JPS62235382A - Thermosetting adhesive film - Google Patents
Thermosetting adhesive filmInfo
- Publication number
- JPS62235382A JPS62235382A JP7732886A JP7732886A JPS62235382A JP S62235382 A JPS62235382 A JP S62235382A JP 7732886 A JP7732886 A JP 7732886A JP 7732886 A JP7732886 A JP 7732886A JP S62235382 A JPS62235382 A JP S62235382A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive film
- polyimide
- polymaleimide
- formula
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 17
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 6
- 229920001721 polyimide Polymers 0.000 claims abstract description 21
- 239000004642 Polyimide Substances 0.000 claims abstract description 18
- 238000005266 casting Methods 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims description 5
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 abstract description 2
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 abstract description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 229920003192 poly(bis maleimide) Polymers 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000013557 residual solvent Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 239000013040 bath agent Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 description 1
- LNAIBNHJQKDBNR-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-2-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=C(N2C(C=CC2=O)=O)C=CC=C1N1C(=O)C=CC1=O LNAIBNHJQKDBNR-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- 241000473391 Archosargus rhomboidalis Species 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- -1 Resin acid compound Chemical class 0.000 description 1
- 241000282806 Rhinoceros Species 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 235000015278 beef Nutrition 0.000 description 1
- 210000001217 buttock Anatomy 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Moulding By Coating Moulds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は可撓性、耐熱性に優２″した熱硬化性接着フィ
ルムに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermosetting adhesive film having excellent flexibility and heat resistance.
従来、電気絶縁材料、構造材料等に用いられているポリ
イミド接着剤としてはＮ、Ｎ’−（４，４−シフエニル
メタン）ビスマレイミドと４．４’−ジアミノジフェニ
ルメタンからなる予備縄付物が知らｎている。Conventionally, as a polyimide adhesive used for electrical insulating materials, structural materials, etc., a pre-attached material made of N,N'-(4,4-cyphenylmethane) bismaleimide and 4,4'-diaminodiphenylmethane is known. ing.
しかしながら上記の予備縮合物自体は、（ｉ！ｉ１＜て
脆いため流延してフィルムとすることができなかった。However, the precondensate itself could not be cast into a film because it was brittle (i!i1<).
また積層材等の接着シートとして用いるＳ甘には、その
溶液ンガラス布などの基材に含浸した後溶剤ケ除去しプ
レプレグとしなければならないため基材の厚さに限定さ
れ、したがりて薄いものを得ることができなかった。Furthermore, in order to use adhesive sheets for laminated materials, etc., the solution must be impregnated into a base material such as glass cloth, and then the solvent must be removed to form a prepreg, which is limited by the thickness of the base material. I couldn't get it.
本発明にかへる状況に！Ｉ２みなされたものであって、
５′Ｊ撓性、耐熱性に優れた熱硬化性接着フィルムを提
供せんとするものである。The situation is related to the present invention! I2 is considered to be
5'J It is an object of the present invention to provide a thermosetting adhesive film having excellent flexibility and heat resistance.
か〜る目的は本発明によれは１次の一般式で表わされる
ポリイミド（Ａ）に。According to the present invention, the purpose is to provide a polyimide (A) represented by the following general formula.
一般式
で表わされるポリマレイミド（Ｂ）を混合した樹脂酸物
′４！：流延成形することによって得らｎる接着性フィ
ルムにより達成される。Resin acid compound mixed with polymaleimide (B) represented by the general formula '4! : Achieved by an adhesive film obtained by casting.
本発明においてポリイミド（８）はクレゾール、フェノ
ール等の溶媒中で５．５’、４．４’−ベンゾフェノン
テトラカルボン酸二無水物（以下ＢＴＤＡ、！：略ｆ）
、！：ビス（４−（３−アミノフェノキシ）フェニルン
スルホン（以下ｍ−ＡＰＰＳと略す）ト３．３’−ジア
ミノジフェニルスルホン［下３゜３’ −Ｄ Ｄ Ｓと
略す）とン加熱攪拌することによって得られるが、ジメ
チルアセトアミド、ジメチルホルムアミド等の非プロト
ン性極性溶媒中で室温以下の温度で反応させ、対応する
ポリアミド酸を合成し、無水酢酸−ピリジン等の脱水剤
？用いて脱水閉環させることによって得ることもできる
。In the present invention, polyimide (8) is prepared as 5.5',4.4'-benzophenonetetracarboxylic dianhydride (hereinafter referred to as BTDA!: abbreviated as f) in a solvent such as cresol or phenol.
,! : Bis(4-(3-aminophenoxy)phenylsulfone (hereinafter abbreviated as m-APPS)) and 3,3'-diaminodiphenylsulfone [abbreviated as 3゜3'-DDS] and stirred under heating. However, the corresponding polyamic acid is synthesized by reacting it in an aprotic polar solvent such as dimethylacetamide or dimethylformamide at a temperature below room temperature, and then acetic anhydride-dehydrating agent such as pyridine? It can also be obtained by dehydration and ring closure.
ポリイミド（４）中のｍ−ＡＰＰＳと５．５’−ＤＤＳ
のモル比は１００：Ｏ〜５０：５０が好ましく３．３’
−ＤＤＳが５０モル％よりも多いとポリイミド（５）が
固くなり成膜性が悪くなる。m-APPS and 5.5'-DDS in polyimide (4)
The molar ratio of 3.3' is preferably 100:O to 50:50.
- If the DDS content is more than 50 mol %, the polyimide (5) becomes hard and film forming properties deteriorate.
本発明に用いることのできるポリマレイミドｔＢ）の具
体例とし′ＣはＮ、Ｎ’ −（４，４’−ジフェニルメ
タン］ビスマレイミド、 Ｎ、Ｎ’ −（４，４’−ジ
フェニルオ中シンビスマレイミド、ＮｓＮ’ １）−
フェニレンビスマレイミド、Ｎ、Ｎ’−ｍ−フェニレン
ビスマレイミド、Ｎ、Ｎ’−２，４−）リレンビスマＬ
／（ミド、 Ｎ、Ｎ’−２，６−トリレンビスマレイ
ミド、 Ｎ、Ｎ’−エチレンビスマレイミ）”、 Ｎ
、Ｎ’−ヘギナメテレンビスマレイミド、あるいはとい
りた構造式で表わされるポリマレイミドがあり、こわら
を単独あるいは二種以上混合して用いることができる。Specific examples of the polymaleimide tB) that can be used in the present invention include N, N'-(4,4'-diphenylmethane) bismaleimide, N, N'-(4,4'-diphenylmethane), Maleimide, NsN' 1)-
Phenylene bismaleimide, N,N'-m-phenylene bismaleimide, N,N'-2,4-)rylene bisma L
/(mido, N, N'-2,6-tolylene bismaleimide, N, N'-ethylene bismaleimide)", N
There are polymerimides represented by the following structural formulas: , N'-hegynamethelene bismaleimide, or the like, and these stiffeners can be used alone or in a mixture of two or more kinds.
ポリイミド囚とポリマレイミドｔＢ）の混合割合は、ポ
リマレイミドＩＢ）χポリイミド（８）に対して１０〜
５０重量％で用いるのが好ましく、さらに好ましくは１
５へ３０重童％である。ポリマレイミド（Ｂ）が１０重
１１％より少ないと硬化が十分でなく５０重量％より多
いと樹脂組成物がもろく成形性がなくなる。The mixing ratio of polyimide prisoner and polymaleimide tB) is 10 to 10 to polymaleimide IB) χ polyimide (8).
It is preferably used at 50% by weight, more preferably 1
5 to 30% of children. When the amount of polymaleimide (B) is less than 10% by weight and 11%, curing is insufficient, and when it is more than 50% by weight, the resin composition becomes brittle and lacks moldability.
ポリイミドとポリマレイミドの混４！ｒは粉状で行なっ
てもよいが、通常はＤＭＦのような浴剤に溶解したポリ
アミドフエスにポリマレイミドを添加溶解することによ
って行なわれる。Mixture of polyimide and polymaleimide 4! Although r may be carried out in powder form, it is usually carried out by adding and dissolving the polymaleimide in polyamide foam dissolved in a bath agent such as DMF.
このようにして得たポリイミドとポリマレイミドとの混
曾ワニス馨ガラスｆｉ！、ステンレス板等に流延、□乾
燥することにより接着フィルムを得る。乾燥温度と時間
は用いる浴剤、ポリマレイミドのＳ類によって異なるが
、温度はポリマレイミドの反応が顕著になる温度よりも
低く保つ必要があり、時間は残存溶剤量が１％以下にな
るようにしなければならない。The thus obtained mixed varnish of polyimide and polymaleimide Kaoru glass fi! , cast onto a stainless steel plate, etc., and dry to obtain an adhesive film. The drying temperature and time vary depending on the bath agent used and the type S of the polymerimide, but the temperature must be kept lower than the temperature at which the reaction of the polymaleimide becomes noticeable, and the drying time should be set so that the amount of residual solvent is 1% or less. There must be.
得られた接着フィルムは被着体と重ねた後。After the obtained adhesive film is overlapped with the adherend.
軟化点以上の温度で加熱加圧することによりて耐熱性に
優れ、良好な接着力’ｔ［する成形品？得ることができ
る。Molded products with excellent heat resistance and good adhesive strength by heating and pressurizing at temperatures above the softening point. Obtainable.
本発明に係る接Ｗ７４ルムはＥｌ撓性に富んでいるため
、フレキシブル配線板の銅箔ト耐熱フィルムの接着剤と
して講じている。Since the contact W74 lumen according to the present invention has high El flexibility, it is used as an adhesive for a heat-resistant film on a copper foil of a flexible wiring board.
以下実施例によって本発明の詳細な説明するが、本発明
はこれらの実施例に陳述されるものではない。The present invention will be described in detail below with reference to Examples, but the present invention is not limited to these Examples.
実施例１
ＢＴＤＡ３２．２ｇ、ｍ−ＡＰＰ８３４．６ｇ％３．３
’−ＤＤＳ ５．０ ｇを攪拌機、温度計、窒素ガス導
入管、冷却管ン備えた四つロフラスコに入れ、ｍ−クレ
ゾール６４６ｇ、）ルエン１０８ｇχ添加し、窒素ガス
を流しながら加熱攪拌した。１５０〜１６０℃で１６時
間反応させて樹脂分２１６％、粘度７Ｐのポリイミドフ
ィルム得た。このポリイミドワニス乞アセトン中に注い
で丹沈し粉砕、洗浄、乾燥することによってポリイミド
粉末を得た。ポリイミド粉末の還元粘度（１度０．１ｇ
／ｄｉ、溶媒Ｎ、Ｎ−ジメチルホルムアミド（ＤＭＦ）
、温度３α０゛Ｃンは１１５１ｄｌ／ｇであった。得ら
れたポリイミド粉末１００ｇとＮ、Ｎ’−（４，４’−
ジフェニルメタン）ビスマレイミド（ＢＭＩ ）１０ｇ
’ｔ’ＤＭＦ４００ｇに溶解してフェスとした。このワ
ニスンガラス板上に流延し、１３０℃１０分乾燥した礫
、剥離し鉄枠に止めて２００℃１時間乾燥して接着フイ
ルムン得た。得られた接着フィルムは厚さ２５μｍ、残
存溶媒ｉ１％、軟化点２２０℃であり、１８０°に折曲
げても割れず可撓性に優れたものであった。Example 1 BTDA32.2g, m-APP834.6g%3.3
5.0 g of '-DDS was placed in a four-hole flask equipped with a stirrer, a thermometer, a nitrogen gas inlet tube, and a cooling tube, and 646 g of m-cresol and 108 g of luene were added thereto, followed by heating and stirring while flowing nitrogen gas. The reaction was carried out at 150 to 160°C for 16 hours to obtain a polyimide film having a resin content of 216% and a viscosity of 7P. This polyimide varnish was poured into acetone and sedated, pulverized, washed and dried to obtain polyimide powder. Reduced viscosity of polyimide powder (0.1g per degree)
/di, solvent N, N-dimethylformamide (DMF)
, temperature 3α0°C was 1151 dl/g. 100g of the obtained polyimide powder and N,N'-(4,4'-
diphenylmethane) bismaleimide (BMI) 10g
't' It was dissolved in 400 g of DMF to make a festival. This varnish was poured onto a glass plate, dried at 130°C for 10 minutes, peeled off, fixed on an iron frame, and dried at 200°C for 1 hour to obtain an adhesive film. The resulting adhesive film had a thickness of 25 μm, a residual solvent i of 1%, a softening point of 220° C., and was excellent in flexibility without cracking even when bent at 180°.
実施例２
Ｎ、Ｎ’−（４，４’ −シフェニルメタンンビスマレ
イミドのかわりにＢＭＩ−Ｍ（三井東圧化学■製ポリマ
レイミド）２０ｇ乞伶加する以外は実施例１と同様にし
て接着フィルムを得た。得もれたＷｃ漕フィルムは厚さ
２５ ｕｒｎ 、残存溶媒量１．１％、軟化点２２０℃
であり、１８０ｏに折曲げても割れず可撓性に優れたも
のであった。Example 2 The same procedure as in Example 1 was carried out except that 20 g of BMI-M (polymaleimide manufactured by Mitsui Toatsu Chemical Co., Ltd.) was added instead of N,N'-(4,4'-cyphenylmethane bismaleimide). An adhesive film was obtained. The obtained Wc column film had a thickness of 25 urn, a residual solvent amount of 1.1%, and a softening point of 220°C.
It did not crack even when bent at 180 degrees and had excellent flexibility.
比較例１
ケルイミド６０１（日本ポリイミド■製ポリアミノビス
マレイミドａ４脂） １００ ｇ’ｋＤＭＦ１００ ｇ
Ｋ溶解したワニスンガラス機上に流延後、１３０℃１０
分、ついで１７０”０２０分乾燥したが、もろくてフィ
ルムとならなかった。Comparative Example 1 Kelimide 601 (polyamino bismaleimide A4 resin manufactured by Nippon Polyimide ■) 100 g'kDMF100 g
After casting on a varnish glass machine with K melted, 130℃10
It was then dried for 170" and 20 minutes, but it was brittle and did not form a film.
実施例３〜５．比較例２〜３
実施例１０ａＭＢＩを表１のように変更する以外は実施
例１と同様にして得た接着フィルムを１ｍｍ厚のアルミ
仮と３５μｍ＃の片面粗化鋼箔の間にはさんで５０ｋｇ
ｆ／ａＩＰ、 ２７５℃、３０分の条件で積層して鋼張
基ｆ２を得た。基板の臀性？表１に示す。Examples 3-5. Comparative Examples 2 to 3 Example 10a An adhesive film obtained in the same manner as Example 1 except that the MBI was changed as shown in Table 1 was sandwiched between a 1 mm thick aluminum temporary and a 35 μm # single-sided roughened steel foil. 50kg
Lamination was performed under f/aIP conditions at 275° C. for 30 minutes to obtain a steel-clad base f2. The buttocks of the board? It is shown in Table 1.
表１
軟化点は荷重２５ｋｇ／ａＩＦ、昇温速度１０℃／鯛で
ペネトレーシラシ法で測定した。Table 1 The softening point was measured by the Penetrate Shirashi method at a load of 25 kg/aIF and a heating rate of 10° C./sea bream.
鋼箔引剥し強さは引張速Ｋ ５０ ｍｍ ７ｗｍで９０
゜引剥し強さケ測定した。Steel foil peel strength is 90 at tensile speed K 50 mm 7wm
゜Peel strength was measured.
を工んだ耐熱性は２０１１１１１１角の試験片ｙａ／は
んだ浴上に鋼箔を下側にして浮べた後、ふ（れの有無を
観察した。The heat resistance was determined by floating a 20111111 square test piece on a solder bath with the steel foil facing down, and then observing the presence or absence of bulges.
実施例６
５０μｍ犀のポリイミドフィルムと３５μｍ厚の片面粗
化鋼箔の間に実施例１で得た接着）４ルＡＬ’１枚はさ
んで、２７５℃、５０ｋｇｆ／ａＩＦ３０分の条件で積
層しフレ牛シプル印刷配［ｉ１周基！＆ケ得た。この基
板の９０°銅箔引剥し強さ乞引張速度５０ ｍｍ ／ｍ
＝で測定したところ室温で２．６ｋｇｆ／ＣｒＢ１１５
０℃で２．１ ｋｇｆ／ｅ１１であった。Example 6 A 50 μm rhinoceros polyimide film and a 35 μm thick single-sided roughened steel foil were sandwiched between one sheet of the adhesive) 4 AL' obtained in Example 1 and laminated at 275° C. and 50 kgf/a IF for 30 minutes. Free beef ciple printing layout [i1 Shuki! &ke got it. The 90° copper foil peel strength of this board is 50 mm/m.
=2.6kgf/CrB115 at room temperature
It was 2.1 kgf/e11 at 0°C.
−！りこの基板を３００℃のはんだ浴に１分間浸漬した
がふくれは生じなかった。-! Riko's board was immersed in a 300°C solder bath for 1 minute, but no blistering occurred.
実施例７
ＢＭＩ量を３０ ｐｈｒとする以外は実施例１と同様に
して接着フィルムχ作製した。５０８℃厚のポリイミド
フィルムの両側にこの接着フィルムと３５μｍ片面粗化
銅箔乞重ねて２７５℃。Example 7 An adhesive film χ was produced in the same manner as in Example 1 except that the BMI amount was changed to 30 phr. This adhesive film and 35 μm single-sided roughened copper foil were layered on both sides of a 508°C thick polyimide film at 275°C.
５０ ｋｇｆ＃、 ３０分の条件で積層しフレキシブル
印刷配ｆｉｌ板用基板乞得た。Lamination was carried out under conditions of 50 kgf# and 30 minutes to obtain a substrate for a flexible printing distribution board.
この基板の９０°銅箔引剥し強さは室温で２゜４ｋｇｆ
／ｃｍ、 １５０℃で２．０ ｋｇｆ／Ｃｍであり、
３００℃のはんだ浴に１分間浸漬してもふくれは生じな
かった。The 90° copper foil peel strength of this board is 2°4 kgf at room temperature.
/cm, 2.0 kgf/Cm at 150℃,
No blistering occurred even after immersion in a 300°C solder bath for 1 minute.
実施例８
ＢＭＩのかわりにＢＭＩ−Ｍ（三井東圧化学姿ポリマレ
イミド）１５ｇン用いる以外は実施例１と同様にして作
製したフィルム状接滑剤を用い実施例７と同様にしてフ
レキシブル印刷配線板用基板ン得た。この基板の９０°
銅箔引剥し強さは室温で２．４ ｋｇｆ／ｃｍ、 １
５０℃で１．９ｋｇｆ／ ｃｍであり、３００℃のはん
だ浴に１分間浸漬してもふくれは生じなかった。Example 8 A flexible printed wiring board was prepared in the same manner as in Example 7 using a film-like lubricant prepared in the same manner as in Example 1 except that 15 g of BMI-M (Mitsui Toatsu Chemical Polymaleimide) was used instead of BMI. I got a board for use. 90° of this board
Copper foil peel strength is 2.4 kgf/cm at room temperature, 1
It was 1.9 kgf/cm at 50°C, and no blistering occurred even when immersed in a 300°C solder bath for 1 minute.
比較例４
本発明に係る接着フィルムのかわりにバイララック（チ
ェボン社製アクリル系フィルム状接着剤）ケ用い％実施
例６と同様のｍｇで１８０’Ｃ１３０ｋｇｆ／ａｔ、
６０分の条件で積層し、フレキシブル印刷配線板用基板
ン得た。この基板の９００銅箔引剥し強さは室温で２．
２ ｋｇｆ／Ｃｍ 、 １５０℃で１６ｋｇｆ／Ｃｍ
であった。またこの基板を３００℃のはんだ浴に１分間
浸漬したところふくれが生じた。Comparative Example 4 In place of the adhesive film according to the present invention, Baylarac (acrylic film adhesive manufactured by Chebon Co., Ltd.) was used.% Same mg as in Example 6, 180'C130 kgf/at,
Lamination was carried out for 60 minutes to obtain a substrate for a flexible printed wiring board. The 900 copper foil peel strength of this board is 2.
2 kgf/Cm, 16 kgf/Cm at 150℃
Met. Further, when this board was immersed in a 300° C. solder bath for 1 minute, blistering occurred.
Claims (1)
０〜 ５０：５０である２価の基を表わす） で表わされるポリイミド（Ａ）に、 一般式▲数式、化学式、表等があります▼ （式中Ｒは炭素数２以上の整数価の基であ りｎは２以上の整数である） で表わされるポリマレイミド（Ｂ）を配合してなる組成
物を流延成形してなる熱硬化性接着フィルム。 ２、ポリイミド（Ａ）とポリマレイミド（Ｂ）の比率（
Ａ：Ｂ）が９０：１０〜５０：５０である特許請求の範
囲第１項記載の熱硬化性接着フィルム。[Claims] 1. General formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (In the formula, Ar is the molar ratio of ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ and ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ 100:
0 to 50:50 (represents a divalent group with a ratio of 0 to 50:50) General formula ▲ Numerical formula, chemical formula, table, etc. are available for polyimide (A) represented by A thermosetting adhesive film obtained by casting a composition containing a polymaleimide (B) represented by the formula (n is an integer of 2 or more). 2. Ratio of polyimide (A) and polymaleimide (B) (
The thermosetting adhesive film according to claim 1, wherein A:B) is 90:10 to 50:50.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7732886A JPS62235382A (en) | 1986-04-03 | 1986-04-03 | Thermosetting adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7732886A JPS62235382A (en) | 1986-04-03 | 1986-04-03 | Thermosetting adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62235382A true JPS62235382A (en) | 1987-10-15 |
Family
ID=13630865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7732886A Pending JPS62235382A (en) | 1986-04-03 | 1986-04-03 | Thermosetting adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62235382A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01268778A (en) * | 1988-04-20 | 1989-10-26 | Hitachi Chem Co Ltd | Hot-melt adhesive, polyimide film with said adhesive layer and printed circuit board therefrom |
| US5478918A (en) * | 1993-02-09 | 1995-12-26 | Central Glass Company, Limited | Low stress polyimide composition and precursor composition solution of same |
| US6468664B1 (en) | 1999-10-19 | 2002-10-22 | Samsung Electronics Co., Ltd. | Poly(imide-siloxane) compound for tapeless LOC packaging |
| EP1787809A1 (en) | 2005-11-21 | 2007-05-23 | Fujifilm Corporation | Ink composition, inkjet recording method, printed material, production method of a planographic printing plate and planographic printing plate |
| US20120059119A1 (en) * | 2009-05-08 | 2012-03-08 | Mitsubishi Gas Chemical Company, Inc. | Thermosetting polyimide resin composition, cured product, and adhesive |
| WO2013141239A1 (en) * | 2012-03-22 | 2013-09-26 | 日産化学工業株式会社 | Polyamic acid and polyimide |
-
1986
- 1986-04-03 JP JP7732886A patent/JPS62235382A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01268778A (en) * | 1988-04-20 | 1989-10-26 | Hitachi Chem Co Ltd | Hot-melt adhesive, polyimide film with said adhesive layer and printed circuit board therefrom |
| US5478918A (en) * | 1993-02-09 | 1995-12-26 | Central Glass Company, Limited | Low stress polyimide composition and precursor composition solution of same |
| US6468664B1 (en) | 1999-10-19 | 2002-10-22 | Samsung Electronics Co., Ltd. | Poly(imide-siloxane) compound for tapeless LOC packaging |
| EP1787809A1 (en) | 2005-11-21 | 2007-05-23 | Fujifilm Corporation | Ink composition, inkjet recording method, printed material, production method of a planographic printing plate and planographic printing plate |
| US20120059119A1 (en) * | 2009-05-08 | 2012-03-08 | Mitsubishi Gas Chemical Company, Inc. | Thermosetting polyimide resin composition, cured product, and adhesive |
| WO2013141239A1 (en) * | 2012-03-22 | 2013-09-26 | 日産化学工業株式会社 | Polyamic acid and polyimide |
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