JPS61112935A - Heat flowmeter - Google Patents
Heat flowmeterInfo
- Publication number
- JPS61112935A JPS61112935A JP23553384A JP23553384A JPS61112935A JP S61112935 A JPS61112935 A JP S61112935A JP 23553384 A JP23553384 A JP 23553384A JP 23553384 A JP23553384 A JP 23553384A JP S61112935 A JPS61112935 A JP S61112935A
- Authority
- JP
- Japan
- Prior art keywords
- heat flow
- insulating substrates
- temperature
- sensitive resistor
- thermistor elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
- G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
- G01K17/08—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
- G01K17/20—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature across a radiating surface, combined with ascertainment of the heat transmission coefficient
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は室内暖冷房装置などの熱源の発熱量を制御する
システムに利用される熱流センサ、すなわち熱流を検出
するセンサに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a heat flow sensor used in a system for controlling the calorific value of a heat source such as an indoor heating/cooling device, that is, a sensor for detecting heat flow.
従来の技術
従来の熱流センサの構成を第３図に示す。同セ２”−’
ンサは熱抵抗体１の表裏にサーモパイル２を組み込み、
さらに熱抵抗体１の温度測定用熱電対３を付加して構成
される。熱流センサが放熱面４に設置されたとき、熱抵
抗体１の表裏に温度差ΔＴが生じる。熱抵抗体１の熱伝
導率をン・、厚さをｄとすれば、熱流Ｑは原理的にＱ−
（λ／ｄ）ΔＴによって求められる。BACKGROUND OF THE INVENTION The structure of a conventional heat flow sensor is shown in FIG. The sensor incorporates thermopiles 2 on the front and back sides of the thermal resistor 1,
Further, a thermocouple 3 for measuring the temperature of the thermal resistor 1 is added. When the heat flow sensor is installed on the heat radiation surface 4, a temperature difference ΔT occurs between the front and back surfaces of the thermal resistor 1. If the thermal conductivity of the thermal resistor 1 is n and the thickness is d, the heat flow Q is theoretically Q-
It is determined by (λ/d)ΔT.
発明が解決しようとする問題点
このように従来の熱流センサでは、サーモパイル２（熱
電対を複数個直列に接続したもの）および温度測定用熱
電対３が用いられているが、熱雷対の熱起電力は１°Ｃ
あたり１〜１０μＶと小さな値である。このように従来
のものは熱流の検出感度が小さく、また、このために起
電力の検出回路が複雑で高価であるなどの問題があった
。Problems to be Solved by the Invention As described above, in the conventional heat flow sensor, a thermopile 2 (a plurality of thermocouples connected in series) and a thermocouple 3 for temperature measurement are used. The electromotive force is 1°C
This is a small value of 1 to 10 μV per unit. As described above, conventional devices have problems such as low heat flow detection sensitivity, and therefore, the electromotive force detection circuit is complicated and expensive.
発明の目的
本発明は熱流の検出感度が大きく、かつ構成が簡単で安
価な熱流センサを提供することを目的とする。OBJECTS OF THE INVENTION An object of the present invention is to provide a heat flow sensor that has high heat flow detection sensitivity, has a simple configuration, and is inexpensive.
問題点を解決するための手段
本発明の熱流センサは、平板状絶Ｉｇ ＦＩＥ基板の一
方の表面に形成された感温抵抗体膜と一対の電極膜とか
らなる第１および第２の薄）漠サーミスタ素子からなり
、第１および第２の薄膜サーミスタ素子の平板状絶縁性
基板の平板状絶縁性基板の他の表面同志を、釧ろう材で
サンドイッチされたチタニウムでろう付して構成される
。Means for Solving the Problems The heat flow sensor of the present invention comprises first and second thin films formed on one surface of a flat Ig FIE substrate and a temperature sensitive resistor film and a pair of electrode films. The thin film thermistor element is composed of a thin film thermistor element, and is constructed by brazing the other surfaces of the flat insulating substrates of the first and second thin film thermistor elements with titanium sandwiched with brazing material. .
作用
平板状絶縁性基板は、感温抵抗体膜と一対の電極膜とを
保持する基板として作用するとともに、熱抵抗体として
も作用する。第１および第２の薄膜ザーミスタ素子の平
板状絶縁性基板の他の表面同志がろう付されるので、接
着された２枚の平板状絶縁性基板が、はぼ全熱抵抗体と
して作用する。The functional flat insulating substrate functions as a substrate that holds the temperature-sensitive resistor film and the pair of electrode films, and also functions as a thermal resistor. Since the other surfaces of the flat insulating substrates of the first and second thin film thermistor elements are brazed to each other, the two bonded flat insulating substrates essentially act as a total heat resistor.
この全熱抵抗体の表裏の温度差は感温抵抗体膜によって
検出される。感温抵抗体膜の抵抗直は１°Ｃあたり１〜
１０％の割合で変化するので、熱流を感度よく検出でき
る。The temperature difference between the front and back sides of this total heat resistor is detected by a temperature sensitive resistor film. The resistance value of the temperature-sensitive resistor film is 1 to 1°C.
Since it changes at a rate of 10%, heat flow can be detected with high sensitivity.
実施例
本発明の一実施例を第１図に示す。薄膜サーミスタ素子
を２個準備する。これらの素子は、それぞれ熱抵抗体と
しての平板状絶縁性基板５．５′の一方の表面５１．６
１′に形成された（感温抵抗体膜６．６′一対の電極膜
７．７′とから構成される。平板状絶縁性基板５．５′
としてアルミナ基板を用い、感温抵抗体膜６．６′とし
てほぼ同じ抵抗温度を有するＦｅ、、Ｃ０ｌＭｎの複合
酸化物膜、ＳｉＣ膜などを用い、電極膜７．７’として
厚膜電極膜を用いた。Embodiment An embodiment of the present invention is shown in FIG. Prepare two thin film thermistor elements. These elements are each mounted on one surface 51.6 of a flat insulating substrate 5.5' serving as a thermal resistor.
1' (consisting of a temperature sensitive resistor film 6.6' and a pair of electrode films 7.7').A flat insulating substrate 5.5'
An alumina substrate is used as the temperature-sensitive resistor film 6.6', a composite oxide film of Fe, C0lMn, SiC film, etc. having almost the same resistance temperature is used as the temperature-sensitive resistor film 6.6', and a thick film electrode film is used as the electrode film 7.7'. Using.
第１の薄膜サーミスタ素子Ａの平板状絶縁性基板５の他
の表面５２と第２の薄膜サーミス素子Ｂの平板状絶縁性
基板５′の他の表面６２′との間に、銀ろう材８、でサ
ンドイッチされたＴｉ箔９を配置したのち、真空中加熱
または不活性カス中加熱により第１と第２の薄膜サーミ
スタ素子をろう付した。A silver brazing material 8 is provided between the other surface 52 of the flat insulating substrate 5 of the first thin film thermistor element A and the other surface 62' of the flat insulating substrate 5' of the second thin film thermistor element B. , and then the first and second thin film thermistor elements were brazed by heating in a vacuum or heating in an inert gas.
このようにして形成された熱流センサにおいて、第１の
薄膜サーミスタ素子Ａの感温抵抗体膜６と第２の４ｄサ
ーミスタ素子Ｂの感温抵抗体膜６′との間に１°Ｃの温
度差が生じたとき、両者の抵抗値には約６％（熱抵抗体
５．５′の温度は約３０’Ｃ）の差が観測された。両者
の抵抗値の差は、熱抵抗体６．５′の温度力月二昇する
とともに低下する傾向を示すが、熱抵抗体５．５′が約
、、’ ３０ ’Ｃになっても両者の抵抗値の差は約２
，５％を示した。このように本実施例の熱流センサは熱
抵抗体５．５′の表裏の温度差を高感度で検出できるの
で、熱流の検出感度が大きく、またその検出回路も簡単
で安１７１１ｉとなる。In the heat flow sensor formed in this way, a temperature of 1° C. When a difference occurred, a difference of about 6% (the temperature of the thermal resistor 5.5' was about 30'C) was observed in the resistance values between the two. The difference in resistance between the two tends to decrease as the temperature of the thermal resistor 6.5' increases, but even when the temperature of the thermal resistor 5.5' reaches approximately 30°C, The difference in resistance value is about 2
, 5%. As described above, the heat flow sensor of this embodiment can detect the temperature difference between the front and back surfaces of the thermal resistor 5.5' with high sensitivity, so the heat flow detection sensitivity is high, and the detection circuit thereof is simple and inexpensive.
また、本実施例の熱流センサは感温抵抗体膜６．６′を
有しているので、熱抵抗体６．６′の温度は感温抵抗体
膜６．６′の抵抗値により容易に検出できる。したがっ
て、従来の熱流センサにおける熱抵抗体１の温度測定用
熱電対３は、本実施例の熱流センサで不要である。この
ことにより本実施例の熱流センサは構成簡単となる。Further, since the heat flow sensor of this embodiment has the temperature sensitive resistor film 6.6', the temperature of the thermal resistor 6.6' can be easily determined by the resistance value of the temperature sensitive resistor film 6.6'. Can be detected. Therefore, the temperature measuring thermocouple 3 of the thermal resistor 1 in the conventional heat flow sensor is unnecessary in the heat flow sensor of this embodiment. This allows the heat flow sensor of this embodiment to have a simple configuration.
また、本実施例の熱流センサは第１と第２の４膜サーミ
スタ紫子がろう付された構成である。したがって本実施
例の熱流センサは高耐熱を有する。Further, the heat flow sensor of this embodiment has a structure in which first and second four-film thermistors are brazed together. Therefore, the heat flow sensor of this embodiment has high heat resistance.
実験的に空気中３６０〜４００ ’Ｃで長期間安定で６
・＼−７
あることが確認された。また、耐熱衝撃性にも優れる。Experimentally stable for long periods at 360-400'C in air.
・＼−7 It was confirmed that there is. It also has excellent thermal shock resistance.
空気中３６０°Ｃ４−＋室温水中の熱衝撃試験を多数回
繰り返しても、特性劣化はほとんど観測されなかった。Even when thermal shock tests were repeated many times at 360° C. in air and in water at room temperature, almost no deterioration in characteristics was observed.
また、本発明の他の実施例の熱流センサとして、第２図
に示すように、第１および第２の薄膜サーミスタ素子の
平板状綿、縁性基板５．６′の間に他の熱抵抗体１０を
配置してもよい。この熱抵抗体１０の材質、形状を適切
に選択することにより、感温抵抗体膜６．６′の間の熱
抵抗値を広い範囲にわたり任意に設定できる。したがっ
て、熱流の微少なときには熱抵抗値を大きくシ、逆に熱
流の大きなときには熱抵抗値を小さくすることにより、
゛測定すべき熱流に応じた適切な熱抵抗値を有する熱流
センサが容易に得られる。なお、熱抵抗体１０にはアル
ミナ、ムライト、ステアタイトなどのセラミック、また
は硝子が用いられ、第１図に示したと同様にして、平板
状絶縁性基板６．６′と熱抵抗体１０とがろう付される
。In addition, as a heat flow sensor according to another embodiment of the present invention, as shown in FIG. The body 10 may be arranged. By appropriately selecting the material and shape of the thermal resistor 10, the thermal resistance value between the temperature sensitive resistor films 6, 6' can be arbitrarily set over a wide range. Therefore, when the heat flow is small, the thermal resistance value is increased, and when the heat flow is large, the thermal resistance value is decreased.
``A heat flow sensor having an appropriate thermal resistance value according to the heat flow to be measured can be easily obtained. Note that the thermal resistor 10 is made of ceramic such as alumina, mullite, steatite, or glass, and the flat insulating substrate 6.6' and the thermal resistor 10 are connected in the same manner as shown in FIG. Brazed.
発明の効果 本発明の熱流センサによれば次の効果が得られる。Effect of the invention According to the heat flow sensor of the present invention, the following effects can be obtained.
（１）熱抵抗体の表裏の温度差の検出に感温抵抗体膜を
用いているので、温度差を高感度で検出できる。したが
って、熱流の検出感度が大きく、また検出回路も簡単で
安価になる。(1) Since a temperature-sensitive resistor film is used to detect the temperature difference between the front and back sides of the thermal resistor, the temperature difference can be detected with high sensitivity. Therefore, the heat flow detection sensitivity is high, and the detection circuit is simple and inexpensive.
（２）感温抵抗体膜の抵抗値により熱抵抗体の温度を容
易に検出できるので、従来の熱流センサに比べ熱抵抗体
の温度測定用熱電対を必要とせず、したがって構成が簡
素化される。(2) Since the temperature of the thermal resistor can be easily detected based on the resistance value of the temperature-sensitive resistor film, there is no need for a thermocouple for measuring the temperature of the thermal resistor compared to conventional heat flow sensors, and the configuration is therefore simplified. Ru.
（ζ３）第１と第２の薄膜サーミスタ素子とはろう付さ
れているので、本発明の熱流センサは高耐熱性、高耐熱
衝撃性など高信頼性を有する。(ζ3) Since the first and second thin film thermistor elements are brazed, the heat flow sensor of the present invention has high reliability such as high heat resistance and high thermal shock resistance.
第１図は本発明の熱流センサの実施例構成を示す断面図
、第２図は本発明の他の実施例を示す断面図、第３図は
従来の熱流センサの構成を示す所ｉｆ１図である。
５と５′・・平板状絶縁性基板、６１と６１′・平板状
絶縁性基板の一方の表面、６２と６２′・・・平板状絶
縁性基板の他の表面、６と６′−・・感温抵抗体膜、７
とγ′・・・・一対の電極膜、８ ・・・ろう材、９
・・チタニウム、１０ 他の熱抵抗体。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
―Ｙ」
？・・・ヂクニウム
第２図
二１− 「ゝ−
第３図
９ ・・チタニウム
ＩＯ・・ｐ、栃Ｉ九ネト
寸−壬、ハ０イルFig. 1 is a sectional view showing the configuration of an embodiment of the heat flow sensor of the present invention, Fig. 2 is a sectional view showing another embodiment of the present invention, and Fig. 3 is a diagram showing the structure of a conventional heat flow sensor. be. 5 and 5'... flat insulating substrate, 61 and 61', one surface of the flat insulating substrate, 62 and 62'... other surface of the flat insulating substrate, 6 and 6'--・Temperature-sensitive resistor film, 7
and γ'...pair of electrode films, 8...brazing material, 9
...Titanium, 10 other thermal resistors. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure-Y”?・・・Dicnium Figure 2 21- ``ゝ- Figure 3 9 Titanium IO...
Claims (2)
抵抗体膜と一対の電極膜とからなる第１および第２の薄
膜サーミスタ素子とからなり、第１および第２の薄膜サ
ーミスタ素子の平板状絶縁性基板の他の表面同志を、銀
ろう材でサンドイッチされたチタニウムでろう付した熱
流センサ。(1) Consisting of first and second thin film thermistor elements consisting of a temperature sensitive resistor film formed on one surface of a flat insulating substrate and a pair of electrode films, the first and second thin film thermistor elements A heat flow sensor in which the other surfaces of the element's flat insulating substrate are brazed with titanium sandwiched with silver brazing material.
縁性基板の間に熱抵抗体を配置した特許請求の範囲第１
項記載の熱流センサ。(2) Claim 1 in which a thermal resistor is arranged between the flat insulating substrates of the first and second thin film thermistor elements.
Heat flow sensor as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23553384A JPS61112935A (en) | 1984-11-08 | 1984-11-08 | Heat flowmeter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23553384A JPS61112935A (en) | 1984-11-08 | 1984-11-08 | Heat flowmeter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61112935A true JPS61112935A (en) | 1986-05-30 |
Family
ID=16987382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23553384A Pending JPS61112935A (en) | 1984-11-08 | 1984-11-08 | Heat flowmeter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61112935A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7059767B2 (en) * | 2001-04-11 | 2006-06-13 | Omron Corporation | Electronic clinical thermometer |
-
1984
- 1984-11-08 JP JP23553384A patent/JPS61112935A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7059767B2 (en) * | 2001-04-11 | 2006-06-13 | Omron Corporation | Electronic clinical thermometer |
| US7284904B2 (en) | 2001-04-11 | 2007-10-23 | Omron Corporation | Electronic clinical thermometer |
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