JPS60189586A - Ic card carrier - Google Patents

Abstract

PURPOSE:To attain mass production of an IC card in manufacturing the IC card by using the IC card carrier which is composed of bonded IC modules on a sheet base material to which a terminal-inserting hole is provided, so that a connecting terminal will be inserted into the terminal-inserting hole. CONSTITUTION:An IC card carrier 1 is formed by bonding an IC module 3 to a sheet base material 2. A connecting terminal 5 of the module 3 is inserted into a terminal-inserting hole 4 of the sheet base material 2 and is exposed to the surface of the material 2. When an IC card carrier 1 stops at the required position, a frame 16 drops as if it were embracing the module 3 of the IC card carrier 1 and implants a resin solution comprising the card base body into a space 17 of the frame 16 from an implanting port. When the resin solution is of a thermoset resin solution type, the frame may be heated. When the solution is of a photosensitive or electron beam hardenable resin solution type, an ultraviolet ray or an electron beam may be irradiated on the resin solution. After hardening the solution in such a way, the IC card can be obtained by raising the frame 16 and punching it in the desired shape according to requirements.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to an IC card carrier used when manufacturing an IC card with an IC chip mounted or built-in.

Technical background of the invention and its problems In recent years, chip cards, memory cards, microcomputer cards, or electronic power L'fput, which are equipped with or have built-in IC chips such as microcomputers and memories, have become popular.
Demand rl-h two J, L#/II+? beat 6
1. y"1.y" T n JI Lll) research is underway.

These IC cards have a larger storage capacity than conventional magnetic stripe cards, so banks are using them to store a history of deposits and savings in place of passbooks, and credit cards are using them to store transaction history such as shopping. It is considered. Such an IC card must necessarily include connection electrodes for electrically and mechanically connecting the IC circuit to an external data processing device or the like. This connection electrode is provided either on the card surface or on the card 14 surface. The method of providing connection electrodes on the end face of the card requires the formation of a circuit pattern inside the card base material, which complicates the manufacturing process and does not allow for sufficient contact area between the electrodes and the connection terminals of the external data processing device. , which has the disadvantage of poor reliability. For this reason, I.C.
It is desirable that the connection terminals on the card be provided on the surface of the card.

IC cards with connection terminals provided on the card surface are
The chip is buried in the card base material, the IC chip is completely surrounded by the card base material, and a conductive pattern for taking out the electrodes is formed inside the base material. Heat the material to about 150℃ and heat it to 25 to 9.
It is manufactured under pressure of about /α2. However, at this time, the IC chip itself is adversely affected by the heat and pressure, and the connection between the IC chip and the circuit pattern may be severed.

For this reason, the electric elements including the IC chip and circuit pattern to be provided in the IC card are integrated into a module, and the resulting IC module is used to reduce the heat and pressure ζ applied during IC card manufacturing. A strong IC card has been proposed.

However, in order to manufacture IC cards using conventional IC modules, a recess suitable for embedding the IC module is cut out in a core material such as a PVC sheet, and each IC module is individually fitted into the recess. Since an oversheet was provided, mechanical processing of the core material such as a PVC sheet required time and effort, and the oversheet had to be aligned, so there was a drawback that it was not suitable for mass production.

On the other hand, ICs that are not manufactured by embedding a recessed IC module formed in a core material such as a PVC sheet
Cards are also proposed. This type of IC card is
Ultraviolet 11! ! A card-shaped resin obtained by curing a curable resin, a thermosetting resin, or an electron beam curable resin with ultraviolet light, heat, or electron beam, respectively, and a connecting terminal exposed on the surface of this resin. The IC module is embedded in this resin. This type of I
C cards are manufactured by pouring the aforementioned uncured liquid resin around the IC module and then curing it, so the IC module may move when the resin is injected, leading to a decrease in productivity. .

Therefore, when manufacturing the above-mentioned type of IC card, it is necessary to securely fix or temporarily fix the IC module by some method.

Purpose and Summary of the Invention The present invention aims to solve all of the drawbacks associated with the prior art as described above. They discovered that it is possible to mass produce IC cards by using an IC card carrier formed by adhering an IC module with its connecting terminal inserted into the front terminal insertion hole. This led to the creation of the present invention.

In the IC card carrier according to the present invention, a terminal insertion hole is provided in a sheet base material that becomes an oversheet when an IC card is assembled, and the connection terminal of the IC module is pushed into the terminal insertion hole. The sheet base material may be formed with a desired print as required. Further, in addition to the case where one IC module is bonded to the sheet base material, a large number of IC modules may be bonded to the sheet base material at appropriate intervals.

3. Detailed description of the invention The present invention will be explained below with reference to the drawings.

The IC card carrier 1 according to the present invention is formed by adhering a 13th layer, and the sheet base material 2 is provided with a terminal insertion hole 4, and the IC module 3 is connected to the terminal insertion hole 4. The connecting terminal 5 is inserted, and the connecting terminal 5 is exposed on the surface of the sheet base material 2. The sheet base material 2 is I
When the C card is assembled, it should become an oversheet. This sheet S material 2 may have desired printing printed thereon as required.

As the sheet base material 2, a plastic sheet such as a polyethylene terephthalate sheet, a polypropylene sheet, a vinyl chloride sheet, a polyester sheet, or a metal sheet such as a spring steel sheet is used.

In addition to the case where one IC module 3 is mounted on the sheet base material 2, a large number of IC modules 3 may be glued at appropriate intervals, which is useful when producing large quantities of IC cards. It is preferable that a large number of IC modules 3 are bonded to the sheet base material 2 at appropriate intervals.

S Note 4 (Kyot9 si T (' :F-Xi-1
-tv 3 > 1 leaf ; m It is preferable that the adhesive is used for adhesion using a polyethylene terephthalate sheet. Specifically, when a polyethylene terephthalate sheet is used as the sheet base material 2, a polyester sheet adhesive such as Stafix (
Using Fuji Photo Film Co., Ltd., film at a temperature of 150℃.
It is sufficient to press it 4 times for 5 minutes at a pressure of 100 l9/cm2.

FIG. 2 shows a cross-sectional view of an example of the IC module 3 used in an unexploded quadruplex, FIG. 3 (4) is a lower perspective view, FIG. The perspective view after the mold processing is shown. This IC module 3 is manufactured, for example, as follows. First, the thickness o,
After etching to obtain a desired pattern using a printed wiring film laminated with a thick steel sheet 6 on a glass epoxy film substrate 6 of about 200 mm thick, it is plated with nickel and gold, and electrodes for connection with the outside are formed. After forming the pattern 7 and the circuit pattern 8, they are punched out to a desired size. The connection pattern 7 and the circuit pattern 8 are electrically connected through through holes 9 at necessary locations. Then, the IC chip 10 is die-bonded at a predetermined position on the butter 78, and the electrode 11 on the IC chip 10 and the circuit pattern 8 are connected through the conductor 121 by a wire bonding method (see FIG. 3(B). )reference). This part can also be implemented by a face bonding method that does not use wires, in which case a thinner IC module can be obtained. After making the necessary connections between the IC chip 10 and the circuit pattern 8,
A botting frame 13 made of hard-purchased polyvinyl chloride material is attached to the glass epoxy film substrate 8 using an epoxy or acrylic adhesive to prevent flow during epoxy resin botting, and the epoxy resin 14 is poured and molded. (See Figure 3 (Q).

At this time, if you first cover the through hole 9 with epoxy resin that has a relatively high viscosity (about 100 PS), and after confirming that it has sufficiently hardened, pour in the epoxy resin that has a low viscosity (about IO" cps). It is possible to prevent the epoxy resin 14 for botting from coming out through the through hole 9 to the side of the connecting electrode pattern 7 which is the surface.

Although the IC module 3 for an IC card can be obtained by the method described above, each of the methods described here, including the method for forming the circuit pattern and the connection electrode pattern 7, and the method for honing the IC chip 10, teeth,
This is supported by technology in the current related industry.

Below, using the IC card carrier 1 according to the present invention,
An example of a method for manufacturing an IC card will be described.

In the following specific explanation, C refers to a type of IC card obtained by injecting a liquid resin such as ultraviolet curable resin around an IC module and then curing it. It can also be used in the production of an IC card in which an IC module is embedded in a recess formed in a material.

FIG. 4 shows an example of an apparatus used when manufacturing an IC card using the IC card carrier 1 according to the present invention, and shows an IC card carrier. And I.C.
The IC module 3 of the card carrier 1 is transferred to the conveyor 15
When the upper predetermined position is reached, it is detected by a return switch (not shown) or the like, and the conveyor 15 is stopped by the signal.

When the IC card carrier 1 stops at the predetermined position in this way, the formwork 16 located above the conveyor 15
comes down to surround the IC module 3 of the IC card gear l. This formwork 16 has a space 17 formed therein corresponding to the desired card thickness, and is also heat-sensitive, photosensitive resin liquid or 'electronic hardening'. ! ! @07 that constitutes the card base for eyebrow liquid etc.
+1 & Liquid pressure inlet 18 and outlet 19 are provided.

In addition, the formwork 16 and the IC card key/A clear l are in close contact with each other to maintain a certain level of density within the space 17 within the formwork, and
G is provided with a suction diary for suctioning the space 17 inside the formwork.

Next, in the space 17 of this formwork 16, a card: j
t-111-6/JJIdt-←'L +l-J'a
,)A=J-Koma? x) -+ It is preferable to inject the intestinal fluid while suctioning the inside of the space 17 with a suction pressure of 1 to 5 kg/cTrL.

When injecting the resin liquid into this space 17, air bubbles may be mixed into the resin liquid. By injecting one bottle into the space 1'l, it is possible to prevent air bubbles from entering.

When the resin acid is a thermosetting resin liquid [here, space 1
After injecting the resin liquid into the mold 7, the mold may be heated to harden the thermosetting resin liquid. In addition, if the resin liquid is a photosensitive or electron beam curable resin liquid, it is sufficient to inject the resin liquid into the space 17 and then irradiate the resin liquid with ultraviolet rays or electron beams. It is necessary that at least a part of 16 be formed of a material transparent to ultraviolet rays or electron beams.

An example of a thermally imageable resin is an epoxy resin.

Phenol resins, unsaturated polyester resins, etc. are used, and photosensitive resins include New Year 10 polyester resins,
An unsaturated urethane resin or the like is used, and as the electron beam curable resin, a system in which an acrylic polymer is dissolved in an acrylic monomer, an unsaturated polyester resin, or the like is used.

After the resin liquid is cured in this manner, the mold 16 is raised and then punched into a desired shape as required to obtain an IC card. In some cases, a sword (not shown) is provided to cut the IC card carrier 1 at the lower part of the formwork 16, and when the formwork 16 and the IC card carrier 1 are brought into close contact with each other, the IC card carrier 1 may be cut. may be punched out into a desired shape.

By repeating this operation, IC cards can be mass-produced efficiently.

In addition, in order to further improve the mechanical strength of the IC card obtained, an oversheet 21 may be provided on the back surface of the IC card, as shown in FIG.

Effects of the Invention In the present invention, an IC card carrier is used in which an IC module is layered on an oversheet provided with terminal insertion holes so that the connection terminals thereof are inserted into the terminal insertion holes. Because we manufacture IC cards, we have the following effects.

(a) It is possible to mass-produce IC cards extremely efficiently.

(b) It can be used to manufacture any type of IC card, and can eliminate or simplify the alignment of IC modules during manufacture.

(e) [IC module on card base material such as vinyl chloride]? :For IC cards that do not have a recess for embedding the IC module, the present invention eliminates the need to form a recess for embedding the IC module in the card base material, which simplifies the manufacturing process of the IC card. Moreover, even if the thickness of the IC module varies, no unevenness will occur on the surface of the resulting IC card, and even if the shape of the IC module changes, it can be easily accommodated.

[Brief explanation of drawings]

FIG. 1 is a sectional view of an IC card carrier according to the present invention, FIG. 2 is a sectional view of an IC module used in the present invention, and FIGS.
FIG. 4 is a cross-sectional view of an apparatus used when manufacturing an IC card using the IC card carrier according to the present invention, and FIG. FIG. 2 is a cross-sectional view of an IC card manufactured using the IC card carrier according to the invention. 1... IC card carrier, 2... Sheet base material,
3...IC module, 4...Terminal insertion hole, 5...
・Connection terminal. Applicant's agent Kiyoshi Inomata' Figure 1 Figure 2 1: l 7 e) 9 Figure 3 (A) (s) 0

Claims (1)

[Claims] An IC card carrier characterized in that an IC module is bonded to a sheet base material provided with a terminal insertion hole so that its connection terminals are inserted into the terminal insertion hole.