JPS6146625U - Tatsuchipaddo - Google Patents
TatsuchipaddoInfo
- Publication number
- JPS6146625U JPS6146625U JP13107384U JP13107384U JPS6146625U JP S6146625 U JPS6146625 U JP S6146625U JP 13107384 U JP13107384 U JP 13107384U JP 13107384 U JP13107384 U JP 13107384U JP S6146625 U JPS6146625 U JP S6146625U
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- tatsuchipaddo
- touch pad
- electrode sheet
- configuration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のタッチパッドの構成を示す縦断面図、第
2図は第1図に示すタッチパッドの電気回路の構成を示
す構成図、第3図は本考案における実施例の操作性の1
例を示す特性図、第4図は本考案における実施例の構成
を示す斜視図、第5図は第4図に示す実施例のベース上
に設けられた抵抗体の構成を示す部分断面図、第6図は
第5図に示す実施例の突起の配列を示す斜視図である。
1・・・電極シート、2・・・感圧導電性ゴム、5,7
・・・抵抗体、6・・・ベース、8 a, 8 b,
〜8n・・・突起、9・・・抵抗塗料。FIG. 1 is a vertical cross-sectional view showing the configuration of a conventional touch pad, FIG. 2 is a configuration diagram showing the configuration of the electrical circuit of the touch pad shown in FIG. 1, and FIG. 3 is a diagram showing the operability of the embodiment of the present invention. 1
A characteristic diagram showing an example; FIG. 4 is a perspective view showing the configuration of an embodiment of the present invention; FIG. 5 is a partial sectional view showing the configuration of a resistor provided on the base of the embodiment shown in FIG. FIG. 6 is a perspective view showing the arrangement of protrusions in the embodiment shown in FIG. 5. FIG. 1... Electrode sheet, 2... Pressure-sensitive conductive rubber, 5, 7
...Resistor, 6...Base, 8 a, 8 b,
~8n...Protrusion, 9...Resistance paint.
Claims (1)
介在され、前記抵抗体に複数の導電硅の突起部が不均一
に分布して形成されたことを特徴とするタッチパッド。A touch pad characterized in that a pressure-sensitive conductive rubber is interposed between an electrode sheet and a planar resistor, and a plurality of conductive silicon protrusions are formed on the resistor in a non-uniform distribution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13107384U JPS6146625U (en) | 1984-08-29 | 1984-08-29 | Tatsuchipaddo |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13107384U JPS6146625U (en) | 1984-08-29 | 1984-08-29 | Tatsuchipaddo |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6146625U true JPS6146625U (en) | 1986-03-28 |
Family
ID=30689667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13107384U Pending JPS6146625U (en) | 1984-08-29 | 1984-08-29 | Tatsuchipaddo |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6146625U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012070450A (en) * | 2000-05-31 | 2012-04-05 | Symbol Technologies Inc | Secure, encrypting pin pad |
-
1984
- 1984-08-29 JP JP13107384U patent/JPS6146625U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012070450A (en) * | 2000-05-31 | 2012-04-05 | Symbol Technologies Inc | Secure, encrypting pin pad |
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