JPS62194693A - Electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention is applicable to electronic components, particularly electronic components such as resistors, diodes, transistors, capacitors, and ICs connected to circuit boards by anisotropic groove adhesives. It concerns parts.

(Prior art) Connections between electronic components and electronic circuit boards are usually made by soldering these 1! pole terminals.
In C2, electronic components and circuit boards are bonded using an anisotropic conductive adhesive that has conductive particles dispersed and mixed in an insulating adhesive and exhibits tetraconductivity in the thickness direction but is insulating in the plane direction. It is said that the method of connecting the
See Publication No. 9].

According to this method, it is possible to electrically connect electronic components and circuit boards and to hold and fix them together, but since the adhesive strength of this anisotropic conductive adhesive is generally weak, movement during the process and vibration of the finished product can be avoided. There is a risk of peeling off when struck by @, and this also has disadvantages in heat resistance and moisture resistance. Therefore, for this type of product, the electronic components connected in this way are then covered with C2 adhesive, but this increases the number of steps and the number of parts. However, if the shape of the parts is different, this process becomes complicated.

(Structure of the Invention) The present invention relates to an electronic component connected to an electronic circuit board that solves such disadvantages. The electrode terminal of this electronic component and the terminal of the electronic circuit board having the terminal to be connected to this electrode are bonded using an anisotropic J!4''r1f adhesive having conductivity only in the film thickness direction C: The electronic circuit board is connected with an adhesive, and the flange of the container and the electronic circuit board are bonded and held together with an adhesive.

- [In other words, the present inventors have carefully considered two methods for firmly adhering and holding electronic components and electronic circuit boards. If the flange part is attached to the circuit board at the same time as the electronic circuit board is adhesively connected, the two parts can be held and fixed at the same time. The present invention was completed after confirming that it was strong.

Electronic components in the present invention include resistors, diodes,
Examples include transistors, capacitors, ICs, etc., but these are not limited to these examples; various conventionally known devices are also included. Typically, electronic components are about a few to several α in length, width, and depth, and are cubic, rectangular, or cylindrical in shape, but are said to be adhesively connected to a circuit board. Therefore, it is preferable to use a cubic or rectangular parallelepiped structure with a flat electrode surface. In addition, although this device is generally considered to be leadless, a device with a lead can also be used as long as the lead is J-bent.

In the present invention, this electronic component is housed in a container having a flange, but this container must have an opening for accommodating the electronic component, and must have two flanges around the outside of this opening. The shape of this flange can be arbitrary, and it is best to have a shape that extends all the way around the outside of the opening and is downward in order to increase the contact with the circuit board, but it is also possible to have a linear structure. In addition, from the viewpoint of productivity and cost, and because it must be made from a material that exhibits sufficient contact force when bonded with an adhesive, polystyrene, polyester, polycarbonate, and polyester are recommended. It may be made of a polymer film such as arylate, polyimide, polyamide, etc. by vacuum forming or press forming.

On the other hand, the electronic circuit board used in this case may be a conventionally known one, such as one in which the desired circuit is printed on a solid board, or one in which a metal foil is etched by a known method. It is sufficient to fit a predetermined electrode terminal into the electronic component, but this electrode terminal portion should be flexible enough to follow the undulations and irregularities at the semi-extreme part of the electronic component to ensure reliable continuity. For example, at least the connection portion is preferably made of polyester film, polyimide film, etc.

Further, the anisotropic conductive adhesive used in the present invention for electrically connecting the electronic components and the circuit board may be any known adhesive, and therefore, this adhesive may be thermosetting, thermodegradable, ultraviolet ray adhesive, etc. It is sufficient to add 5 to 30 parts by volume of gold, trowel, palladium, nickel, soot, tungsten, solder alloy, etc. per 100 parts by volume to an insulating adhesive that is hardenable, electron beam hardenable, or has a hardening property. . However, this insulating adhesive has the disadvantages of a reaction-curing adhesive, such as a strong adhesive force but a short pot life and a long m1 during reaction. Since the shortcomings are that the time is short and the adhesive strength is weak, it is necessary to select the adhesive appropriately from the viewpoints of workability, adhesive strength, and price.Note that this anisotropic conductive adhesive is usually in liquid form. This can be applied to a circuit board as a thin film so that it exists as a thin film on the board, but it may also be a film-like solid substance. (You only need two devices.

Next, the electronic component of the present invention was prepared at night 5 based on the attached N side.
I will clarify. FIG. 1 shows an exploded perspective view of an electronic component of the present invention, in which a rectangular electronic component 1 having an electrode terminal 2 is shown.
is accommodated in a container 3I formed into this shape ζ2 and having an opening 4 and a flange 5. This container 3 is its circumference I]
It has an electrode terminal 7 provided with two notches 8, and an anisotropically conductive adhesive 6!
! The flange portion 5 of this container 3 is crimped onto the circuit board 6 on which the electronic component 1 and the electrode terminal 7 of the circuit board fi6 are electrically connected. Since both electrode terminals Z and
The electrical connection of 7 is 1M, and the #Il terminal 1 is made into a movable strip by the notch 8 (2), which gives it the advantage of being reliable and strong. Since the container 3 is molded to match the external shape of the electronic component 1, it is easy to store the electronic component 1 in the container 3 (this is done twice).
C: To prevent the circuit board 6 from floating up, an elastic body 10 is interposed on the back surface of the top of the container 3 as shown in FIG. (Two protrusions 11
It is advisable to provide a

Examples of the present invention will now be described.

Example 1 As shown in No. 41￥1 (2, 4 Yanagi terminal 13 is J-bent, IC+2 is as shown in FIG. The film is placed in a container 14 having a flange portion 15 obtained by molding the film, and is placed in a polyimide film-based flexible base material (copper foil thickness
IC on top of '/90z/ft'' surface gold plated
The electrode 17 corresponding to the +2 electrode terminal 13 is cut 18
(Therefore, it is made into a movable strip shape, and the particle size is 1.
7% by volume of silver-copper alloy particles with a diameter of 0 to 30 μm based on the adhesive
A circuit board 16 having a coating film 19 formed by screen printing a dispersed anisotropically conductive adhesive to a thickness of 40 μm.
Then, while crimping them using a crimping jig made of transparent glass in at least one direction,
This coating was cured by irradiating it with ultraviolet rays having an energy of 2.000 mJ/li.

Next, when we examined the electrical operation of this cured product, we found that it worked perfectly, and that it operated in the same way.

Example? As shown in FIG. 7, the cylindrical resistor 20 has a thickness of 0.
This was housed in a container 21 made by molding a 213+ amorphous polyester film, and this was placed on a 38 μm polyester film substrate (on which the desired circuit was printed with hook paste, and electrode terminals were placed on this). It is provided in the same movable strip shape as above, and on top of this is an anisotropically conductive adhesive containing 65% by volume of spherical solder alloy with a particle size of 5 to 15 μm dispersed in an insulating adhesive based on thermoplastic SBR resin. After gluing together the adhesive film formed with a flexible adhesive by a casting method and placing it on the flexible circuit board 22 provided with the partial opening g=reinforcing plate 23, these are formed into a cylindrical shape (two 150 °C using a crimping jig with an elastic body as obtained, 30 to 9/c + tr
When thermocompression bonded under these conditions, these were completely (integrated into two).

Next, we measured the contact resistance of the electronic component obtained in this way, and found that the initial average resistance was 0.63Ω, and this changed slightly to 0.710 even after 1.000 hours at 70°C. However, for those that do not use this container, the initial average resistance is 0.65Ω at 70°C.
．． After 000 hours, the sea rose by 1.53ΩC2.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of the electronic component of the present invention, FIGS. 2 and 3 are longitudinal cross-sectional views of the electronic component, FIG. 4 is a plan view of the IC in Example 1, and FIG. 5 is a vertical cross-section of the electronic component. Front view, '#IJb
The figure is a plan view of a circuit board for use in the 22-phase circuit, and FIG. 7 is a longitudinal cross-sectional view of the circuit board and sub-components according to the second embodiment. 1.12.20...Electronic parts, 3. +4.21・
...Container, 6.16.22...Circuit board, 2, +3.7.17...Electrode terminal, 5.15...
Flange, 8.18...notch, 9, +9.2
4...Anisotropic conductive adhesive. Patent applicant: Shin-Etsu Polymer Co., Ltd. Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] 1. An electronic component is placed in a container having an opening and a flange around the outside of the opening, and an electrode terminal of the electronic component and a terminal of an electronic circuit board having a terminal to be connected to the electrode are placed. What is claimed is: 1. An electronic component comprising: an anisotropically conductive adhesive having conductivity only in the film thickness direction; and a flange of the container and an electronic circuit board bonded and held together using an adhesive.