JPS61165288A - Control device for laser beam processing machine - Google Patents

Control device for laser beam processing machine

Info

Publication number
JPS61165288A
JPS61165288A JP60005899A JP589985A JPS61165288A JP S61165288 A JPS61165288 A JP S61165288A JP 60005899 A JP60005899 A JP 60005899A JP 589985 A JP589985 A JP 589985A JP S61165288 A JPS61165288 A JP S61165288A
Authority
JP
Japan
Prior art keywords
height
processing machine
positioning
processing head
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60005899A
Other languages
Japanese (ja)
Inventor
Tatsukazu Itou
伊藤　竪一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60005899A priority Critical patent/JPS61165288A/en
Publication of JPS61165288A publication Critical patent/JPS61165288A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To improve the accuracy of positioning and to reduce the time for positioning by providing a non-contact type height detector and height setter to a laser beam processing machine and positioning automatically a processing head. CONSTITUTION:The processing head 3 of the processing machine body 1 is brought near to the work 7 and a visible beam fed from a laser oscillator 10 via an optical path 9 is matched with a reference for marking off in the stage of positioning the work in an X-Y direction. The spacing between the head 3 and the work 7 is preliminarily set at a height setter 12 with respect to the Z direction. A control panel 4 positions automatically the head 3 while reading the information of the setter 12. The height position thereof is stored in the panel 4. The control device for the laser beam processing machine which can position automatically the processing head is thus obtd.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はレーザ加工機における制御装置の改良に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement of a control device for a laser processing machine.

〔従来の技術〕[Conventional technology]

第２図は従来のレーザ加工機の加工ヘッドの位置決め制
御装置を示す斜視図である。図中（１）は加工機本体、
（２）は集光レンズ、（３）は加工ヘッド、（４）は制
御盤、（５）はティーチングボックス、（６）ハｉｔ測
用治具、（７）は被加工物、（８）は加工テーブル、（
９）はレーザ光路、α１はレーザ発振器である。FIG. 2 is a perspective view showing a positioning control device for a processing head of a conventional laser processing machine. In the figure (1) is the processing machine main body,
(2) is a condenser lens, (3) is a processing head, (4) is a control panel, (5) is a teaching box, (6) is a height measurement jig, (7) is a workpiece, (8) is the processing table, (
9) is a laser optical path, and α1 is a laser oscillator.

次に動作について説明する。装置にプロダラムをティー
チングする場合は、加工機本体（１）を移動し、加工ヘ
ッド（３）を被加工物（７）に接、近させる。ティーチ
ングの際は可視光線（通常ヘリウムネオンレーザ）が光
路（９）を介し、被加工物（７）に投光されているので
、この光を杉加工物（７）に罫書きされた基準線に合せ
ることによってＸ、Ｙ方向の位置決めは可能である。次
に２方向すなわち高さに関しては、図に示すように被加
工物（７）の上に計測用治具（６）を置き、これに加工
ヘッド（３）先端を嶺部せしめることによって高さを決
め、ティーチングボックス（５）を操作してこの高さを
制御盤（４）に記憶させる方法をとっている。Next, the operation will be explained. When teaching the program to the device, the processing machine main body (1) is moved and the processing head (3) is brought close to the workpiece (7). During teaching, visible light (usually a helium neon laser) is projected onto the workpiece (7) through the optical path (9), so this light is used to align the reference line marked on the cedar workpiece (7). Positioning in the X and Y directions is possible by adjusting the position. Next, regarding the two directions, that is, height, as shown in the figure, place the measuring jig (6) on top of the workpiece (7), and place the tip of the processing head (3) on the ridge to measure the height. The method is to determine the height, operate the teaching box (5), and store this height in the control panel (4).

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで以上述べた第２図に示すような加工ヘッド（３
）の被加工物（７）に対する高さ位置を装置にティーチ
ングさせる方式では、加工ヘッド（３）と被加１物（７
）との間隔を一定に保つため計測用治具（６）を使用す
る心上があるため、高さを決める際加工ヘット責３）を
計測用治具（６）や被加工物（７）にぶつつけて何度も
位置決め動作を繰返したわ、場合によっては被加工物（
７）を変形させたりすることがある。By the way, the processing head (3
), the height position of the workpiece (7) is taught to the device.
) to keep the distance between the measuring jig (6) and the workpiece (7) constant. I repeated the positioning operation many times by hitting the workpiece (
7) may be transformed.

本発明は上記のような従来装置の欠点を解消し、加工ヘ
ッドを自動的に位置決めするレーザ加工機の制御装置を
提供しようとするものである。The present invention aims to eliminate the drawbacks of the conventional devices as described above and to provide a control device for a laser processing machine that automatically positions the processing head.

〔問題点を解決するための手段と作用〕レーザ加工機に
おいて、加工ヘッドに非接触型高さ検出器を備え、制御
装置に高さ設定器を設けて、該高さ設定器にセットされ
た高さに合せて、加工ヘッドが前記高さ検出器により高
さを検出しながら、自動的に高さを位置決めし、この高
さを制御盤に記憶させるように構成した。[Means and effects for solving the problem] In a laser processing machine, the processing head is equipped with a non-contact height detector, the control device is equipped with a height setter, and the height detector is set in the height setter. The processing head is configured to automatically position the height while detecting the height using the height detector, and to store this height in the control panel.

この結果加工ヘッドの高さの位置決めが自動的に行なわ
れ、位置決めの時間が短縮されるとともに、加工ヘッド
の計測用治具や被加工物への衝突によるトラブルが解消
された。As a result, the height of the processing head is automatically determined, reducing the time required for positioning and eliminating troubles caused by the processing head colliding with the measuring jig or workpiece.

〔発明の実施例〕[Embodiments of the invention]

第１図は本発明の実施例を示す斜視図で（１）〜（５）
。FIG. 1 is a perspective view showing an embodiment of the present invention (1) to (5).
.

（７）〜（１１は従来装置と同一である。αつは加工ヘ
ッド（３）に係着された非接触型高さ検出器、（６）は
制御盤（４）に接続する高さ設定器である。(7) to (11) are the same as the conventional device. α is a non-contact height detector attached to the processing head (3), and (6) is a height setting connected to the control panel (4). It is a vessel.

第１図において、ｘ−ｙ方向の位置決めについては従来
と同じようにティーチングボックス（５）ヲ使用し、加
工機本体（１）を移動し、加工ヘッド（３）を被加工物
（７）に接近せしめ、光路（９）を介して送られる可視
光線を被加工物（７）に罫書きされた基準線に合わせて
位置決めする。In Figure 1, for positioning in the x-y directions, the teaching box (5) is used as in the conventional method, the processing machine body (1) is moved, and the processing head (3) is placed on the workpiece (7). The visible light beam sent through the optical path (9) is positioned in line with the reference line marked on the workpiece (7).

２方向すなわち高さに関しては、加工ヘッド（３）と被
加工物（７）との間隔を高さ設定器（６）に設定してお
き、ティーチングボックス（５）の“接近”の釦を押す
と、制御盤（４）は前記非接触型高さ設定器任・２・か
らの高さの情報を読みながら、加工ヘッド（３）を移動
させ、前記高さ設定器αつに設定した高さに一致する点
で加工ヘッド（３）を停止せしめ、ティーチングボック
ス（５）を操作してこの高さの位置を制御盤（４）に記
憶させる。Regarding the two directions, that is, the height, set the distance between the processing head (3) and the workpiece (7) on the height setting device (6), and press the "approach" button on the teaching box (5). Then, the control panel (4) moves the processing head (3) while reading the height information from the non-contact height setting device 2, and adjusts the height set on the height setting device α. The processing head (3) is stopped at a point that corresponds to the height, and the teaching box (5) is operated to store this height position in the control panel (4).

なお上記実施例は三次元レーザ加工機の加ニ一般につい
てのティーチングの例であるが、二次元加工のティーチ
ングにおいても同様に使用できる。Although the above embodiment is an example of teaching for general machining of a three-dimensional laser processing machine, it can be similarly used for teaching two-dimensional processing.

〔発明の効果〕〔Effect of the invention〕

本発明は上記のようにレーザ加工機に非接触型高さ検出
器と高さ設定器とを備えて、加工ヘッドの高さの位置決
めを自動的に行々わしめたので、位置決めの精度向上と
位置決め時間の短縮に優れた効果を上げることができた
。As described above, the present invention equips a laser processing machine with a non-contact height detector and a height setting device to automatically position the height of the processing head, thereby improving the accuracy of positioning. We were able to achieve an excellent effect in shortening the positioning time.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例を示すレーザ加工機制御装置
の斜視図、第２図は従来装置の斜視図である。 図中（１）は加工機本体、（３）は加工ヘッド、（４）
は制御盤、（７）は被加工物、αηは高さ検出器、（６
）は高さ設定器である。 なお図中同一符号は同−又は相当部品を示すものとする
。FIG. 1 is a perspective view of a laser processing machine control device showing an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional device. In the figure, (1) is the processing machine body, (3) is the processing head, and (4)
is the control panel, (7) is the workpiece, αη is the height detector, (6
) is a height setter. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] レーザ加工機において、その加工ヘッドに非接触型の高
さ検出器を備えるとともに、制御盤に高さ設定器を設け
、該高さ設定器にセットされた高さに合せて、加工ヘッ
ドが前記高さ検出器により加工ヘッドと被加工物との高
さを検出しながら自動的に位置決めし、この高さを制御
盤に記憶せしめるように構成したことを特徴とするレー
ザ加工機の制御装置。In a laser processing machine, the processing head is equipped with a non-contact height detector, and a height setting device is provided on the control panel, and the processing head is set to the height set in the height setting device. A control device for a laser processing machine, characterized in that it is configured to automatically position a processing head and a workpiece while detecting the height thereof using a height detector, and to store this height in a control panel.
JP60005899A 1985-01-18 1985-01-18 Control device for laser beam processing machine Pending JPS61165288A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60005899A JPS61165288A (en) 1985-01-18 1985-01-18 Control device for laser beam processing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60005899A JPS61165288A (en) 1985-01-18 1985-01-18 Control device for laser beam processing machine

Publications (1)

Publication Number Publication Date
JPS61165288A true JPS61165288A (en) 1986-07-25

Family

ID=11623737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60005899A Pending JPS61165288A (en) 1985-01-18 1985-01-18 Control device for laser beam processing machine

Country Status (1)

Country Link
JP (1) JPS61165288A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386003A (en) * 1986-09-30 1988-04-16 Toyoda Mach Works Ltd Working machine containing teaching function
DE4407682A1 (en) * 1993-03-08 1994-09-15 Mitsubishi Electric Corp Laser processing device and method for its focus adjustment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386003A (en) * 1986-09-30 1988-04-16 Toyoda Mach Works Ltd Working machine containing teaching function
DE4407682A1 (en) * 1993-03-08 1994-09-15 Mitsubishi Electric Corp Laser processing device and method for its focus adjustment
US5624587A (en) * 1993-03-08 1997-04-29 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus and method of setting focus thereof
DE4407682C2 (en) * 1993-03-08 1999-10-21 Mitsubishi Electric Corp Laser processing device and method for its focus adjustment

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