JPS6178133A - Wire bonding device - Google Patents
Wire bonding deviceInfo
- Publication number
- JPS6178133A JPS6178133A JP59200110A JP20011084A JPS6178133A JP S6178133 A JPS6178133 A JP S6178133A JP 59200110 A JP59200110 A JP 59200110A JP 20011084 A JP20011084 A JP 20011084A JP S6178133 A JPS6178133 A JP S6178133A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- wire bonding
- heads
- wire
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の技術分野〕 この発明はワイヤボンディング装置に関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a wire bonding device.
半導体素子の実装ブＯセスに６いて、半導体素子の電極
パッドと、半導体素子を搭載する基板上の配線とを接続
する手段としてワイヤボンディング法が多く用いられて
いる。このワイヤボンディング工程において、従来では
１＠所ずつボンディングを行なっていたため、多数の素
子を同一基板上に搭載する場合には、全素子のボンディ
ングを完了するのに長時間を要するという問題があった
。In a semiconductor device mounting process, a wire bonding method is often used as a means for connecting electrode pads of a semiconductor device and wiring on a substrate on which the semiconductor device is mounted. Conventionally, in this wire bonding process, bonding was performed at one location at a time, which caused the problem that it took a long time to complete the bonding of all devices when a large number of devices were mounted on the same board. .
この発明の目的は、複数個所のボンディングを同時に行
なえるようにすることによりボンデイン、グに要する時
間を短縮することができるワイヤボンディング装置を提
供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a wire bonding apparatus that can shorten the time required for bonding by simultaneously performing bonding at a plurality of locations.
（発明のｌｌＩ要）
この発明に係るワイヤボンディング装置は、複数のワイ
ヤボンディング用ヘッドを共通のヘラ下取付は台に取付
けてなることを特徴とする特許ある。(Summary of the Invention) A wire bonding apparatus according to the present invention is patented, characterized in that a plurality of wire bonding heads are mounted on a common base.
この発明によるワイヤボンディング装置を用いれば、？
！２数個所のワイヤボンディングを同時に行なうことが
できるため、ワイヤボンディング工程に要する時間を短
縮することが可能であり、特に多数の素子を同一基板上
に実ｉする場合に有効である。What happens if you use the wire bonding device according to this invention?
! Since wire bonding can be performed at two or more locations at the same time, it is possible to shorten the time required for the wire bonding process, which is particularly effective when a large number of elements are mounted on the same substrate.
また、複数のワイヤボンディング用ヘッドを、ボンデ−
（ング泣胃に選択的に当接されるようにヘッド移動台に
対して個別に上下方向に移動可能に取付け、ボンディン
グ位置に当接しないボンディング用ヘッドはボンディン
グ位置に当接するボンディング用ヘッドより上方位置に
固定されるようにしたり、あるいは各ワイヤボンディン
グ用ヘッドをヘッド移動台に対して個別に水平方向に移
動可能に取付ければ、Ｗ １ｆｆｉ上における配列が種
々異なる素子のワイヤボンディング工程を同じワイヤボ
ンディング装置によって行なうことができる。In addition, multiple wire bonding heads can be
(The bonding heads are installed so that they can be moved vertically individually on the head moving table so that they selectively abut on the stomach, and the bonding heads that do not abut the bonding position are placed above the bonding heads that abut the bonding position. If the wire bonding head is fixed in position, or if each wire bonding head is mounted so as to be movable in the horizontal direction individually relative to the head moving table, the wire bonding process for elements arranged in various ways on the W 1ffi can be performed using the same wire. This can be done using a bonding device.
第１図はこの発明の一実施例に係るワイヤボンディング
装置の構成を示したちのである。図に示すように、キャ
ピラリ１をそれぞれ有する？！数のボンディング用ヘッ
ド２が同一のヘッド取付は台３に取付けられている。FIG. 1 shows the configuration of a wire bonding apparatus according to an embodiment of the present invention. As shown in the figure, each has a capillary 1? ! The same number of bonding heads 2 are mounted on a stand 3.
ヘッド取付は台３のボンディング用ヘッド取付は部には
ボンディング用ヘッド２の上下位Ｍ”１４Ｍのための縦
長の孔４が形成され、各ボンディング用ヘッド２はこの
孔４の醍寸法の範囲内で矢印Ａで示す上下方向に移動可
能となっている。すなわち、第２図に詳細に示すように
ヘッド移動台３にはそれぞれの孔４に向けて上下から位
置決めねじ５．６が螺入されでおり、これらのねし５．
６のいずれかを締付けることによって、ワイヤボンディ
ング用ヘッド２の位置をヘッド取付は台３における孔４
の上部あるいは下部に任意に設定できるようになってい
る。第２図（ａ）はワイヤボンディング用ヘッド２が上
部位置に設定された状態、同図（ｂ）は下部位置に設定
された状態をそれぞれ示している。このようにすること
により、下部４ 位置に設定されたワイヤボンディング
用ヘッドのみ８選択的にボンディング位置に当接させる
ことが可能である。A vertically elongated hole 4 for the upper and lower M"14M of the bonding head 2 is formed in the bonding head mounting part of the base 3, and each bonding head 2 is installed within the range of the actual dimensions of this hole 4. In other words, as shown in detail in FIG. 2, positioning screws 5 and 6 are screwed into the head moving table 3 from above and below toward the respective holes 4. 5.
6, the position of the wire bonding head 2 can be adjusted to the hole 4 in the base 3.
It can be set arbitrarily at the top or bottom of the page. FIG. 2(a) shows a state in which the wire bonding head 2 is set at an upper position, and FIG. 2(b) shows a state in which it is set at a lower position. By doing so, only the wire bonding head set at the lower position 4 can be brought into selective contact with the bonding position.
また、位置決めねじ５．６を綴めればワイヤボン′Ｆ（
ング用ヘッド２含矢印Ｂで示す水平方向にし個別に移動
ができるようになっており、その移動後ねじ５．６を再
び締付けることによってキャピラリ１をボンディングす
べき位置に応じて水平方向の任意の位置に設定すること
が可能である。Also, if you tighten the positioning screws 5 and 6, the wirebond'F (
The bonding head 2 can be moved individually in the horizontal direction shown by arrow B, and after the movement, by tightening the screw 5.6 again, the capillary 1 can be moved to any horizontal direction depending on the bonding position. It is possible to set the position.
第３図はこのワイヤボンディング用装置を用いて実際に
ワイヤボンディングを行なう場合の一例を示したちので
、塁仮７上に多数搭載された［Ｃデツプ９上の１固バッ
ド１０と基板７上の配線８とをワイヤ１０より接読する
工程を示している。Figure 3 shows an example of actual wire bonding using this wire bonding device. This shows the process of directly reading the wiring 8 from the wire 10.
この場合、前述のねじ５，６を用いてキャピラリ１を選
択的に上下方向に移動させることで、ボンティングすべ
き位置にのみキャピラリ１を当１妄さぜ、その状態でキ
ャピラリ１に超音波振動等を与えることにより、ワイヤ
ボンディングを１１なうことができる。第３図において
１は基板７上の配線８に当接されるキレピラリであり、
１′は当接されないキャピラリである。In this case, by selectively moving the capillary 1 in the vertical direction using the screws 5 and 6 described above, the capillary 1 is moved only to the position where bonding is to be performed, and in that state, the capillary 1 is exposed to ultrasonic waves. Wire bonding can be performed 11 times by applying vibration or the like. In FIG. 3, numeral 1 is a sharp beam that comes into contact with the wiring 8 on the board 7,
1' is a capillary that is not abutted.
以上のように、この発明によれば複数個所のワイヤボン
ディングを同時に行なうことができ、ボンディング工程
を極めて短時間で２１］：＄的に行なうことができる。As described above, according to the present invention, wire bonding can be performed at a plurality of locations simultaneously, and the bonding process can be performed in an extremely short time.
特に、イメージセンサ、サーマルヘッド等に代表される
ような、同一基板上に同−構成のＩＣチップ（例えばイ
メージセンサの場合は光電変換部からの信号読取り回路
用ＩＣチップ、ナーマルヘッドの４合は発熱部を通で駆
動するための駆動回路用ＩＣチップ）が複数飼一方向に
配列されて搭載され、またポンディングパッドが操返し
パターンにより形成されるようなデバイスにおいては、
碗数個の素子のボンディングを同時に、あるいはボンデ
ィング個所の総数よりはるかに少ない回数で１１なうこ
とが可能となり、量産性の向上に寄与するところは帰め
て大きい。In particular, IC chips with the same configuration on the same substrate, such as image sensors, thermal heads, etc. (For example, in the case of image sensors, the IC chip for the signal reading circuit from the photoelectric conversion part, and the 4th circuit of the thermal head generate heat. In a device in which a plurality of IC chips (for driving circuits for driving through a part) are arranged and mounted in one direction, and a bonding pad is formed by a repeating pattern,
It becomes possible to bond several devices at the same time or in a number of times far less than the total number of bonding locations, which greatly contributes to improving mass productivity.
なお、この発明は上記実施例に限定されるものではなく
、例えば複数のボンディング用ヘッドを選択的に上下方
向あるいは水平方向に移動させて任意の位置に設定する
ための哉構等について種々変形することが可能て必る。Note that the present invention is not limited to the above-mentioned embodiments, and various modifications may be made to, for example, a structure for selectively moving a plurality of bonding heads vertically or horizontally to set them at arbitrary positions. It must be possible.
第１図はこの発明の一実施例に係るワイヤボンディング
装置の概略的構成を示す図、第２図は同実施例装置の要
部構成を示す断面図、第３図は同実施例装置を使用して
ワイヤボンディングを行なう種子を示す図である。
１・・・キャピラリ、２・・・ワイヤボンディング用ヘ
ッド、３・・・ヘッド取付は台、４・・・ワイヤボンデ
ィング用ヘッドの位置ｖ４整用孔、５，６・・・位置決
め用ねじ、７・・・基板、８・・・基板上の配線、９・
・・ＩＣチップ、１０・・・ＩＣチップ上の電極パッド
。
出願人代理人 弁理士 鈴江武彦
第１図FIG. 1 is a diagram showing a schematic configuration of a wire bonding device according to an embodiment of the present invention, FIG. 2 is a sectional view showing the main part configuration of the same embodiment device, and FIG. 3 is a diagram showing the use of the same embodiment device. FIG. 3 is a diagram showing seeds to which wire bonding is performed. 1... Capillary, 2... Wire bonding head, 3... Head mounting stand, 4... Wire bonding head position v4 adjustment hole, 5, 6... Positioning screw, 7 ... Board, 8... Wiring on the board, 9.
...IC chip, 10...electrode pad on the IC chip. Applicant's agent Patent attorney Takehiko Suzue Figure 1
Claims (3)
ド取付け台に取付けてなることを特徴とするワイヤボン
ディング装置。(1) A wire bonding device characterized in that a plurality of wire bonding heads are mounted on a common head mounting base.
グ位置に選択的に当接されるようにヘッド移動台に対し
て個別に上下方向に移動可能に取付けられ、ボンディン
グ位置に当接しないボンディング用ヘッドはボンディン
グ位置に当接するボンディング用ヘッドより上方位置に
固定されることを特徴とする特許請求の範囲第１項記載
のワイヤボンディング装置。(2) A plurality of wire bonding heads are individually movable vertically with respect to a head moving table so that they selectively contact bonding positions, and bonding heads that do not contact bonding positions are used for bonding. 2. The wire bonding device according to claim 1, wherein the wire bonding device is fixed at a position above the bonding head that abuts the wire bonding device.
台に対して個別に水平方向に移動可能に取付けられてい
ることを特徴とする特許請求の範囲第１項記載のワイヤ
ボンディング装置。(3) The wire bonding apparatus according to claim 1, wherein the plurality of wire bonding heads are individually movable in the horizontal direction with respect to the head moving table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59200110A JPS6178133A (en) | 1984-09-25 | 1984-09-25 | Wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59200110A JPS6178133A (en) | 1984-09-25 | 1984-09-25 | Wire bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6178133A true JPS6178133A (en) | 1986-04-21 |
Family
ID=16418992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59200110A Pending JPS6178133A (en) | 1984-09-25 | 1984-09-25 | Wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6178133A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5839640A (en) * | 1996-10-23 | 1998-11-24 | Texas Instruments Incorporated | Multiple-tool wire bonder |
| KR100505444B1 (en) * | 2000-12-30 | 2005-08-05 | 주식회사 하이닉스반도체 | An apparatus for multi-bonding of wire |
| US8008183B2 (en) * | 2007-10-04 | 2011-08-30 | Texas Instruments Incorporated | Dual capillary IC wirebonding |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5141959A (en) * | 1974-10-07 | 1976-04-08 | Suwa Seikosha Kk |
-
1984
- 1984-09-25 JP JP59200110A patent/JPS6178133A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5141959A (en) * | 1974-10-07 | 1976-04-08 | Suwa Seikosha Kk |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5839640A (en) * | 1996-10-23 | 1998-11-24 | Texas Instruments Incorporated | Multiple-tool wire bonder |
| KR100505444B1 (en) * | 2000-12-30 | 2005-08-05 | 주식회사 하이닉스반도체 | An apparatus for multi-bonding of wire |
| US8008183B2 (en) * | 2007-10-04 | 2011-08-30 | Texas Instruments Incorporated | Dual capillary IC wirebonding |
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