JPS60250689A - Photographic film set unit in liquid photoresist processor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a photographic film for positioning a photographic film with respect to a liquid photoresist used for etching resist, metal resist, solder resist, etc. when exposing the liquid photoresist to light. The present invention relates to a setting device.

[Technical background of the invention]

The pattern density of current printed circuit boards is becoming higher and higher, and dry film resist is normally used to manufacture these high-density printed circuit boards due to the advantages of quality control. There are also disadvantages such as high material costs and difficulty in fully automation, and in particular, dry film for solder resist does not adhere completely to the board surface as the pattern becomes denser, causing soldering defects. Sometimes.

Therefore, there has been an active movement to use liquid photoresist for printed circuit boards in the same way as for LSI bus treatment.

For example, as shown in Japanese Patent Application Laid-Open No. 57-164595, the American chemical manufacturer W. A photographic film having a circuit pattern is placed off-contact through a very slight uniform gap, and then a parallel light beam is applied to this photographic film to expose the liquid photoresist. We have developed a printed circuit board manufacturing method that involves curing according to the pattern, then removing the uncured liquid photoresist, then removing the exposed metal by etching, and finally removing the cured photoresist.

This printed circuit board manufacturing method using liquid photoresist is
It is suitable for high-density circuit patterns, allows for complete automation of production lines, and has the advantage of low material costs.

[Problems with background technology]

However, in order to carry out this printed circuit board manufacturing method using liquid photoresist, a highly accurate resist coating device and exposure device are required. Particularly in exposure equipment, the gap between the liquid photoresist and the 4-attenuation film is required to be small and uniform over the entire surface, but there has been no conventional device that satisfactorily satisfies this requirement.

[Purpose of the invention]

An object of the present invention is to provide an apparatus that can set a photographic film against a liquid photoresist with high precision during exposure.

[Summary of the invention]

The photographic film setting device in the liquid photoresist processing apparatus of the present invention places a photographic film off-contact with a slight uniform gap on the liquid film resist uniformly coated on a substrate, and passes the liquid photoresist through the photographic film. In a liquid photo resist processing device that hardens a liquid film resist according to a pattern on a photographic film by exposing the resist to light, a locking pin is inserted into each of a plurality of stable support positions of a frame member that is moved downward by -V. A glass frame is vertically movably fitted to each of the locking pins, a glass plate for adsorbing the photographic film is integrally provided to the glass frame, and a glass plate is attached to each of the plurality of stable support positions of the glass frame. A height fine adjustment body is provided, and the lower end of each height fine adjustment body is brought into contact with the upper surface of the surface plate on which the board is positioned and supported, and the vertically moved frame member is moved from the position where it should descend and stop. Even if there is some overrun, the plurality of height fine-adjustment bodies act as stoppers and come into contact with the top surface of the surface plate, allowing the entire glass plate to be positioned at a predetermined height on the surface plate, thereby allowing the photographic film on the bottom surface of the glass plate to The slight gap between the substrate and the liquid photoresist on the substrate can be kept constant and uniform over the entire surface. Further, in the device of the present invention, a slight gap in the horizontal direction is provided at the fitting portion between the locking pin and the glass frame, and a plurality of horizontal gaps are provided on the lower surface of the glass frame that fit with the plurality of positioning portions on the surface plate side. A directional positioning part is provided, and by fitting both positioning parts, the glass frame can be positioned horizontally with respect to the surface plate, so that the substrate positioned and supported on the surface plate and the photographic film on the bottom surface of the glass plate can be aligned. Horizontal positioning between

[Embodiments of the invention]

The present invention will be described below with reference to embodiments shown in the drawings.

FIG. 1 shows a portion of a liquid photoresist processing apparatus,
One by one from a large number of stacked substrates 1 is fed onto a conveyor 2 by a transfer 1 machine (not shown), and after static electricity and dust are removed by a static eliminator 3, the substrates are transferred to a [1-ra]-tube. 4, and the liquid photoresist supplied between rollers 5 and 6 is applied to the entire surface of the substrate to a uniform thickness. This liquid photoresist is
It is an ultraviolet curable liquid resin composition (also called UV ink), and has the property of being cured by being exposed to ultraviolet light. Next, this substrate is sent through 179 to a container having an ultraviolet ray prevention cover 8 (to the B light device 10).

This exposure device 10 consists of a pre-exposure device 11, an ultraviolet ray irradiation device 12, a photographic film setting device 13, a surface plate 14 on the lower side, and a conveyor 15 that can move up and down.
The above-mentioned photographic film setting device 13 allows the above-mentioned surface plate 14 to
A photographic film having a circuit pattern (negative The liquid photoresist is then exposed to a parallel beam of ultraviolet light on the photographic film, and the liquid photoresist is cured according to the circuit pattern of the photographic film.

The board onto which the circuit pattern has been transferred in this way is sent to a developing and washing process (not shown) via a conveyor 18 having an ultraviolet protection cover 17, to remove uncured liquid photoresist, and then to a drying process. The photoresist is sent to a curing furnace for additional curing by post-exposure, then sent to an etching process to remove exposed metal, and finally remove the hardened photoresist.

The photographic film setting device 13 is shown in FIGS.
As shown in the figure, a square-shaped outer frame 23 is attached to a vertical movement guide 21 fixed at four locations on the left and right surfaces via a vertical movement bearing 22 so as to be vertically movable, and the inner end is placed at the center of the left and right sides of this outer frame 23. The left and right chains 24 connected to each other are wound around the upper left and right sprockets 25, and a balance weight 26 is provided at the outer end of the left and right chains 24. The motor 27 and the joint 28 rotate in opposite directions through the engagement of the left and right worm reducers 1i'29 and the gears 30 and 31, thereby simultaneously moving the inner end of the right chino 24 up and down, The outer frame 23 is covered up and down.

Next, as shown in FIGS. 3 and 4, sliding units 34 in the front-rear direction are provided inside the left and right portions of the outer frame 23 when viewed from the side where the photographic film is mounted.

This slide unit 34 has a slide rail slidably fitted to a guide rail fixed to the outer frame 23.Front-back drawer rails 35 are attached to the left and right slide rails, and Drawer rail 35
A rear part of a link 37 is rotatably attached to the rear part of the link 37 via a horizontal shaft 36, and a relatively front side of a photo tool 39 for holding photographic film is connected between the front parts of the links 37 on both sides via a horizontal shaft 38. The left and right sides of the tool 39 are rotatably attached to the right and left sides, and the rollers 40 that are transferred on the rail 35 are attached to the left and right sides of the relatively rear side of the tool 39, and the left and right rails 35
A stopper 4 that locks the roller 40 at a relatively front side of the
1 will be provided.

Note that rollers 42 supported by the rails 35 are also pivotally attached to the left and right side surfaces of the relatively front portions of the three photo tools, but these do not need to be rollers.

The photo tool 39 is mounted on an inversion frame 45 which is moved up and down integrally with the outer frame 23 and inverted around the front transverse axis 38, and at a plurality of stable support positions on the lower surface of the inversion frame 45. A glass frame 48 is fitted to the provided locking pin 46 through a cedar plate 47 so as to be able to move vertically, and the glass frame 48 is positioned by two positioning pins 49 and is integrally connected by a large number of locking claws 50. provided glass plate 5
1. It is made up of several kidnappings. The upper glass plate 51 adsorbs a photographic film (NECA FILM) 52 on the lower surface as shown in FIG.

The glass frame 48 is provided with a micrometer head 55 as a height fine adjustment body at each of its plurality of stable support positions, and as shown in FIG. The lower end is brought into contact with the first surface of the surface plate 14 on which the substrate 1 is positioned and supported.

Therefore, even if the reversing frame 45 slightly overruns the position where it should descend and stop due to the difficulty of controlling the motor 27, the plurality of micrometer heads 55 will come into contact with the upper surface of the surface plate 14 as a stopper, and the glass plate 51 will be The entire body can be positioned at a predetermined height on the surface plate, and thereby the distance between the photographic film 52 on the bottom surface of the glass plate 51 and the liquid photoresist 57 coated on the substrate 1 is 0.2 to 0.5 #. It is possible to maintain such a small gap 58 at all times and at uniform intervals over the entire surface.

As roughly shown in FIG. 5, the locking pin 4 of the reversing frame 45
A slight gap 61 is provided in the horizontal direction at the fitting portion between the 1-cedar board 47 of the glass frame 48 and the 1-cedar board 47 of the glass frame 48, and 1 is marked on the lower surface of the glass frame 48 as shown in FIGS. Two pins 63 as horizontal positioning portions are provided to protrude and fit into holes 62 as positioning portions at two locations on the board 14 . Then, by fitting the tapered pin tip of the pin 63 of the glass frame 48 into the hole 162 of the surface plate 14, the glass frame 48 can be accurately positioned in the horizontal direction with respect to the surface plate 14. Furthermore, as the vertical conveyor 15 shown in FIG. 1 descends, the substrate 1 is accurately positioned with respect to the surface plate 14 by fitting into two positioning pins 64 on the surface plate shown in FIG. Accordingly, the horizontal positioning of the glass frame 48, the glass plate 51, and the photographic film 52 on the lower surface of the glass plate relative to the substrate 1 can be accurately performed.

As shown in FIG. 6, the glass plate 51 has an endless groove 65 on its lower surface, and a vacuum pump is connected to an intake hole 66 formed in a part of the groove 65 through a tube (not shown). Connecting. Then, the photographic film 52 is held in close contact with the glass plate 51 by the vacuum suction effect of the groove 65.

Next, to attach the photographic film 52 to the glass plate 51, as shown in FIG. The photo tool 39 in between is pulled out from the outer frame 23 by the action of the slide units 1 to 34.
Further, when the handle 67 is pulled up, the link 31 is rotated upward around the rear horizontal shaft 36, and the photo tool 39 is rotated around the front horizontal shaft 38, which rises due to the rotation of the link 37. He is turned upside down while rotating. At this time, the rear roller 40 is moved forward along the rail 35. On this day, when the camera 40 was placed below the front transverse shaft 38 and the handle 67 was measured backward, the lower surface of the photo tool 39, that is, the lower surface of the glass plate 51, as shown in FIG. The roller 40 is turned diagonally upward so as to face the worker at a position slightly below the worker, and in this state, the roller 40 is stopped by the stopper 41. In this way, the glass plate 51 is inverted to the most suitable position for the operator to attach the photographic film 52 to the lower surface of the glass plate 51, and the operation is performed by pulling up the handle 67 while pulling it up, and then pulling it up slightly. It is easy to push backwards and has good workability.

Since the micrometer head 55 is used as a height fine adjustment member for the glass frame 48, there is an advantage that the gap between the film 52 and the liquid photoresist 57 can be adjusted and changed very easily.

Finally, although the above embodiments have been described with respect to the edge resist method, the photographic film cell 1 to apparatus of the present invention can be similarly utilized in the edge resist method or the solder resist method.

For example, in the metskiresist method, a liquid photoresist is coated on a substrate, a photographic film is placed on top of the liquid photoresist using this device, and the liquid photoresist is exposed to parallel light through the photographic film. The photoresist is removed, the exposed metal surface of the liquid resist removed area is plated with metal, the cured liquid photoresist is then removed, and the exposed metal of the hardened resist removed area is removed.

Furthermore, in the solder resist method, a liquid photoresist is applied to a substrate, a photographic film is placed on top of the liquid photoresist using this device, and the liquid resists A1 to A1 are exposed to parallel light through the photographic film and hardened. The remaining liquid photoresist is removed, and solder is applied to the exposed metal surface where the resist has been removed.

〔Effect of the invention〕

According to the present invention, the glass frame is vertically movably fitted to the locking pin provided on the vertically movable frame member, and the height fine adjustment body is provided at a plurality of stable support positions of the glass frame, so that the motor control Even if the frame member that moves up and down due to the difficulty of
By means of the height fine adjustment body, it is possible to uniformly and precisely set the small gap between the photographic film on the lower surface of the glass plate and the liquid photoresist on the substrate over the entire surface. Furthermore, the present invention provides a slight gap in the horizontal direction at the fitting portion between the locking pin and the glass frame, and a plurality of horizontal positioning portions that fit with the positioning portions on the surface plate on the lower surface of the glass frame. Since this is provided, the horizontal positioning between the substrate on the surface plate and the photographic film on the lower surface of the glass plate can also be performed with high precision by the fitting.

[Brief explanation of the drawing]

The figures relate to the photographic film cellar of the present invention. Fig. 1 is a front view showing a part of the liquid photoresist processing system, Fig. 2 is a sectional view taken along the line ■-■ of Fig. 1, and Fig. Figure 3 is a cross-sectional view of ■-■ in Figure 2, and Figure 4 is a cross-sectional view of ■-rV in Figure 3.
A line sectional view, FIG. 5 is an enlarged sectional view of a part of FIG. 4, and FIG. 6 is a perspective view of the glass plate. 1...Substrate, 14...Surface plate, 45...Frame member that moves up and down, 46...Lock pin, 48...Glass frame, 51...Glass plate, 52...Photographic film, 55...Height Micrometer head as a fine adjustment body, 57.. Liquid photoresist, 58.. Gap, 61.. Gap, 62.. Hole groove as a positioning section, 63.. Bottle as a horizontal positioning section.

Claims (1)

[Claims] 1) A photographic film is placed off-contact with a slight uniform gap on a liquid photoresist uniformly applied to a substrate, and the liquid photoresist is exposed through this photographic film. In a liquid photoresist processing device that hardens liquid photoresist according to the pattern of a photographic film, a locking pin is provided protrudingly at each of a plurality of stable support positions of a frame member that is moved up and down, and each of these locking pins is A glass frame is fitted onto the pin so as to be movable up and down, a glass plate for adsorbing the photographic film is integrally provided on the glass frame, and height fine adjustment bodies are provided at each of a plurality of stable support positions of the glass frame. A photographic film setting device for a liquid photoresist processing apparatus, characterized in that the lower end of each height fine adjustment body is brought into contact with the upper surface of a surface plate for positioning and supporting the substrate. , (2) The height fine adjustment body is a microphone [1 meter head height]
A photographic film setting device in a liquid photoresist processing apparatus according to claim 1. (3) A photographic film is placed off-contact with a slight uniform gap on the liquid photoresist that has been uniformly applied to the substrate, and the liquid photoresist is exposed through the photographic film to make the liquid photoresist photographic. In a liquid photoresist processing device that hardens according to the pattern of the film, locking pins are provided protruding from each of a plurality of stable support positions of a frame member that is moved up and down, and the glass frame can be moved up and down on each of these locking pins. A glass plate that fits into the glass frame and attracts the photographic film is integrally provided, a height fine adjustment body is provided at each of a plurality of stable support positions of the glass frame, and a lower end of each height fine adjustment body is provided. is brought into contact with the upper surface of the surface plate on which the board is positioned and supported, a slight gap is provided in the horizontal direction at the fitting part between the locking pin and the glass frame, and the above-mentioned fixed position is placed on the lower surface of the glass frame. 1. A photographic film hitting device for a liquid photoresist processing apparatus, characterized in that a plurality of horizontal positioning portions are provided that fit with a plurality of positioning portions on a board side.