JPS62152136A - Spinning chuck for semiconductor wafer - Google Patents

Abstract

PURPOSE:To perform a drying treatment on a wafer in a stable state in the simple structure, without being subjected to the restriction of the installation place and also, preventing damage to the wafer by fixing the wafer by one end part of the wafer retention pawls which are shifted on the recessed part of the chuck by a centrifugal force. CONSTITUTION:A wafer 12 is housed in a recessed part 13 of a chuck 20 and thereafter, a chuck main body 11 is rotated. At this time, wafer retention pawls 16a-16c make bend end parts 17a-17c elongate outside on the recessed part 13 by the centrifugal force to accompany the turning force of the main body 11. A drying treatment of the wafer 12 is performed in a state that the wafer 12 is reliably held by the pinching action of the bent end arts 17a-17c and spacer pins 14. When the rotation of the main body 11 is stopped after the drying treatment, the wafer press pawls 16a-16c are returned to the prescribed positions on the main body 11 by the action of springs 19. Then, the wafer 12 is taken out of the recessed part 13.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a spin chuck for semiconductor wafers (hereinafter simply referred to as wafers).

[Technical background of the invention]

Conventionally, in order to dry wafers etc. after cleaning, for example, a third
A spin chuck 10 for a semiconductor wafer shown in FIGS.
is used. 1 in the figure is a cylinder block. The cylinder block 1 is connected to a rotation mechanism (not shown) via a rotation shaft 2. cylinder block 1
The ends of a rod 4 are drawn out from both ends of the cylinder block 1 in a state where they are pulled toward the center of the cylinder block 1 by the tensile action of a spring 3 provided inside the rod. Lotsu I-'
A gripping member 6 is attached to the end of the wafer 4 for gripping the peripheral side surface of the wafer 5 as the object to be processed.

The wafer 5 is dried by gripping the circumferential side of the wafer 5 by one gripping member 6 and rotating the cylinder block 1 in this state.

[Problems with background technology]

In such a conventional semiconductor wafer spin chuck 10, there are 10 cylinder blocks in a lot.

4 requires external equipment to load high pressure air,
There are restrictions on the installation location of the spin chuck 10 for semiconductor wafers. Further, when rotating the cylinder block 1, there is a problem that the wafer 5 is likely to come off and be damaged. Furthermore, since the shape of the cylinder block 1 is not circular, when the wafer 5f is rotated at high speed, large vibrations are applied to the wafer 5 and the wafer 5
There is a problem that accidents such as cracks are likely to occur.

[Purpose of the invention]

The present invention provides a spin chuck for semiconductor wafers that does not require external equipment, has a simple structure, is not limited by installation locations, and is capable of drying wafers in a stable state while preventing damage to the wafers. Its purpose is to provide.

[Summary of the invention]

The present invention uses one end of the presser claw to fix the wafer to the sea urchin that moves onto the recess due to centrifugal force, thereby eliminating the need for external equipment and having a simple structure that is not subject to restrictions on installation location. In addition, this semiconductor wafer spin chuck is capable of drying a wafer in a stable state while preventing damage to the wafer.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a front view of the embodiment. Reference numeral 11 in the figure indicates a disc-shaped chuck body. A recess 13 into which a wafer 12 as an object to be processed is fitted is formed in the center of the chuck body 1 . Spacer bins 14 are provided on the floor of the recess 13 at an opening angle interval of 120 degrees from the center thereof. The spacer bin 14 prevents the back surface of the wafer 12 from coming into contact with the floor surface of the recess 13, thereby effectively performing the drying process of the wafer 12. The chuck body 11 is rotated at a predetermined rotational speed by a rotation mechanism (not shown). A positioning bin 15 is erected at a predetermined position on the floor of the recess 13 so as to come into contact with the orientation flat surface of the wafer 12 . In the vicinity of the recess 13 on the chuck body 1, there is a recess 13.
Three wafer holding claws 16B, 16b, and 16c are arranged radially from the center at an opening angle of, for example, 120 degrees.

f) The y-c presser claws 16a, 16b, and 16C are rotatably provided so that bent ends 17a, 17b, and 17C extend above the recess 13 due to centrifugal force caused by the rotation of the chuck body 1, which will be described later. It is being Presser claw 16 for each sea urchin
a,zt;b.

Bent ends rva and 1vb are located near 16C.

A claw stopper 18 is provided for preventing the wafer holding claws 16a, 16b, 16C (D rotation) by abutting the rear ends of the wafer holding claws 17C when they extend above the recess 13.Claw stopper 1
8 and the wafer presser claws 16a, 16b, and 16C, when the chuck main body 11 is not rotating, the wafer presser claw 1
A spring 19 is provided for returning 6a, 16b, 16C to a predetermined position on chuck body 11. As for the two wafer holding claws 16b and 16G, the claw stopper 18 is not shown in FIG. 1 to simplify the explanation. Further, one of the wafer holding claws 16b is pressed against the bent end by the centrifugal force accompanying the rotation of the chuck body 11.
7b is shown extending above the recess 13. The remaining wafer holding claws 16C are shown returning to their predetermined positions by the action of the spring 19 after the chuck body 1) has stopped.

Semiconductor wafer spin chuck 2 configured in this way
According to No. 0, after the wafer 12 is accommodated in the recess 13, the chuck body 11 is rotated by the rotation mechanism. At this time, each of the wafer holding claws 16a, 16b, 16c
The bent ends 17a, 17b, and 17G are extended onto the four parts 13 by the centrifugal force accompanying the rotational force of the chuck body 11. The wafer 12 is completely secured by the sandwiching action between the bent ends 17a, 17b, 17C and the spacer bin 14, and the wafer 12 is dried using centrifugal force. After the drying process, when the rotation of the chuck body 1 stops, each wafer holding claw 16a, 16'D, 16C
It returns to a predetermined position on the chuck body 11 under the action of the spring 19. After that, the wafer 1 was dried by centrifugal force.
2 from the recess 13.

As described above, according to this semiconductor wafer spin chuck 20, the wafer holding claws 16Fa, 16b and the bent end portion 17a of the groove C rotate using the centrifugal force accompanying the rotation of the chuck body 1.

It is an extremely simple structure in which the wafer 12 is fixed by the wafers 17b and 17C, and there is no need for any external equipment and there is no restriction on the installation location. Moreover, the bent ends 17a, 17
Since the wafer 12 is clamped and fixed from both sides by the spacer bin 14 and the spacer bin 17B, the wafer 12 can be dried and processed in a stable state without being damaged due to the wafer 12 flying out or the like.

〔Effect of the invention〕

As explained above, the spin chuck for semiconductor wafers according to the present invention does not require any external equipment, has a simple structure, is not limited by installation locations, and also prevents damage to the wafer and allows the chuck to be held in a stable state. It is capable of drying ``soil''.

[Brief explanation of drawings]

FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a front view of an embodiment of the present invention, FIG. 3 is a plan view of a conventional semiconductor wafer spin chuck, and FIG. 4 is a conventional This is a front view of a spin chuck for semiconductor wafers. 1... Chuck body, 12... Wafer, 13...
・Concavity, 14...Spacer bin, 15...Positioning bin, 16a, 16b, 16C...Z Presser claw, 17a, 17b, J7
c---Folded end, 1 B...Claw stopper, 19.
...Spring, 20... Spin chuck for semiconductor wafers. Applicant's agent Patent attorney Takehiko Suzue Go to Figure 1 Figure 32 Figure 4

Claims (1)

[Claims] A chuck body having a recess into which a semiconductor wafer is fitted, a spacer provided on the floor so as to separate the back surface of the semiconductor wafer from the floor of the recess, and a rotation mechanism for rotating the chuck body. , disposed on the chuck body near the recess at predetermined intervals substantially radially from the center of the recess, one end of which is directed from above the chuck body near the recess toward the recess due to centrifugal force accompanying rotation of the chuck body. A semiconductor wafer comprising a plurality of rotatably provided wafer holding claws and a claw stopper protruding from the chuck body so that the other end of the wafer holding claws comes into contact with the chuck body. spin chuck.