JPS61187282A - Photodetecting element - Google Patents

Photodetecting element

Info

Publication number
JPS61187282A
JPS61187282A JP60026821A JP2682185A JPS61187282A JP S61187282 A JPS61187282 A JP S61187282A JP 60026821 A JP60026821 A JP 60026821A JP 2682185 A JP2682185 A JP 2682185A JP S61187282 A JPS61187282 A JP S61187282A
Authority
JP
Japan
Prior art keywords
layer
type layer
wavelength beams
photodiode
absorbed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60026821A
Other languages
Japanese (ja)
Inventor
Mikihiro Kimura
木村 幹広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60026821A priority Critical patent/JPS61187282A/en
Publication of JPS61187282A publication Critical patent/JPS61187282A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • H01L27/14645Colour imagers
    • H01L27/14647Multicolour imagers having a stacked pixel-element structure, e.g. npn, npnpn or MQW elements

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To read a chrominance signal having high resolving power by mounting three kinds of photodiodes, which detect short wavelength beams, medium wavelength beams and long wavelength beams projected, consist of pnpnp structure and obtain several photocurrent, and a switch controlling these photodiodes. CONSTITUTION:Among beams projected to a light-receiving surface in a photodetecting element, short wavelength beams hu11 are absorbed to a p-n junction between a p-type layer 16 as a first layer and an n-type layer 17 as a second layer, and function as photocurrents I11 in a photodiode PD11, medium wavelength beams hu12 are absorbed to an n-p junction between the n-type layer 17 as the second layer and a p-type layer 18 as a third layer, and serves as photocurrents I12 in a photodiode PD12, and long wavelength beams hu13 are absorbed to a p-n junction between the p-type layer 18 as the third layer and an n-type layer 19 as a fourth layer, and function as photocurrents I13 in a photodiode PD13. When bias voltage V1-V4 is applied previously and MOS switches S11-S13 are brought simultaneously to ON stages, potential differences are generated in electrodes d-f, and chrominance signals corresponding to wavelengths can be read. Accordingly, color discrimination can be improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、光起電力効果を利用して、カラーフィルタ
を用いずにカラーセンシングを行う光検出素子に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a photodetecting element that utilizes the photovoltaic effect to perform color sensing without using a color filter.

〔従来の技術〕[Conventional technology]

従来の光検出素子の一例を第3図に示し説明すると、こ
の第3図は従来のカラーフィルタを用いない光検出素子
を示す断面図である。
An example of a conventional photodetection element is shown and explained in FIG. 3. FIG. 3 is a sectional view showing a conventional photodetection element that does not use a color filter.

図において、1は保護膜(8i0s)、4はp形シリコ
ン基板、3はこのp形シリコン基板4の上に形成したn
形層、2はこのn形層3の中に形成したp形層である。
In the figure, 1 is a protective film (8i0s), 4 is a p-type silicon substrate, and 3 is an n-type silicon substrate formed on this p-type silicon substrate 4.
A type layer 2 is a p-type layer formed within this n-type layer 3.

なお、h旧およびhu2はそれぞれ外部から入射する短
波長光および長波長光を示し、a、bはn形層2および
n形層3の各電極、Cはp形シリコン基板4の電極を示
す。
Note that hold and hu2 respectively indicate short wavelength light and long wavelength light incident from the outside, a and b indicate the respective electrodes of the n-type layer 2 and n-type layer 3, and C indicates the electrode of the p-type silicon substrate 4. .

このように構成された光検出素子の動作を第3図の等何
回路である第4図を参照して説明する。
The operation of the photodetecting element constructed in this way will be explained with reference to FIG. 4, which is a circuit similar to that shown in FIG.

まず、外部から入射する短波長光り旧は上部のn形層2
とn形層3のpn接合で吸収され、第4図のフォトダイ
オードPDIの光電流11となる。
First, short-wavelength light incident from the outside is exposed to the upper n-type layer 2.
is absorbed by the pn junction of the n-type layer 3, resulting in a photocurrent 11 of the photodiode PDI shown in FIG.

つぎに外部から入射する長波長光hu2は下部のn形層
3とp形シリコン基板4のnp層で吸収され、第4図の
フォトダイオードPDlIの光電流IsとなるO このようにして、フォトダイオードPDl、PDgによ
って各光電流Ii、Isが得られ、この両光電流II、
Isの比I 2 /I lの値が入射光の光に対応して
、色の判別を行うことができる。
Next, the long wavelength light hu2 incident from the outside is absorbed by the lower n-type layer 3 and the np layer of the p-type silicon substrate 4, and becomes a photocurrent Is of the photodiode PDlI shown in FIG. Each photocurrent Ii, Is is obtained by the diodes PDl, PDg, and these photocurrents II,
Color discrimination can be performed depending on the value of the ratio I 2 /I 1 of Is, which corresponds to the incident light.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記のような従来の光検出素子では、色判別の分解能が
著しく低下し、色の分離に限界があるなどの問題点があ
った。
Conventional photodetecting elements such as those described above have problems such as a marked decrease in resolution for color discrimination and a limit to color separation.

この発明はかかる問題点を解決するためになされたもの
で、簡単な構成によって、色判別を著しく向上すること
ができ、また、自然色に近い色再現性を実現することが
できる光検出素子を得ることを目的とする。
This invention was made to solve these problems, and it provides a photodetector element that can significantly improve color discrimination and realize color reproducibility close to natural colors with a simple configuration. The purpose is to obtain.

〔問題点を解決するだめの手段〕[Failure to solve the problem]

この発明による光検出素子は、pnpnp構造からなシ
入射する短波長光と中波長光および長波長光を検出して
各光電流を得る3種類のフォトダイオードと、この3種
類のフォトダイオードを制御するスイッチとを備えてな
るようにしたものである。
The photodetecting element according to the present invention has a pnpnp structure and has three types of photodiodes that detect incident short wavelength light, medium wavelength light, and long wavelength light to obtain each photocurrent, and a control function for controlling these three types of photodiodes. The device is equipped with a switch to

〔作用〕[Effect]

この発明においては、3種類のフォトダイオードによっ
てそれぞれ短波長光、中波長光、長波長光に対応した光
電流を得、予めバイアスをかけておくことにより、MO
B形スイスイツチングり電位差を生じ、よ多分解能の高
い色信号を読み出すことを可能にする。
In this invention, three types of photodiodes are used to obtain photocurrents corresponding to short wavelength light, medium wavelength light, and long wavelength light, respectively, and by applying a bias in advance, MO
A B-type switching potential difference is generated, making it possible to read color signals with higher resolution.

〔実施例〕〔Example〕

以下、図面に基いて本発明の実施例を詳細に説明する。 Embodiments of the present invention will be described in detail below based on the drawings.

第1図は本発明による光検出素子の一実施例を示す断面
図である。
FIG. 1 is a sectional view showing an embodiment of a photodetecting element according to the present invention.

図において、11はバイアス電圧Vlをかけられた一層
目のドレイン電極、12はバイアス電圧Vgをかけられ
た二層目のドレイン電極、13はバイアス電圧■8をか
けられた三層目のドレイン電極、14−1.14−2.
14−3はそれぞれMOS形スイッチ、15はこれら各
MOS形スイッチ14−1〜14−3を同時にON状態
にするゲート電極、16は一層目のp形層、17は二層
目のn形層、18は三層目のp形層、19は四層目のn
形層、20はp形基板である。
In the figure, 11 is the drain electrode of the first layer to which the bias voltage Vl is applied, 12 is the drain electrode of the second layer to which the bias voltage Vg is applied, and 13 is the drain electrode of the third layer to which the bias voltage ■8 is applied. , 14-1.14-2.
14-3 is a MOS type switch, 15 is a gate electrode that simultaneously turns on each of these MOS type switches 14-1 to 14-3, 16 is a first p-type layer, and 17 is a second n-type layer. , 18 is the third p-type layer, 19 is the fourth n-type layer
The type layer 20 is a p-type substrate.

そして、V4は四層目のn形層19にかけられるバイア
ス電圧を示し、d、e、fはそれぞれ一層目のp形層1
6.二層目のn形層17.三層目のn形層18の各電極
を示す。
Further, V4 indicates the bias voltage applied to the fourth n-type layer 19, and d, e, and f respectively indicate the bias voltage applied to the first p-type layer 19.
6. Second n-type layer 17. Each electrode of the third n-type layer 18 is shown.

第2図は第1図の等価回路図である。この第2図におい
て第1図と同一符号のものは相当部分を示し、PDli
−PD18はフォトダイオード、811゜812 、5
illはMOSスイッチで、これら各MOSスイッチS
ll、812.81sはそれぞれ第1図におけるMOS
スイッチ14−1 、14−2 、14−3に対応する
FIG. 2 is an equivalent circuit diagram of FIG. 1. In this Fig. 2, the same reference numerals as in Fig. 1 indicate corresponding parts, and PDli
-PD18 is a photodiode, 811°812, 5
ill is a MOS switch, and each of these MOS switches S
ll, 812.81s are MOS in Fig. 1, respectively.
It corresponds to switches 14-1, 14-2, and 14-3.

つぎに第1図に示す実施例の動作を第2図を参   □
照して説明する。
Next, refer to Figure 2 for the operation of the embodiment shown in Figure 1.
I will refer to and explain.

まず、光検出素子の受光面に入射した光のうち、短波長
光hunは一層目のp形層16と二層目のn形層17の
pn接合に吸収され、第2図のフォトダイオードPDI
Iの光電流■11となり、中波長光hu I&は二層目
のn形層11と三層目のn形層18のnp接合に吸収さ
れ、第2図のフォトダイオードPD12の光電流112
となり、さらに、長波長光hu laは三層目のn形層
18と四層目のn形層19のpn接合に吸収され、第2
図のフォトダイオードPD 18の光電流Itsとなる
First, among the light incident on the light receiving surface of the photodetector, short wavelength light hun is absorbed by the pn junction between the first p-type layer 16 and the second n-type layer 17, and the photodiode PDI shown in FIG.
The photocurrent of I becomes 11, and the medium wavelength light hu I& is absorbed by the np junction between the second n-type layer 11 and the third n-type layer 18, and the photocurrent of photodiode PD12 in FIG. 2 becomes 112.
Furthermore, the long wavelength light hu la is absorbed by the pn junction between the third n-type layer 18 and the fourth n-type layer 19, and the second
The photocurrent Its of the photodiode PD 18 in the figure is obtained.

そして、第2図に示すように、予めバイアス電圧V1.
V2 、VB 、V4をかけていれば、MOSスイッチ
Sll、 S12.5illを同時にON状態にすると
、電極d、e、fで電位差が生じ、波長に応じた色信号
を読み出すことができる。また、回路をリセットするに
は、第1図に示すMOSスイッチ14−1〜14−3の
ゲート電極15を制御して第2図に示すMOSスイッチ
811.SN2,818をOFF状態にすればよい。
As shown in FIG. 2, the bias voltage V1.
If V2, VB, and V4 are applied, when the MOS switches Sll and S12.5ill are turned on at the same time, a potential difference is generated between the electrodes d, e, and f, and a color signal corresponding to the wavelength can be read out. Furthermore, in order to reset the circuit, the gate electrodes 15 of the MOS switches 14-1 to 14-3 shown in FIG. 1 are controlled and the MOS switches 811. It is sufficient to turn SN2, 818 into the OFF state.

このように、受光面に入射する短波長光huu、中波長
光hu 1gおよび長波長光huiaを検出して各光電
流l1l−Itsを得るpnpnp構造の3種類のフォ
トダイオードPDII〜PDIBで構成しだので、色判
別を著しく向上することができ、また、カラーフィルタ
のように、色合が微妙に影響することもなく、自然色に
近い色再現性を実現することもできる。
In this way, it is composed of three types of photodiodes PDII to PDIB with a pnpnp structure that detect the short wavelength light huu, medium wavelength light hu1g, and long wavelength light huia incident on the light receiving surface to obtain each photocurrent l1l-Its. Therefore, color discrimination can be significantly improved, and color reproducibility close to natural colors can be achieved without the slight influence of hue unlike color filters.

なお、上記実施例においては、−絵素の光検出素子とし
て作用する場合を例にとって説明したが、この発明はこ
れに限定されるものではなく、プレイ構造にすることに
よって、カラーイメージセンサとして使用することもで
きる。
In addition, in the above embodiment, the case where the picture element acts as a photodetecting element was explained as an example, but the present invention is not limited to this, and by making it into a play structure, it can be used as a color image sensor. You can also.

〔発明の効果〕〔Effect of the invention〕

以上の説明から明らかなように、この発明によれば、複
雑な手段を用いることなく、3種のフォトダイオードで
構成した簡単な構成によって、色判別を著しく向上する
ことができ、また、カラーフィルタのように、フィルタ
の色合が微妙に影響することもなく、自然色に近い色再
現性を実現することができるので、実用上の効果は極め
て大である。
As is clear from the above description, according to the present invention, color discrimination can be significantly improved with a simple configuration composed of three types of photodiodes without using complicated means, and color discrimination can be significantly improved without using complicated means. As shown in the figure, it is possible to achieve color reproducibility close to natural colors without being subtly affected by the tint of the filter, so the practical effect is extremely large.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明による光検出素子の一実施例を示す断
面図、第2図は第1図の等価回路図、第3図は従来の光
検出素子の一例を示す断面図、第4図は第3図の等価回
路図である。 11〜13・拳・・ドレイン電極、14−1〜14−3
・・・・MOSスイッチ、15・・・・ゲート電極、1
6・−・・一層目のp形層、17・拳・・二層目のn形
層、18・・・・三層目のp形層、19・・・・四層目
のn形層、2011@@・p形基板。
FIG. 1 is a sectional view showing an embodiment of a photodetecting element according to the present invention, FIG. 2 is an equivalent circuit diagram of FIG. 1, FIG. 3 is a sectional view showing an example of a conventional photodetecting element, and FIG. is an equivalent circuit diagram of FIG. 3. 11~13・Fist・Drain electrode, 14-1~14-3
...MOS switch, 15...gate electrode, 1
6...First p-type layer, 17.Fist...Second n-type layer, 18...Third p-type layer, 19...Fourth n-type layer , 2011@@・p-type substrate.

Claims (2)

【特許請求の範囲】[Claims] (1)pnpnp構造からなり入射する短波長光と中波
長光および長波長光を検出して各光電流を得る3種類の
フォトダイオードと、この3種類のフォトダイオードを
制御するスイッチとを備えてなることを特徴とする光検
出素子。
(1) Equipped with three types of photodiodes that have a pnpnp structure and detect incident short-wavelength light, medium-wavelength light, and long-wavelength light to obtain each photocurrent, and a switch that controls these three types of photodiodes. A photodetecting element characterized by:
(2)3種類のフォトダイオードを制御するスイッチは
、MOS型構造のスイッチによつて構成されていること
を特徴とする特許請求の範囲第1項記載の光検出素子。
(2) The photodetecting element according to claim 1, wherein the switch for controlling the three types of photodiodes is constituted by a switch having a MOS type structure.
JP60026821A 1985-02-14 1985-02-14 Photodetecting element Pending JPS61187282A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60026821A JPS61187282A (en) 1985-02-14 1985-02-14 Photodetecting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60026821A JPS61187282A (en) 1985-02-14 1985-02-14 Photodetecting element

Publications (1)

Publication Number Publication Date
JPS61187282A true JPS61187282A (en) 1986-08-20

Family

ID=12203939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60026821A Pending JPS61187282A (en) 1985-02-14 1985-02-14 Photodetecting element

Country Status (1)

Country Link
JP (1) JPS61187282A (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232788A (en) * 1987-06-12 1990-02-02 Hitachi Ltd Control of motor and motor control device
US5298771A (en) * 1992-11-09 1994-03-29 Xerox Corporation Color imaging charge-coupled array with photosensitive layers in potential wells
US5506430A (en) * 1992-03-03 1996-04-09 Canon Kabushiki Kaisha Solid state image pick-up device with differing capacitances
EP1078233A1 (en) * 1998-04-24 2001-02-28 Foveon, Inc. Color separation in an active pixel cell imaging array using a triple-well structure
WO2002027804A2 (en) * 2000-09-25 2002-04-04 Foveon, Inc. Vertical color filter detector group and array
US6841816B2 (en) 2002-03-20 2005-01-11 Foveon, Inc. Vertical color filter sensor group with non-sensor filter and method for fabricating such a sensor group
US6864557B2 (en) 2001-06-18 2005-03-08 Foveon, Inc. Vertical color filter detector group and array
US6894265B2 (en) 2003-01-31 2005-05-17 Foveon, Inc. Vertical color filter sensor group and semiconductor integrated circuit fabrication method for fabricating same
EP1535236A1 (en) * 2002-03-20 2005-06-01 Symbol Technologies, Inc. Image capture system and method
US6914314B2 (en) 2003-01-31 2005-07-05 Foveon, Inc. Vertical color filter sensor group including semiconductor other than crystalline silicon and method for fabricating same
US6930336B1 (en) 2001-06-18 2005-08-16 Foveon, Inc. Vertical-color-filter detector group with trench isolation
US6960757B2 (en) 2001-06-18 2005-11-01 Foveon, Inc. Simplified wiring schemes for vertical color filter pixel sensors
US6998660B2 (en) 2002-03-20 2006-02-14 Foveon, Inc. Vertical color filter sensor group array that emulates a pattern of single-layer sensors with efficient use of each sensor group's sensors
EP1630871A1 (en) * 2003-11-10 2006-03-01 Matsushita Electric Industrial Co., Ltd. An imaging device and an imaging method
US7164444B1 (en) 2002-05-17 2007-01-16 Foveon, Inc. Vertical color filter detector group with highlight detector
US7166880B2 (en) 2002-03-20 2007-01-23 Foveon, Inc. Vertical color filter sensor group with carrier-collection elements of different size and method for fabricating such a sensor group
US7339216B1 (en) 2003-01-31 2008-03-04 Foveon, Inc. Vertical color filter sensor group array with full-resolution top layer and lower-resolution lower layer
US7602430B1 (en) 2007-04-18 2009-10-13 Foveon, Inc. High-gain multicolor pixel sensor with reset noise cancellation
WO2010049183A1 (en) * 2008-10-28 2010-05-06 Sony Ericsson Mobile Communications Ab Combined sensor for portable communication devices
US7745773B1 (en) 2008-04-11 2010-06-29 Foveon, Inc. Multi-color CMOS pixel sensor with shared row wiring and dual output lines
US8089109B2 (en) 2006-07-21 2012-01-03 Renesas Electronics Corporation Photoelectric conversion device and imaging device
JP2013055245A (en) * 2011-09-05 2013-03-21 Canon Inc Photoelectric conversion device

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232788A (en) * 1987-06-12 1990-02-02 Hitachi Ltd Control of motor and motor control device
US5506430A (en) * 1992-03-03 1996-04-09 Canon Kabushiki Kaisha Solid state image pick-up device with differing capacitances
US5298771A (en) * 1992-11-09 1994-03-29 Xerox Corporation Color imaging charge-coupled array with photosensitive layers in potential wells
EP1078233A1 (en) * 1998-04-24 2001-02-28 Foveon, Inc. Color separation in an active pixel cell imaging array using a triple-well structure
EP1078233A4 (en) * 1998-04-24 2001-08-08 Foveon Inc Color separation in an active pixel cell imaging array using a triple-well structure
WO2002027804A3 (en) * 2000-09-25 2003-02-20 Foveon Inc Vertical color filter detector group and array
WO2002027804A2 (en) * 2000-09-25 2002-04-04 Foveon, Inc. Vertical color filter detector group and array
US6632701B2 (en) 2000-09-25 2003-10-14 Foveon, Inc. Vertical color filter detector group and array
US6727521B2 (en) 2000-09-25 2004-04-27 Foveon, Inc. Vertical color filter detector group and array
US7132724B1 (en) 2000-09-25 2006-11-07 Foveon, Inc. Complete-charge-transfer vertical color filter detector
US6864557B2 (en) 2001-06-18 2005-03-08 Foveon, Inc. Vertical color filter detector group and array
US6960757B2 (en) 2001-06-18 2005-11-01 Foveon, Inc. Simplified wiring schemes for vertical color filter pixel sensors
US6930336B1 (en) 2001-06-18 2005-08-16 Foveon, Inc. Vertical-color-filter detector group with trench isolation
EP1535236A4 (en) * 2002-03-20 2005-08-10 Symbol Technologies Inc Image capture system and method
US7166880B2 (en) 2002-03-20 2007-01-23 Foveon, Inc. Vertical color filter sensor group with carrier-collection elements of different size and method for fabricating such a sensor group
EP1535236A1 (en) * 2002-03-20 2005-06-01 Symbol Technologies, Inc. Image capture system and method
US6841816B2 (en) 2002-03-20 2005-01-11 Foveon, Inc. Vertical color filter sensor group with non-sensor filter and method for fabricating such a sensor group
US6976629B2 (en) 2002-03-20 2005-12-20 Symbol Technologies, Inc. Image capture system and method
US6998660B2 (en) 2002-03-20 2006-02-14 Foveon, Inc. Vertical color filter sensor group array that emulates a pattern of single-layer sensors with efficient use of each sensor group's sensors
US7164444B1 (en) 2002-05-17 2007-01-16 Foveon, Inc. Vertical color filter detector group with highlight detector
US6894265B2 (en) 2003-01-31 2005-05-17 Foveon, Inc. Vertical color filter sensor group and semiconductor integrated circuit fabrication method for fabricating same
US6914314B2 (en) 2003-01-31 2005-07-05 Foveon, Inc. Vertical color filter sensor group including semiconductor other than crystalline silicon and method for fabricating same
US7339216B1 (en) 2003-01-31 2008-03-04 Foveon, Inc. Vertical color filter sensor group array with full-resolution top layer and lower-resolution lower layer
EP1630871A1 (en) * 2003-11-10 2006-03-01 Matsushita Electric Industrial Co., Ltd. An imaging device and an imaging method
EP1630871A4 (en) * 2003-11-10 2007-03-14 Matsushita Electric Ind Co Ltd An imaging device and an imaging method
US7247851B2 (en) 2003-11-10 2007-07-24 Matsushita Electric Industrial Co., Ltd. Imaging device and an imaging method
US8089109B2 (en) 2006-07-21 2012-01-03 Renesas Electronics Corporation Photoelectric conversion device and imaging device
US7602430B1 (en) 2007-04-18 2009-10-13 Foveon, Inc. High-gain multicolor pixel sensor with reset noise cancellation
US7745773B1 (en) 2008-04-11 2010-06-29 Foveon, Inc. Multi-color CMOS pixel sensor with shared row wiring and dual output lines
WO2010049183A1 (en) * 2008-10-28 2010-05-06 Sony Ericsson Mobile Communications Ab Combined sensor for portable communication devices
JP2013055245A (en) * 2011-09-05 2013-03-21 Canon Inc Photoelectric conversion device

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