JPS6079405A - Controller for semiconductor manufacturing device - Google Patents

Controller for semiconductor manufacturing device

Info

Publication number
JPS6079405A
JPS6079405A JP18691183A JP18691183A JPS6079405A JP S6079405 A JPS6079405 A JP S6079405A JP 18691183 A JP18691183 A JP 18691183A JP 18691183 A JP18691183 A JP 18691183A JP S6079405 A JPS6079405 A JP S6079405A
Authority
JP
Japan
Prior art keywords
control device
processing
controller
information processing
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18691183A
Other languages
Japanese (ja)
Inventor
Atsushi Ito
温司 伊藤
Kazuhiro Shiroo
和博 城尾
Keiji Tada
多田　啓司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Sanki Engineering Co Ltd
Hitachi Ltd
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Sanki Engineering Co Ltd
Hitachi Techno Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Sanki Engineering Co Ltd, Hitachi Techno Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Sanki Engineering Co Ltd
Priority to JP18691183A priority Critical patent/JPS6079405A/en
Publication of JPS6079405A publication Critical patent/JPS6079405A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Abstract

PURPOSE:To prevent deterioration in the ability in processing and to improve extendability by providing respective process chambers with process controllers of a controller divided into plural units. CONSTITUTION:The controller is divided into an information processing controller 10, conveyance controller 20, and process controllers 30 and 31; the process controllers 30 and 31 are installed corresponding to process chambers 40 and 41. Those respective devices for information processing, etc., are connected through a communication circuit 50 using interfaces to constitute a multidrop nextwork. For example, the information processor 10 sends set data, process start signals, etc., to the conveyance controller 20 and process controllers 30 and 31 through the communication circuit 50. A display device 60, external storage device 61, and console panel 62 are connected to the information processor 10, which is connected to a host computer through the communication circuit 51. Further, those are mounted on a control board 70.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は、半導体製造装置用制御装置に係り、特にドラ
イプロセスにて基板に所定の処理を施こす半導体製造装
置に好適な半導体製造装置用制御装置に関するものであ
る。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a control device for semiconductor manufacturing equipment, and particularly to a control device for semiconductor manufacturing equipment suitable for semiconductor manufacturing equipment that performs predetermined processing on a substrate in a dry process. It is related to the device.

〔発明の背景〕[Background of the invention]

ドライプロセスにて基板に所定の処理を施こす半導体製
造装置では、次のような制御機能が必要とされる。A semiconductor manufacturing apparatus that performs predetermined processing on a substrate in a dry process requires the following control functions.

（１）処理条件データの設定と記憶、処理状態のデータ
収集と記憶、サブコンピュータの状態把握上位コンピュ
ータとの通信１表示装置・操作パネルによるマン・マシ
ン・インターフェイス等の機能（以下、情報処理機能と
略） （２）基板の搬送、基板の位置合せ、基板搬送異常検出
等の機能（以下、搬送機能と略） （３）処理プロセス制御、処理路ｒ検出、処理室内圧力
制御等の機能（以下、プロセス機能と略）従来の半導体
製造装置では、例えば、情報処理機能を有する制御袋Ｍ
（以下、情報処理装置と幅と、搬送機能並びにプロセス
機能を有する制御装置（以下、搬送・プロセス制御装置
と略）とで構成された制御装置が慣用されている。(1) Setting and storing processing condition data, collecting and storing data on processing status, grasping the status of subcomputers Communication with host computer 1 Functions such as man-machine interface using display device and operation panel (hereinafter referred to as information processing function) (2) Functions such as substrate transport, substrate alignment, and substrate transport abnormality detection (hereinafter referred to as transport function) (3) Functions such as processing process control, processing path r detection, and processing chamber pressure control ( (hereinafter abbreviated as process function) In conventional semiconductor manufacturing equipment, for example, a control bag M having an information processing function
(Hereinafter, a control device composed of an information processing device, a width, and a control device having a transport function and a process function (hereinafter abbreviated as a transport/process control device) is commonly used.

しかし、このような制御装置では、処理室の増設や基板
の搬送手順が変更された場合は、特に搬送・プロセス制
御装置の制御プログラムを全面的に変更する必要がある
と共に、より複雑な制御を行う必要がある。従って、処
理室の増設の程度や基板の搬送手順の変更の程度によっ
ては、処理能力が限界に達してしまい、これに対応する
のには更に処理能力の大きい制御装置に変更しなければ
ならない。このように、従来の制御装置は、拡張性に劣
るといった欠点があった。However, with this type of control device, if a processing chamber is added or the substrate transfer procedure is changed, it is necessary to completely change the control program of the transfer/process control device, and it is also necessary to perform more complex control. There is a need to do. Therefore, depending on the degree of expansion of the processing chamber or the degree of change in the substrate transfer procedure, the processing capacity may reach its limit, and in order to cope with this, it is necessary to change to a control device with even greater processing capacity. As described above, conventional control devices have the disadvantage of poor expandability.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、処理室が増設された場合や基板の搬送
手順の変更があった場合に制御プログラムの変更を極力
少なくし処理能力の低下を生じさせない二とで優れた拡
張性を有することができる半導体製造装置用制御装置を
提供することにある。An object of the present invention is to have excellent expandability by minimizing changes in the control program and preventing a decrease in processing capacity when a processing chamber is added or when the substrate transfer procedure is changed. An object of the present invention is to provide a control device for semiconductor manufacturing equipment that can perform the following steps.

〔発明の概要〕[Summary of the invention]

本発明は、制御装置を、情報処理装置と、搬送機能を有
する制御装置（以下、搬送制御装置と略）と、プロセス
機能を有する制御装置（以下、プロセス制御袋ｄと略）
とに分割し、該プロセス制御された場合でも、制御プロ
グラムの変更を極力少なくし処理能力の低下を生じさせ
ないようにしたものである。The present invention includes a control device including an information processing device, a control device having a transport function (hereinafter referred to as a transport control device), and a control device having a process function (hereinafter referred to as a process control bag d).
Even when the process is divided into two parts and the process is controlled, changes in the control program are minimized to prevent a decrease in processing capacity.

〔発明の実施例］ 本発明の一実施例を図面により説明する。[Embodiments of the invention] An embodiment of the present invention will be described with reference to the drawings.

図面で、制御装置は、情報処理装置１ｏと搬送制御装置
加とプロセス制御装置（資）、３１とに分割されている
。プロセス制御装置３ｔｌ　、　３１は、処理室４０　
。In the drawing, the control device is divided into an information processing device 1o, a conveyance control device and a process control device (equipment) 31. The process control device 3tl, 31 has a processing chamber 40
.

４１にそれぞれ設けられている。情報処理装置１ｏには
、例えばパーソナルコンピュータを、搬送制御装置加、
プロセス制御装置加、３１には、例えば、制御用マイク
ロコンピュータを用いている。41, respectively. The information processing device 1o includes, for example, a personal computer, a conveyance control device,
For example, a control microcomputer is used as the process control device 31.

情報処理装置１０．搬送制御装置加、プロセス制御装置
（９）、３１は１例えば、ＩＥＢＥ−４８８標準インタ
ーフエイスを用いた通信回線（資）で接続され、情報処
理装置ｌＯをメインコンピュータ、搬送制御装置加、プ
ロセス制御装置３１１　、３１をサブコンピュータとす
るマルチドロップ・ネットワークを構成している。従っ
て、情報処理袋Ｍ、　１０は通信回線（資）を介して搬
送制御装置シ加、プロセス制御装置３ｆ＋　、　３１に
設定データ、処理開始信号、処理停止信号を送り、逆に
、搬送制御装置加、プロセス制御装置３】。Information processing device 10. The transport control device and the process control device (9) and 31 are connected by a communication line using, for example, an IEBE-488 standard interface, and the information processing device IO is connected to the main computer, the transport control device and the process control device. A multi-drop network is constructed in which devices 311 and 31 serve as subcomputers. Therefore, the information processing bag M, 10 sends setting data, a process start signal, and a process stop signal to the transfer control device and the process control device 3f+, 31 via the communication line, and conversely, the information processing bag M, 10 sends setting data, a processing start signal, and a processing stop signal to the transfer control device and the process control device 3f+, 31. , process control device 3].

３１から処理状態テ゛−タ、割り込み信号等を受付ける
。又、搬送制御装置加とプロセス制御装置加。31 receives processing status data, interrupt signals, etc. Additionally, we have added conveyance control equipment and process control equipment.

３１とは５通信回線印を介してインターロック信号、処
理開始信号等のやりとりを行なう。31 and exchanges interlock signals, processing start signals, etc. via communication line mark 5.

尚、情報処理装置ｌＯには、ＣＲＴディスプレイを用い
た表示装置６０と、フロッピーディスクを用いた外部記
憶装置６１と、照光式スイッチを用いた操作パネル６２
がそれぞれ接続されると共に、上位コンピュータ（図示
省略）に接続される通信回線５１が接続されている。又
、情報処理装置ｌＯと搬送制御袋Ｍ２０と表示装置ωと
外部記憶装置６１と操作パネル６２とは制御盤７０に実
装されている。The information processing device IO includes a display device 60 using a CRT display, an external storage device 61 using a floppy disk, and an operation panel 62 using illuminated switches.
are connected to each other, and a communication line 51 connected to a host computer (not shown) is also connected. Further, the information processing device IO, the transport control bag M20, the display device ω, the external storage device 61, and the operation panel 62 are mounted on the control panel 70.

このような状態において１例えば、処理室４２が増設さ
れた場合１次のように対処される。In such a situation, for example, if the processing chamber 42 is added, the following steps will be taken.

まず、ハードウェアにおいては。First, in terms of hardware.

（１）処理室４２を制御するためのプロセス制御装置３
２と通信回線間を増設する。(1) Process control device 3 for controlling the processing chamber 42
2 and add a communication line.

（２）処理室４２に基板を搬送するのに必要な装置を制
御するため、搬送制御装置加に入出力回路を増設する。(2) In order to control the equipment necessary to transport the substrate to the processing chamber 42, an input/output circuit is added to the transport control device.

次に、制御システムのソフトウェアの変更においてｉよ
。Next, I would like to change the software of the control system.

（１）　基板の搬送箇所が追加されるため、搬送制御袋
ｗ２０のプログラムに処理室４２の基板搬送プログラム
を追加する。(1) Since a substrate transfer location is added, the substrate transfer program for the processing chamber 42 is added to the program for the transfer control bag w20.

（２）増設されたプロセス制御装置３２と通信を行うた
め、情報処理装置ｌ　１０　＋搬送制御装置１“イ加、
プロセス制御装置３１１　、３１のそれぞれに通信用プ
ログラムを追加する。(2) In order to communicate with the added process control device 32, the information processing device l 10 + transport control device 1 “I,
A communication program is added to each of the process control devices 311 and 31.

（３）　プロセス制御装置３２のプロセス処理プログラ
ムの追加をする。尚、処理室４２のプロセスが、処理室
４０　、４１のいずれかのプロセスと回シ場合は、同じ
プロセスを有する処理室を制御するプロセス制御装置の
プログラムをプロセス制御装置３２のプログラムとして
流用する。(3) Add the process processing program of the process control device 32. Note that if the process in the processing chamber 42 is the same as the process in either of the processing chambers 40 or 41, the program of the process control device that controls the processing chamber having the same process is used as the program of the process control device 32.

又、基板の搬送手順が変更された場合は、処理室が増設
された場合と異なり、ハードウェアの増設は不要で、搬
送制御装置加の制御プログラムの変更のみで対処される
。Further, when the substrate transfer procedure is changed, unlike when a processing chamber is added, there is no need to add hardware, and the change can be handled only by changing the control program of the transfer control device.

本実施例のような半導体製造装置用制御ＩＡ詔では、次
のような効果が得られる。The control IA edict for semiconductor manufacturing equipment as in this embodiment provides the following effects.

（１）　情報処理装置、搬送制御装置、プロセス制御装
置に分割し、プロセス制御装置を処理室毎に設けている
ため、処理室が増設された場合や基板の搬送手順が変更
され大場合でも、制御プログラムの変更を少なくできる
と共に、各制御装置の負担軽減により処理能力の低下を
防止でき、拡張性を優れたものにできる。(1) Since the system is divided into an information processing device, a transfer control device, and a process control device, and a process control device is installed in each processing chamber, even if the processing chamber is expanded or the substrate transfer procedure is changed significantly, Changes in the control program can be reduced, and by reducing the burden on each control device, a decrease in processing capacity can be prevented, and expandability can be improved.

（２）プロセス制御と搬送制御とを分割して独立に制御
できるため、基板の処理、搬送における無駄時間を排除
でき、スループットを向上できる。(2) Since process control and transport control can be divided and controlled independently, wasted time in processing and transporting substrates can be eliminated and throughput can be improved.

（３）　プロセス制御と搬送制御とを分割して独立に制
御できるため、処理プロセスを複雑化でき。(3) Process control and conveyance control can be separated and controlled independently, making it possible to complicate the processing process.

高精度処理を行うことができる。High precision processing can be performed.

（４）　情報処理装置の入出力点数が少なくなるため、
情報処理装置のサイズをコンパクト化できる。(4) Because the number of input/output points of the information processing device is reduced,
The size of the information processing device can be made more compact.

（５）処理室には、プロセス制御装置のみを設けるため
、全体として装置占有面積を狭鳴することができる。(5) Since only the process control device is provided in the processing chamber, the area occupied by the device as a whole can be reduced.

尚、本実施例では、情報処理装置と搬送制御装置、各プ
ロセス制御装置とからなるマルチドロップ・ネットワー
クを構成しているが、その他に、情報処ＪＩ！装置と搬
送制御装置並びに情報処理装置と各プロセス制御装置と
からなるツリーネットワークを構成しても、又」情報処
理装置と搬送制御装ａと各プロセス制御装置とからなる
ループネットワークを構成しても良い。In this embodiment, a multi-drop network consisting of an information processing device, a transport control device, and each process control device is configured, but in addition, the information processing device JI! It is possible to configure a tree network consisting of a device, a transfer control device, an information processing device, and each process control device, or to configure a loop network consisting of an information processing device, a transfer control device a, and each process control device. good.

〔発明の効果〕〔Effect of the invention〕

本発明は１以上説明したように、半導体製造装置用制御
装置を、情報処理装置と搬送制御装置とプロセス制御装
置とに分割し、該プロセス制御装置を処理室毎に設けた
ことで、制御プログラムの変更を少なくできると共に処
理能力の低下を防止できるので、拡張性を優れたものに
できる効果がある。As described above, the present invention divides a control device for semiconductor manufacturing equipment into an information processing device, a transfer control device, and a process control device, and provides the process control device for each processing chamber, thereby making it possible to program a control program. This has the effect of making it possible to improve expandability, since it is possible to reduce the number of changes and prevent a decrease in processing capacity.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は１本発明による半導体Ｖ造装Ｕ用制御装置の一実
施例を示すブロック図である。The drawing is a block diagram showing an embodiment of a control device for a semiconductor V assembly U according to the present invention.

Claims (1)

【特許請求の範囲】[Claims] １、半導体製造装置に用いられる制御装置において、前
記制御装置を情報処理装置と搬送制御装置とプロセス制
御装置とに分割し、該プロセス制御装置を前記半導体製
造装置の処理室毎に設けたことを特徴とする半導体製造
装置用制御装置。1. In a control device used in semiconductor manufacturing equipment, the control device is divided into an information processing device, a transfer control device, and a process control device, and the process control device is provided in each processing chamber of the semiconductor manufacturing device. Characteristic control device for semiconductor manufacturing equipment.
JP18691183A 1983-10-07 1983-10-07 Controller for semiconductor manufacturing device Pending JPS6079405A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18691183A JPS6079405A (en) 1983-10-07 1983-10-07 Controller for semiconductor manufacturing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18691183A JPS6079405A (en) 1983-10-07 1983-10-07 Controller for semiconductor manufacturing device

Publications (1)

Publication Number Publication Date
JPS6079405A true JPS6079405A (en) 1985-05-07

Family

ID=16196840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18691183A Pending JPS6079405A (en) 1983-10-07 1983-10-07 Controller for semiconductor manufacturing device

Country Status (1)

Country Link
JP (1) JPS6079405A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254322A (en) * 1987-03-31 1988-10-21 フード　オートメーション‐サービス　テクニックス，インコーポレイテッド Cooking computer communication system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5119293A (en) * 1974-08-06 1976-02-16 Toyoda Machine Works Ltd

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5119293A (en) * 1974-08-06 1976-02-16 Toyoda Machine Works Ltd

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254322A (en) * 1987-03-31 1988-10-21 フード　オートメーション‐サービス　テクニックス，インコーポレイテッド Cooking computer communication system

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