JPS61164774A - Vibration polishing machine - Google Patents

Vibration polishing machine

Info

Publication number
JPS61164774A
JPS61164774A JP86085A JP86085A JPS61164774A JP S61164774 A JPS61164774 A JP S61164774A JP 86085 A JP86085 A JP 86085A JP 86085 A JP86085 A JP 86085A JP S61164774 A JPS61164774 A JP S61164774A
Authority
JP
Japan
Prior art keywords
polishing
polishing plate
vibration
plate
torsionally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP86085A
Other languages
Japanese (ja)
Inventor
Toru Imanari
徹 今成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP86085A priority Critical patent/JPS61164774A/en
Publication of JPS61164774A publication Critical patent/JPS61164774A/en
Pending legal-status Critical Current

Links

Landscapes

  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PURPOSE:To carry out polishing with high accuracy and favorably in a short time by providing a means of vibrating a polishing plate at a high vibrating frequency with a small amplitude and making the tracks of movement of abrasive grains with respect to a workpiece during a unit time complex and longer. CONSTITUTION:The switch of an ultrasonic vibration generating device 24 is turned on, to make a vibrator 18 torsionally vibrate around an axis X with a minute amplitude, via a cord 40, a slip ring 20, etc. This torsional vibration is transmitted to a polishing plate 28 through a vibration transmitting horn 26, equally to make the end of the polishing plate 28 torsionally vibrate around the axis X with a minute amplitude of few microns. After rotating a rotary body 4 by driving a motor 14 under this condition, a plate glass (workpiece) 32 is pressed with a holder 34 and a supporting means 38 to be pushed against the polishing plate being torsionally vibrated, while feeding a polishing agent to the polishing plate 28 from a feeding pipe 26, to polish this plate glass 32 with the abrasive grains on the polishing plate 28 under ultrasonic vibration.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は平面あるいは球面を有するカメラ用レンズ等の
光学素子の研摩加工装置に関し、特に研摩皿を回転方向
と同方向に高周波振動させながら研摩加工を行う振動研
摩加工装置に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a polishing device for optical elements such as camera lenses having flat or spherical surfaces, and in particular polishing while vibrating a polishing plate at high frequency in the same direction as the rotation direction. The present invention relates to a vibration polishing device that performs processing.

〔従来の技術〕[Conventional technology]

一般にカメラ等に代表される光学機器のレンズは表面の
加工精度がその製品の優劣を決定する重要な要素の一つ
である。そして、このレンズの表面を研摩するための装
置としては、よく知られている様に、回転運動を行う研
摩皿に研摩砥粒を含む研摩剤を供給しながら被研摩物を
圧接する形式のものが使用されている。そして、最近で
は更に研摩速度を高める為に、その上に研摩皿の回転方
向に電磁弁等の手段により、数10Hz程度の低周波振
動を加えて振動砥石加工を行う装置も実用化されてきて
〜する。
In general, the processing accuracy of the surface of lenses for optical devices such as cameras is one of the important factors that determines the quality of the product. As is well known, the device for polishing the surface of this lens is of the type that presses the object to be polished while supplying an abrasive agent containing abrasive grains to a rotating polishing plate. is used. Recently, in order to further increase the polishing speed, a device has been put into practical use that performs vibratory grindstone processing by applying low frequency vibrations of about 10 Hz in the rotating direction of the polishing plate using means such as a solenoid valve. ~do.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながら、前記従来の振動研摩加工装置は研摩皿の
面振れ等の影響で被研摩物の加工面が研摩皿に面追随し
ない為、良好な研摩加工面を得ることが困難であシ、又
大型で重量のある研摩皿を含む回転体を振動させる為、
回転体軸受部の寿命が著しく損われる等の問題点があっ
た。
However, with the conventional vibration polishing apparatus, it is difficult to obtain a good polished surface because the machined surface of the object to be polished does not follow the polishing plate due to the influence of surface runout of the polishing plate, and it is also difficult to obtain a good polished surface. In order to vibrate the rotating body including the heavy polishing plate,
There were problems such as the life of the rotating body bearing being significantly shortened.

〔目的〕〔the purpose〕

本発明の目的は前記従来装置の問題点を持たない装置を
提供することにある。
An object of the present invention is to provide a device that does not have the problems of the conventional devices.

〔問題点を解決する為の手段〕[Means for solving problems]

本発明は前記目的を達成すべく、被研摩物と研摩皿とを
圧接し、該研摩皿を回転させて被研摩物を加工する研摩
加工装置において、研摩皿の回転運動方向に該研摩皿を
高周波振動させるための手段を設けてなることを特徴と
する。
In order to achieve the above-mentioned object, the present invention provides a polishing apparatus that presses an object to be polished and a polishing plate and rotates the polishing plate to process the object. It is characterized by being provided with means for causing high frequency vibration.

〔実施例〕〔Example〕

以下、本発明に係る振動研摩加工装置の実施例を図面に
基づいて具体的かつ詳細に説明する。
Embodiments of the vibration polishing apparatus according to the present invention will be described in detail below with reference to the drawings.

第0図は本発明に係る振動研摩加工装置の一実施例を示
す断面図であり、同図は特に平面ガラスの表面を研摩す
る装置の実施例である。図に示す′ 様に、振動研摩加
工装置2は円筒形状を有する回転体4と、該回転体4を
軸受6によりて軸Xのまわシに回転可能に支持する本体
8とを有する。また該回転体4の下端部には第1ベルト
車10が突設されておシ、該第1ベルト車10にはベル
ト12が掛けられてお)、該ベルト12はモータ14の
回転軸に固設された第2ベルト車16にも掛けられてい
る。この様にして回転体4はモータ14の動力によシ回
転することができる。回転体4の中には円筒形状を有す
る超音波振動子18(例えば振動周波数10〜50 k
& ) 、振動伝達ホーン26及び研摩皿28カー配置
されて〜)る。振動子18は振動伝達ホーン26とネジ
等で強固に結合されておシ、また振動伝達ホーン26は
研摩皿28とネジ等によシ強固に結合されている。振動
伝達ホーン26の外面にはフランジ30が形成されてお
シ、該フランジ30部分において振動伝達ホーン26が
回転体4に取シ付けられている。これら振動子1B、振
動伝達ホーン26及び研摩皿28は1つの振動系を形成
し、振動子18がその固有振動数で振動したときに全系
が共振状態となり、この時に研摩皿の表面が振動の腹と
なる様に設定されている。研摩皿28の上にはホルダー
34によυ保持された平面がラス32が上方から支持手
段38によシ該平面ガラス32が自転可能な様に研摩皿
28に圧接されている。36は研摩側供給管である。
FIG. 0 is a cross-sectional view showing an embodiment of a vibration polishing apparatus according to the present invention, and this figure particularly shows an embodiment of the apparatus for polishing the surface of flat glass. As shown in the figure, the vibration polishing apparatus 2 includes a rotating body 4 having a cylindrical shape, and a main body 8 that rotatably supports the rotating body 4 around an axis X by a bearing 6. Further, a first belt pulley 10 is protruded from the lower end of the rotating body 4, and a belt 12 is hung on the first belt pulley 10. It is also hung on a second belt pulley 16 that is fixedly installed. In this manner, the rotating body 4 can be rotated by the power of the motor 14. Inside the rotating body 4 is an ultrasonic transducer 18 having a cylindrical shape (for example, a vibration frequency of 10 to 50 k).
& ), a vibration transmission horn 26 and a polishing plate 28 are arranged. The vibrator 18 is firmly connected to a vibration transmission horn 26 using screws or the like, and the vibration transmission horn 26 is firmly connected to a polishing plate 28 using screws or the like. A flange 30 is formed on the outer surface of the vibration transmission horn 26, and the vibration transmission horn 26 is attached to the rotating body 4 at the flange 30 portion. These vibrator 1B, vibration transmission horn 26, and polishing plate 28 form one vibration system, and when the vibrator 18 vibrates at its natural frequency, the entire system becomes resonant, and at this time, the surface of the polishing plate vibrates. It is set to be the belly of the person. On the polishing plate 28, a flat glass 32 held by a holder 34 is pressed against the polishing plate 28 from above by a supporting means 38 so that the flat glass 32 can rotate. 36 is a polishing side supply pipe.

ここで超音波振動発生装置24で発生した電気信号の振
動子18までの伝達の方法を第0図に基づいて説明する
Here, a method of transmitting an electric signal generated by the ultrasonic vibration generator 24 to the vibrator 18 will be explained based on FIG.

第0図は第0図におけるA部分の拡大図である。FIG. 0 is an enlarged view of part A in FIG.

同図に示す如く、超音波振動発生装置24で発生した電
気信号は、本体8側に設けられたコード40・を通り、
該本体80回転体4と対向する内側の円周上に2個設け
られたリング形状を有するスリップリング20へ導かれ
る。スリップリング20に導かれた電気信号は、回転体
4に設けられた導体で構成されるブラシ42に導かれ、
更に、コード44によって振動子18に導かれる。また
1図示する様K、ブラシ42と回転体4の間にはバネ4
6が設けられて〜・る。これは回転体4が回転する際に
、ブラシ42の先端がスリ、プリング20と常時接して
、電気的に摺動接触する様に設けたものである。
As shown in the figure, the electric signal generated by the ultrasonic vibration generator 24 passes through a cord 40 provided on the main body 8 side.
The main body 80 is guided to two ring-shaped slip rings 20 provided on the inner circumference facing the rotating body 4. The electrical signal guided to the slip ring 20 is guided to a brush 42 made of a conductor provided on the rotating body 4,
Furthermore, it is guided to the vibrator 18 by a cord 44 . In addition, as shown in Figure 1, a spring 4 is connected between the brush 42 and the rotating body 4.
6 is provided. This is provided so that when the rotary body 4 rotates, the tip of the brush 42 is always in contact with the slide and pull 20 to make electrical sliding contact.

次に、上記構成を有する装置の動作を説明する。Next, the operation of the apparatus having the above configuration will be explained.

超音波振動発生装置24のスイッチを投入するとここで
発生した電気信号がコード40.スリ、プリング20.
fラン42、コード44を通シ振動子18に入る。する
と振動子18は電歪振動現象を起こし、軸Xのまわシに
微小振幅をもったねじり振動をする。この振動はネジ結
合等で結合された振動伝達ホーン26を通)、研摩皿2
8へ伝達され研摩皿28先端面も同様に軸Xのまわシに
数ミクロン種度の微小振幅をもったねじ)振動をする。
When the switch of the ultrasonic vibration generator 24 is turned on, the electric signal generated here becomes the code 40. Pickpocket, Pulling 20.
It passes through the f run 42 and the cord 44 and enters the vibrator 18. Then, the vibrator 18 causes an electrostrictive vibration phenomenon and performs torsional vibration around the axis X with a minute amplitude. This vibration is transmitted through the vibration transmission horn 26 (connected with screws, etc.) to the polishing plate 2.
8, the tip surface of the polishing plate 28 similarly vibrates around the axis X with a very small amplitude of several microns.

ここでモータ14のスイッチを投入、作動させ、振動系
を取シつけた回転体4を回転させた後、研摩側供給管3
6から研摩皿28へ研摩剤を供給しながら平面がラス3
2をホルダ34及び支持手段38で加圧し研摩皿28へ
押しつける。すると平面ガラス32は研摩皿28の周速
差により自転し、平面ガラス32と研摩皿28との間に
介在する研摩剤中の砥粒は研摩皿28の超音波振動を受
は超音波振動を起こし動きが活発になる。尚、支持手段
38を駆動して、平面ガラス32を横方向に往復運動さ
せてもよい。以上のようにして平面ガラス32の研摩加
工面の高速安定均等研摩が可能となる。尚、本実施例装
置においては振動系全体が回転体4の内部に収容されて
〜・るので、回転体4の軸受6の寿命が長くなる。□ また。前記実施例では被研摩物を平面としたが、本発明
は第0図に示す様な球面を有する研摩皿を使用すること
によシ、球面の形状を有するレンズ32′にも適用可能
である。またその場合は、同図に示す様にレンズ32′
を安定保持するホルダー34は球面方向に移動可能に設
ける。
Here, the switch of the motor 14 is turned on and operated to rotate the rotating body 4 equipped with the vibration system, and then the polishing side supply pipe 3
While supplying abrasive from 6 to the polishing plate 28, the flat surface is
2 is pressurized by the holder 34 and the support means 38 and pressed against the polishing plate 28. Then, the flat glass 32 rotates due to the difference in circumferential speed of the polishing plate 28, and the abrasive grains in the abrasive interposed between the flat glass 32 and the polishing plate 28 receive the ultrasonic vibrations of the polishing plate 28. Wake-up movements become more active. Note that the support means 38 may be driven to cause the flat glass 32 to reciprocate in the lateral direction. As described above, the polished surface of the flat glass 32 can be polished stably and uniformly at high speed. In the device of this embodiment, the entire vibration system is housed inside the rotating body 4, so the life of the bearing 6 of the rotating body 4 is extended. □ Again. In the above embodiment, the object to be polished was a flat surface, but the present invention can also be applied to a lens 32' having a spherical shape by using a polishing plate having a spherical surface as shown in FIG. . In that case, as shown in the figure, the lens 32'
A holder 34 for stably holding the is provided so as to be movable in the spherical direction.

〔発明の効果〕〔Effect of the invention〕

以上、詳細かつ具体的に説明した如く、本発明装置にお
いては、研摩皿が小さい振幅で極めて高〜・振動周波数
にて振動するので、被研摩物は研摩皿に対し良好な追随
性を示し、かつ単位時間における被研摩物に対する砥粒
の運動軌跡が複雑かつ長くなるため、高能率で良好な研
摩加工面を作ることが出来る。
As explained above in detail and concretely, in the present invention apparatus, the polishing plate vibrates with a small amplitude and at an extremely high vibration frequency, so that the object to be polished shows good followability to the polishing plate. In addition, since the locus of motion of the abrasive grains relative to the object to be polished per unit time becomes complex and long, it is possible to produce a good polished surface with high efficiency.

【図面の簡単な説明】[Brief explanation of the drawing]

第0図は本発明に係る振動研摩加工装置の一実施例を示
す断面図、第0図は第0図におけるへ部分の拡大図、第
0図は本発明に係る振動研摩加工装置の他の実施例を示
す一部省略断面図である。 2・・・振動研摩加工装置、4・・・回転体、18・・
・振動子、20・・・スリ、プリング、24・・・超音
波振動発生装置、26・・・振動伝達ホーン、28・・
・研摩皿、32・・・平面ガラス。 代理人 弁理士  山 下 穣 平 第2図 旧
Figure 0 is a sectional view showing an embodiment of the vibration polishing apparatus according to the present invention, Figure 0 is an enlarged view of the bottom part of Figure 0, and Figure 0 is another example of the vibration polishing apparatus according to the present invention. It is a partially omitted sectional view showing an example. 2... Vibration polishing processing device, 4... Rotating body, 18...
- Vibrator, 20... Pickpocket, pulling, 24... Ultrasonic vibration generator, 26... Vibration transmission horn, 28...
- Polishing plate, 32...Flat glass. Agent Patent Attorney Jo Yamashita Figure 2 Old

Claims (3)

【特許請求の範囲】[Claims] (1)被研摩物と研摩皿とを圧接し、該研摩皿を回転さ
せて被研摩物を加工する研摩加工装置において、研摩皿
の回転運動方向に該研摩皿を高周波振動させるための手
段を設けてなることを特徴とする、振動研摩加工装置。
(1) In a polishing device that presses an object to be polished and a polishing plate and processes the object by rotating the polishing plate, a means for vibrating the polishing plate at high frequency in the direction of rotational movement of the polishing plate is provided. A vibration polishing device characterized by comprising:
(2)高周波振動手段により発生される高周波の振動数
が10〜50kHzである、特許請求の範囲第(1)項
記載の振動研摩加工装置。
(2) The vibration polishing apparatus according to claim (1), wherein the frequency of the high frequency waves generated by the high frequency vibration means is 10 to 50 kHz.
(3)研摩皿と該研摩皿に結合されている高周波振動子
とが振動系を構成し、該振動系が回転体内部に収容され
ている、特許請求の範囲第(1)項記載の振動研摩加工
装置。
(3) The vibration according to claim (1), wherein the polishing plate and the high-frequency vibrator coupled to the polishing plate constitute a vibration system, and the vibration system is housed inside a rotating body. Polishing equipment.
JP86085A 1985-01-09 1985-01-09 Vibration polishing machine Pending JPS61164774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP86085A JPS61164774A (en) 1985-01-09 1985-01-09 Vibration polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP86085A JPS61164774A (en) 1985-01-09 1985-01-09 Vibration polishing machine

Publications (1)

Publication Number Publication Date
JPS61164774A true JPS61164774A (en) 1986-07-25

Family

ID=11485417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP86085A Pending JPS61164774A (en) 1985-01-09 1985-01-09 Vibration polishing machine

Country Status (1)

Country Link
JP (1) JPS61164774A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000501518A (en) * 1995-12-07 2000-02-08 リソチェンコ ヴィタリー Micro system module
JP2009034812A (en) * 2007-07-11 2009-02-19 Saichi Industries Inc Both-plane-face polishing method and both-plane-face polishing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000501518A (en) * 1995-12-07 2000-02-08 リソチェンコ ヴィタリー Micro system module
JP2009034812A (en) * 2007-07-11 2009-02-19 Saichi Industries Inc Both-plane-face polishing method and both-plane-face polishing device

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