JPS62190201A - Ultraviolet curing resin composition - Google Patents
Ultraviolet curing resin compositionInfo
- Publication number
- JPS62190201A JPS62190201A JP3067886A JP3067886A JPS62190201A JP S62190201 A JPS62190201 A JP S62190201A JP 3067886 A JP3067886 A JP 3067886A JP 3067886 A JP3067886 A JP 3067886A JP S62190201 A JPS62190201 A JP S62190201A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- compound
- group
- meth
- curable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 23
- 150000001875 compounds Chemical class 0.000 claims abstract description 24
- 125000003118 aryl group Chemical group 0.000 claims abstract description 8
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 8
- 125000006615 aromatic heterocyclic group Chemical group 0.000 claims description 4
- 239000000203 mixture Substances 0.000 abstract description 7
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 abstract description 4
- 125000000623 heterocyclic group Chemical group 0.000 abstract description 4
- 230000000704 physical effect Effects 0.000 abstract description 4
- NDKJATAIMQKTPM-UHFFFAOYSA-N 2,3-dimethylbenzenethiol Chemical compound CC1=CC=CC(S)=C1C NDKJATAIMQKTPM-UHFFFAOYSA-N 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 12
- -1 t-butylcuocresol Chemical compound 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 6
- 238000009472 formulation Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical group OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- WHMDPDGBKYUEMW-UHFFFAOYSA-N pyridine-2-thiol Chemical compound SC1=CC=CC=N1 WHMDPDGBKYUEMW-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- AOCLMTXQVVUTEB-UHFFFAOYSA-N (2-benzylphenyl)-phenylmethanone Chemical compound C=1C=CC=C(CC=2C=CC=CC=2)C=1C(=O)C1=CC=CC=C1 AOCLMTXQVVUTEB-UHFFFAOYSA-N 0.000 description 1
- OZFIGURLAJSLIR-UHFFFAOYSA-N 1-ethenyl-2h-pyridine Chemical group C=CN1CC=CC=C1 OZFIGURLAJSLIR-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- QGKGHQPUCHEWMC-UHFFFAOYSA-N 1-sulfanylnaphthalen-2-ol Chemical group C1=CC=CC2=C(S)C(O)=CC=C21 QGKGHQPUCHEWMC-UHFFFAOYSA-N 0.000 description 1
- KXZSVYHFYHTNBI-UHFFFAOYSA-N 1h-quinoline-2-thione Chemical compound C1=CC=CC2=NC(S)=CC=C21 KXZSVYHFYHTNBI-UHFFFAOYSA-N 0.000 description 1
- LLMLGZUZTFMXSA-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzenethiol Chemical compound SC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl LLMLGZUZTFMXSA-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- ZFFTZDQKIXPDAF-UHFFFAOYSA-N 2-Furanmethanethiol Chemical compound SCC1=CC=CO1 ZFFTZDQKIXPDAF-UHFFFAOYSA-N 0.000 description 1
- RFCQDOVPMUSZMN-UHFFFAOYSA-N 2-Naphthalenethiol Chemical compound C1=CC=CC2=CC(S)=CC=C21 RFCQDOVPMUSZMN-UHFFFAOYSA-N 0.000 description 1
- VRVRGVPWCUEOGV-UHFFFAOYSA-N 2-aminothiophenol Chemical compound NC1=CC=CC=C1S VRVRGVPWCUEOGV-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- JKIFPWHZEZQCQA-UHFFFAOYSA-N 2-nitrobenzenethiol Chemical compound [O-][N+](=O)C1=CC=CC=C1S JKIFPWHZEZQCQA-UHFFFAOYSA-N 0.000 description 1
- BKMGLHQPYYCKPO-UHFFFAOYSA-N 2-tert-butylbenzenethiol Chemical compound CC(C)(C)C1=CC=CC=C1S BKMGLHQPYYCKPO-UHFFFAOYSA-N 0.000 description 1
- ZVANSRULPRVUSG-UHFFFAOYSA-N 4,6-dimethyl-1h-pyridine-2-thione Chemical compound CC1=CC(C)=NC(S)=C1 ZVANSRULPRVUSG-UHFFFAOYSA-N 0.000 description 1
- KGCLPWUBYGOUMV-UHFFFAOYSA-N 5-chloro-2-sulfanylphenol Chemical compound OC1=CC(Cl)=CC=C1S KGCLPWUBYGOUMV-UHFFFAOYSA-N 0.000 description 1
- RKEVGXWCJYWMEX-UHFFFAOYSA-N 7-sulfanylchromen-2-one Chemical compound C1=CC(=O)OC2=CC(S)=CC=C21 RKEVGXWCJYWMEX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 1
- 125000002541 furyl group Chemical group 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- PMRYVIKBURPHAH-UHFFFAOYSA-N methimazole Chemical compound CN1C=CNC1=S PMRYVIKBURPHAH-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 125000005493 quinolyl group Chemical group 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
Landscapes
- Polymerisation Methods In General (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、硬化速度がはやく、かつ、極めて短時間で要
求される物性を得ることができる紫外線硬化型樹脂組成
物に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an ultraviolet curable resin composition that has a rapid curing speed and can obtain required physical properties in an extremely short period of time.
紫外線硬化型樹脂組成物は、短時間で硬化する性質を有
することから、コーテイング材、ポツティング材等に使
用されているが、より生産性を高めるという目的で、で
きるだけ速く、要求される特性へ近づける改良、すなわ
ち、樹脂組成物の硬化速度を上げるための改良がなされ
ている。その方法としては、従来、光開始剤の種類、量
を変える方法、光増感剤を使用する方法などがあるが、
より筒便に硬化速度を上げることが期待されていた。Ultraviolet curable resin compositions have the property of curing in a short time, so they are used in coating materials, potting materials, etc., but in order to further increase productivity, it is possible to get closer to the required properties as quickly as possible. Improvements have been made to increase the curing speed of resin compositions. Conventional methods include changing the type and amount of photoinitiators, and using photosensitizers.
It was expected that this would further increase the curing speed.
本発明は、このような事情にかんがみなされたものであ
って、成る特定の化合物を少量配合することにより硬化
速度を向上させ、かつ、極めて短時間で要求される物性
を得ることを可能とした紫外線硬化型樹脂組成物を提供
することを目的とする。The present invention was developed in view of these circumstances, and has made it possible to improve the curing speed and obtain the required physical properties in an extremely short period of time by incorporating a small amount of a specific compound. The purpose of the present invention is to provide an ultraviolet curable resin composition.
このため、本発明は、光重合性化合物と光開始剤とから
なる紫外線硬化型樹脂組成物に、アリール基又は芳香族
性を有する複素環基に直接結合したチオール基を有する
化合物を0.01〜5重量%含有させてなることを特徴
とする紫外線硬化型樹脂組成物を要旨とするものである
。Therefore, in the present invention, 0.01% of a compound having a thiol group directly bonded to an aryl group or an aromatic heterocyclic group is added to an ultraviolet curable resin composition comprising a photopolymerizable compound and a photoinitiator. The gist of the present invention is an ultraviolet curable resin composition characterized by containing ~5% by weight.
以下、本発明の構成について詳しく説明する。Hereinafter, the configuration of the present invention will be explained in detail.
本発明で用いるアリール基に直接結合した化合物(A)
とは、例えば、チオフェノール、および下記一般式(1
)で表されるチオフェノール類、例えばl−チオクレゾ
ール、ジメチルチオフェノール、t−ブチルクオクレゾ
ール、t−ブチルチオフェノール、4−クロロチオカテ
コール、2.5−ジクロロチオフェノール、ペンタクロ
ロチオフェノール、2−アミノチオフェノール、2−ニ
トロチオフェノールなどである。Compound (A) directly bonded to the aryl group used in the present invention
For example, thiophenol and the following general formula (1
), such as l-thiocresol, dimethylthiophenol, t-butylcuocresol, t-butylthiophenol, 4-chlorothiocatechol, 2.5-dichlorothiophenol, pentachlorothiophenol, These include 2-aminothiophenol and 2-nitrothiophenol.
R,=アルキル基、アルコキシル基、了り−ル基、ニト
リル基、ニトロ基、カルボキシル基、アミノ基、ハロゲ
ン基、水酸基、アセチル基、(Rtはオルト、メタ、バ
ラのどの位置でもよい)さらに、チオナフトール、1−
メルカプト−2−ナフトールのような縮合ベンゼン環を
有する化合物も含まれる。また、芳香族性を有する複素
環基に直接結合したチオール基を有する化合物(B)と
は、ピリジル、キノリル、フリル、クマリル基などの複
素環基中の炭素原子に直接結合したチオール基を有する
化合物、例えばフルフリルメルカプタン、2−メルカプ
トピリジン、2−メルカプトキノリン、2−メルカプト
−4,6−シメチルビリジン、7−メルカプトクマリン
、2−メルカプトベンズイミダゾール、1−メチル−2
−メルカプトイミダゾール、2−メルカプトベンゾチア
ゾール、5−メルカプト−2−メチル−1,3,4,−
チアゾールなどである。これらアリール基又は芳香族性
を有する複素環基に直接結合した化合物(A)。R, = alkyl group, alkoxyl group, aryol group, nitrile group, nitro group, carboxyl group, amino group, halogen group, hydroxyl group, acetyl group, (Rt can be at any position of ortho, meta, or rose), and , thionaphthol, 1-
Also included are compounds with fused benzene rings such as mercapto-2-naphthol. In addition, the compound (B) having a thiol group directly bonded to a heterocyclic group having aromaticity refers to a compound (B) having a thiol group directly bonded to a carbon atom in a heterocyclic group such as pyridyl, quinolyl, furyl, coumaryl group, etc. Compounds such as furfuryl mercaptan, 2-mercaptopyridine, 2-mercaptoquinoline, 2-mercapto-4,6-dimethylpyridine, 7-mercaptocoumarin, 2-mercaptobenzimidazole, 1-methyl-2
-mercaptoimidazole, 2-mercaptobenzothiazole, 5-mercapto-2-methyl-1,3,4,-
Such as thiazole. A compound (A) directly bonded to these aryl groups or aromatic heterocyclic groups.
(B)の含有割合としては、光重合開始剤のみを使用し
た時よりも明らかに硬化速度が上がる量として、0.0
1重量%以上である。また、これらチオール化合物は、
一般に臭気が強く、さらに、樹脂の貯蔵安定性を保持す
るということから、最高でも5重量%である。すなわち
0.01〜5重量%である。The content ratio of (B) is 0.0 as the amount that clearly increases the curing speed compared to when only the photopolymerization initiator is used.
It is 1% by weight or more. In addition, these thiol compounds are
In general, it has a strong odor and, furthermore, it is required to maintain the storage stability of the resin, so the maximum content is 5% by weight. That is, it is 0.01 to 5% by weight.
ここで、光重合性化合物とは、(メタ)アクリロイル基
を有する化合物、(メタ)アクリロイル基を有するオリ
ゴマー、(メタ)アクリロイル基以外のエチレン性不飽
和結合を有する化合物をいう。Here, the photopolymerizable compound refers to a compound having a (meth)acryloyl group, an oligomer having a (meth)acryloyl group, and a compound having an ethylenically unsaturated bond other than the (meth)acryloyl group.
(メタ)アクリロイル基を有する化合物としては、例え
ば、フェノキシエチル(メタ)アクリレート、エチル(
メタ)アクリレート、メチル(メタ)アクリレート、ベ
ンジル(メタ)アクリレート、2−エチルヘキシル(メ
タ)アクリレート、テトラヒドロフルフリル(メタ)ア
クリレート、ラウリル(メタ)アクリート、のような単
官能(メタ)アクリレート、下記一般式(2)で示され
るような単官能(メタ)アクリレート、
CIl□= C−C−(−QC)l 2Cl(−hR4
・・・ (2)11I
Rz 0 1h
(n=1〜4)
Rz= 11 、 CH,、
R3= H、C1h、
0C4H9、
+1H
1,6−ヘキサンシオールジ(メタ)アクリレート、ネ
オベンチルグリコールジ(メタ)アクリレート、ポリエ
チレングリコールジ(メタ)アクリレート、ビスフェノ
ールAのエチレンオキサイド付加物を骨格に含むジ(メ
タ)アクリレートなどの2官能(メタ)アクリレート、
トリメチロールプロパントリ (メタ)アクリレート、
トリス(ヒドロキシ−エチルアクリロイル)イソシアヌ
レートのような3官能(メタ)アクリレートなどである
。(メタ)アクリロイル基を有するオリゴマーとは、ポ
リエチレングリコール、ポリプロピレングリコール、ポ
リテトラメチレングリコール、ポリエステルグリコール
などのグリコール類より得られるウレタンアクリレート
、エポキシアクリレート、ポリエステルアクリレートな
どである。Examples of compounds having a (meth)acryloyl group include phenoxyethyl (meth)acrylate, ethyl (
Monofunctional (meth)acrylates such as meth)acrylate, methyl (meth)acrylate, benzyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, lauryl (meth)acrylate, the following general Monofunctional (meth)acrylate as shown by formula (2), CIl□=C-C-(-QC)l2Cl(-hR4
... (2) 11I Rz 0 1h (n = 1 to 4) Rz = 11, CH,, R3 = H, C1h, 0C4H9, +1H 1,6-hexanethiol di(meth)acrylate, neobentyl glycol di (meth)acrylate, polyethylene glycol di(meth)acrylate, bifunctional (meth)acrylate such as di(meth)acrylate containing an ethylene oxide adduct of bisphenol A in its skeleton;
trimethylolpropane tri(meth)acrylate,
These include trifunctional (meth)acrylates such as tris(hydroxy-ethyl acryloyl) isocyanurate. Oligomers having (meth)acryloyl groups include urethane acrylates, epoxy acrylates, and polyester acrylates obtained from glycols such as polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and polyester glycol.
(メタ)アクリロイル基以外のエチレン性不飽和結合を
有する化合物とは、N−ビニルピリジン、N−ビニルピ
ロリドン、スチレン、α−メチルスチレン、などである
。これらの光重合性化合物は、2種以上を組み合わせて
使用することが、コーテイング材、ボッティング材とし
ての性質を得る上で好ましい。Compounds having ethylenically unsaturated bonds other than (meth)acryloyl groups include N-vinylpyridine, N-vinylpyrrolidone, styrene, α-methylstyrene, and the like. It is preferable to use two or more of these photopolymerizable compounds in combination in order to obtain properties as a coating material and a botting material.
光重合開始剤としては、ラジカル開裂型、水素引きぬき
型のどちらを用いてもよく、例えば、ベンジルジメチル
ケタール、1−ヒドロキシシクロへキシルフェニルケト
ン、2−ヒドロキシ−2−メチルプロピオフェノン、ジ
ェトキシアセトフェノン、ベンゾインエチルエーテル、
ベンジルベンゾフェノン、2−メチルアントラキノン、
2.4−ジエチルチオキサントンなどが有効に用いられ
る。As the photopolymerization initiator, either a radical cleavage type or a hydrogen abstraction type may be used. For example, benzyl dimethyl ketal, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methylpropiophenone, Toxyacetophenone, benzoin ethyl ether,
Benzylbenzophenone, 2-methylanthraquinone,
2,4-diethylthioxanthone and the like are effectively used.
これらを配合して、紫外線硬化型樹脂組成物を得るが、
本発明では、これらの紫外線硬化型樹脂組成物に一般に
は使用されない前記化合物(A)、(B)を少量添加す
ることで紫外線硬化型樹脂組成物の硬化速度を顕著に上
げることを見い出したものである。These are blended to obtain an ultraviolet curable resin composition,
In the present invention, it has been discovered that the curing speed of ultraviolet curable resin compositions can be significantly increased by adding a small amount of the compounds (A) and (B), which are not generally used, to these ultraviolet curable resin compositions. It is.
以下に実施例および比較例を示す。Examples and comparative examples are shown below.
実施例、比較例
+1) 下記表−1に示す配合(重量部)にて、紫外
線硬化型樹脂組成物を得た。表−1において、N12の
配合は階1の配合に、患4の配合は隘3の配合に、それ
ぞれ、チオフェノールを0.5重量部加えたものである
。これら配合した紫外線硬化型樹脂組成物は、紫外線ラ
ンプ(80W/cm、IKW、メタルハライドランプ)
で50mJ/cd、 100mJ/ cA、200mJ
/CIA、400mJ/cjの光をあて、厚さ200μ
mのシートを作成し、プラスチックJIS2号ダンベル
にて打ちぬき、その弾性率を測定した。比較例で弾性率
の飽和度という点から、樹脂の硬化速度を比較した。Examples, Comparative Examples +1) Ultraviolet curable resin compositions were obtained using the formulations (parts by weight) shown in Table 1 below. In Table 1, 0.5 parts by weight of thiophenol was added to the formulation of N12 and the formulation of Level 1, and the formulation of Case 4 to the formulation of Level 3, respectively. These blended ultraviolet curable resin compositions are prepared using an ultraviolet lamp (80W/cm, IKW, metal halide lamp).
50mJ/cd, 100mJ/cA, 200mJ
/CIA, 400mJ/cj light, 200μ thick
A sheet of 1.5 m was prepared, punched out using a plastic JIS No. 2 dumbbell, and its elastic modulus was measured. In comparative examples, the curing speeds of resins were compared in terms of saturation of elastic modulus.
表−1
□□□□I
註)
ウレタンアクリレートAニ
ーCHzCHtOCCH=C11□(−(CHtCHI
CIl□CI(t−0汁の部分0 は、PTM
G平均分子量850のものを示す)。Table-1 □□□□I Note) Urethane acrylate A knee CHzCHtOCCH=C11□(-(CHtCHI
CIl□CI (t-0 juice part 0 is PTM
G-average molecular weight of 850).
ウレタンアクリレートB:
モノアクリレートA:
ジアクリレートA:
トリアクリレートAニ
ドリス(ヒドロキシエチルアクリロイル)イソシアヌレ
ート。Urethane acrylate B: Monoacrylate A: Diacrylate A: Triacrylate A Nidris (hydroxyethyl acryloyl) isocyanurate.
第1図は、400mJ/ca!の光を照射したときの弾
性率を100とし、50IIIJ/ci、100mJ/
cIa、 200mJ/Caの光をそれぞれ照射したと
きの弾性率が400ffiJ/−照射時のどれぐらいに
なっているかをパーセントで表したものである。Figure 1 shows 400mJ/ca! The elastic modulus when irradiated with light is 100, 50IIIJ/ci, 100mJ/
cIa, the elastic modulus when irradiated with light of 200 mJ/Ca is expressed as a percentage when irradiated with 400 ffiJ/-.
第1図において、隘1と嵐2、隘3と隘4をそれぞれ比
較するとわかるように、同一の樹脂組成にもかかわらず
チオフェノールを加えることにより、50mJ/ cj
の光を照射したときの弾性率が上がり、弾性率の飽和度
という点から見た硬化速汝が向上している。As can be seen by comparing No. 1 and Arashi 2, and No. 3 and No. 4 in Figure 1, the addition of thiophenol resulted in a reduction of 50 mJ/cj despite the same resin composition.
The elastic modulus increases when irradiated with light, and the curing speed improves in terms of saturation of the elastic modulus.
(2)下記表−2に示す配合(重量部)にて、紫外線硬
化型樹脂組成物を得た。表−2において、階6は階5に
2−メルカプトベンズイミダゾールを、階7は階5に2
−メルカプトピリジンをそれぞれ0.5重量部加えたも
のである。これら配合した紫外線硬化型樹脂組成物で前
記(1)と動揺にシートを作成し、その弾性率を測定し
た。また、比較例で弾性率の飽和度という点から、樹脂
組成物の硬化速度を比較した。(2) An ultraviolet curable resin composition was obtained using the formulations (parts by weight) shown in Table 2 below. In Table 2, on floor 6, 2-mercaptobenzimidazole was added to floor 5, and on floor 7, 2-mercaptobenzimidazole was added to floor 5.
- 0.5 parts by weight of mercaptopyridine. A sheet was prepared using the ultraviolet curable resin composition blended above in the same manner as in (1) above, and its elastic modulus was measured. Furthermore, in a comparative example, the curing speeds of the resin compositions were compared in terms of the degree of saturation of the elastic modulus.
表−2
第2図は、400mJ/cjの光を照射したときの弾性
率を100とし、50mJ/cd、100+eJ/ca
t、 200a+J/cdの光をそれぞれ照射したとき
のフィルムの弾性率が400mJ/aJ照射時のどれく
らいになっているかをパーセントで表したものである。Table 2 Figure 2 shows the elastic modulus of 100 when irradiated with 400 mJ/cj light, 50 mJ/cd, 100+eJ/ca
The elastic modulus of the film when irradiated with light of t and 200a+J/cd is expressed as a percentage when irradiated with 400mJ/aJ.
第2図において、隘5と階6、階5と隘7をそれぞれ比
較すると判るように、同一の樹脂組成にもかかわらず前
記(1)で用いたチオフェノールと同様に、芳香族性を
有する複素環基に直接結合したチオール基を有する化合
物である2−メチルカブトビリジンを加えた場合にも、
50mJ/cdの光を照射したときの弾性率が上がり、
性率の飽和度という点での硬化速度が向上している。In Fig. 2, as can be seen by comparing No. 5 and No. 6, and No. 5 and No. 7, they have aromatic properties similar to the thiophenol used in (1) above, despite having the same resin composition. Even when 2-methylcabutoviridine, a compound having a thiol group directly bonded to a heterocyclic group, is added,
The elastic modulus increases when irradiated with 50 mJ/cd light,
The curing speed in terms of percent saturation is improved.
以上説明したように、アリール基(または芳香族複素環
基)に直接結合したチオール基を有する化合物を含む本
発明の紫外線硬化型樹脂組成物は、同一組成の樹脂に対
して硬化後の樹脂の特性を損なうことなく、硬化速度を
向上させ得るものであるから、短時間で所定の物性値が
得られ、生産性を向上させ得るという利点があり、光フ
ァイバーのコーテイング材、ボッティング材等への利用
可能である。As explained above, the ultraviolet curable resin composition of the present invention containing a compound having a thiol group directly bonded to an aryl group (or aromatic heterocyclic group) has a Since it can improve the curing speed without sacrificing properties, it has the advantage of achieving desired physical properties in a short time and improving productivity, making it suitable for optical fiber coating materials, botting materials, etc. Available.
第1図および第2図は、紫外線硬化型樹脂組成物の弾性
率比と照射紫外線エネルギーとの関係図である。FIG. 1 and FIG. 2 are relationship diagrams between the elastic modulus ratio of the ultraviolet curable resin composition and the irradiated ultraviolet energy.
Claims (1)
組成物に、アリール基又は芳香族性を有する複素環基に
直接結合したチオール基を有する化合物を0.01〜5
重量%含有させてなることを特徴とする紫外線硬化型樹
脂組成物。0.01 to 5% of a compound having a thiol group directly bonded to an aryl group or an aromatic heterocyclic group is added to an ultraviolet curable resin composition consisting of a photopolymerizable compound and a photoinitiator.
% by weight of an ultraviolet curable resin composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3067886A JPS62190201A (en) | 1986-02-17 | 1986-02-17 | Ultraviolet curing resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3067886A JPS62190201A (en) | 1986-02-17 | 1986-02-17 | Ultraviolet curing resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62190201A true JPS62190201A (en) | 1987-08-20 |
Family
ID=12310360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3067886A Pending JPS62190201A (en) | 1986-02-17 | 1986-02-17 | Ultraviolet curing resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62190201A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110052855A1 (en) * | 2008-05-30 | 2011-03-03 | Nipponkayaku Kabushikikaisha | Ultraviolet-Curable Resin Composition For Optical Disk, Cured Product And Optical Disk |
TWI480697B (en) * | 2013-06-10 | 2015-04-11 | Chi Mei Corp | Photosensitive resin composition and applications thereof |
-
1986
- 1986-02-17 JP JP3067886A patent/JPS62190201A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110052855A1 (en) * | 2008-05-30 | 2011-03-03 | Nipponkayaku Kabushikikaisha | Ultraviolet-Curable Resin Composition For Optical Disk, Cured Product And Optical Disk |
JP5391194B2 (en) * | 2008-05-30 | 2014-01-15 | 日本化薬株式会社 | Ultraviolet curable resin composition for optical disc, cured product, and optical disc |
TWI480697B (en) * | 2013-06-10 | 2015-04-11 | Chi Mei Corp | Photosensitive resin composition and applications thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4612209A (en) | Process for the preparation of heat-curable adhesive films | |
US4552604A (en) | Bonding method employing film adhesives | |
JPH01102455A (en) | Photopolymerizable recording material for plate body and relief plate in particular | |
CA1317501C (en) | Liquid photoinitiator mixtures | |
JPH01300246A (en) | Photosensitive resin composition for flexography | |
AU2010306807A1 (en) | Anaerobically curable compositions | |
EP0144148A2 (en) | Photocurable compositions containing prepolymers of two curing types | |
CA1198539A (en) | Heat stable, polymer-forming composition | |
JP3510393B2 (en) | Flexographic printing plate obtained from a photocurable elastomer composition | |
EP0136186A2 (en) | Photocurable resin composition | |
JPS62190201A (en) | Ultraviolet curing resin composition | |
AU2326484A (en) | Photopolymerizable acrylate composition | |
EP0548740B2 (en) | Light-currable polymeric adhesive based on methylmethacrylate | |
JPS5941444B2 (en) | Photopolymerizable composition | |
JPS59152922A (en) | Resin composition curable with high-energy radiation | |
JPH02269103A (en) | Photo-initiator mixture | |
US4463117A (en) | Heat stable, polymer-forming composition | |
KR910012809A (en) | Photocurable Urethane-Containing Compositions | |
JPS6139759B2 (en) | ||
US4264709A (en) | Synergistic photoinitiators for ultraviolet curable resins | |
CA2047454A1 (en) | Free radically curable formulations employing dithiolate catalysts | |
KR20070041715A (en) | Maleimide-based radiation curable compositions | |
JP2006508381A (en) | Photosensitive resin composition containing halogen-free colorant | |
JPS61133215A (en) | Curable resin composition | |
JPS6031322B2 (en) | Highly sensitive photocurable composition |