JPS6129159B2 - - Google Patents
Info
- Publication number
- JPS6129159B2 JPS6129159B2 JP8017179A JP8017179A JPS6129159B2 JP S6129159 B2 JPS6129159 B2 JP S6129159B2 JP 8017179 A JP8017179 A JP 8017179A JP 8017179 A JP8017179 A JP 8017179A JP S6129159 B2 JPS6129159 B2 JP S6129159B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed circuit
- circuit board
- heating
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 36
- 238000010438 heat treatment Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 20
- 239000000155 melt Substances 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 238000005476 soldering Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 230000004907 flux Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010421 standard material Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、プリント基板に搭載されている部品
を取外す方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for removing components mounted on a printed circuit board.
電子計算機等の一般電子機器を実装する場合、
個別部品あるいはサブユニツトをプリント基板上
に搭載して論理機能モジユールを構成した後、こ
れらモジユールを集合体として大形配線基板上に
実装し、サブシステム化ないしシステム化された
機能単位を構成する。これらの機能単位を集合体
として筐体構造に実装し、相互に電気的接続を行
つて独立した装置を完成する。このような実装構
造中で、中心となる部分は論理素子とプリント板
パツケージである。 When implementing general electronic equipment such as computers,
After configuring logical functional modules by mounting individual parts or subunits on a printed circuit board, these modules are mounted as a collection on a large wiring board to construct a subsystem or systemized functional unit. These functional units are assembled into a housing structure and electrically connected to each other to complete an independent device. In such a mounting structure, the central parts are the logic element and the printed circuit board package.
プリント基板搭載部品の接続には、基板の孔に
貫通するリードを有する部品に対して、溶融した
はんだの槽に接合面を浸してはんだ付けする浸漬
はんだ付け方法、あるいはフラツト・パツク形部
品に対して、接合面にあらかじめ予備はんだない
しめつきによりはんだの層を設けておき、加熱電
極を押当てるか、または通電によるジユール熱に
よりはんだを溶融させて接合するリフローはんだ
付け方法が用いられている。 For connecting components mounted on printed circuit boards, dip soldering is used for parts with leads that penetrate through holes in the board, in which the joint surface is immersed in a bath of molten solder, or immersion soldering is used for flat pack components. For this reason, a reflow soldering method is used in which a layer of solder is previously provided on the bonding surface by pre-soldering or tightening, and the solder is melted by pressing a heating electrode or by energization to melt the solder.
はんだ付けは、通常取外すことを前提としない
永久的な接続方法であるが、設計、改造あるいは
実験の段階では、はんだ付けを取外して他の部品
と接続替えすることが多い。 Soldering is a permanent connection method that does not normally require removal, but at the stage of design, modification, or experimentation, soldering is often removed and connections are made with other parts.
従来、第１図に示すプリント基板１に搭載され
ている部品２を取外す方法としては、はんだごて
を用いて人手により取外すことが多い。第２図に
示すように、フラツト・パツク形パツケージの部
品２では、パツケージの四辺から水平にリード３
が配列され、これらのリード３がパツド４にはん
だ付けされている。基板１から部品２を取外す場
合、第３図に示すように、先ずはんだごて５を用
いて部品２のリード３を加熱し、下のパツド４の
はんだを溶かした後、リード引掛治具６により加
熱直後のリード３を１点ずつ引上げて取外してい
る。 Conventionally, as a method for removing a component 2 mounted on a printed circuit board 1 shown in FIG. 1, it is often removed manually using a soldering iron. As shown in FIG.
are arranged, and these leads 3 are soldered to pads 4. When removing the component 2 from the board 1, as shown in FIG. The leads 3 immediately after heating are pulled up one by one and removed.
この方法によれば、リード３が多数配置されて
いる場合、作業時間がリード３の数に比例して長
くかかり、かつ人手によりはんだごて５を使用す
るので、各リード３に均一な熱を加えることがで
きず、熱による悪影響が現われる等の欠点があ
る。 According to this method, when a large number of leads 3 are arranged, the working time takes longer in proportion to the number of leads 3, and since the soldering iron 5 is manually used, uniform heat is applied to each lead 3. It has drawbacks such as the fact that it cannot be added to heat, and there are adverse effects due to heat.
ところで、最近、第４図に示すように、４つの
方向に加熱部８を設けて、リード３の上方から加
熱し、パツド４のはんだが溶けると同時に吸着部
９により部品２を吸着し、上方に取外す方法が提
案されている。しかし、この方法では、４つの方
向のリード３を加熱部８により加熱しても、リー
ド３の先端が不揃いの場合には、均一にリード３
に熱を加えることができず、リード３を極部的に
熱負荷してしまうため、一部のパツド４を剥して
しまうことがある。 Incidentally, recently, as shown in FIG. 4, heating parts 8 are provided in four directions to heat the leads 3 from above, and at the same time as the solder on the pads 4 melts, the suction part 9 attracts the component 2 and heats the lead 3 from above. A method of removal has been proposed. However, in this method, even if the leads 3 in four directions are heated by the heating unit 8, if the tips of the leads 3 are uneven, the leads 3 are heated uniformly.
Since heat cannot be applied to the lead 3 and the lead 3 is subject to a local heat load, a part of the pad 4 may come off.
本発明の目的は、このような欠点を除去し、プ
リント基板上の部品の接続部に対する熱負荷を少
くし、リードの先端が不揃いの部品でも簡単に取
外すことができ、かつ加熱装置の寿令を延ばすこ
とができるプリント基板搭載部品の取外し方法を
提供することにある。 The purpose of the present invention is to eliminate such drawbacks, reduce the heat load on the connection parts of components on the printed circuit board, enable easy removal of components even with uneven lead tips, and extend the service life of the heating device. It is an object of the present invention to provide a method for removing components mounted on a printed circuit board, which can extend the time.
本発明は、プリント基板上のパツドと部品のリ
ードとの接続部上に該接続部をおおうはんだ片を
載置し、はんだのぬれ性のよい表面処理を施した
加熱具によつてこのはんだ片を介して接続部を加
熱し、はんだ片を溶融させて接続部のはんだに熱
を伝達させ、接続部のはんだが溶融すると同時に
部品取外し治具で部品を取外すプリント基板搭載
部品の取外し方法を特徴とする。 In the present invention, a piece of solder is placed on the connection part between a pad on a printed circuit board and a lead of a component to cover the connection part, and the solder piece is soldered using a heating tool whose surface has been treated to have good solder wettability. This method is characterized by a method for removing parts mounted on printed circuit boards, in which the connection part is heated through the heat exchanger, the solder piece is melted, and the heat is transferred to the solder in the connection part, and the solder in the connection part is melted and the part is removed using a component removal jig at the same time. shall be.
以下、本発明の実施例を、図面により説明す
る。 Embodiments of the present invention will be described below with reference to the drawings.
第５図は、本発明によるプリント基板搭載部品
取外し方法を示す斜視図である。 FIG. 5 is a perspective view showing a method for removing components mounted on a printed circuit board according to the present invention.
第５図において、プリント基板１は、ガラス・
エポキシ、フエノール等の材料の上に、銅にはん
だめつき等を施したパツド４を備えている。ま
た、セラミツク等の材質を使用した集積回路、抵
抗器等の部品２は、コバール、リン青銅等の材質
で作られ、かつプリント基板１のパツド４の上に
置くことができる形状のリード３により接続さ
れ、基板上に搭載されている。 In FIG. 5, the printed circuit board 1 is made of glass.
A pad 4 made of copper soldered or the like is provided on a material such as epoxy or phenol. Components 2 such as integrated circuits and resistors made of materials such as ceramics are connected to leads 3 made of materials such as Kovar and phosphor bronze and shaped so that they can be placed on the pads 4 of the printed circuit board 1. connected and mounted on the board.
第６図は、本発明に使用された供給はんだの形
状図、第７図は第５図における加熱前の部分的断
面図、第８図は第５図における加熱後の断面図で
ある。 6 is a shape diagram of the supplied solder used in the present invention, FIG. 7 is a partial sectional view of FIG. 5 before heating, and FIG. 8 is a sectional view of FIG. 5 after heating.
先ず、第７図に示すように、基板上のリード３
とパツド４の接続部に対してロジン系等のフラツ
クス１２を塗布した後、共晶はんだ（Sn6：
Pb4）等の標準的な材質ではんだ箔を作り、第６
図に示すように、部品２のリード３の位置に一致
する枠形の供給はんだ１０を形成して、接続部の
上に設置する。 First, as shown in FIG. 7, the leads 3 on the board are
After applying flux 12 such as rosin type to the connection part between pad 4 and pad 4, eutectic solder (Sn6:
Make solder foil from standard material such as Pb4) and
As shown in the figure, a frame-shaped supply solder 10 corresponding to the position of the lead 3 of the component 2 is formed and placed over the connection part.
次に、銅等の材質をリード３の端部に接触する
ことができるように形成し、かつ表面に酸化防止
処理を施した加熱具７を、第５図に示すように部
品２の上方から接近させる。加熱具７の先端に
は、酸化防止処理後の表面にはんだが付着し易
い、例えば鉄めつき等の表面処理１１を施した加
熱部８が設けられており、この加熱部８を下降さ
せて接続部を加熱すると、供給はんだ１０が溶融
して、リード３とパツド４のはんだを溶かす。加
熱具７の中心部には、ステンレス鋼等の材質で作
られた部品取外し治具１３、例えば吸着治具等が
備えられており、接続部のはんだが溶けると同時
に、この吸着治具で部品２の上面を吸着し、第８
図に示すように、プリント基板１から部品２を取
外すことができる。 Next, a heating tool 7 made of a material such as copper so that it can come into contact with the end of the lead 3 and whose surface has been subjected to oxidation prevention treatment is inserted from above the component 2 as shown in FIG. bring them closer. A heating part 8 is provided at the tip of the heating tool 7, and the heating part 8 has been subjected to a surface treatment 11 such as iron plating, which makes it easy for solder to adhere to the surface after anti-oxidation treatment. When the connection is heated, the supplied solder 10 melts and melts the solder on the leads 3 and pads 4. At the center of the heating tool 7, there is a component removal jig 13 made of a material such as stainless steel, such as a suction jig. Adsorb the top surface of 2, and
As shown in the figure, the component 2 can be removed from the printed circuit board 1.
なお、供給はんだ１０については、フラツクス
１２を塗布することを考慮すれば、やに入りはん
だ等も使用することができる。 As for the supplied solder 10, a flux-cored solder or the like may be used if the application of the flux 12 is taken into account.
加熱具７の材質を選択する場合、熱伝導性がよ
く、また酸化されることがなく、かつリード３と
接触する部分は下地が熱に対して変形が少なく、
しかも表面がはんだのぬれ性のよいものを選定す
る。これらの性質に見合うものとして、クロム銅
等の表面全体にアルミナ合金等の層を作り、さら
に先端部には鉄めつき等を施したものを使用する
必要がある。 When selecting a material for the heating tool 7, select one that has good thermal conductivity, is not oxidized, and has a base that is less deformed by heat at the part that comes into contact with the lead 3.
In addition, select one whose surface has good solder wettability. In order to meet these properties, it is necessary to use a material in which a layer of alumina alloy or the like is formed on the entire surface of chromium copper or the like, and the tip is plated with iron or the like.
また、部品２の取外し条件については、加熱温
度、加熱時間、加圧力等を実験より算出するもの
とする。 Moreover, regarding the removal conditions of the component 2, heating temperature, heating time, pressing force, etc. shall be calculated through experiments.
なお、取外し治具１３としては、吸着方法のほ
かに、部品をつまみ上げる方法、あるいは部品の
角を引掛ける方法等がある。 As for the removal jig 13, in addition to the suction method, there are other methods such as a method of picking up the component, a method of hooking the corner of the component, and the like.
本発明では、熱伝導性をよくするために、加熱
部８とリード３との間に供給はんだ１０を設置す
るが、この供給はんだ１０は、再度この位置に部
品を接続する場合に、むかえはんだとすることが
できる。 In the present invention, in order to improve thermal conductivity, a supply solder 10 is installed between the heating section 8 and the leads 3. When connecting components at this position again, this supply solder 10 is used as a contacting solder. It can be done.
以上説明したように、本発明によれば、接続部
に供給はんだを行い、リードとの接触部にはんだ
のぬれ性のよい表面処理を施した加熱具で加熱す
るので、接続部の熱負荷を少なくして部品を取外
しでき、したがつてプリント基板、部品の信頼度
が向上するとともに、加熱時間が短くなるので、
コスト・ダウンが可能となる。また、供給はんだ
がむかえはんだとなるので、部品交換要求に対し
て数回にわたり受入れが可能である。さらに、リ
ード先端が不揃いな部品に対しても取外し可能で
あり、しかも加熱具を低い温度で使用できるの
で、装置の寿命を延ばすことが可能となる。 As explained above, according to the present invention, solder is supplied to the connection part, and the contact part with the lead is heated with a heating tool that has been surface-treated to have good solder wettability, so that the heat load on the connection part is reduced. Components can be removed with less heat, which improves the reliability of printed circuit boards and components, and reduces heating time.
Cost reduction becomes possible. Further, since the supplied solder becomes the received solder, it is possible to accept several requests for parts replacement. Furthermore, parts with uneven lead tips can be removed, and the heating tool can be used at low temperatures, making it possible to extend the life of the device.
第１図はプリント基板搭載部品の斜視図、第２
図は第１図の接続部の拡大図、第３図は従来の部
品取外し方法を示す説明図、第４図は従来の他の
部品取外し方法を示す説明図、第５図は本発明の
実施例を示すプリント基板搭載部品取外し方法を
示す斜視図、第６図は本発明で使用される供給は
んだの形状図、第７図は第５図における加熱前の
部分的断面図、第８図は第５図における加熱後の
断面図である。
１……プリント基板、２……部品、３……リー
ド、４……パツド、５……はんだごて、６……リ
ード引掛治具、７……加熱具、８……加熱部、９
……吸着部、１０……供給はんだ、１１……表面
処理、１２……フラツクス、１３……部品取外し
治具。
Figure 1 is a perspective view of the parts mounted on the printed circuit board, Figure 2
The figure is an enlarged view of the connection part in Figure 1, Figure 3 is an explanatory diagram showing a conventional component removal method, Figure 4 is an explanatory diagram showing another conventional component removal method, and Figure 5 is an explanatory diagram showing the implementation of the present invention. A perspective view showing an example of a method for removing components mounted on a printed circuit board, FIG. 6 is a shape diagram of supplied solder used in the present invention, FIG. 7 is a partial cross-sectional view of FIG. 5 before heating, and FIG. 8 is a 6 is a sectional view after heating in FIG. 5. FIG. 1... Printed circuit board, 2... Parts, 3... Lead, 4... Pad, 5... Soldering iron, 6... Lead hooking jig, 7... Heating tool, 8... Heating part, 9
... Adsorption part, 10 ... Supply solder, 11 ... Surface treatment, 12 ... Flux, 13 ... Parts removal jig.
Claims (1)
部品を該プリント基板から取外す方法において前
記パツドと前記部品のリードとの接続部上に該接
続部をおおうはんだ片を載置し、はんだのぬれ性
のよい表面処理を施した加熱具によつて前記はん
だ片を介して前記接続部を加熱し、前記はんだ片
を溶融させて前記接続部のはんだに熱を伝達さ
せ、前記接続部のはんだが溶融すると同時に部品
取外し治具で部品を取外すことを特徴とするプリ
ント基板搭載部品の取外し方法。1. In a method for removing a component soldered to a pad on a printed circuit board from the printed circuit board, a piece of solder is placed on the connection between the pad and the lead of the component to cover the connection, and the wettability of the solder is determined. Heat the connection part through the solder piece using a heating tool with a good surface treatment, melt the solder piece and transfer heat to the solder of the connection part, and when the solder of the connection part melts, A method for removing components mounted on a printed circuit board, characterized by simultaneously removing the components using a component removal jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8017179A JPS566459A (en) | 1979-06-27 | 1979-06-27 | Removing method of component carried on printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8017179A JPS566459A (en) | 1979-06-27 | 1979-06-27 | Removing method of component carried on printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS566459A JPS566459A (en) | 1981-01-23 |
| JPS6129159B2 true JPS6129159B2 (en) | 1986-07-04 |
Family
ID=13710877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8017179A Granted JPS566459A (en) | 1979-06-27 | 1979-06-27 | Removing method of component carried on printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS566459A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61108196A (en) * | 1984-10-31 | 1986-05-26 | シャープ株式会社 | Element removing apparatus |
| JPS62172175U (en) * | 1986-12-06 | 1987-10-31 | ||
| US5174016A (en) * | 1991-04-25 | 1992-12-29 | Toddco General, Inc. | Chip removal apparatus and method of using same |
| US5172469A (en) * | 1991-05-08 | 1992-12-22 | Hughes Aircraft Company | Advanced part removal and torque shear station |
-
1979
- 1979-06-27 JP JP8017179A patent/JPS566459A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS566459A (en) | 1981-01-23 |
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