JPS62208649A - Transfer device for semiconductor wafer - Google Patents

Abstract

PURPOSE:To shorten the transfer distance between a cassette and a boat as well as to curtail the transfer time by a method wherein, with a linearly slanted guide rail arranged between the cassette and the boat, two groups of transfer mechanisms for the transfer of one sheet of a wafer and the transfer of plural sheets of wafers are provided. CONSTITUTION:When wafers are transferred from a cassette 2 to a boat 3 one sheet by one sheet, a movable stopper 14 is pushed down. Whereupon, a purposive wafer 1 passes through a slit of a fixed stopper 13 one sheet only and the remaining wafers 1 are held by the fixed stopper 13. The wafer which passed through the slit 13a is held by a V-grooved roller 7 provided at the point part of a slider 8 being ready-come for suppressing in advance, rolled on a guide rail 11 and transferred to the boat 3. Then, when the total number of the wafers 1 in the cassette 2 are transferred to the boat 3 at the same pitches as in the cassette 2, a slider 18 is made to previously advance, the movable stopper 14 is pushed down and all the wafers 1 are made to retreat while being held by a plurality of V-grooved rollers 17 provided at the point part of the slider 18, thereby enabling to transfer the wafers to the boat 3.

Description

[Detailed Description of the Invention] [Industrial Application Field] The invention of B is for transferring evaporators stored in a heat treatment boat (cassette) used in a diffusion furnace in the manufacturing process of semiconductor wafers (hereinafter referred to as wafers). This relates to a device for changing.

[Conventional technology]

Figure 6 (↑, for example, disclosed in Japanese Patent Application Laid-Open No. 58-182846, t: is a configuration diagram showing a conventional wafer transfer device, in which 1 is a wafer transfer device, and 2 is a wafer transfer device for a plurality of wafers 1). The cassette for storage, 3 is a boat that holds the wafers 1 one by one, and 4 is a force 1!・The wafer 1 can be rolled between 2 and 1 and 3. This guide rail consists of an upper rail 4a and a lower rail 4b. 5 is a swinging arm that pushes the wafer 1 from the bottom of the cassette 2 onto the guide rail 4, 6 is a drive device for the swinging arm, and 7 is a slider 8. V-groove rollers are provided at the tip of the guide 1 and the tip of the swinging arm 5 to pick up and support the wafer 1 at a position where the wafer 1 exceeds the chevron-shaped peak of the guide 1 knob 4. .9 is the drive 111 mounting fil of slider 8, 10
It is a rotatable cassette chuck that grips the cassette chuck.

Next, the operation will be explained. When transferring 17 the wafer 1 in the cassette 2 to the board 1-3, the swing arm 5
The wafer 1 is pushed out from the bottom of the C cassette 2 onto the guide rail 4. On the other hand, the slider 8 picks up the wafer I in time to pass over the chevron-shaped top of the guide knob 4.
The wafer 1 is supported by the slider 8 and then gently placed on the boat 3-1-. 1.

Conversely, transfer wafer 1 from board 1-3 to cassette l-2 (7
When changing, push the boat 3 out onto the guide rail 4 using the slider 8. When the guide 1 knob 4 passes over the top of the chevron, the Ugoha 1 rolls on the guide rail 4 and is housed in the cassette 2.

[Problem that the invention seeks to solve]

Since the conventional semiconductor transfer device is constructed as described above, the speed of the swinging arm 5 and the slider 8 is limited due to the loss of tin on the wafer 1, resulting in a disadvantage that the processing time becomes longer. was there.

Furthermore, the pitch of cassette 2 is the same as that of cassette 2.
When transferring wafer 1 to boat 3, transfer wafer 1 to boat 3.
There was a problem in that it was extremely inefficient to transfer the cards one by one.

B's invention (made in order to solve the problems mentioned in 1) is to shorten the transfer distance between the cassette and the boat. Two sets are provided, one for sheet transfer and one for multiple sheet transfer, and the L1 objective is to obtain a device that can shorten the transfer time.

[Means for solving problems]

The wafer transfer device according to the present invention is equipped with a linear inclined guide rail arranged between the cassette and the boat, and two transfer mechanisms, one for transferring one wafer and one for transferring multiple wafers. It is something.

[Effect]

The wafer transfer device according to the present invention has a linear guide rail, so the wafer transfer distance can be shortened, and two sets of transfer mechanisms, one for one wafer and one for multiple wafers, allow the transfer of wafers on a boat. One of the following transfer mechanisms can be selected for the arrangement pattern, and as a result, the transfer time can be significantly shortened.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an overall configuration diagram of a wafer transfer device according to the present invention, FIG. 2 is a configuration diagram of a transfer machine for one wafer, FIG. 3 is a configuration diagram of a transfer machine for multiple wafers, and FIG. 4 is a configuration diagram of a transfer machine for multiple wafers. is the TV in Figure 2
5 is a sectional view taken along line -IV in FIG. 2. FIG. In these figures, numerals 1 to 10 indicate the same or corresponding parts as the same minus signs in FIG. 6 of the conventional example. Reference numeral 11 denotes a guide rail for transferring one wafer, which guides the wafer 1 in a straight line between the cassette 2 and the boat 3. Ila is a part of the guide rail 11, and Ilb is the lower part of the guide rail 11.
12 is a rail fixture that supports the guide rail 11, 13 is a fixed stopper for transferring one sheet, and 13a is a slit provided on this fixed stopper 13. (Condition shown by the solid line in Fig. 2) A movable stopper provided to prevent the wafer 1 from rolling out, a cylinder 15 for driving the movable stopper 1-flange 14, and a cylinder 15 for the holder 16 attached to the force setting jack 10. This is the cylinder mounting plate. Next 1711-
F mark V groove "1- installed side by side with rough t'1. t
vVff roller for transferring multiple sheets, 18 is this roller 1
7 is a slider for transferring a plurality of sheets, 19 is a slider driving device for driving the slider 17, and 20 is the guide 1 above.

- A guide rail for transferring a plurality of sheets installed side by side with the guide rail 11, 20a is the upper part of the guide rail 2o of the cigarette, and 20b is the lower part of the guide rail. In addition, since the fixed stopper 13 is not required except for the movable stopper 14 for transferring a plurality of sheets, the lower rail 20h is made longer than the lower rail Ilb by the thickness of the fixed collar 13.

Next, the operation of the device constructed as described in 1- below will be explained. C) When transferring the wafers 1 from the cassette 2 to the boat 3 one by one, by pushing down the movable stopper 14, one target wafer 1 passes through the slit 13a of the fixed stopper 13, and the remaining wafers 1 is held by a fixed stopper 13. The wafer 1 that has passed through the slit 13a is held by a V-groove roller rough at the tip of the slider 8 that has been picked up in advance, rolls on the guide rail 11, and is transferred to the boat 3. Conversely, when returning the wafer 1 from the boat 3 to the cassette l-2, the wafer 1 on the board 3 is moved by the groove roller 7 to the guide rail 11,
Collect it into the cassette 2 through the slit 1-13a, push the movable stopper 14, and move the first groove 2 and the bow 1-3 to the next groove.

Next, when transferring all the wafers 1 in the cassette 2 to the wafers 1 and 3 with the same pitch and pitch as the horn set 2, advance the slider 18 in advance, press down the movable stopper 14, and ②Retreat while holding all wafers with the grooved roller 17.J, you can move to Report 3. Furthermore, when collecting the wafers from the boat 3 into the cassette 2, the slider 18 is moved forward, the wafers 1 are collected into the cassette 2, and the wafers 1 can be transferred by pushing up the movable slot member 14.

In addition, in the embodiment described in 4-, the V-groove rollers 7, J, and 17 attached to the tips of the sliders 8 and 18 have a structure in which one point is t for the wafer 1, but the retention of the wafer 1 is In order to improve the quality, two rollers are in contact with the wafer 1.
1-U (koshimo J2 [ha.

[Effect of , 11ij] As described above, according to the invention, if the guide rail is +f
By using a single line, the wafer transfer distance can be shortened, and as a result, the transfer time can be shortened.

Furthermore, we will provide two wafer transfer mechanisms, one for one wafer and one for multiple wafers, and select two transfer mechanisms for various arrangement patterns from boat to boat. This has the effect of always being able to operate with the shortest transfer time.

[Brief explanation of drawings]

Figures 1 to 5 show embodiments of this invention.
FIG. 1 is a perspective view of a semiconductor wafer transfer device, FIG. 2 is a front view of a single wafer transfer mechanism, FIG. 3 is a front view of a multiple wafer transfer mechanism, and FIG. 4 is a front view of a multiple wafer transfer mechanism. 2 is a sectional view taken along the line TV-TV in FIG. 2, FIG. 5 is a sectional view taken along the line V-V in FIG. 2, and FIG. 6 is a front view showing a conventional semiconductor wafer transfer apparatus. In the figure, 1 (wafer, 2 cassette, 3 (1;I:'
-1-17.17t; tV groove row, 8.181. i sura (ta, n, 201i guide 1 nord, lla, 2
0al and 1 tatami/-, 1, 1 and 20h are lower rails, and 14 is a movable stopper. Note that the same reference numerals in the figures indicate the same or corresponding parts. Figure 1 2: Sumo wrestler, To8, Non-door, /7: Vtsut roller 6.16: Slider. / / , 20: Force ゛1 tray telells Qa:
k-yare)shittb, λOb: Lower 40 rays-1 and 14° I1 Aoh Sto Soba 0 Sa Figure 4 Figure 5 Figure 2 11ttll

Claims (2)

[Claims] (1) Two sets of linear guide rails are installed between the cassette and the boat, one for transferring one wafer and one for transferring multiple wafers, respectively, and the wafers are placed inside the guide rails facing each of the above guide rails. A semiconductor wafer transfer device comprising two sets of sliders that reciprocate while supporting the wafer during movement. (2) The semiconductor wafer transfer device according to claim 1, wherein the rotatable cassette chuck is provided with a movable stopper to prevent the wafer from rolling out of the cassette.