JPS61284389A - Sensor for sense of contact force - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field to which the Invention Pertains] The present invention relates to pressure sensors, which are attached to the legs and feet of robots in order to improve the object grasping and walking functions of robots. Touch sense, pressure sense.

Senses corresponding to the sense of slip and the sense of hardness are present in a pressure sensor that can be recognized.

[Prior art and its problems] A conventional pressure sensor of this type is configured as shown in FIG. a multiplexer 4 for sequentially taking out and amplifying the output signals from the sensor modules 2;

Decoders 5 and 6. A sweep/amplification unit including an amplifier 7 etc. and its circuit, 8 is an A/D converter and a storage device RA.
) and a ROM, and is equipped with the functions of a microprocessor, in which computations for correction of the above-mentioned output signals and generation of sweep signals are performed.

Further, as shown in factor 3B, each sensor module 2 generally includes a plurality of pressure detection elements ax, GY, and GZ and respective output switches Sx+, Sxz,
The sensor module 2 includes Sy+, SY2, Sz+, Sz2, and a row switch sM and a stage switch SN, and such sensor modules 2 are arranged in a matrix in the pressure sensor l to constitute the pressure sensor as described above. .

In the pressure sensor configured as described above, the address signal from the signal processing unit 8 causes the decoders 5 and 6 to select the column switch SM and stage switch sN in the sensor module 2 at the address corresponding to the signal. energized, its output switches SXl, SX'1
．． SY+, 5YISZI F3 J: and sZ2 are in the "on" state.

Furthermore, the multiplexer 4 is driven in the sweep/amplification section 3 by the output selection signal from the signal processing section 8, and a specified element among the pressure detection elements cx, GY, and GZ in the sensor module 2 at the selected address is activated. The output signal is amplified via the amplifier 7, and the signal processing section 8
can be entered.

However, in such conventional pressure sensors, although the pressure sensing part 1 (not shown in the figure) is generally attached to the base or foot, the signal processing part 8 is attached to the hands and feet due to its weight and mounting space. The sweep/amplification section 3, which is provided between the signal processing section 8 and the pressure sensing section 1, is arranged at a position away from the pressure sensing section 1. If installed, there was a risk that external noise would be superimposed on the wiring between them. Further, since the number of wiring lines between them is large as shown in the example of FIG. 3A, there is a possibility that the operation may be hindered.

Furthermore, since a large number of sensor modules 2 are arranged in the pressure sensing section 1, if a defect or failure occurs in a part of the module during inspection after manufacturing or during use, it is not easy to correct or partially replace the sensor module.

[Object of the Invention] In view of the above-mentioned points, the object of the present invention is to eliminate the drawbacks and to provide a block consisting of a plurality of sensor modules in a form that is detachable from the base on which the sweeping fist amplifying section is disposed. By integrating the pressure sensing part and the sweep/amplification part, it is possible to not only prevent external noise from being superimposed on the wiring between them, but also to easily connect the pressure sensing part and the sweep/amplification part without interfering with the movement of the limbs. An object of the present invention is to provide a pressure sensor whose parts can be replaced.

[Summary of the Invention] That is, the present invention provides a pressure sensor in which a plurality of sensor modules provided with pressure detection elements are arranged in a matrix, and an electric circuit is arranged to selectively extract output signals from the individual pressure detection elements of the sensor modules. In the sensor, a plurality of sensor modules are arranged and attached in a matrix on a first base, a first terminal member for taking out an output signal from a pressure detection element is provided on the first base, an electric circuit is built therein, and the first base has a built-in electric circuit. The second base body is capable of attaching a plurality of second terminal members, and includes a second base body on which second terminal members are removably arranged in correspondence with the first terminal members, and the plurality of first base bodies and second base bodies are connected to the first terminal member and the second base body. It is characterized in that it is electrically connected and integrated with a terminal member.

[Embodiments of the Invention] Hereinafter, embodiments of the present invention will be described in detail and specifically based on the drawings.

FIG. 1 shows an embodiment of the present invention, where 12 is a plurality of pressure sensing elements GK' as shown in FIG. 3B, for example.
+GY+ and Gz and output switch SXI, 5X2
−, SYl, ””, szz and further column switch s
The sensor module M and the stage switch SN are formed by a semiconductor formation process, and are small in size, for example, with a negative side of several millimeters.

A plurality of such sensor modules 12 are arranged and mounted on the upper circuit board (substrate) 13, and the upper circuit board 13 has a wiring section 13A for connection on its upper surface as shown in FIG. Multilayer printed wiring section 13B in the middle layer
Furthermore, a connection pin 14 is provided on the lower surface, and the wiring section 12A disposed on the sensor module 12 and the wiring section 13A of the upper circuit board 13 are electrically connected by, for example, soldering or the like. connected to.

Further, the middle layer multilayer printed wiring section 13B is configured to aggregate the electric circuits drawn out from each of the plurality of sensor modules 12 attached on the upper part into the minimum number of circuits, and from this aggregated circuit. so that the output signal of the terminal is guided to the connection pin 14.

A plurality of sensor modules 12 disposed on the upper circuit board 13 in this manner will be referred to as a sensor array 20 hereinafter, but in this example, the sensor array 20 has an area large enough to accommodate the required number of sensor arrays 20, A base body (hereinafter referred to as a sweep amplification board) 30 in which the machine part and target elements of the sweep/amplification section are built is provided, and this sweep/amplification board 30
The sensor array 20 is arranged and attached as shown in FIG.

Reference numeral 15 denotes a socket plate into which the connecting pin 14 of the sensor array 20 is inserted; and 1B is a socket plate formed at a position corresponding to the bin 14, and the sweep/amplification board 30 is provided with the socket plate 1B on the upper layer thereof. In addition, a lower circuit board 17 is attached to the lower surface of the socket board 1B in a stacked state.
Although not shown in the figure, a circuit as shown in FIG. 3A is arranged in the form of multilayer printed wiring, and electronic components 18 such as a multiplexer, decoder, and amplifier are mounted, and these electronic components 18 is electrically connected to the socket 15 via the circuit described above.

Reference numeral 18 denotes a case installed under the lower circuit board 17. The case 18 protects the electronic components 18 and circuits, and also serves as a part for attaching to an object to be mounted (not shown). By inserting the connection pin 14 of the sensor module 12 into the socket 15 of the sweep Φ amplification board 30 integrated by the IB, lower circuit board 17, and case 18, the electrical connection between the pressure sensing part and the sweep/amplification part is established. Not only can the wiring length between them be significantly shortened, but also the sensor module 12
can be attached/detached or replaced in units of sensor array 20.

[Effects of the Invention] As described above, according to the present invention, a sensor array is constructed by arranging a plurality of sensor modules each having a pressure detection element on a first base, and the lower surface of the first base is is provided with a terminal member for taking out the output signal from each pressure sensing element, while the second base is provided with a sweep and amplification circuit for taking out and amplifying the output signal from each sensor module. , a removable terminal member corresponding to the above-mentioned terminal member is provided on the upper surface, and this second
Since the sensor array is arranged on the base to form a matrix of sensor modules, the wiring length between the pressure sensing section and the sweep/amplification circuit can be shortened, and external noise can be superimposed on the wiring section. Not only can this type of wiring not be exposed to the outside, it will not interfere with the movement of the robot's limbs, and it can also be easily attached and detached from the second base in the form of a sensor array. This makes it possible to easily replace defective sensor modules in units of sensor arrays during inspections, repairs, and the like.

[Brief explanation of drawings]

FIG. 1 is a partially exploded perspective view showing an example of the configuration of the pressure sensor of the present invention, FIG. 2 is a sectional view of the sensor array, and FIG. 3A is a circuit of a sensor output signal preprocessing device in a conventional pressure sensor. Figure 1. Figure 13B is a configuration diagram of an output signal extraction circuit in the sensor module. DESCRIPTION OF SYMBOLS 1... Pressure sense part, 2... Sensor module, 3... Sweep/amplification part, 4... Multiplexer-1 5, 8... Decoder, 7... Amplifier, 8... Signal processing part, ax, GY, GZ...pressure detection element, SXI,
SX2.3Yl, SY'1. SZl, SZ2"" output switch, SM... row switch, sN... stage switch, 12... sensor module, l3... upper circuit board (base), 12A, 13A... wiring section, 13B ...Multilayer printed wiring section. 14... Connection bin, 15... Socket, 16... Socket board. 17... Lower circuit board, 18... Electronic components, 18... Case, 20... Sensor array, 30... Sweep/amplification board (substrate). Collar correction sharp Tsuneto engineer door π is 廿・Qか far ■ 1 豐;・!寥娑-一

Claims (1)

[Claims] A pressure sensor in which a plurality of sensor modules provided with pressure detection elements are arranged in a matrix, and an electric circuit is arranged for selectively extracting output signals from each of the pressure detection elements of the sensor module, the plurality of sensor modules are arranged and attached to a first base in a matrix, a first terminal member for taking out an output signal from the pressure detection element is provided on the first base, the electric circuit is built in, and a plurality of the first bases are installed. a second base body that is attachable and has second terminal members arranged in a removable manner corresponding to the first terminal member;
A pressure sensor characterized in that the terminal member and the second terminal member are electrically connected and integrated.