JPS6127652A - Wafer positioning device - Google Patents

Abstract

PURPOSE:To ensure free directional adjustment in the supply of dies by a methed wherein an X-Y table, turn-table, pins for positioning a wafer frame on a wafer platform, and a control means are provided. CONSTITUTION:A wafer frame 13 is installed on a wafer platform 10, an air cylinder 18 is actuated for a lever 16 to move the wafer frame 13 toward positioning pins 11, 12, for the accomplishment of positioning. An X-Y table 1 is caused to travel by a Y-direction pulse motor 3 for the movement of the wafer platform 10 along the direction of Y, for the detection by a TV camera 34 of dies 14a one after the other. When the cut line (arrangement of each of the dies 14a) is inclined relative to the Y-axis, deviation is produced along the direction X in the course of movement. The quantity of deviation in relation to the total movement along the direction Y is processed in the central processing unit for the computation of the angle of inclination of the wafer 14 in relation to the directions X, Y. A pulse motor 8 is operated for the rotation of a turn-table 7 with the intermediary of a gear 9 for angular compensation, for the accomplishment of correct positioning.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a wafer positioning device that automatically positions a wafer frame to which a wafer is fixed.

(Prior art) A wafer is divided into multiple dies and attached to a sheet.
The sheet is stretched to increase the die spacing and fixed to the wafer frame. Then, the Uninor frame to which the wafer is fixed is set in a die pickup device such as a die bonder, and the dies are picked up one by one by the Gui pickup device and supplied to the Gui bonder or the like.

(Problems with the prior art) By the way, since the divided dies are not always lined up regularly, it is necessary to automatically supply the wafer to the die pickup device while maintaining the alignment direction of the dies in a fixed direction. It was difficult to do so, and we had no choice but to increase manpower.

Recently, there have been requests to bond the same type of die to several types of lead frames by changing only the direction of the die, or to bond several types of dies to the same type of lead frame by changing the direction of the die. .

However, with conventional die bonders, the operator controls both the feeding of the wafer and the direction of bonding, that is, the direction of setting the wafer, so the die is always fed in only one direction, and cannot meet the above requirements. There was a problem.

(Object of the Invention) The first object of the present invention is to provide a wafer positioning device that can automatically supply and position a fixed wafer frame and can freely adjust the feeding direction of dies. It is about providing.

A second object and advantage of the present invention is to provide a wafer positioning device that can correct the alignment direction of the dies in the die position supply direction.

(Example of the invention) Hereinafter, the present invention will be explained with reference to illustrated embodiments.

Fig. 1 is a partially cutaway front view of the wafer positioning device according to the present invention, Fig. 2 shows the wafer mounting table before the wafer clamp, fa) is a plan view, fb) is a horizontal sectional view, and Fig. 3 4 shows a wafer mounting table during wafer clamping, (a) is a plan view, (b) is a cross-sectional view, and FIG. 4 is a block diagram of the detection processing and driving section.

In FIG. 1, C11 is an XY table having a circumferential configuration, which can be moved vertically and horizontally by an X-direction pulse motor 2 and a Y-direction pulse ε-3. 4 is a top plate fixed on the XY table 1 via a pedestal 5; 6 is a hollow vertical shaft fixed to the top plate 5; 7 is a rotary table that is rotatable around the vertical axis 6; (hereinafter referred to as θ table),
A gear portion 7a is formed on the outer periphery. 84 is a θ-direction pulse motor for rotating the θ table 7; 9 is a spur gear fixed to the output shaft of the pulse motor 8;
It meshes with the gear portion 7a.

1 to 3, 1o is a wafer mounting table fixed on the θ table 7, 11 is an X-direction positioning pin implanted in the wafer mounting table 10f, and 12 is a pin implanted in the wafer mounting table 10. This is a Y-direction positioning pin. Reference numeral 13 denotes a wafer frame to which the wafer 14 is fixed via a sheet 15, and includes a first notch 1 in an approximately L-shape for positioning in the X direction.
3a, and a V-shaped second notch 13b for positioning in the Y direction.
is formed. 16) A presser V bar C1 pin 17) is rotatably supported and is driven by an air cylinder 18 and swings. 19
．． 20 is fixed to a detection frame 21.22 which is slidably supported by the detection pin C1 arranged between the positioning pins 11.12 and the wafer mounting table 10#. 23 and 24 are the detection pins 19.2o that position the wafer frame 13 on the pins 11.
．． A compression coil spring 25 biases the detection frames 21 and 22 in a direction away from the detection frame 12, and a proximity switch 25 is provided facing the detection frame 20.

In FIG. 1, reference numeral 30 denotes a needle holder arranged inside the wafer mounting table 1o, which is moved downward by a driving means (not shown). A needle 31 is fixed to an arm 32 that is moved up and down by a drive means (not shown), and is guided by a needle holder 30f. 33 is wafer 1
The collet attracts the four divided dies 14a, and is moved up and down and in the X and Y directions by a driving means (not shown).

This is a TV camera that recognizes the 34har7 wafer 14 and is placed above the needle 31.

In FIG. 4, 40 is an image recognition unit of the rV camera 34, 41 is a central processing unit that processes the signal of the image recognition unit 40,
42 is a drive unit that drives the solenoid valve 43 connected to the x-, y-, and θ-direction pulse motors 2, 3, 8 &, and the air cylinder 18 based on signals from the central processing unit 41; 44 is the solenoid valve 43;
This is a combustible tube that sends compressed air through the C air cylinder Ii.

Next, the operation of the wafer positioning device having such a configuration will be explained. The wafer 14 is divided into a plurality of dies 14a and attached to a sheet 15, and one wafer frame 13
is fixed. The wafer frame 13 is held by a means such as suction on a wafer frame transport 7-m (not shown) and is transported to and from the wafer mounting table 10. At this time, the presser foot V bar 16 is in the backward position @ as shown in FIG.

Then, the transfer arm descends, places the wafer frame 13 on the wafer mounting table 10, and rises again to return to its original position.

When the wafer frame 13 is placed on the mounting table 1o, the air cylinder 18 operates and moves forward to swing the presser bar 16 and position the wafer frame 13, as shown in FIG. The first notch 13a of the wafer frame 13 comes into contact with the positioning pin 11 in the X direction, the second notch 13b contacts the positioning pin 12 in the Y direction, and the It is guided along the V-shaped groove of the two notches 13b and positioned in the XY directions.

At this time, the wafer frame 13 is also brought into contact with the detection pin 19.20, and the detection pin 19.20 is suppressed and moved.

The movement of the detection rod 21 activates the proximity switch 25, and the completion of positioning of the wafer frame 13 is confirmed.

Next, the direction and position of the wafer 14 are corrected.

Now, the direction of the die 14a when the wafer frame 13 is positioned on the wafer mounting device stand 10 as described above is shown in FIG.
Assume that it is facing upward like a prisoner as shown in aiIC.

It is assumed that the direction in which this die is picked up and placed in a die bonder or the like is to the right, like the mouth.

In this case, first, the pulse motor 8 rotates, and the spur gear 9
The Cθ table 7 is rotated through the 511th fbl
ζ Rotated 90 degrees clockwise as shown. After that, as shown in the figure (0), adjust the screw θ so that the die 14a faces in the correct direction (direction of supply to the die bonder, etc.).
The processing of E is performed as follows.

The wafer 14 positioned on the wafer mounting table 10 is monitored by the TV right camera 4I, and the TV left camera 4 sends images of one die and one die in the wafer 14 to the image recognition unit 40.
I am sending it to Then, when the wafer 14 is positioned as shown in FIG. , the wafer mounting table 10 moves in the SX, l, and Y directions. For convenience of explanation and 1 here Y
Assuming that the die moves in the direction l, the 11th die is detected by the 'Pv camera 34, and its position is read and moved. At this time, if the cut line dividing the wafer 14 (that is, the individual arrangement of the dies 14a) is tilted with respect to the X and Y axes, the component of arise. The central processing unit 41 performs XY processing for each individual die 14a.
The table 1 is moved in the X direction, this deviation is corrected, and the amount of movement at that time is stored in the central processing unit 41 (not shown).
Ku.

In this way, if this process is repeated IvA until the 'C die is easily detected, the ratio of the total amount of movement in the X direction required to correct the deviation of the die to the total amount of movement in the Y direction is 1 query/S14. The inclination angle with respect to the XY direction is the central processing unit 4
It is calculated by 1. That is, the inclination angle is calculated by the following equation.

Therefore, the θ table 7 is rotated by the central processing unit 41 via the drive unit 42 by an amount corresponding to the inclination angle, and the θ table 7 is rotated by an amount corresponding to the tilt angle. The current situation will be corrected. As a result, the wafer 14 is accurately positioned without tilting in the X and Y directions, as shown in FIG. 5+C). Further, when changing the direction of the die 14a and performing -C bonding, it is sufficient to rotate the θ table 7 by the required die inclination based on the corrected accurate value stored in the central processing section 41G.

In addition, the above operation is slightly enlarged, the XY table 1 is moved along the Y direction I, the distance from one end of the wafer 14 to the other end is detected, and the next By repeating the same operation, it is possible to easily determine the size of the wafer 14, its center, or the average distance between individual dies, which previously had to be done manually by an operator. Work can also be automated.

(Effects of the Invention) As is clear from the above description, the following effects can be obtained according to the present invention. By automating the supply of one wafer, it is useful for fully automating the wafer processing process. Even if the die arrangement is irregular, it is possible to deal with the situation by finding the average distance between the die. The feeding direction of the die can be completely freely controlled by the θ tape set.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway front view showing an embodiment of the positioning device according to the present invention, Fig. 2 shows a wafer mounting table before wafer clamping, (a) is a plan view, and (lb) is a cross-sectional view, Figure 3 is the weight when clamping the wafer...XY table, 7...θ (ro1 rotation) table, 10...
Sea urchin... mounting table, 11.12... positioning pin, 13... wafer frame, 14... wafer, 16... push lever, 19.20... detection pin, 34 ・'rv camera, 40.・
- Image recognition unit, 41... Central processing unit. Figure 2 Figure 3

Claims (2)

[Claims] (1) An XY table, a rotating table installed on the XY table that rotates around a vertical axis, a wafer mounting table provided on the rotating table, and a wafer frame with a fixed wafer placed on the wafer mounting table. a clamping means having a positioning pin for positioning the wafer frame at a fixed position, a holding mechanism for positioning the wafer frame by pressing it against the positioning pin, an XY table driving means for driving the XY table, and a rotary table for driving the rotary table. A wafer positioning device having a driving means. (2) An XY table, a rotary table provided on the XY table that rotates around a vertical axis, a wafer mounting table provided on the rotary table, and a wafer frame with a fixed wafer placed on the wafer mounting table. a clamping means having a positioning pin for positioning the wafer frame at a fixed position, a holding mechanism for positioning the wafer frame by pressing it against the positioning pin, a driving means for driving the XY table, and a rotary table driving means for driving the rotary table. After positioning the wafer frame on the wafer mounting table, actuate the XY table drive means to move the XY table in one of the XY directions, and detect a deviation in the die arrangement direction in the other control direction. 1. A wafer positioning device comprising: a control means for detecting the inclination of the wafer in the X and Y directions, and operating the rotary table driving means to correct the wafer by rotating the rotary table.