JPS62264835A - Combined machine for manufacturing thin substrate - Google Patents

Abstract

PURPOSE:To permit a single set of machine to perform grinding and cutting, by providing a means flatly printing the end surface of an ingot, means cutting and end surface side of the ingot into a thin piece and a means supporting the ingot. CONSTITUTION:A moving bed 21 of an ingot supporting means 20 and its indexing slide 23 are respectively vertically and laterally moved performing positioning of an ingot 24. Next, a blade fixing frame 12, that is, a blade 13 is rotated while the ingot 24 is gradually lifted, and an end surface side of the ingot 24 is cut into an thin piece shape. After a thin substrate 27 is cut to be separated, the indexing slide 23 is retracted, and the ingot 24 is positioned so as to slightly protrude from the surface of a grinding tool 16. Subsequently, the moving bed 21 is lifted while the blade fixing frame 12 is rotated, and a warped part 24b in the end surface of the ingot 24 is successively ground. If grinding is finished, the ingot supporting means 20 lowers the moving bed 21 while the indexing slide 23 to a predetermined position.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a multi-processing machine used for manufacturing thin substrates of crystal, silicon, gallium arsenide, etc. The present invention relates to a multi-purpose processing machine for manufacturing thin substrates that is capable of grinding end faces and cutting thin pieces of the ground end faces of ingots.

[Conventional technology]

Conventionally, as a method for manufacturing thin substrates, such as wafers, by cutting ingots of crystals such as quartz or silicon into thin pieces, a method consisting of the steps (main steps) shown in Fig. 5 has usually been adopted. Te(・ru.

That is, the ingot is cut into thin pieces in a wafer cutting process 501, and the periphery of the cut wafer 7 is chamfered in a beveling process 502 to prevent chips, scratches, cracks, etc. from occurring during lapping. . Next, in a double-sided lapping step 503, both sides of the wafer are lapped, and the warpage generated during cutting is removed.
Crack layers and saw marks on the wafer surface are removed, and the wafer is processed to a predetermined thickness. After that, in a polishing step 504,
To remove wafer warpage and improve smoothness,
Boring processing is performed on both sides of the wafer, and further, etching processing 505 is performed to remove the altered layer on the wafer surface caused by machining. Finally, in a mirror polishing process 506, the mirror surface of the wafer is again polished and finished to form a final wafer.

[Problems to be solved by the invention]

In manufacturing such wafers, removing warpage that occurs during wafer processing, especially when cutting the wafer, is a major issue. Therefore, various wafer cutting methods have been proposed, but with any of the methods, it is difficult to cut the wafer while significantly reducing the occurrence of warpage.

For this reason, it is necessary to reliably remove the warp in a processing step after cutting the wafer, but conventional wafer manufacturing methods have not been able to sufficiently remove the warp.

In conventional wafer manufacturing methods, the following reasons are thought to be the reasons why warpage generated during wafer cutting cannot be sufficiently removed.

In other words, when cutting a wafer in the wafer cutting process,
Warpage occurs in the wafer 61 due to changes in cutting resistance due to the incision during cutting and deformation (buckling) of the blade caused by heat generation etc. (Fig. 6(a)). In the polishing step, the wafer 61 is processed while applying pressure with upper and lower surface plates 65 and 66 to remove warpage (FIG. 6(b)).

However, in this case, the wafer 61 is a thin piece, and
- One side is concave and the other side is convex (both sides are concave,
(or it may be concave), and since the whole is arched, the elasticity of the wafer 61 forces the wafer 61 to apply pressure from above and below using the surface plates 65 and 66.
1 is bent into a flat shape.

For this reason, although the warpage that occurs when the material is bent and becomes flat can be removed by the ramping process and the borising process, the warpage that occurs when the material is bent and becomes flat when pressurized cannot be removed. Therefore, when the vertical pressure from the surface plates 65 and 66 is removed, the wafer returns to its warped shape (FIG. 6(C)), and it has been impossible to remove more than a predetermined amount of warpage.

Therefore, regarding a method of manufacturing a thin substrate that eliminates the above-mentioned problems, a main manufacturing process as shown in FIG. 4 may be considered.

That is, in the end face grinding step 401, the end face of the ingot is ground to make a flat reference surface, and then the wafer cutting step 40
In step 2, the end face side of the ingot is cut into thin pieces to create a wafer, and then the peripheral edge is chamfered in a beveling step 406, and then the wafer is manufactured through a single-sided lapping step 404, polishing steps 405, 406, etc. It is something to do.

Here, lapping process 404 and polishing process 40
5.406 is intended to remove wafer warpage and saw marks as in the conventional manufacturing method, but in the case of the manufacturing method of the present invention, the flat standard created in the first edge grinding step 401 Since the wafer is lapped and borated using the surface as a reference, even if pressure is applied to the wafer in the vertical direction using the upper and lower surface plates, the entire wafer will not bend or deform. It has an excellent effect of being able to reliably and sufficiently remove warpage during the bolling process.

The present invention simplifies the manufacturing process and achieves higher precision and higher quality by making it possible to perform edge grinding and wafer cutting in one machine in the thin substrate manufacturing method described above. The purpose of the present invention is to provide a multi-tasking machine for manufacturing thin substrates, which enables the manufacture of thin wafers (thin substrates).

[Means for solving problems and their effects]

In order to achieve the above object, the multi-tasking machine for manufacturing thin substrates according to the present invention includes a blade fixing frame formed in a cylindrical shape and having a blade at the front, and a support member rotatably supporting the blade fixing frame. A thin substrate cutting means comprising: an index slide mounting section located opposite to the blade fixing frame;
and a movable stage that moves in the radial direction with respect to the blade fixing frame, and a split plate that fixes the ingot and places it on the index slide mounting section so as to be movable in the axial direction with respect to the blade fixing frame. The ingot supporting means includes an ejecting slide, and the grinding means includes a grinding tool that is attached to the movable table side on the front side of the blade fixing frame and is rotatable together with the blade.

With this configuration, one machine can grind the end face of the ingot to create a flat reference surface, and also cut the end face of the ingot into thin pieces to create a thin substrate. There is.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 to 3.

Fig. 1 is a partially cutaway right side view of this embodiment, Fig. 2(a)
3(b) is a side view and a partial front view showing a thin substrate cutting state, and FIGS. 3(a) and 3(b) are a side view and a partial front view showing an end face grinding state.

In these drawings, 1 is a base, 10 is a thin substrate cutting means and a grinding tool supporting means, 20 is an ingot supporting means, and 30 is an ingot supporting means.
indicates a thin substrate holding and conveying means.

The thin substrate cutting means and grinding tool supporting means 10 has a bearing 11 firmly fixed to the substantially center of the base 1, and a blade fixing frame 12 is rotatably supported by this bearing 11. The blade fixing frame 12 is formed into a cylindrical shape, and the blade 16 is attached to the front part thereof by a blade presser 14.

Further, a grinding tool 16 such as a grindstone is attached to the outside of the blade holder 14 of the blade fixing frame 12 and is fixed to the base metal 15 by adhesive or fitting. Also, blade fixing frame 1
2 is such that the rotation of the motor 18 is transmitted via a transmission member 17 such as a belt.

The ingot support means 20 is located in front of the blade fixing frame 12, and has a movable base 2 attached to the base 1 so as to be movable up and down.
1. An index slide mounting portion 22 extending inward of the blade fixing frame 12 is formed at the upper portion of the movable table 21. An index slide 23 is mounted on the index slide mounting portion 22 so as to be movable in the axial direction of the blade fixing frame 12, that is, in the left-right direction. An ingot 24 is attached to the index slide 23 in the same direction via an adhesive base material 25 such as carbon. Therefore ingot 2
4 is capable of vertical movement with respect to the blade fixing frame 12 and horizontal movement in the axial direction of the blade fixing frame 12. Further, a clamp mechanism 26 for clamping the ingot 24 together with the adhesive base material 25 is attached to the index slide mounting section 22 .

The thin substrate holding and conveying means 30 is located behind the blade fixing frame 12,
A rod holding stand 35 is provided which allows the rod rod 4 to be taken in and taken out by a predetermined length and which can be rotated 90 degrees.

This rod 64 has a vacuum chuck 6 at its tip for holding a thin substrate.
1 and a motor 33 that rotates the arm 32 by 90 degrees. Reference numeral 36 denotes an unloading section for unloading the thin substrate 27 held and conveyed by the vacuum chuck 31.

Next, Figure 2 (a) and (b) and Figure 3 (a) and (b)
), an example of the operation of this multitasking machine will be explained.

The moving table 21 of the ingot support means 20 and the indexing slide 26 are moved up and down and left and right, respectively, so that the ingot 24 is positioned approximately in the center of the blade fixing frame 12, and its end surface is positioned closer to the center hole of the blade 16. Position the knife so that it protrudes slightly. In this case, the amount that the ingot end surface protrudes from the blade 13 is usually the warped portion 24a.
and the thickness of the thin substrate 27 is added.

(A in Figure 2(a)). Next, the blade fixing frame 12,
That is, while rotating the blade 13, the ingot 2
4 was gradually raised and the end face side of the ingot 24 was cut into thin pieces (B in Fig. 2(a)').

During this processing, the rotor 64 of the thin substrate holding/unloading means 300 is advanced, and the vacuum chuck 61 is moved from the retracted position to a position close to the thin substrate 27.

When the ingot 24 rises to a predetermined position, the thin substrate 2
7 is completed and separated. On the other hand, the vacuum chuck 31 sucks and holds the separated thin substrate 27 at the same time as cutting the thin substrate 27 (B in FIG. 2(a)). Subsequently, the thin substrate 27 is transported by the retraction of the rod 64 (see FIG. 2(a)).
C), the arm 32 is rotated 90 degrees by the motor 66 above the unloading section 36 to change its direction, and the rod 64 is further rotated 90 degrees to direct the vacuum chuck 31 downward. 2(a) D), the suction of the vacuum chuck 61 is then released and the paper is gently lowered into the unloading section 66.

On the other hand, after cutting and separating the thin substrate 27, the indexing slide 23 is moved back, and the ingot 24 is positioned so as to slightly protrude from the surface of the grinding tool 160, such as a grindstone. In this case, the amount of protrusion of the ingot 24 is usually set to the extent of the warped portion 24b (E in FIG. 3(a)). Next, while rotating the blade fixing frame 12, the movable table 21 is raised, and the warped portions 24b of the end face of the ingot 24 are sequentially ground (F in FIG. 3(a)). When the grinding is completed and the warped portion 24b of the end face of the ingot 24 is removed and processed into a flat shape, the moving table 21 is lowered and the indexing slide 26 is lowered to a predetermined position (the state shown in FIG. 1). .

This completes the end face grinding process of the ingot 24.

The thin substrate 27 whose negative surface has been ground into a flat reference surface in this manner is sequentially transported to the next process, where processing such as lapping and boring is performed using the reference surface as a reference.

According to such a multi-tasking machine, the end face grinding of an ingot, in other words, the process of creating a reference surface of a thin substrate, and the cutting process of a thin substrate can be continuously performed with one machine having a simple structure. Therefore, it is possible to efficiently implement a method of manufacturing a thin substrate with high precision and high quality by reliably removing the warped Qen-mark.

It should be noted that the present invention is not limited to the multitasking machine of the above embodiment, but includes, for example, the following modifications.

■ Cutting and grinding of the ingot end face is performed by moving a moving table from the top to the bottom.

■ Cutting and grinding of the ingot end face is performed by moving the movable table to the left, right, or diagonally when viewed from the front of the blade fixing frame.

■ Cutting and grinding of the ingot end face is performed by moving the bearing of the blade fixing frame up and down, left and right, diagonally, and back and forth.

In addition, the thin substrate to be processed by the multitasking machine of the present invention is
It includes not only wafers used as microcircuit or IC substrates, but also various similar thin substrates.

Furthermore, as for the material of the thin substrate, not only crystal, silicon, and hygallium, but also thin substrates made of lithium tantalate, etc. can be applied.

〔Effect of the invention〕

As described above, the multitasking machine of the present invention has the effect of making it possible to grind the end face of an ingot and cut a thin substrate with a single machine.

[Brief explanation of drawings]

1 to 3 show an embodiment of the present invention, FIG. 1 is a partially cutaway right side view of the embodiment, and FIG. 2(a)
3(b) is a side view and a partial top view showing a thin substrate cutting state, and FIGS. 3(a) and 3(b) are a side view and a partial top view showing an end face grinding state. FIG. 4 is a process diagram of an embodiment of a thin substrate manufacturing method using the processing machine of the present invention, FIG. 5 is a process diagram of an embodiment of a conventional thin substrate manufacturing method, and FIGS.
b) and (C) are diagrams illustrating the occurrence of warpage. DESCRIPTION OF SYMBOLS 1... Base, 10... Thin substrate cutting means and grinding tool support means, 11... Bearing, 12... Blade fixing frame, 16... ... Blade, 16 ... Grinding tool such as a grindstone, 20 ... Ingot support means, 21 ... Moving table. 22... Index slide mounting stand, 26...
... Index slide, 24 ... Ingot, 2
4a, 24b... warped portion, 27...
Thin substrate, 60...Thin substrate holding and conveying means, 61.
...Vacuum chunk, 66...Thin substrate transfer section. Figure 4 Figure 5 Figure 6 (a)

Claims (2)

[Claims] (1) A multi-tasking machine for manufacturing thin substrates, which is characterized by meeting the following requirements (a), (b), and (c): grinding the end face of an ingot flat and then cutting the end face side of the ingot into thin pieces. A thin substrate cutting means comprising a blade at the front and a support member rotatably supporting a cylindrical blade fixing frame. b. An indexing slide mounting section is located opposite to the blade fixing frame, and a movable table that moves in a radial direction with respect to the blade fixing frame, and fixing the ingot, the indexing slide mounting section and an ingot support means comprising an indexing slide mounted movably in the axial direction with respect to the blade fixing frame. C. Grinding means comprising a grinding tool attached to the movable table side on the front side of the blade fixing frame and rotatable together with the blade. (2) The multi-tasking machine for manufacturing thin substrates according to claim 1, wherein the movable stage of the ingot supporting means moves up and down.