JPS6195344A - Dry film - Google Patents

Abstract

PURPOSE:To obtain a defectless circuit by forming the protective film on the exposing side of a photoresist provided with the protective films on both sides into two-sheet lamination and stripping the upper film to remove the dust from the film surface just prior to exposing. CONSTITUTION:The protective films 12, 13 on the side to be exposed of the photoresist 11 protected with the thin films 12, 14 on both sides are formed into two-sheet lamination. The resist is brought into tight contact with the surface of a substrate 15 under the heat and pressure exerted thereto by, for example, a roller 16 while the film 14 is stripped. The cutting dust sticking to the substrate 15 in the stage of removing the unnecessary part, etc. around the substrate after the lamination sticks onto the film 13. The film 13 is thereupon stripped and a glass mask 17 is brought into tight contact with the film 12, then the resist is subjected to exposing, by which the generation of the defect in the circuit as a result of the dust sticking is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a dry film, and more particularly to a dry film having a photoresist structure used for patterning a plate or the like.

(Prior Art) A dry film conventionally used for patterning printed boards and the like is a film-like photoresist protected on one side with a polyester film and on the other side with a polyethylene film.

This dry film is laminated onto the surface of the substrate on which a circuit is to be formed using a special laminator by applying constant heat and pressure while peeling off the polyethylene film. After that, a mask with a predetermined circuit drawn on it is placed on top of the other, and a certain amount of ultraviolet rays are irradiated for exposure. At this time, the portion of the dry film exposed to the ultraviolet rays undergoes a polymerization reaction and dissolves in the solvent to form a tζ pile structure. By subsequently developing the dry film using a solvent,
Only the unexposed portions are washed away, and a predetermined circuit is obtained on the substrate.

However, in circuit boards that require a fine pattern 7, the minute dust on the polyester film blocks the ultraviolet rays during exposure and causes defects such as pinholes in the photoresist and short circuits after development. In addition, to prevent this, there is a method of peeling off the polyester film immediately before exposure and exposing the photoresist with it exposed, but in exposure machines that require close exposure to the mask, This is a photo shoot of Kenki.

The drawback was that the cysts adhered to the mask, inducing similar defects.

(Object of the Invention) The object of the present invention is to eliminate such drawbacks in conventional dry films, and to remove two films that protect the laminated photoresist from among the films that protect both sides of a film-like photoresist, and then expose the film to light. It is an object of the present invention to provide a dry film in which dust on the film is removed by peeling off the upper film immediately before the dry film is removed, thereby making it possible to obtain a defect-free circuit.

(Structure of the Invention) According to the present invention, there is obtained a dry film characterized in that in a film-like photoresist whose both sides are protected by thin films, two layers of the photoresist on the side to be exposed and the protective film are stacked. It will be done.

(Example) Next, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a dry film that is an embodiment of the present invention. In FIG. 4, a film-like photoresist 1i that is an embodiment of the present invention is protected on one side by a protective film 12 and a protective film 13. The other side is protected by a film 14.The protective films 12 and 13 are made of polyester to withstand the heat during lamination, and the protective film 14 is 7 Otoresist l when laminating
Since it is peeled off from the photoresist, a polyethylene film that does not require heat resistance and has a suitable adhesion to the photoresist is used.

In laminating this dry film, as shown in FIG.
The films 12 and 13 remain in close contact with the photoresist 11. At this time, the protective films 12 and 13 remain in close contact with the photoresist 11. 15 is preheated to about 90° C. to improve adhesion to the photoresist 11.

The photoresist is a 6-layer substrate 1 that has been laminated.
Unnecessary parts around 5 are cut off and sold together with protective films 13 and 12.

Normally, when the resist is cut, fine pieces of the photoresist 11 adhere to the protective film 13, resulting in defects in the circuit after exposure.

The photorex 1 laminated on the substrate 15 is removed from the protective film 12 by peeling off the film i3 from the protective film 12.
As shown in the figure, the protective film 13 is brought into close contact with the crow mask 17 and exposed to ultraviolet rays, but by peeling off the protective film 13 just before exposure, it is possible to simultaneously remove dust that has adhered in the previous steps, eliminating defects caused by dust.
゛It enables exposure in close contact with the glass mask 17.

(Effect of development) As explained above, the present invention provides dry film with
By stacking two films that hold the photoresist film after lamination and using a nine-drive film, it is possible to obtain a defect-free circuit.

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[Brief explanation of the drawing]

Fig. 1 is a sectional view showing a dry film according to an embodiment of the present invention, Fig. 2 is a side view showing the dry film in the laminated state, and Fig. 3 is a side view showing the dry film as an example of the present invention.
The figure is a side view showing the state during exposure. ,′・−

Claims (1)

[Claims] A dry film characterized in that, in a film-like photoresist whose both sides are protected by thin films, two films are stacked to protect the photoresist on the exposed side.