JPS61187282A - Photodetecting element - Google Patents
Photodetecting elementInfo
- Publication number
- JPS61187282A JPS61187282A JP60026821A JP2682185A JPS61187282A JP S61187282 A JPS61187282 A JP S61187282A JP 60026821 A JP60026821 A JP 60026821A JP 2682185 A JP2682185 A JP 2682185A JP S61187282 A JPS61187282 A JP S61187282A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- type layer
- wavelength beams
- photodiode
- absorbed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004304 visual acuity Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 241001441754 Heteralocha acutirostris Species 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
- H01L27/14647—Multicolour imagers having a stacked pixel-element structure, e.g. npn, npnpn or MQW elements
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、光起電力効果を利用して、カラーフィルタ
を用いずにカラーセンシングを行う光検出素子に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a photodetecting element that utilizes the photovoltaic effect to perform color sensing without using a color filter.
従来の光検出素子の一例を第3図に示し説明すると、こ
の第3図は従来のカラーフィルタを用いない光検出素子
を示す断面図である。An example of a conventional photodetection element is shown and explained in FIG. 3. FIG. 3 is a sectional view showing a conventional photodetection element that does not use a color filter.
図において、1は保護膜(8i0s)、4はp形シリコ
ン基板、3はこのp形シリコン基板4の上に形成したn
形層、2はこのn形層3の中に形成したp形層である。In the figure, 1 is a protective film (8i0s), 4 is a p-type silicon substrate, and 3 is an n-type silicon substrate formed on this p-type silicon substrate 4.
A type layer 2 is a p-type layer formed within this n-type layer 3.
なお、h旧およびhu2はそれぞれ外部から入射する短
波長光および長波長光を示し、a、bはn形層2および
n形層3の各電極、Cはp形シリコン基板4の電極を示
す。Note that hold and hu2 respectively indicate short wavelength light and long wavelength light incident from the outside, a and b indicate the respective electrodes of the n-type layer 2 and n-type layer 3, and C indicates the electrode of the p-type silicon substrate 4. .
このように構成された光検出素子の動作を第3図の等何
回路である第4図を参照して説明する。The operation of the photodetecting element constructed in this way will be explained with reference to FIG. 4, which is a circuit similar to that shown in FIG.
まず、外部から入射する短波長光り旧は上部のn形層2
とn形層3のpn接合で吸収され、第4図のフォトダイ
オードPDIの光電流11となる。First, short-wavelength light incident from the outside is exposed to the upper n-type layer 2.
is absorbed by the pn junction of the n-type layer 3, resulting in a photocurrent 11 of the photodiode PDI shown in FIG.
つぎに外部から入射する長波長光hu2は下部のn形層
3とp形シリコン基板4のnp層で吸収され、第4図の
フォトダイオードPDlIの光電流IsとなるO
このようにして、フォトダイオードPDl、PDgによ
って各光電流Ii、Isが得られ、この両光電流II、
Isの比I 2 /I lの値が入射光の光に対応して
、色の判別を行うことができる。Next, the long wavelength light hu2 incident from the outside is absorbed by the lower n-type layer 3 and the np layer of the p-type silicon substrate 4, and becomes a photocurrent Is of the photodiode PDlI shown in FIG. Each photocurrent Ii, Is is obtained by the diodes PDl, PDg, and these photocurrents II,
Color discrimination can be performed depending on the value of the ratio I 2 /I 1 of Is, which corresponds to the incident light.
上記のような従来の光検出素子では、色判別の分解能が
著しく低下し、色の分離に限界があるなどの問題点があ
った。Conventional photodetecting elements such as those described above have problems such as a marked decrease in resolution for color discrimination and a limit to color separation.
この発明はかかる問題点を解決するためになされたもの
で、簡単な構成によって、色判別を著しく向上すること
ができ、また、自然色に近い色再現性を実現することが
できる光検出素子を得ることを目的とする。This invention was made to solve these problems, and it provides a photodetector element that can significantly improve color discrimination and realize color reproducibility close to natural colors with a simple configuration. The purpose is to obtain.
この発明による光検出素子は、pnpnp構造からなシ
入射する短波長光と中波長光および長波長光を検出して
各光電流を得る3種類のフォトダイオードと、この3種
類のフォトダイオードを制御するスイッチとを備えてな
るようにしたものである。The photodetecting element according to the present invention has a pnpnp structure and has three types of photodiodes that detect incident short wavelength light, medium wavelength light, and long wavelength light to obtain each photocurrent, and a control function for controlling these three types of photodiodes. The device is equipped with a switch to
この発明においては、3種類のフォトダイオードによっ
てそれぞれ短波長光、中波長光、長波長光に対応した光
電流を得、予めバイアスをかけておくことにより、MO
B形スイスイツチングり電位差を生じ、よ多分解能の高
い色信号を読み出すことを可能にする。In this invention, three types of photodiodes are used to obtain photocurrents corresponding to short wavelength light, medium wavelength light, and long wavelength light, respectively, and by applying a bias in advance, MO
A B-type switching potential difference is generated, making it possible to read color signals with higher resolution.
以下、図面に基いて本発明の実施例を詳細に説明する。 Embodiments of the present invention will be described in detail below based on the drawings.
第1図は本発明による光検出素子の一実施例を示す断面
図である。FIG. 1 is a sectional view showing an embodiment of a photodetecting element according to the present invention.
図において、11はバイアス電圧Vlをかけられた一層
目のドレイン電極、12はバイアス電圧Vgをかけられ
た二層目のドレイン電極、13はバイアス電圧■8をか
けられた三層目のドレイン電極、14−1.14−2.
14−3はそれぞれMOS形スイッチ、15はこれら各
MOS形スイッチ14−1〜14−3を同時にON状態
にするゲート電極、16は一層目のp形層、17は二層
目のn形層、18は三層目のp形層、19は四層目のn
形層、20はp形基板である。In the figure, 11 is the drain electrode of the first layer to which the bias voltage Vl is applied, 12 is the drain electrode of the second layer to which the bias voltage Vg is applied, and 13 is the drain electrode of the third layer to which the bias voltage ■8 is applied. , 14-1.14-2.
14-3 is a MOS type switch, 15 is a gate electrode that simultaneously turns on each of these MOS type switches 14-1 to 14-3, 16 is a first p-type layer, and 17 is a second n-type layer. , 18 is the third p-type layer, 19 is the fourth n-type layer
The type layer 20 is a p-type substrate.
そして、V4は四層目のn形層19にかけられるバイア
ス電圧を示し、d、e、fはそれぞれ一層目のp形層1
6.二層目のn形層17.三層目のn形層18の各電極
を示す。Further, V4 indicates the bias voltage applied to the fourth n-type layer 19, and d, e, and f respectively indicate the bias voltage applied to the first p-type layer 19.
6. Second n-type layer 17. Each electrode of the third n-type layer 18 is shown.
第2図は第1図の等価回路図である。この第2図におい
て第1図と同一符号のものは相当部分を示し、PDli
−PD18はフォトダイオード、811゜812 、5
illはMOSスイッチで、これら各MOSスイッチS
ll、812.81sはそれぞれ第1図におけるMOS
スイッチ14−1 、14−2 、14−3に対応する
。FIG. 2 is an equivalent circuit diagram of FIG. 1. In this Fig. 2, the same reference numerals as in Fig. 1 indicate corresponding parts, and PDli
-PD18 is a photodiode, 811°812, 5
ill is a MOS switch, and each of these MOS switches S
ll, 812.81s are MOS in Fig. 1, respectively.
It corresponds to switches 14-1, 14-2, and 14-3.
つぎに第1図に示す実施例の動作を第2図を参 □
照して説明する。Next, refer to Figure 2 for the operation of the embodiment shown in Figure 1.
I will refer to and explain.
まず、光検出素子の受光面に入射した光のうち、短波長
光hunは一層目のp形層16と二層目のn形層17の
pn接合に吸収され、第2図のフォトダイオードPDI
Iの光電流■11となり、中波長光hu I&は二層目
のn形層11と三層目のn形層18のnp接合に吸収さ
れ、第2図のフォトダイオードPD12の光電流112
となり、さらに、長波長光hu laは三層目のn形層
18と四層目のn形層19のpn接合に吸収され、第2
図のフォトダイオードPD 18の光電流Itsとなる
。First, among the light incident on the light receiving surface of the photodetector, short wavelength light hun is absorbed by the pn junction between the first p-type layer 16 and the second n-type layer 17, and the photodiode PDI shown in FIG.
The photocurrent of I becomes 11, and the medium wavelength light hu I& is absorbed by the np junction between the second n-type layer 11 and the third n-type layer 18, and the photocurrent of photodiode PD12 in FIG. 2 becomes 112.
Furthermore, the long wavelength light hu la is absorbed by the pn junction between the third n-type layer 18 and the fourth n-type layer 19, and the second
The photocurrent Its of the photodiode PD 18 in the figure is obtained.
そして、第2図に示すように、予めバイアス電圧V1.
V2 、VB 、V4をかけていれば、MOSスイッチ
Sll、 S12.5illを同時にON状態にすると
、電極d、e、fで電位差が生じ、波長に応じた色信号
を読み出すことができる。また、回路をリセットするに
は、第1図に示すMOSスイッチ14−1〜14−3の
ゲート電極15を制御して第2図に示すMOSスイッチ
811.SN2,818をOFF状態にすればよい。As shown in FIG. 2, the bias voltage V1.
If V2, VB, and V4 are applied, when the MOS switches Sll and S12.5ill are turned on at the same time, a potential difference is generated between the electrodes d, e, and f, and a color signal corresponding to the wavelength can be read out. Furthermore, in order to reset the circuit, the gate electrodes 15 of the MOS switches 14-1 to 14-3 shown in FIG. 1 are controlled and the MOS switches 811. It is sufficient to turn SN2, 818 into the OFF state.
このように、受光面に入射する短波長光huu、中波長
光hu 1gおよび長波長光huiaを検出して各光電
流l1l−Itsを得るpnpnp構造の3種類のフォ
トダイオードPDII〜PDIBで構成しだので、色判
別を著しく向上することができ、また、カラーフィルタ
のように、色合が微妙に影響することもなく、自然色に
近い色再現性を実現することもできる。In this way, it is composed of three types of photodiodes PDII to PDIB with a pnpnp structure that detect the short wavelength light huu, medium wavelength light hu1g, and long wavelength light huia incident on the light receiving surface to obtain each photocurrent l1l-Its. Therefore, color discrimination can be significantly improved, and color reproducibility close to natural colors can be achieved without the slight influence of hue unlike color filters.
なお、上記実施例においては、−絵素の光検出素子とし
て作用する場合を例にとって説明したが、この発明はこ
れに限定されるものではなく、プレイ構造にすることに
よって、カラーイメージセンサとして使用することもで
きる。In addition, in the above embodiment, the case where the picture element acts as a photodetecting element was explained as an example, but the present invention is not limited to this, and by making it into a play structure, it can be used as a color image sensor. You can also.
以上の説明から明らかなように、この発明によれば、複
雑な手段を用いることなく、3種のフォトダイオードで
構成した簡単な構成によって、色判別を著しく向上する
ことができ、また、カラーフィルタのように、フィルタ
の色合が微妙に影響することもなく、自然色に近い色再
現性を実現することができるので、実用上の効果は極め
て大である。As is clear from the above description, according to the present invention, color discrimination can be significantly improved with a simple configuration composed of three types of photodiodes without using complicated means, and color discrimination can be significantly improved without using complicated means. As shown in the figure, it is possible to achieve color reproducibility close to natural colors without being subtly affected by the tint of the filter, so the practical effect is extremely large.
第1図はこの発明による光検出素子の一実施例を示す断
面図、第2図は第1図の等価回路図、第3図は従来の光
検出素子の一例を示す断面図、第4図は第3図の等価回
路図である。
11〜13・拳・・ドレイン電極、14−1〜14−3
・・・・MOSスイッチ、15・・・・ゲート電極、1
6・−・・一層目のp形層、17・拳・・二層目のn形
層、18・・・・三層目のp形層、19・・・・四層目
のn形層、2011@@・p形基板。FIG. 1 is a sectional view showing an embodiment of a photodetecting element according to the present invention, FIG. 2 is an equivalent circuit diagram of FIG. 1, FIG. 3 is a sectional view showing an example of a conventional photodetecting element, and FIG. is an equivalent circuit diagram of FIG. 3. 11~13・Fist・Drain electrode, 14-1~14-3
...MOS switch, 15...gate electrode, 1
6...First p-type layer, 17.Fist...Second n-type layer, 18...Third p-type layer, 19...Fourth n-type layer , 2011@@・p-type substrate.
Claims (2)
長光および長波長光を検出して各光電流を得る3種類の
フォトダイオードと、この3種類のフォトダイオードを
制御するスイッチとを備えてなることを特徴とする光検
出素子。(1) Equipped with three types of photodiodes that have a pnpnp structure and detect incident short-wavelength light, medium-wavelength light, and long-wavelength light to obtain each photocurrent, and a switch that controls these three types of photodiodes. A photodetecting element characterized by:
、MOS型構造のスイッチによつて構成されていること
を特徴とする特許請求の範囲第1項記載の光検出素子。(2) The photodetecting element according to claim 1, wherein the switch for controlling the three types of photodiodes is constituted by a switch having a MOS type structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60026821A JPS61187282A (en) | 1985-02-14 | 1985-02-14 | Photodetecting element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60026821A JPS61187282A (en) | 1985-02-14 | 1985-02-14 | Photodetecting element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61187282A true JPS61187282A (en) | 1986-08-20 |
Family
ID=12203939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60026821A Pending JPS61187282A (en) | 1985-02-14 | 1985-02-14 | Photodetecting element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61187282A (en) |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0232788A (en) * | 1987-06-12 | 1990-02-02 | Hitachi Ltd | Control of motor and motor control device |
US5298771A (en) * | 1992-11-09 | 1994-03-29 | Xerox Corporation | Color imaging charge-coupled array with photosensitive layers in potential wells |
US5506430A (en) * | 1992-03-03 | 1996-04-09 | Canon Kabushiki Kaisha | Solid state image pick-up device with differing capacitances |
EP1078233A1 (en) * | 1998-04-24 | 2001-02-28 | Foveon, Inc. | Color separation in an active pixel cell imaging array using a triple-well structure |
WO2002027804A2 (en) * | 2000-09-25 | 2002-04-04 | Foveon, Inc. | Vertical color filter detector group and array |
US6841816B2 (en) | 2002-03-20 | 2005-01-11 | Foveon, Inc. | Vertical color filter sensor group with non-sensor filter and method for fabricating such a sensor group |
US6864557B2 (en) | 2001-06-18 | 2005-03-08 | Foveon, Inc. | Vertical color filter detector group and array |
US6894265B2 (en) | 2003-01-31 | 2005-05-17 | Foveon, Inc. | Vertical color filter sensor group and semiconductor integrated circuit fabrication method for fabricating same |
EP1535236A1 (en) * | 2002-03-20 | 2005-06-01 | Symbol Technologies, Inc. | Image capture system and method |
US6914314B2 (en) | 2003-01-31 | 2005-07-05 | Foveon, Inc. | Vertical color filter sensor group including semiconductor other than crystalline silicon and method for fabricating same |
US6930336B1 (en) | 2001-06-18 | 2005-08-16 | Foveon, Inc. | Vertical-color-filter detector group with trench isolation |
US6960757B2 (en) | 2001-06-18 | 2005-11-01 | Foveon, Inc. | Simplified wiring schemes for vertical color filter pixel sensors |
US6998660B2 (en) | 2002-03-20 | 2006-02-14 | Foveon, Inc. | Vertical color filter sensor group array that emulates a pattern of single-layer sensors with efficient use of each sensor group's sensors |
EP1630871A1 (en) * | 2003-11-10 | 2006-03-01 | Matsushita Electric Industrial Co., Ltd. | An imaging device and an imaging method |
US7164444B1 (en) | 2002-05-17 | 2007-01-16 | Foveon, Inc. | Vertical color filter detector group with highlight detector |
US7166880B2 (en) | 2002-03-20 | 2007-01-23 | Foveon, Inc. | Vertical color filter sensor group with carrier-collection elements of different size and method for fabricating such a sensor group |
US7339216B1 (en) | 2003-01-31 | 2008-03-04 | Foveon, Inc. | Vertical color filter sensor group array with full-resolution top layer and lower-resolution lower layer |
US7602430B1 (en) | 2007-04-18 | 2009-10-13 | Foveon, Inc. | High-gain multicolor pixel sensor with reset noise cancellation |
WO2010049183A1 (en) * | 2008-10-28 | 2010-05-06 | Sony Ericsson Mobile Communications Ab | Combined sensor for portable communication devices |
US7745773B1 (en) | 2008-04-11 | 2010-06-29 | Foveon, Inc. | Multi-color CMOS pixel sensor with shared row wiring and dual output lines |
US8089109B2 (en) | 2006-07-21 | 2012-01-03 | Renesas Electronics Corporation | Photoelectric conversion device and imaging device |
JP2013055245A (en) * | 2011-09-05 | 2013-03-21 | Canon Inc | Photoelectric conversion device |
-
1985
- 1985-02-14 JP JP60026821A patent/JPS61187282A/en active Pending
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0232788A (en) * | 1987-06-12 | 1990-02-02 | Hitachi Ltd | Control of motor and motor control device |
US5506430A (en) * | 1992-03-03 | 1996-04-09 | Canon Kabushiki Kaisha | Solid state image pick-up device with differing capacitances |
US5298771A (en) * | 1992-11-09 | 1994-03-29 | Xerox Corporation | Color imaging charge-coupled array with photosensitive layers in potential wells |
EP1078233A1 (en) * | 1998-04-24 | 2001-02-28 | Foveon, Inc. | Color separation in an active pixel cell imaging array using a triple-well structure |
EP1078233A4 (en) * | 1998-04-24 | 2001-08-08 | Foveon Inc | Color separation in an active pixel cell imaging array using a triple-well structure |
WO2002027804A3 (en) * | 2000-09-25 | 2003-02-20 | Foveon Inc | Vertical color filter detector group and array |
WO2002027804A2 (en) * | 2000-09-25 | 2002-04-04 | Foveon, Inc. | Vertical color filter detector group and array |
US6632701B2 (en) | 2000-09-25 | 2003-10-14 | Foveon, Inc. | Vertical color filter detector group and array |
US6727521B2 (en) | 2000-09-25 | 2004-04-27 | Foveon, Inc. | Vertical color filter detector group and array |
US7132724B1 (en) | 2000-09-25 | 2006-11-07 | Foveon, Inc. | Complete-charge-transfer vertical color filter detector |
US6864557B2 (en) | 2001-06-18 | 2005-03-08 | Foveon, Inc. | Vertical color filter detector group and array |
US6960757B2 (en) | 2001-06-18 | 2005-11-01 | Foveon, Inc. | Simplified wiring schemes for vertical color filter pixel sensors |
US6930336B1 (en) | 2001-06-18 | 2005-08-16 | Foveon, Inc. | Vertical-color-filter detector group with trench isolation |
EP1535236A4 (en) * | 2002-03-20 | 2005-08-10 | Symbol Technologies Inc | Image capture system and method |
US7166880B2 (en) | 2002-03-20 | 2007-01-23 | Foveon, Inc. | Vertical color filter sensor group with carrier-collection elements of different size and method for fabricating such a sensor group |
EP1535236A1 (en) * | 2002-03-20 | 2005-06-01 | Symbol Technologies, Inc. | Image capture system and method |
US6841816B2 (en) | 2002-03-20 | 2005-01-11 | Foveon, Inc. | Vertical color filter sensor group with non-sensor filter and method for fabricating such a sensor group |
US6976629B2 (en) | 2002-03-20 | 2005-12-20 | Symbol Technologies, Inc. | Image capture system and method |
US6998660B2 (en) | 2002-03-20 | 2006-02-14 | Foveon, Inc. | Vertical color filter sensor group array that emulates a pattern of single-layer sensors with efficient use of each sensor group's sensors |
US7164444B1 (en) | 2002-05-17 | 2007-01-16 | Foveon, Inc. | Vertical color filter detector group with highlight detector |
US6894265B2 (en) | 2003-01-31 | 2005-05-17 | Foveon, Inc. | Vertical color filter sensor group and semiconductor integrated circuit fabrication method for fabricating same |
US6914314B2 (en) | 2003-01-31 | 2005-07-05 | Foveon, Inc. | Vertical color filter sensor group including semiconductor other than crystalline silicon and method for fabricating same |
US7339216B1 (en) | 2003-01-31 | 2008-03-04 | Foveon, Inc. | Vertical color filter sensor group array with full-resolution top layer and lower-resolution lower layer |
EP1630871A1 (en) * | 2003-11-10 | 2006-03-01 | Matsushita Electric Industrial Co., Ltd. | An imaging device and an imaging method |
EP1630871A4 (en) * | 2003-11-10 | 2007-03-14 | Matsushita Electric Ind Co Ltd | An imaging device and an imaging method |
US7247851B2 (en) | 2003-11-10 | 2007-07-24 | Matsushita Electric Industrial Co., Ltd. | Imaging device and an imaging method |
US8089109B2 (en) | 2006-07-21 | 2012-01-03 | Renesas Electronics Corporation | Photoelectric conversion device and imaging device |
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