JPS6039855A - Liquid-cooled module - Google Patents

Abstract

PURPOSE:To obtain a liquid-cooled module having an excellent cooling function by vertically dipping and receiving wiring substrates constituting the module in a sealed vessel into which a refrigerant liquid is contained while a cooling plate is positioned between the wiring substrates and forcibly cooling the wiring substrates by cooling the cooling plate. CONSTITUTION:Connector terminals 8 having airtight structure are fitted to the bottom of a sealed vessel 7, and male contacts for substrates 9 are inserted and mounted. Cooling plates 10, the outsides thereof have a porous metal and the insides thereof have hoses, are arranged amoung substrates 9 vertically disposed in parallel, and a refrigerant is circulated from an upper section. The refrigerant 11 is entered in a shape that the substrates 9 are dipped completely. The cooling plate 10 is manufactured by covering the outside of the hose 12 with the porous tabular expanded metal, and bubbles generated by boiling and the refrigerant freely pass through the cooling plate through foamy void sections 13. Since the speed of passage of bubbles slows down, a large cooling effect is generated when water is passed through the hoses 12 to cool the title module.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a forced cooling structure for a printed wiring module loaded with high density 5A.

(b) Technical background Semiconductor ICs and LSIs have become denser over the years9.
The number of structural JJZ bits in a unit element increases with age. In addition, the cost of mounting these ICs and LSIs on printed wiring boards has increased, and accordingly, 10 layers are now 1'i, and the wiring structure is made up of just a few scraps.

This is the IC1LS on the printed wiring board.
Since a large number of heating elements such as module resistors and the like are provided in addition to the semiconductor elements such as I, the printed wiring board (hereinafter referred to as the board for short) experiences a temperature increase of -1 during use.

Therefore, as a countermeasure to this problem, the substrate 4 should be made of a heat-resistant organic insulating material such as polyimide resin, or made of porcelain such as alumina to reduce the heat resistance of the substrate 4. It's increasing. - Generally, the maximum crystallization temperature for contaminated parts on 10,000 substrates is 85 (℃,
] 1iii is taken, so in order to maintain the reliability and lifetime of the parts, it is necessary to maintain the temperature within this specified temperature, and therefore cooling is required. 0 The conventional cooling method is to provide air cooling for handheld components such as ICs and LSIs (by providing heat dissipation fins on the package and using a fan (hereinafter referred to as fan)). It is common to insert the male contact part of the upper board after mounting the components into a large number of connectors that are mounted on the mount with a spacing commensurate with the mounting height of the components. By loading all the boards and blowing air using the fan provided at the F section of the mount, forced air cooling is performed by allowing air to pass through all the boards lined up in parallel. However, the mounting chromaticity of components, especially IC', LSI (1), is large and the degree of mounting is large.
C.As the number of bits constituting the LSI increases, forced ventilation will maintain the temperature of the parts within the maximum operating temperature.
I thought it was impossible and needed another method.

The liquid cooling module according to the present invention arises from the need for power.

Figure 1 shows the structure of a conventional liquid cooling module, with heat generating elements such as LSI and resistors! ? The swamped substrate 24 is placed at the bottom of a sealed container 3, and a cooling plate 5 with fins 4 is placed on the top of the container 3, into which a refrigerant 6 is placed. Now that the heating element 1 is energized, there will be no bubbles or cold air.
At the temperature of JJ, 6, the refrigerant vapor generated from the #1 liquid Jul is cooled by the cooling plate 5, liquefied, and dripped. By repeating the entire cycle, the substrate 2 including all the heating elements 1 is cooled. However, the inside of the container 30 is filled with refrigerant 6.
It is difficult to fill it with a gas tank, and if nitrogen etc. are mixed in, there is a point where the cooling NF' power decreases significantly, and it cannot be said that it is an excellent cooling structure. Nota.

(dJ Object of the Invention The object of the present invention is to provide an entire structure of a liquid cooling module with improved cooling function.

(e) Structure of the Invention The object of the present invention is to store the wiring boards that make up the entire module vertically and immerse them in a sealed container containing liquid refrigerant, and to place a cooling plate between the wiring boards. This can be achieved by using a structure in which the entire wiring board is forcibly cooled by completely cooling the cooling plate. The cooling is performed by interposing a cooling plate between the substrates.

FIG. 2 shows an embodiment of the present invention, in which a connector terminal 8 having an airtight structure is provided at the bottom of an L&I sealing device 7, and a male contact of a three-plate plate 9 is inserted into the connector terminal 8. . Next, between the substrates 9 arranged vertically and in parallel, there is a ff1t fJI board 10 with porous gold on the outside and piping inside.
are arranged, and a Ti medium (water in this example) is supplied from the top and circulated.

-JlThe refrigerant 11 is put into the refrigerant 11 in such a way that the substrate 9 is completely immersed.As a refrigerant, it is chemically stable, has no corrosive effects, and has a boiling point within +35 ('C) from Muro. It is necessary to use the liquid sound of Me9, and to satisfy this condition, C
A fluorocarbon d? expressed by the molecular formula mF*m+2 (where 1 is a positive number) There is a For example, the boiling point of CqFlt is 30 (C), eflII'+t1"! 56 (C
] Ash and non-corrosive. In addition, the cooling plate 10 is covered with a foam metal made of copper (extremely porous plate-like V) made of copper, as shown in the cross-section of FIG. 3. The air bubbles and refrigerant generated by the oven pass through it [113].The air bubbles and refrigerant pass through freely, and the passing speed of the air bubbles becomes slow, so water is passed through the flexible pipe 12. With 11 tons, it is possible to produce a much greater cooling effect than with only an energized coiled pipe.

Now, as the mining area of the agency rises, heat-generating elements IQ such as Redy LSI and resistor module will be added to the soil of board 9.
) Iy+> g Since the i+ is higher than the boiling point of 11, the heating element l is υ and 1 drop is OK, causing the generation of bubbles.

Since the collectors 1 are closely mounted on the substrates 9 arranged in a row, the air bubbles generated in the heat generating elements 1 at the lower side cause the heat generating elements 1 at the upper side to become an ion medium. It is easy to completely cut off the J concubine's touch, and at this point 6r cooling effect sound) fi, It is necessary to devise ways to avoid this.0
The cooling plate 10 according to Honkotsu J is one of these measures.
It is necessary to narrow the distance between O and the heating element 1. A further Fc effective method is to install a gas guide plate 14' between the thermal xing elements 9a arranged on the substrate 9 as shown in FIG.
It is provided perpendicularly to the substrate 9 and parallel to the bottom surface of the container, so that air bubbles 15 generated from the heat generating element 1 of the lower blade do not hit the heat generating element 1 above.S).

'if7'c'A range 15 is preferably brought into contact with the cooling cannon 10' and liquefied rapidly, and for this purpose the gas interlayer plate 14 must be brought close to the point where it almost touches the cooling &lO. φru0 to cool'i4 Temporary 10 Cooling method 2 Figure 2r - Yang Tseng of the embodiment, the entire cooling plate lO between the inlet pipe 17 provided at the top of the circulation container 7 and the inlet pipe Water is used as a cooling rope to connect the connecting pipes 12 inside, but is there a refrigerant such as Freon that can also cool at low temperatures? If used, the cooling temperature can be further lowered. In this way, all the boards are arranged vertically and a cooling plate is placed between them? Effective cooling is possible by using a structure that cools the liquid by immersing it in water.

(-Effects of the Invention The present invention was made because it is difficult to maintain component temperatures below the specified maximum operating temperature with conventional air cooling structures by high-density mounting on printed wiring boards. This makes it possible to maintain the temperature within the standard range.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional diagram of a conventional liquid-cooled module, Figure 2 is μ
What is the cross-sectional configuration diagram of the liquid cooling module according to the invention, FIG. 3?
'? FIG. 4 is a partial cross-sectional view of an embodiment equipped with a gas-conducting sheet metal. In the figure, 1 is a heating element, 2.9 is a printed wiring board,
3 and 7 are 'If column containers, 6.11 is a refrigerant, 10 is a cooling plate, 12 is a serpentine pipe, 13 is a gap, and 14 is a gas binding guide plate.

Claims (2)

[Claims] (1) A plurality of four printed wiring boards are arranged facing each other with a small distance between each other. A: As a forced cooling method for a printed wiring board mounted module in which thermal components are arranged, the wiring board is immersed and stored in a sealed container containing refrigerant liquid gold, and the wiring boards are placed between each other. A liquid cooling module characterized in that it is equipped with a cooling plate and that the cooling plate is cooled to perform forced cooling. (2) Fill the refrigerant liquid in a sealed container with a cooling plate in between, and the opposing printed wiring board will protrude parallel to the bottom of the container and reach the cooling plate. 2. A liquid cooling module according to claim 1, comprising: a liquid cooling module;