JPS62171194A - Matrix wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application in Industry] The present invention relates to a matrix wiring board having an insulating layer and conductor layers formed above and below the insulating layer.

[Prior Art] Conventionally, in this type of matrix wiring board, an insulating layer disposed between a first conductive layer (hereinafter referred to as the first layer) and a second conductive layer (hereinafter referred to as the second layer) is formed using a printing method. However, in this case, the insulating layer is printed twice to prevent short circuits between the first layer and the second layer due to pinholes formed in the insulating layer.

[Problems to be Solved by the Invention] However, in the through-hole portion of the insulating layer provided to obtain electrical conduction between the first layer and the second layer, the step portion formed in that portion may be The slope becomes steep. In particular, if the second layer is a thin film formed by vapor deposition or sputtering, the resist may be removed from the resist at the step formed by the two insulating layers during the subsequent trilithography step (during pattern formation). If you adjust the exposure amount to match other parts, a short circuit will occur in the pattern at the step part, and if you adjust the exposure amount to match the difference part, the pattern in other parts will become thicker. However, there was a problem in that disconnections (opens) occurred.

[Means for solving the problem] The present invention solves the problem, and when forming the second insulating layer, the pattern is different from that of the first time,
It is an object of the present invention to provide a matrix wiring board in which pattern formation of a second layer can be easily and reliably performed by making the slope of the stepped portion gentle.

Therefore, in the present invention, there is provided a first conductive layer disposed on a substrate, a first insulating layer disposed on the first conductive layer and having a hole portion exposing a conductive portion thereof, and a first insulating layer disposed on the first insulating layer. a second insulating layer having a hole that covers the surface of the hole in the first insulating layer and exposes a conductive portion; and a second conductive layer having a portion that contacts the conductive portion of the first conductive layer through the hole.

[Function] That is, according to the present invention, the second insulating layer is disposed with the hole having a gentle slope shape with respect to the substrate, covering the surface of the hole in the first insulating layer, so that the second conductive layer Layers are formed easily and reliably.

[Example] Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an example of the structure of a matrix wiring board according to the present invention. Here, 1 is a substrate made of glass or ceramic, etc., and 2 is a first plate made of conductive paste such as silver or copper printed on the substrate 1.
It is a layer. 3 and 4 are insulators formed in the first and second steps, respectively, and can be formed by screen printing using epoxy resin or polyimide resin.

5 is the second layer formed by film formation and photolithography process.
It is a layer.

FIGS. 2 through 4 show an example of a sequential process for manufacturing the matrix wiring board shown in FIG. First, the second
As shown in the figure, a conductive paste is printed on a substrate 1 by a screen printing method to obtain a first layer 2.

Next, as shown in FIG. 3, by screen printing, the first layer 2 and the second layer
An insulating layer 3 having a through hole 3A so as to be in contact with layer 5 is formed using an insulating resin. In this example, the thickness of this insulating layer 3 was set to 15 μm to 20 μm.

Next, as shown in FIG. 4, an insulating layer 4 having through holes 4A is formed on the same lines by screen printing. At this time, in this example, the printed pattern was expanded to a total area of about 150 μm from the printed pattern of the insulating layer 3 formed the first time. Then, a second layer 5 is formed on the insulating layer 4 by a photolithography process,
The matrix wiring board shown in the first diagram is obtained.

As a result, as shown in FIGS. 5 and 6, the insulating layer 1
As shown in FIG. 7, the slope of the stepped portion becomes gentler than when the insulating layer 14 whose pattern is not changed is provided, making it easier to form the second layer and preventing the occurrence of opens and shorts. This enables reliable pattern formation.

Specifically, when the pattern is not changed, the angle of inclination of the stepped portion from the surface of the substrate 1 to the top surface of the insulating layer with respect to the substrate is approximately 20 degrees, but when the pattern is changed as in this example, It is possible to gradually reduce the temperature to about 6 degrees. Therefore, when the second layer is formed as a thin film by vapor deposition or sputtering in a subsequent step, the thickness of the resist at the stepped portion of the insulating layer is By reducing the inclination angle of the stepped portion, it becomes possible to reduce the inclination angle to about half that of the insulating layer formed in the conventional method, thereby making it possible to eliminate opens and shorts that occur during conventional patterning.

In addition, in this example, the case where the first layer is formed into a thick film by pattern printing has been described, but the present invention
Of course, the present invention can also be very effectively applied to matrix wiring boards formed into thin films by processes including film formation and photolithography processes.

[Effects of the Invention] As explained above, according to the present invention, when forming the second insulating layer, the pattern is different from the first, and the slope of the stepped portion such as the through hole portion is made gentler. As a result, pattern formation of the second layer can be easily and reliably performed, and a highly reliable matrix wiring board can thus be obtained.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an example of the structure of a matrix wiring board according to the present invention; FIGS. 2 to 4 are sectional views showing an example of a sequential process for manufacturing the matrix wiring board shown in FIG. 1; FIG. 5 is a cross-sectional view showing an example of a 71-RIX wiring board in which the pattern was not changed from the first formation during the second insulating layer formation, and FIG. 6 and FIG. FIG. 2 is a cross-sectional view for explaining the shape of a stepped portion of the matrix wiring board shown in the drawings and FIG. 1; DESCRIPTION OF SYMBOLS 1... Substrate, 2... First layer, 3.13... Insulating layer formed at the first time, 4.14.
... Insulating layer formed second time, 5... Second layer.

Claims (1)

[Scope of Claims] 1) a first conductive layer disposed on a substrate; a first insulating layer disposed on the first conductive layer and having a hole exposing a conductive portion thereof; and the first insulating layer. a second insulating layer disposed on the second insulating layer and having a hole portion that covers the surface of the hole portion of the first insulating layer and exposes a conductive portion; and a step including a film formation and photolithography process on the second insulating layer. and a second conductive layer having a portion disposed in the insulating member and in contact with the conductive portion of the first conductive layer through the hole of the insulating member. 2) The matrix wiring board according to claim 1, wherein the first and second insulating layers are formed by screen printing.