JPS6159763A - Cascaded connection structure of microwave leadless package - Google Patents
Cascaded connection structure of microwave leadless packageInfo
- Publication number
- JPS6159763A JPS6159763A JP18137384A JP18137384A JPS6159763A JP S6159763 A JPS6159763 A JP S6159763A JP 18137384 A JP18137384 A JP 18137384A JP 18137384 A JP18137384 A JP 18137384A JP S6159763 A JPS6159763 A JP S6159763A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- package
- microwave
- terminals
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、パッケージの両側部にストリップライン型端
子がそれぞれ対称に形成され、パッケージ同志を突合せ
ることによシ継続接続されるマイクロ波リードレスパッ
ケージの接続構造に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a microwave lead in which strip line terminals are formed symmetrically on both sides of a package and are continuously connected by butting the packages together. Regarding the connection structure of the wireless package.
本発明に利用されるパッケージは、例えば１個で５ｄＢ
のゲインが得られるマイクロ波増幅器ユニットであシ、
その外形を第５図に示す。１は金属のペースであり、そ
の中央にセラミック部２が形成され、その上に６本のメ
タライズ形成されたストリップライン型の端子４，４’
、５，５’が形成されている。そして増幅器素子はケー
ス３内にノ・−メチツクシールされている。増幅器ユニ
ットの人、出力のインピーダンスはいずれも５０Ωに整
合されている。第５図において、左側の端子４がＲＦ大
入力右側の端子５がＲＦ比出力あり、４′は８ｒのＤＣ
バイアスの入力端子、５′は次段へのＤＣバイアスの供
給端子であシ、この増幅器ユニットはこの８ｒのＤＣ！
圧の供給のみで作動する。そして、各々のストリップラ
イン型端子の位置は、増幅器ユニットを直接継続接続で
きるように入、出力が対称に形成されている。以上のよ
うに構成されている増幅器ユニットは、例えば８〜１８
ＧＨｚ において１ユニツトあたシ、５ｄＢ程度のゲイ
ンを得ることができる。超高周波の人、出力のために１
パツケージのストリップライン型端子は、例えば０．２
５Ｘ Ｏ，２ｍｍといったようにごく微小に形成される
。For example, each package used in the present invention has a 5 dB
A microwave amplifier unit that can obtain a gain of
Its external shape is shown in FIG. Reference numeral 1 denotes a metal paste, on which a ceramic part 2 is formed, and six metallized strip-line terminals 4, 4' are formed on the ceramic part 2.
, 5, 5' are formed. The amplifier element is then mechanically sealed within the case 3. The impedance of the amplifier unit and the output are both matched to 50Ω. In Figure 5, terminal 4 on the left has a high RF input, terminal 5 on the right has an RF ratio output, and 4' is an 8r DC
The bias input terminal 5' is the DC bias supply terminal to the next stage, and this amplifier unit is connected to this 8r DC!
Operates only by supplying pressure. The positions of the respective stripline type terminals are such that the amplifier units can be directly connected, and the outputs are symmetrically formed. The amplifier unit configured as described above has, for example, 8 to 18
At GHz, a gain of about 5 dB can be obtained per unit. Ultra high frequency person, 1 for output
The strip line type terminal of the package is, for example, 0.2
It is formed in a very small size such as 5X O, 2mm.
そして、各増幅器ユニットを自由に継続接続して使用で
きるようにするため、パッケージにはリードを設けない
。In order to allow each amplifier unit to be freely and continuously connected and used, the package does not have any leads.
第６図に、上記マイクロ波リードレスパッケージを継続
接続する従来例を示す。図において、対応するストリッ
プライン型端子５．５′と４，４′は金のリボン６を相
互にボンディングすることによシ接続される。図におい
て、右のケース３の部分は段間接続部が見えるように切
欠いて示している。FIG. 6 shows a conventional example in which the microwave leadless package is continuously connected. In the figure, corresponding stripline terminals 5,5' and 4,4' are connected by bonding gold ribbons 6 to each other. In the figure, the right part of the case 3 is shown cut away so that the inter-stage connections can be seen.
ところが、この段間は、ストリップライン型端子示前記
のように微小であるため、通常０．４〜０．５鴎程度と
なシ、きわめて狭い。このため、普通のボンディングツ
ールでは股間に入れることができず、抵抗加熱式の特殊
設計のボンデ、インダノールを用いる必要があった。However, since the distance between the stages is very small as described above in the case of the strip line type terminal, it is usually about 0.4 to 0.5 mm, which is extremely narrow. For this reason, ordinary bonding tools could not be inserted into the crotch, and it was necessary to use a specially designed resistance heating type bonder, Indanol.
従来は、上記のようにマイクロ波リードレスパッケージ
の段間接続に特殊なボンディングツールを必要とするた
め不便であシ、また多数のパッケージを接続するために
は接続箇所毎に何度も繰返してボンディング作業をしま
ければならず、大量処理に適さない。あるいは半田ごて
を用いて金のリボンを接続する際は、ろう材がセラ建ツ
ク部に流れ出ることがらシ、このようになるとマイクロ
波の反射が生じ使用不能になる。さらに、従来のマイク
ロ波リードレスパッケージは、対称型で方向性がないが
、このこと自体入出力端子の誤接続の可能性があシ取扱
上不便なこともある。Conventionally, as mentioned above, connecting between stages of microwave leadless packages required a special bonding tool, which was inconvenient, and in order to connect a large number of packages, the bonding process had to be repeated many times for each connection point. Bonding work must be done and it is not suitable for mass processing. Alternatively, when using a soldering iron to connect gold ribbons, the brazing material may flow into the soldering joint, causing microwave reflection and rendering the soldering iron unusable. Further, conventional microwave leadless packages are symmetrical and have no directionality, but this itself may lead to incorrect connection of input/output terminals, which may be inconvenient in handling.
本発明においては上記問題点を解決するために、パッケ
ージの両側部ＶＣストリップライン型端子がそれぞれ対
称に形成され、パッケージ同志を突合せることによシ継
続接続されてなるマイクロ波リードレスパッケージの接
続構造において、第１図に示すように、対応するストリ
ップライン型端子５．５′と４，４′の一方５，５′に
濡れ性の良好な金属薄片７をボンディングする。該金属
薄片７の先端には透゛孔８が形成され、透孔８は対応す
る他方のパッケージのストリップライン歴端子り、４′
上に位置し、透孔８内にノ・ンダプリ７ォーム９を設置
し、加熱してハンダを溶融し、該透孔８の周囲の壁面及
び透孔内の他方のパッケージのストリップライン型端子
４，４′をろう付する。第２図にこの様子が示され、ろ
う材のハンダ１０は透孔８の周囲の壁面の濡れ性が良い
ため透孔の周囲に引上げられるような矢印方向の表面張
力が作用し、図示のごとき断面形状に碌る。そして、透
孔８内に収まるようなハンダプリフォーム（例えば球）
を用い死時透孔８に溶融ハンダが限定され、外部に漏れ
出ることがない。In order to solve the above-mentioned problems, in the present invention, the VC strip line type terminals on both sides of the package are formed symmetrically, and the packages are butted against each other to continuously connect the microwave leadless package. In the structure, as shown in FIG. 1, a thin metal piece 7 with good wettability is bonded to one of the corresponding stripline terminals 5, 5' and 4, 4'. A through hole 8 is formed at the tip of the thin metal piece 7, and the through hole 8 is connected to the corresponding strip line terminal of the other package, 4'.
A solder paste 7 form 9 located above is installed in the through hole 8 and heated to melt the solder, and the strip line type terminal 4 of the other package on the wall surface around the through hole 8 and the other package in the through hole is heated. , 4' are brazed. This situation is shown in FIG. 2, and since the solder material 10 has good wettability on the wall surface around the through hole 8, surface tension in the direction of the arrow acts to pull it up around the through hole, as shown in the figure. Suitable for cross-sectional shapes. Then, a solder preform (for example, a ball) that fits inside the through hole 8
By using this, the molten solder is confined to the through hole 8 at the time of death, and does not leak to the outside.
第５図に示すようなマイクロ波リードレスパッケージの
出力側のストリップライン５．５′に、第３図のように
、先端に透孔８を有するコバールの薄・ 片７の一端を
ボンディングする。この中間構造においては、パッケー
ジの入力には薄片７がなく、出力に薄片７が形成される
ので方向性が生じる。One end of a Kovar thin piece 7 having a through hole 8 at its tip, as shown in FIG. 3, is bonded to the strip line 5.5' on the output side of the microwave leadless package as shown in FIG. In this intermediate structure, there is no lamina 7 at the input of the package and a lamina 7 is formed at the output, resulting in directionality.
そして、このように形成されたパッケージの所用数のも
のを糺続するように突合せると、薄片７が他のパッケー
ジの薄片がない側のストリップライン製端子に突出し、
透孔８が接続すべきストリップライン型端子５，５′−
ヒに位置する。 この様子を第４図に示す。次に透孔８
に；・ンダプリ７オーム９を投入し、加熱溶融してろう
付する。この加熱は一括して多数のパッケージの接続を
ホットプレートによシ一度に行なう仁とができるし、ま
たコンベア炉によって連続して行うこともでき、大量処
理が可能である。本実施例による薄片７は、厚みが１０
０μｍ以下、数十μｍにすることができ、接続部は透孔
によシ規定され、漏れることがなく、ハンダは第２図の
ととく透孔８内に収まるので、接続部でのマイクロ波の
反射が生ずることがない。Then, when the required number of packages formed in this way are butted together in a continuous manner, the thin piece 7 protrudes from the strip line terminal on the side of the other package where the thin piece is not provided.
Strip line type terminals 5, 5'- to which the through hole 8 should be connected
Located in H. This situation is shown in FIG. Next, through hole 8
- Inject Nadapuri 7 ohm 9, heat and melt and braze. This heating can be performed by connecting a large number of packages at once using a hot plate, or can be performed continuously using a conveyor furnace, making it possible to process large quantities. The thin piece 7 according to this embodiment has a thickness of 10
The solder can be made from 0 μm or less to several tens of μm, and the connecting portion is defined by the through hole, so there is no leakage, and since the solder fits within the through hole 8 shown in Fig. 2, microwave radiation at the connecting portion can be reduced. No reflection occurs.
なお、薄片７は濡れ性の良い他の電極材料を用いること
もできる。また第３図の状態の薄片７のボンデイングは
、パッケージ製造時に行うことができる。Note that other electrode materials with good wettability can also be used for the thin piece 7. Further, bonding of the thin piece 7 in the state shown in FIG. 3 can be performed at the time of manufacturing the package.
本発明によれば、マイクロ波リードレスパッケージの片
側のみに透孔を有する金属薄片をボンディングすること
で、パッケージに方向性を持たせることができ、所用数
のパッケージを金属薄片のある側とない側とで突合せ、
透孔内にハンダプリフォームを入れて継続接続のセット
ができ、これらを一度に多数ホットプレートで熱処理し
たシ、コンベア炉で連続処理する等で大量処理ができる
。According to the present invention, by bonding a thin metal piece with a through hole to only one side of a microwave leadless package, the package can be given directionality, and the required number of packages can be placed on the side with the thin metal piece and without it. Butt the sides,
A set of continuous connections can be made by inserting solder preforms into the through holes, and large quantities can be processed by heat-treating a large number of these at once on a hot plate or continuously processing them in a conveyor furnace.
そして、ろう付部は、金属薄片の透孔がガイドとして作
用し、透孔周壁の濡れ性の良さくよる表面張力も作用す
る結果、透孔によ）規制され、ろう材は透孔内に収まる
から、接続に併うマイクロ波の反射は生じない。The brazing part is regulated by the through-hole as a result of the through-hole in the metal thin piece acting as a guide and the surface tension due to the good wettability of the surrounding wall of the through-hole, and the brazing material is regulated within the through-hole. Because it fits, there is no microwave reflection associated with the connection.
第１図は本発明によるパッケージの段間接続部を示す図
、
第２図は本発明におけるろう付部を示す図、第５図、第
４図は本発明の一実施例のそれぞれ突合せ前のストリッ
プライン型端子及び突合せ後のストリップライン型端子
を示す図、
第５図はマイクロ波リードレスパッケージを示す図、
第６図は従来のマイクロ波リードレスパッケージの接続
を示す図。
（主な符号）
１・・・金属のペース
２・・・セラミック部
４−（入力側）ストリップライン型端子５・・・（出力
側）ストリップツイン型端子６・・・金のリボン
７・・・金属薄片
８・・・透孔
９・・・ハンダプリフォーム
１０・・・ハンダFIG. 1 is a diagram showing the interstage connection part of the package according to the present invention, FIG. 2 is a diagram showing the brazing part in the present invention, and FIGS. FIG. 5 is a diagram showing a stripline terminal and a stripline terminal after butting; FIG. 5 is a diagram showing a microwave leadless package; FIG. 6 is a diagram showing the connection of a conventional microwave leadless package. (Main symbols) 1...Metal paste 2...Ceramic part 4-(Input side) Strip line type terminal 5...(Output side) Strip twin type terminal 6...Gold ribbon 7...・Thin metal piece 8...Through hole 9...Solder preform 10...Solder
Claims (1)
それぞれ対称に形成され、パッケージ同志を突合せるこ
とにより継続接続されてなるマイクロ波リードレスパッ
ケージの接続構造において、対応するストリップライン
型端子の一方に濡れ性の良好な金属薄片がボンディング
され、該金属薄片の先端は対応する他方のパッケージの
ストリップライン型端子上に延在し、該延在している金
属薄片部分に透孔が形成され、該透孔の周囲の壁面及び
透孔内の前記他方のパッケージのストリップライン型端
子がろう付されていることを特徴とするマイクロ波リー
ドレスパッケージの継続接続構造。(1) In a microwave leadless package connection structure in which stripline type terminals are formed symmetrically on both sides of the package and are continuously connected by butting the packages, one of the corresponding stripline type terminals A metal thin piece with good wettability is bonded, the tip of the metal thin piece extends over the corresponding stripline type terminal of the other package, a through hole is formed in the extending metal thin piece, and A continuous connection structure for a microwave leadless package, characterized in that a wall surface around the through hole and a stripline terminal of the other package inside the through hole are brazed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18137384A JPS6159763A (en) | 1984-08-30 | 1984-08-30 | Cascaded connection structure of microwave leadless package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18137384A JPS6159763A (en) | 1984-08-30 | 1984-08-30 | Cascaded connection structure of microwave leadless package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6159763A true JPS6159763A (en) | 1986-03-27 |
Family
ID=16099593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18137384A Pending JPS6159763A (en) | 1984-08-30 | 1984-08-30 | Cascaded connection structure of microwave leadless package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6159763A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11763401B2 (en) | 2014-02-28 | 2023-09-19 | Delos Living Llc | Systems, methods and articles for enhancing wellness associated with habitable environments |
-
1984
- 1984-08-30 JP JP18137384A patent/JPS6159763A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11763401B2 (en) | 2014-02-28 | 2023-09-19 | Delos Living Llc | Systems, methods and articles for enhancing wellness associated with habitable environments |
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