JPS6222870U - - Google Patents

Info

Publication number
JPS6222870U
JPS6222870U JP11420485U JP11420485U JPS6222870U JP S6222870 U JPS6222870 U JP S6222870U JP 11420485 U JP11420485 U JP 11420485U JP 11420485 U JP11420485 U JP 11420485U JP S6222870 U JPS6222870 U JP S6222870U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
card
card substrate
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11420485U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11420485U priority Critical patent/JPS6222870U/ja
Publication of JPS6222870U publication Critical patent/JPS6222870U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の一実施例を示すものであり、第
１図はプリント配線板とカード基板とを分離した
状態を示す斜視図、第２図はカード基板の裏面を
示す斜視図、第３図はプリント配線板の裏面を示
す斜視図、第４図はメモリーカードの斜視図であ
る。 １……カード基板、２……凹部、３……穴、４
……凹部、２０……プリント配線板、２３……端
子、２４……半導体メモリー。 The drawings show one embodiment of the present invention, and FIG. 1 is a perspective view showing the printed wiring board and the card board separated, FIG. 2 is a perspective view showing the back side of the card board, and FIG. 3 is a perspective view showing the back side of the card board. 4 is a perspective view showing the back side of the printed wiring board, and FIG. 4 is a perspective view of the memory card. 1... Card board, 2... Recess, 3... Hole, 4
... recess, 20 ... printed wiring board, 23 ... terminal, 24 ... semiconductor memory.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体メモリーをマウントしたプリント配線板
をカード基板に取りつけてなるメモリーカードに
おいて、前記カード基板とプリント配線板とを両
面粘着フイルムを介して接着し一体化することを
特徴とするメモリーカード。 A memory card comprising a printed wiring board on which a semiconductor memory is mounted is attached to a card substrate, characterized in that the card substrate and the printed wiring board are bonded and integrated via a double-sided adhesive film.
JP11420485U 1985-07-25 1985-07-25 Pending JPS6222870U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11420485U JPS6222870U (en) 1985-07-25 1985-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11420485U JPS6222870U (en) 1985-07-25 1985-07-25

Publications (1)

Publication Number Publication Date
JPS6222870U true JPS6222870U (en) 1987-02-12

Family

ID=30996724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11420485U Pending JPS6222870U (en) 1985-07-25 1985-07-25

Country Status (1)

Country Link
JP (1) JPS6222870U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948985A (en) * 1982-09-13 1984-03-21 大日本印刷株式会社 Method of producing ic card
JPS6015786A (en) * 1983-07-06 1985-01-26 Dainippon Printing Co Ltd Ic card and its production

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948985A (en) * 1982-09-13 1984-03-21 大日本印刷株式会社 Method of producing ic card
JPS6015786A (en) * 1983-07-06 1985-01-26 Dainippon Printing Co Ltd Ic card and its production

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