdk Corp | Manufacture of laminated ceramic chip component and device |
| JP2011243804A (en) * | 2010-05-19 | 2011-12-01 | Disco Abrasive Syst Ltd | Dividing device for plate-like body |
| JP2012099558A (en) * | 2010-10-29 | 2012-05-24 | Shindengen Electric Mfg Co Ltd | Device and method for dividing wafer |
| JP2012160711A (en) * | 2011-02-01 | 2012-08-23 | Samsung Electronics Co Ltd | Wafer dicing press apparatus and semiconductor wafer dicing system using wafer dicing press apparatus |
| JP2016076546A (en) * | 2014-10-03 | 2016-05-12 | 株式会社ディスコ | Division device |
| JP2018117130A (en) * | 2012-12-31 | 2018-07-26 | サンエディソン・セミコンダクター・リミテッドＳｕｎＥｄｉｓｏｎ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｌｉｍｉｔｅｄ | Device for applying stress to semiconductor substrate |
-
1986
- 1986-06-03 JP JP61128960A patent/JPS62284707A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223360A (en) * | 1999-01-28 | 2000-08-11 | Tdk Corp | Manufacture of laminated ceramic chip component and device |
| JP2011243804A (en) * | 2010-05-19 | 2011-12-01 | Disco Abrasive Syst Ltd | Dividing device for plate-like body |
| JP2012099558A (en) * | 2010-10-29 | 2012-05-24 | Shindengen Electric Mfg Co Ltd | Device and method for dividing wafer |
| JP2012160711A (en) * | 2011-02-01 | 2012-08-23 | Samsung Electronics Co Ltd | Wafer dicing press apparatus and semiconductor wafer dicing system using wafer dicing press apparatus |
| US9252055B2 (en) | 2011-02-01 | 2016-02-02 | Samsung Electronics Co., Ltd. | Wafer dicing press and method and semiconductor wafer dicing system including the same |
| JP2018117130A (en) * | 2012-12-31 | 2018-07-26 | サンエディソン・セミコンダクター・リミテッドＳｕｎＥｄｉｓｏｎ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｌｉｍｉｔｅｄ | Device for applying stress to semiconductor substrate |
| US10361097B2 (en) | 2012-12-31 | 2019-07-23 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
| US11276583B2 (en) | 2012-12-31 | 2022-03-15 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
| US11276582B2 (en) | 2012-12-31 | 2022-03-15 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
| US11282715B2 (en) | 2012-12-31 | 2022-03-22 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
| US11764071B2 (en) | 2012-12-31 | 2023-09-19 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
| JP2016076546A (en) * | 2014-10-03 | 2016-05-12 | 株式会社ディスコ | Division device |
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