JPS605125U - Heater block for semiconductor device assembly - Google Patents

Heater block for semiconductor device assembly

Info

Publication number
JPS605125U
JPS605125U JP1983083749U JP8374983U JPS605125U JP S605125 U JPS605125 U JP S605125U JP 1983083749 U JP1983083749 U JP 1983083749U JP 8374983 U JP8374983 U JP 8374983U JP S605125 U JPS605125 U JP S605125U
Authority
JP
Japan
Prior art keywords
heater block
semiconductor device
device assembly
lead frame
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983083749U
Other languages
Japanese (ja)
Inventor
雄二 坂本
塩田　敏男
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP1983083749U priority Critical patent/JPS605125U/en
Publication of JPS605125U publication Critical patent/JPS605125U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のヒータブロック１０にリードフレーム２
０が載置された状態を示す説明図、第２図はこの考案の
一実施例たるヒータブロックの斜視図、第３図は第２図
に示したヒータブロック３０にリードフレーム２０を載
置した状態を示す説明図である。 ２０・・・・・・リードフレーム、２１・・・・・・リ
ード端子、３０・・・・・・ヒータブロック、３１・・
・・・・凹部。Figure 1 shows a conventional heater block 10 and a lead frame 2.
2 is a perspective view of a heater block that is an embodiment of this invention, and FIG. 3 is an explanatory diagram showing a state in which a lead frame 20 is placed on the heater block 30 shown in FIG. 2. It is an explanatory diagram showing a state. 20... Lead frame, 21... Lead terminal, 30... Heater block, 31...
・・・Concavity.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレームのリード端子に対向するヒータブロック
の表面部分に凹部を設けたことを特徴とする半導体装置
組み立て用ヒータブロック。A heater block for assembling a semiconductor device, characterized in that a recess is provided in a surface portion of the heater block facing a lead terminal of a lead frame.
JP1983083749U 1983-05-31 1983-05-31 Heater block for semiconductor device assembly Pending JPS605125U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983083749U JPS605125U (en) 1983-05-31 1983-05-31 Heater block for semiconductor device assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983083749U JPS605125U (en) 1983-05-31 1983-05-31 Heater block for semiconductor device assembly

Publications (1)

Publication Number Publication Date
JPS605125U true JPS605125U (en) 1985-01-14

Family

ID=30213708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983083749U Pending JPS605125U (en) 1983-05-31 1983-05-31 Heater block for semiconductor device assembly

Country Status (1)

Country Link
JP (1) JPS605125U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234430U (en) * 1985-08-17 1987-02-28
JPH028033U (en) * 1988-06-24 1990-01-18
JPH0252334U (en) * 1988-10-05 1990-04-16

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029793A (en) * 1973-07-21 1975-03-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029793A (en) * 1973-07-21 1975-03-25

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234430U (en) * 1985-08-17 1987-02-28
JPH028033U (en) * 1988-06-24 1990-01-18
JPH0252334U (en) * 1988-10-05 1990-04-16

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