JPS6028366U - Condenser - Google Patents
CondenserInfo
- Publication number
- JPS6028366U JPS6028366U JP12099283U JP12099283U JPS6028366U JP S6028366 U JPS6028366 U JP S6028366U JP 12099283 U JP12099283 U JP 12099283U JP 12099283 U JP12099283 U JP 12099283U JP S6028366 U JPS6028366 U JP S6028366U
- Authority
- JP
- Japan
- Prior art keywords
- flat plate
- flat
- condenser
- plate portions
- hollow bodies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
1第1図iこの考案による凝縮器を備えた半導体素子冷
却装置の平面図、第2図は同じく一部切欠き側面図、第
3図は第1図の部分拡大図、第4図は第3図のIV−I
V線にそう断面図、第5図は放熱フィンの変形例を示す
第3図相当の図、第6図は放熱フィンの他の変形例を示
す横断面図である。
3・・・・・・凝縮器、7・・・・・・偏平中空体、8
,28゜38・・・・・・放熱フィン、8at 28
at 38a・・・・・・平板状部、8bt 28b
t 38bw 38c”””突出部、13・・・・・・
ガス状冷媒通路。1 Figure 1 i A plan view of a semiconductor device cooling device equipped with a condenser according to this invention, Figure 2 is a partially cutaway side view, Figure 3 is a partially enlarged view of Figure 1, and Figure 4 is a IV-I in Figure 3
5 is a view corresponding to FIG. 3 showing a modified example of the radiation fin, and FIG. 6 is a cross-sectional view showing another modified example of the radiation fin. 3... Condenser, 7... Flat hollow body, 8
,28゜38・・・Radiating fin, 8at 28
at 38a... Flat plate part, 8bt 28b
t 38bw 38c"""Protrusion, 13...
Gaseous refrigerant passage.
Claims (1)
数配置され、隣り合う偏平中空体7どうしの間にアルミ
ニウム押出型材製放熱フィン8゜28.38が介させら
れ、放熱フィン8.28゜38が、縦長の平板状部8a
v*28at 38aと、平板状部8a、28a、3
8aの両面のうち少な(ともいずれか−面に一体的に設
けられた長さ方向に伸びる複数の突出部8b、28b、
3Bbt38cとからなり、かつ平板状部8a、28a
、38aの両側縁で偏平中空体7に接合されている凝縮
器。A plurality of flat hollow bodies 7 having gaseous refrigerant passages 13 are arranged in parallel, and heat radiation fins 8.28.38 made of extruded aluminum are interposed between adjacent flat hollow bodies 7.゜38 is the vertically long flat plate portion 8a
v*28at 38a and flat plate portions 8a, 28a, 3
A plurality of protrusions 8b, 28b extending in the length direction are integrally provided on one of the two surfaces of the 8a.
3Bbt38c, and flat plate portions 8a, 28a
, 38a are joined to the flat hollow body 7 at both side edges of the condenser.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12099283U JPS6028366U (en) | 1983-08-03 | 1983-08-03 | Condenser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12099283U JPS6028366U (en) | 1983-08-03 | 1983-08-03 | Condenser |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6028366U true JPS6028366U (en) | 1985-02-26 |
JPH0412376Y2 JPH0412376Y2 (en) | 1992-03-25 |
Family
ID=30277080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12099283U Granted JPS6028366U (en) | 1983-08-03 | 1983-08-03 | Condenser |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6028366U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009528695A (en) * | 2006-03-03 | 2009-08-06 | エルジー イノテック カンパニー リミテッド | Light emitting diode package and manufacturing method thereof |
-
1983
- 1983-08-03 JP JP12099283U patent/JPS6028366U/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009528695A (en) * | 2006-03-03 | 2009-08-06 | エルジー イノテック カンパニー リミテッド | Light emitting diode package and manufacturing method thereof |
US8212274B2 (en) | 2006-03-03 | 2012-07-03 | Lg Innotek Co., Ltd. | Light-emitting diode package and manufacturing method thereof |
JP2012178581A (en) * | 2006-03-03 | 2012-09-13 | Lg Innotek Co Ltd | Light-emitting diode package |
US8796717B2 (en) | 2006-03-03 | 2014-08-05 | Lg Innotek Co., Ltd. | Light-emitting diode package and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH0412376Y2 (en) | 1992-03-25 |
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