JPS6146293B2 - - Google Patents

Info

Publication number
JPS6146293B2
JPS6146293B2 JP51117432A JP11743276A JPS6146293B2 JP S6146293 B2 JPS6146293 B2 JP S6146293B2 JP 51117432 A JP51117432 A JP 51117432A JP 11743276 A JP11743276 A JP 11743276A JP S6146293 B2 JPS6146293 B2 JP S6146293B2
Authority
JP
Japan
Prior art keywords
pressure
injection
reference pattern
relief valve
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51117432A
Other languages
Japanese (ja)
Other versions
JPS5342252A (en
Inventor
Kazumitsu Oomori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiki Seisakusho KK
Original Assignee
Meiki Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiki Seisakusho KK filed Critical Meiki Seisakusho KK
Priority to JP11743276A priority Critical patent/JPS5342252A/en
Publication of JPS5342252A publication Critical patent/JPS5342252A/en
Publication of JPS6146293B2 publication Critical patent/JPS6146293B2/ja
Granted legal-status Critical Current

Links

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  • Injection Moulding Of Plastics Or The Like (AREA)
  • Control Of Fluid Pressure (AREA)

Description

【発明の詳細な説明】 射出成形に於いて成形品に発生ひけ、フローマ
ーク、シルバストリークを防止することは成形品
の品質保持に極めて重要である。又工業用プラス
チツク成形品の分野では成形品の寸法精度が益々
厳しく要求されている。高品質及び精密寸法の射
出成形のため成形要因の制御装置が今迄に多く開
発されている。
DETAILED DESCRIPTION OF THE INVENTION In injection molding, it is extremely important to prevent sink marks, flow marks, and silver streaks from occurring in molded products in order to maintain the quality of the molded products. Furthermore, in the field of industrial plastic molded products, dimensional accuracy of molded products is increasingly required. To date, many molding factor control devices have been developed for injection molding of high quality and precise dimensions.

本発明は射出成形機の制御装置に関するもので
あり、金型内の溶融樹脂圧を一定の基準パターン
に沿つて制御する最近行われている新しい制御手
段の一つの発明である。特長とするところは、溶
融樹脂を金型キヤビテイに射出する最初の或る時
間射出油圧を制御する電磁リリーフバルブを最高
圧に設定し、即ち金型キヤビテイに溶融樹脂が充
満するまでは射出油圧は最高圧以下に於いて自由
に変動し得る状態にし、金型キヤビテイに溶融樹
脂が充満し始めるとその時期を検出し、電磁リリ
ーフバルブの設定圧が最高圧から解除され溶融樹
脂圧の基準パターンに沿つて溶融樹脂圧を制御す
るようにした制御装置にある。更に本発明の新規
なことは溶融樹脂が金型に於いてゲートシールす
る時期を溶融樹脂圧Pの時間Tに対する微小変化
DP/DTによつて検出することにある。
The present invention relates to a control device for an injection molding machine, and is an invention of a new control means that has recently been used to control the pressure of molten resin in a mold according to a certain reference pattern. The feature is that the electromagnetic relief valve that controls the injection hydraulic pressure is set to the highest pressure for a certain period of time at the beginning of injecting the molten resin into the mold cavity.In other words, the injection hydraulic pressure remains unchanged until the mold cavity is filled with the molten resin. The pressure is set below the maximum pressure so that it can freely fluctuate, and when the mold cavity begins to be filled with molten resin, that time is detected, and the set pressure of the electromagnetic relief valve is released from the maximum pressure and returns to the standard pattern of molten resin pressure. The control device is adapted to control the pressure of molten resin along the same line. Furthermore, the novelty of the present invention is that the timing at which the molten resin gate-seals the mold is determined by minute changes in the molten resin pressure P with respect to the time T.
The purpose is to detect by DP/DT.

次に図面に従つて本発明を説明する。 Next, the present invention will be explained according to the drawings.

1は加熱筒、2は加熱筒1内にて回転往復動す
るスクリユであり、3はホツパ、4は射出シリン
ダ、5はピストン、6は金型であり、6aは金型
キヤビテイである。7は電磁作動フローコントロ
ールバルブ(サーボコントロールバルブも含
む)、9はポンプであり、10はレベルシフト、
11は電流アンプ、12は演算器、13は積分器
であり14はキヤビテイ圧力保持勾配設定器であ
る。15は関数発生器である。該関数発生器15
には第2図に示すように抵抗r1を抵抗r2とコンデ
ンサcとを並列に結線した回路に直列に結線し、
短形入力波形を不完全積分し、金型キヤビテイ内
における溶融樹脂圧の時間に対する変化の曲線に
近似した基準パターン信号を発生させる。16は
射出速度プログラム設定器、17はキヤビテイ圧
力設定器、18は微分器、19は比較器、20は
出力回路、21は微分器、22は比較器、23は
出力回路、24は比較器、25は出力回路、26
及び27はタイマである。28は金型キヤビテイ
内の樹脂圧を測定するセンサである。
1 is a heating cylinder, 2 is a screw that rotates and reciprocates within the heating cylinder 1, 3 is a hopper, 4 is an injection cylinder, 5 is a piston, 6 is a mold, and 6a is a mold cavity. 7 is an electromagnetically operated flow control valve (including a servo control valve), 9 is a pump, 10 is a level shift,
11 is a current amplifier, 12 is an arithmetic unit, 13 is an integrator, and 14 is a cavity pressure holding gradient setter. 15 is a function generator. The function generator 15
As shown in Figure 2, resistor r 1 is connected in series with a circuit in which resistor r 2 and capacitor c are connected in parallel.
A rectangular input waveform is incompletely integrated to generate a reference pattern signal that approximates a curve of change in molten resin pressure over time in a mold cavity. 16 is an injection speed program setting device, 17 is a cavity pressure setting device, 18 is a differentiator, 19 is a comparator, 20 is an output circuit, 21 is a differentiator, 22 is a comparator, 23 is an output circuit, 24 is a comparator, 25 is an output circuit, 26
and 27 are timers. 28 is a sensor that measures the resin pressure within the mold cavity.

第3図は金型キヤビテイ内の樹脂圧力の時間に
対する変化の基準パターンを示すものである。
FIG. 3 shows a reference pattern of changes in resin pressure within the mold cavity over time.

次に本発明の制御装置の機能及び作動について
説明する。
Next, the functions and operations of the control device of the present invention will be explained.

先ず成形に先行して成形品の試行を行い、レベ
ルシフト10の設定を行う。レベルシフト10の
設定は金型キヤビテイに溶融樹脂が射出される最
初の或る時間に於いて生ずる溶融樹脂圧以上に設
定する。第3図に於いて、圧力P1である。スク
リユ2が回転して一定量の原料を可塑化し、成形
品が金型から取り出され金型が閉じ射出が開始さ
れるとスイツチ29が接となり、制御回路が作動
する。加熱筒1内のスクリユ2の前進によりスク
リユ先端の溶融樹脂は金型のゲートを通つてキヤ
ビテイ内に流入する。この時キヤビテイ内に溶融
樹脂は充満してないので、溶融樹脂はセンサ28
によつて殆んど検出されない程度であり、圧力p1
の基準電圧よりセンサ28の入出信号電圧の方が
低くアンプ11のフイードバツク機能により信号
電圧を基準電圧に一致させるため最大ゲインの出
力を出し、電磁作動リリーフバルブ8の設定圧力
を最高圧力にする。このため溶融樹脂の流動は圧
力制御ではなく電磁作動フローコントロールバル
ブ7によつて射出速度を精度よく制御することが
できる。溶融樹脂が金型キヤビテイに充満するに
つれ、樹脂圧力は上昇し始める。
First, prior to molding, a molded product is tested and the level shift 10 is set. The level shift 10 is set to be higher than the molten resin pressure that occurs during the initial period when the molten resin is injected into the mold cavity. In FIG. 3, the pressure is P1. The screw 2 rotates to plasticize a certain amount of raw material, the molded product is taken out of the mold, the mold is closed, and injection begins, the switch 29 is turned on and the control circuit is activated. As the screw 2 moves forward within the heating cylinder 1, the molten resin at the tip of the screw flows into the cavity through the gate of the mold. At this time, the cavity is not filled with molten resin, so the molten resin reaches the sensor 28.
It is almost undetectable by the pressure p 1
Since the input/output signal voltage of the sensor 28 is lower than the reference voltage of the sensor 28, the feedback function of the amplifier 11 outputs the maximum gain to make the signal voltage match the reference voltage, and the set pressure of the electromagnetic relief valve 8 is set to the maximum pressure. Therefore, the injection speed of the flow of the molten resin can be precisely controlled by the electromagnetic flow control valve 7 rather than by pressure control. As molten resin fills the mold cavity, resin pressure begins to rise.

スイツチ30をa接点に切換えておけば微分器
18が作動し、樹脂圧Pが急激に立ち上る点T1
に於いてDP/DTの予かめ定めた値を検出し、こ
の信号を比較器19に伝え設定値以上の信号であ
ればリレーR1が作動する。又スイツチ30をb
接点に切換えておけば、直接溶融樹脂圧の信号は
比較器19に伝わりリレーR1を作動させる。本
発明は溶融樹脂圧力の金型キヤビテイ充満時間を
微分器18によつて検出することも、又樹脂圧の
予め定めた値によつても検出することが出来る。
リレーR1が作動すると関数発生器15が作動
し、溶融樹脂の立ち上り曲線即ち第3図に於いて
曲線ABの基準パターンを積分の時定数曲線によ
り関数発生器15が設定する。センサ28は金型
キヤビテイ内の樹脂圧を検出し、アンプ11に検
出した電圧を伝え該電圧と関数発生器15による
曲線ABに従つた基準信号とを比較し、両者の差
を解消させるための信号を電磁リリーフバルブ8
に伝える。
If the switch 30 is switched to the a contact, the differentiator 18 will operate and the resin pressure P will rise rapidly at a point T1.
At this point, a predetermined value of DP/DT is detected, and this signal is transmitted to the comparator 19, and if the signal exceeds the set value, relay R1 is activated. Also, switch 30
If it is switched to the contact point, the signal of the molten resin pressure is directly transmitted to the comparator 19 and activates the relay R1. In the present invention, the mold cavity filling time of the molten resin pressure can be detected by the differentiator 18 or by a predetermined value of the resin pressure.
When the relay R1 is activated, the function generator 15 is activated, and the function generator 15 sets the reference pattern of the rise curve of the molten resin, that is, the curve AB in FIG. 3, according to the time constant curve of integration. The sensor 28 detects the resin pressure in the mold cavity and transmits the detected voltage to the amplifier 11, which compares the voltage with a reference signal generated by the function generator 15 according to the curve AB, and eliminates the difference between the two. Signal to electromagnetic relief valve 8
tell to.

本発明に於いて第3図に示す曲線ABを基準パ
ターンに設定した理由は、溶融樹脂圧の最大値に
圧力を増加させるとき急激に増加させると圧力の
オーバランが生じ、成形品の寸法精度に悪い影響
を与えるので溶融樹脂圧を漸増させるようにし
た。溶融樹脂圧がキヤビテイ圧力設定器17に設
定したキヤビテイ圧に達すると比較器24により
圧力設定器17よりの信号とセンサ28よりの信
号を比較し定めた信号によりリレーR2が作動
し、成形機の射出保持時間タイマーを計時開始さ
せる。これと同時に本装置内のタイマ26が計時
を開始し、この間溶融樹脂圧が基準パターンBC
に沿つて制御される。タイマ26が計時を完了す
るとリレーR0が作動し、キヤビテイ内圧力が基
準パターンのCDに沿つて下降する。成形品によ
つてはCD部を上昇させることもある。
The reason for setting the curve AB shown in Fig. 3 as the reference pattern in the present invention is that if the pressure is increased rapidly to the maximum value of the molten resin pressure, pressure overrun will occur and the dimensional accuracy of the molded product will be affected. Since this would have a negative effect, the molten resin pressure was gradually increased. When the molten resin pressure reaches the cavity pressure set in the cavity pressure setting device 17, the comparator 24 compares the signal from the pressure setting device 17 with the signal from the sensor 28, and the determined signal activates the relay R2 , which starts the molding machine. Starts the injection holding time timer. At the same time, the timer 26 in this device starts measuring time, and during this time the molten resin pressure changes to the reference pattern BC.
controlled along the lines. When the timer 26 completes timing, the relay R0 is activated and the cavity internal pressure decreases along the reference pattern CD. Depending on the molded product, the CD section may be raised.

基準パターンCDはキヤビテイ圧力保持勾配設
定器14と積分器13が作動することに行われ
る。一方溶融樹脂圧はセンサ28によつて圧力を
検出されており、金型のゲートが冷却によりシー
ルされると樹脂圧が急激に下がる。この時発生す
る樹脂圧の変曲点は微分器18と微分器21の二
重微分によつてパルス信号が検出される。検出さ
れた信号は比較器22に伝えられ出力回路23を
通じてR3が作動し射出が完了する。タイマ27
はゲートシールする前に第3図に於いて示す変曲
点Cに於いて微分器が変曲点を検出して射出工程
を完了することを防止する。
The reference pattern CD is performed by operating the cavity pressure holding gradient setter 14 and the integrator 13. On the other hand, the pressure of the molten resin is detected by the sensor 28, and when the gate of the mold is sealed by cooling, the resin pressure drops rapidly. At the inflection point of the resin pressure that occurs at this time, a pulse signal is detected by double differentiation by the differentiator 18 and the differentiator 21. The detected signal is transmitted to the comparator 22 and R3 is activated through the output circuit 23 to complete the injection. timer 27
This prevents the differentiator from detecting the inflection point C at the inflection point C shown in FIG. 3 before gate sealing and completing the injection process.

以上述べたように本発明の制御装置によつて溶
融樹脂圧力を基準パターンに沿つて制御し、成形
品の品質を一定にしたことは本発明の効果であ
る。
As described above, the effect of the present invention is that the molten resin pressure is controlled according to the reference pattern by the control device of the present invention, and the quality of the molded product is made constant.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明を説明するブロツクダイヤグラ
ムであり、第2図は本発明の電気回路であり、第
3図は溶融樹脂圧の時間に対する基準パターンで
ある。
FIG. 1 is a block diagram explaining the present invention, FIG. 2 is an electric circuit of the present invention, and FIG. 3 is a reference pattern of molten resin pressure with respect to time.

Claims (1)

【特許請求の範囲】[Claims] 1 油圧ポンプと射出シリンダのピストンを前進
させるシリンダ室とを連通する管路にシリンダ室
の圧力を制御する電磁作動リリーフバルブ8と射
出速度を制御する電磁フローコントロールバルブ
7と金型内の溶融樹脂圧力を検出する樹脂圧検出
センサ28を設けた回路において、該電磁作動リ
リーフバルブ8の圧力設定を行うフイードバツク
機能を備えたアンプ11を設け、一方圧力制御の
基準パターン設定器としてレベルシフト10と短
形入力波形を不完全積分し、基準パターン曲線を
発生する関数発生器15とキヤビテイ圧力設定器
17及び積分器13と直列に配列した圧力保持勾
配設定器14を設け、これら基準パターン設定器
の各々の出力と該樹脂圧検出センサ28からの出
力とを該アンプ11にて比較し、フイードバツク
制御により該電磁作動リリーフバルブ8を作動さ
せ、射出初期において前記レベルシフト10に設
定した基準パターンによる信号と前記樹脂圧セン
サ28の検出信号の差により電磁リリーフバルブ
の圧力設定を最大設定圧とし射出速度を前記コン
トロールバルブのみにより制御するようにした射
出成形機の射出圧力制御装置。
1. An electromagnetic relief valve 8 that controls the pressure in the cylinder chamber, an electromagnetic flow control valve 7 that controls the injection speed, and molten resin in the mold are connected to a pipe line that communicates the hydraulic pump and the cylinder chamber that advances the piston of the injection cylinder. In a circuit provided with a resin pressure detection sensor 28 for detecting pressure, an amplifier 11 with a feedback function for setting the pressure of the electromagnetic relief valve 8 is provided, and a level shift 10 and a short circuit are provided as a reference pattern setting device for pressure control. A function generator 15 for incompletely integrating a shape input waveform to generate a reference pattern curve, a pressure holding gradient setting device 14 arranged in series with a cavity pressure setting device 17 and an integrator 13 are provided, and each of these reference pattern setting devices The amplifier 11 compares the output from the resin pressure detection sensor 28 with the output from the resin pressure detection sensor 28, operates the electromagnetic relief valve 8 through feedback control, and generates a signal based on the reference pattern set in the level shift 10 at the initial stage of injection. An injection pressure control device for an injection molding machine, in which the pressure of an electromagnetic relief valve is set to the maximum setting pressure based on the difference in detection signals of the resin pressure sensor 28, and the injection speed is controlled only by the control valve.
JP11743276A 1976-09-29 1976-09-29 Device for controlling injection pressure of injection molding machine Granted JPS5342252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11743276A JPS5342252A (en) 1976-09-29 1976-09-29 Device for controlling injection pressure of injection molding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11743276A JPS5342252A (en) 1976-09-29 1976-09-29 Device for controlling injection pressure of injection molding machine

Publications (2)

Publication Number Publication Date
JPS5342252A JPS5342252A (en) 1978-04-17
JPS6146293B2 true JPS6146293B2 (en) 1986-10-13

Family

ID=14711492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11743276A Granted JPS5342252A (en) 1976-09-29 1976-09-29 Device for controlling injection pressure of injection molding machine

Country Status (1)

Country Link
JP (1) JPS5342252A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57142336A (en) * 1981-02-28 1982-09-03 Asahi Chem Ind Co Ltd Method and apparatus for measuring gate seal time in injection molding
JPS59123910A (en) * 1982-12-29 1984-07-17 Daikin Ind Ltd Pressure controlling mechanism
JPS60160401A (en) * 1984-01-31 1985-08-22 Mitsubishi Heavy Ind Ltd Setting device of control data
JPS62217313A (en) * 1986-03-19 1987-09-24 Yuken Kogyo Kk Control circuit for proportional electromagnetic type fluid control valve
JP6552933B2 (en) * 2015-09-29 2019-07-31 住友重機械工業株式会社 Injection molding machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010952A (en) * 1973-05-25 1975-02-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010952A (en) * 1973-05-25 1975-02-04

Also Published As

Publication number Publication date
JPS5342252A (en) 1978-04-17

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