JPS60167414A - Semiconductor packing body - Google Patents

Abstract

PURPOSE:To minimize contamination and change in quality of the semiconductor, wafer, etc. as the materials to be packed and solve a problem of breakdown during transportation by using a particular buffer body and an accommodation bag for accommodating materials to be packed such as semiconductor and inserting them into a plastic case which is imparted with the particular performance. CONSTITUTION:A buffer material 1 is composed of a buffer material 2, for example, sponge and a heat sealing flexible covering material which perfectly covers the sponge, for example, polyethylene sheet 3. The buffer material 2 is perfectly sealed by thermally sealing the covering material 3 at the part 4. Thereby, generation of dust of buffer material 2 can be prevented perfectly. The space of buffer material 2 is filled with a dry inactive gas (for example, nitrogen). A case for packing 7 is formed with a cover 8 and a body 9. A flange type melting part 10 is provided at the edge of contact area and it is sealed after the space is filled with inactive gas such as dry nitrogen gas. The inside is perfectly insulated from the external air after said case 7 is perfectly sealed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to packages for semiconductors. More specifically, the present invention provides packaging for semiconductors, etc. that effectively protects semiconductors, their wafers, chips, etc. from contamination and deterioration due to contact with outside air, etc., and damage due to the action of external forces during storage and transportation. Regarding the body.

The resistivity of prior art semiconductors varies greatly depending on the type and amount of impurities. Therefore, semiconductor devices require crystal perfection and impurity control of the semiconductor itself.

Furthermore, with the recent development of photolithography, even greater perfection of the crystal surface is required, to the point where a mirror finish with a smoothness of 0.1 μm or less is required.

In particular, high-performance semiconductor devices require complete surface treatment, such as high-frequency transistors and epitaxial wafers that require microfabrication.

Epitaxial growth technology has recently become particularly important because it facilitates the control of impurities in semiconductors. In order to epitaxially grow a semiconductor single crystal and make a transistor into an IC, the single crystal must be cut along a specific crystal plane, and that plane must be polished to a mirror finish that is at least mirror-like for visible light. No.

Based on such demands, mirror finishing methods have changed from the classic chemical mirror finishing to polishing methods using abrasive materials such as fine-grained alumina and carborundum, and then to the latest chemical polishing materials.

The mirror surface obtained by polishing in this manner is in a highly active state and is susceptible to external factors, particularly oxygen and humidity in the air, resulting in oxidation and discoloration.

Therefore, it was necessary to take sufficient consideration to avoid deterioration during storage or transportation after production and before use.

Conventionally, they are stored in a packaging container that does not come into contact with the outside air in a clean room, and stored or transported in this state. However, this level of packaging is insufficient;
Oxidation and discoloration due to air, moisture, etc. in the packaging container cannot be avoided, and it is often necessary to perform activation treatment by etching again before use. Further, if such a package is accidentally exposed to high temperatures, the above problem becomes even more pronounced.

Also known is a method in which a semiconductor wafer is inserted into a bag made of medicine wrapper paper, or placed in a tray-shaped container and fixed from above, as described in Japanese Patent Application Laid-Open No. 51-43461 by the present applicant. However, there is still room for improvement in terms of issues such as contamination, damage during transportation, and fixation to accommodate a variety of shapes.

In fact, when the package is inserted into a bag made of paper, for example, powdered starch is generated and adhered during the packaging process, and when the package is stored in the bag, the starch granules contaminate the packaged object. Although such contamination can be partially removed by acid cleaning, it becomes a major hindrance during subsequent etching and the like.

Therefore, a large decrease in yield is expected.

Object of the Invention The object of the present invention is to avoid the drawbacks of conventional methods, namely to minimize contamination and deterioration of semiconductors, their chips, wafers, etc. as packaged objects, and to avoid problems such as damage during transportation. Another object of the present invention is to provide a novel packaging body that can be adapted to the variety of shapes of objects to be packaged.

Structure of the Invention As a result of various examinations and researches in view of the problems of the conventional method, the present inventor used a specific shock absorber and a bag body for storing objects to be packaged such as semiconductors, and developed a bag body with a specific performance. It has been found to be advantageous to place the product in a provided plastic case.

That is, the packaging body for semiconductors, their chips, and wafers according to the present invention includes a cushioning body in which the entire surface of the cushioning body is covered with a sheet or film of a heat-sealable flexible material, and a packaging body made of a heat-sealable flexible material. A bag body for storing objects to be packaged, a plastic container in which these are alternately arranged or stacked to form a parakink, an inert gas to fill the space inside the container, and an outer container to maintain an airtight state. This feature makes it possible to achieve the object of the present invention.

First, the heat-sealable flexible plastic material for covering the cushioning material used in the present invention is generally a dust-free paper, film, or sheet made of thermoplastic resin such as polyethylene or unstretched polypropylene, and is not available as a commercially available product. An example is a synthetic paper named Yupo made by Tamago Paper Manufacturing. This covering material generally completely surrounds the dust-producing cushioning material and
This is to prevent dust generation, and of course the device itself must be dust-free.

Therefore, the covering material is produced in a clean room, and the cushioning material is also sealed in the clean room.

The cushioning material used in the present invention is not particularly limited, and various types can be considered. For example, sponge, wool, cotton,
Inert gas, paper, chemical fibers, natural fibers, etc.)
Various materials such as IJ tubes can be used, and any material can be used as long as it does not cause harmful mechanical damage to the covering material or the packaged object. All of these need to be used in an anhydrous state.

Furthermore, if the coating material can be expected to have extremely low permeability, the buffer material may be air.

The cushioning material can be manufactured by, for example, cutting a heat-sealable plastic film or sheet into an appropriate size, folding it in half, or stacking two sheets or films and forming the cushioning material into a predetermined shape between them. It can be produced by sandwiching the bag and heat-sealing the opening, or by forming a heat-sealable plastic material into a bag, inserting a cushioning material into the bag, and heat-sealing the opening. In addition, spot welding at appropriate locations to prevent the cushioning material from shifting or shifting is advantageous, especially when the cushioning material is made of easily moving air, inert gas, wool, cotton, or other fibers. .

When heat-sealing the open part, replacing the air existing in the gap between the cushioning materials with an inert gas, such as dry N2 gas, avoids the negative effects of air etc. on the packaged object when the covering material is damaged. It is effective in the sense that

Therefore, for example, when the cushioning material is air or an inert gas, the gas may be sealed in a spot-welded plastic container or as discontinuous bubbles in a plastic sheet. It can be used as a buffer in the invention.

Furthermore, the shock absorber of the present invention can also have a shape in which the buffer body is attached to a frame made of plastic or the like by heat welding, and when a shock absorber having such a shape is used, when producing the package, The protection of the packaged object when external force is applied during its storage and transportation becomes even more reliable.

Furthermore, a buffer body of a predetermined shape is inserted into the plastic frame,
The cushioning body may be obtained by placing two heat-sealable flexible films or sheets one above the other and welding them together by heat-sealing or the like.

Similarly, the bag for storing semiconductor chips, etc. used in the present invention may be made of any known heat-sealable flexible plastic, such as polyethylene, polypropylene, polycarbonate, etc., and is suitable for semiconductor wafers, chips, etc. There is no restriction as long as it does not cause harmful effects.

The shape of the bag is not particularly limited, and examples include circular, rectangular, and square shapes, and combinations thereof, and can be appropriately selected depending on the shape of the object to be stored.

The inner surface of the bag is roughened, for example, by treatment with a roll having fine protrusions. This is a measure to make it easier to take in and take out the stored object by making it a point contact.

In the packaging material for semiconductor wafers and the like used in the present invention, the buffer body and the storage bag can be formed into various shapes.

According to the first aspect, the buffer body and the bag body are produced separately, and they are arranged or stacked alternately and housed in the container as described above.

Furthermore, according to another aspect, the bag body and the buffer body are alternately bonded by heat welding or the like and have a shape that can be folded, or a binding margin is provided on both of them and they are alternately stacked or arranged to form a book shape. It can be of.

Similarly, in each of the above embodiments, it is also possible to bond the bag body onto the buffer body by thermal welding or the like to integrate the bag body. It is also possible to combine an integrated cushioning body with an independent cushioning body that is not integrated. For example, it is possible to combine an integrated cushioning body with an independent cushioning body. It is also within the scope of the present invention to insert an independent buffer between individual packaging materials when folding double-sided integral packaging materials that are mutually connected with a margin. Enter.

Even in the case where the buffer body is thermally welded to the plastic fixing frame, the buffer body and the bag body can be formed separately or they can be formed integrally. In this case, it is desirable that the thickness of the frame be approximately the same as or slightly smaller than that of the buffer to prevent the semiconductor wafer or the like to be packaged from shifting. In such embodiments, an independent buffer is optionally used.

After the semiconductors, their wafers, chips, etc. are loaded into the packaging material as described above, the packaging material is placed in a predetermined container, such as a wafer tray, box, carrier, etc., which generally has a lid, and then placed in a container. The air in the space is replaced with an inert gas, such as nitrogen gas, and the container is then sealed.

The container is generally made of thermoplastic resin, and any material may be used as long as it does not generate harmful decomposition residues due to heat, light, etc. Examples include polyolefins such as polyethylene, polypropylene, and polybutylene, polystyrene, polycarbonate, and polyester. In some cases, it may also be advantageous to use a heat-resistant resin.

The container completely blocks the outside air from the packaged object and serves to prevent contamination and deterioration. The container can also be made of a light-blocking material. That is, for example, the container is coated with metal (aluminum, other nickel, tin, zinc, etc.)
It may be a plastic container or the like containing a light-shielding pigment (e.g. carbon black, white pigment, red iron oxide, etc.), which effectively prevents deterioration of the packaged object due to light and/or heat. This makes it possible to greatly improve the yield of the packaged objects in subsequent steps. However, it is essential that the materials of these containers be harmless to the packaged object, that is, inert.

The metal vapor deposition can be performed on the inner surface, outer surface, or both of the container. However, from the viewpoint of preventing contamination, it is better to deposit it on the outer surface, and it is also effective to protect the deposited layer with a polymer coach ink.

The shape and dimensions of these containers are not particularly limited, and may be various shapes such as rectangular parallelepiped, cylinder, and pyramid, and can be appropriately selected depending on the shape, dimensions, and amount of backing of the object to be packaged and the packaging material.

After the packaging material is loaded into the container, the atmosphere is replaced, and then the container is sealed. Such treatment can be performed in the following various ways or in combinations thereof.

First, sealing can be achieved by heat sealing the container itself. In this case, the container material itself is heat-sealable, and can be sealed by welding the flange portions provided at the contact portions of the lid and the container body to each other. Alternatively, methods such as sealing the contact area between the lid and the container body with an adhesive tape, heat-sealable plastic tape, etc., or covering and sealing the entire container with a heat-sealable plastic film, sheet, bag, etc., can also be used.

On the other hand, in order to fill the inside of the container with dry inert gas, the flange portion of the container, a part of the sealing covering material, etc. are removed and welded by heat sealing, and this is connected to an appropriate vacuum means to fill the inside of the container. This is done by evacuating the container, then connecting it to an inert gas source, filling the inside of the container with anhydrous inert gas until the internal pressure becomes approximately equal to the external pressure, and simultaneously stopping the supply of inert gas and heat-sealing.

According to another embodiment, the container or its sealing covering or the like is provided with two holes (or may be tubular means welded or integrally formed therewith) and the dry inert gas is introduced through one of the holes. This can be done by flowing an inert gas for a certain period of time to purge the air and moisture in the container, and then simultaneously sealing and welding the wire holes by heat sealing or the like.

Further, the inert gas used in the present invention includes nitrogen gas, rare gas, etc. (but is not limited to these gases as long as they are harmless to the packaged object. However, from an economical point of view, It is advantageous to use nitrogen gases; they must be substantially free of moisture.

The object to be packaged as intended by the present invention is a semiconductor, for example, Si.
, elemental semiconductors such as Ge, InP, 1nAs, InS
b. The power of so-called compound semiconductors such as GaP, GaAs, and GaSb, their substrates, wafers, chips, etc. (but is not limited to these, but the present invention is similar?) (Due to external factors, It can be advantageously applied to this type of zero force dJ that is easily applied, especially to mechanically fragile objects.

EXAMPLES Hereinafter, the present invention will be explained in more detail by way of examples described with reference to the accompanying drawings. However, the present invention is not limited to these Examples in any way.

FIG. 1 is a partially cutaway perspective view showing an example of a shock absorber, a bag for storing a packaged object, and an integrated product of the present invention. In Figure 1a, the buffer l is the buffer material 2.
, for example, consists of a sponge and a heat-sealable flexible covering material, such as a polyethylene sheet 3, which completely covers the surface of the sponge, and by heat-sealing the covering material 3 at the portion 4, the cushioning material 2 is completely This completely prevents the cushioning material 2 from generating dust. Further, in a preferred embodiment, the voids of the buffer material 2 are filled with dry inert gas (eg, nitrogen gas).

In addition, FIG. 1 shows the packaged objects used in the present invention, such as S
This shows an i-wafer storage bag 5, which is made of polyethylene, for example, and is closed by heat sealing at position 6, and its inner surface is roughened to protect the packaged object. It is designed to be stored with point contact,
It can be easily put in and taken out.

FIG. 1C is a diagram showing another embodiment of the buffer body in which the bag body 5 is bonded onto the buffer body 1 by heat sealing, and the reference numbers are the same as those in FIGS. 1a and 1. It is. In the illustrated example, the bag 5 is integrally welded to only one side of the buffer body 1 at a portion 6, but the bag 5 can also be provided on both sides. Further, it is also possible to perform the integration only on a part of the bag body 5, for example, only on the bottom part.

These buffer bodies 1 and bag bodies 5 are installed in a plastic container in such a way that after the objects to be packaged are inserted into the bag body 5, they are arranged alternately, that is, the objects to be packaged are separated from each other by the buffer bodies. entered.

All of these operations, as well as the fabrication of the buffer, its materials, and the bag, must be performed in a clean room to reliably prevent contamination due to contact with outside air.

FIG. 2 is a diagram schematically showing an example of a preferred embodiment of the package of the present invention with a portion removed. Here, the buffer body 1 and the bag body 5 may be those shown in FIG. These must ensure that each packaged object is separated by a buffer.

A packaging container 7 for storing these items is composed of a lid part 8 and a main body 9, and a flange-shaped welded part 10 is provided at the edge of the contact part, and after filling with an inert gas such as dry nitrogen gas, The container 7 is heat-sealed so that the container 7 is completely sealed and shut off from outside air.

Further, the welding flange portion 10 is provided with one or two heat-sealable pipe members 11, which communicate with the inside of the container 7, and are used to evacuate the inside of the container and then introduce nitrogen gas. When gas filling is completed (when the internal pressure almost matches the external pressure), it is sealed by heat sealing.

All operations up to this point are carried out in a clean room, similar to the above. Therefore, the semiconductor wafers and the like packaged in this manner are guaranteed to be contaminated and deteriorated by dust, oxygen, moisture, etc. until they are opened again in the clean room for subsequent processing.

In FIG. 2, both the lid portion 8 and the main body 9 of the storage container 7 are made of heat-sealable plastic material, and light shielding treatment is performed by vapor-depositing aluminum on the inner surface, outer surface, or both. However, from the viewpoint of contamination prevention, it is desirable to cover the surface with a polymer coach ink after vapor deposition or to vapor-deposit only the outer surface. This light-shielding treatment includes metals other than aluminum as mentioned above,
For example, nickel, zinc, tin, etc. can be used, and it is also possible to form the container 7 from a resin in which a light-shielding pigment is dispersed.

By such light shielding treatment, the semiconductor or the like as a packaged object is sufficiently protected from the effects of light, heat, etc., and the risk of deterioration due to these is significantly reduced.

FIGS. 3 and 4 show other embodiments of the package of the present invention. Here, the reference numbers in FIG. 1 and some parts that are the same as in FIG. 2 are the same. In the example of FIG. 3, the sealing of the package is ensured by a heat-sealable plastic film or seam H2; - in the embodiment of FIG. 4, by sealing with a heat-sealable plastic tape 13; .

In particular, in the example of FIG. 3, the container 7 does not have to be airtight;
It only needs to function as a mechanical support frame, and it does not need to be made of heat-sealable material.
It is also advantageous to use heat-resistant resins.

Effects of the Invention According to the packaging body for semiconductors, their wafers, chips, etc. according to the present invention, the cushioning body is composed of a cushioning material and a heat-sealable plastic film or sheet that completely surrounds the cushioning material, and the inner surface is roughened. Based on the use of a storage container that is used in combination with a treated heat-sealable plastic bag and, in some cases, that has been subjected to light-shielding treatment, it is possible that the packaged object may be exposed to the effects of dust, oxygen, moisture, etc. in the outside air. Problems such as contamination, deterioration, and breakage of semiconductor wafers, etc. can be advantageously improved, and the adverse effects of light, heat, etc. are also significantly reduced, which in turn greatly improves the yield of packaged objects in subsequent processes. Sa9. Therefore, the present invention can be said to be extremely significant in this field.

[Brief explanation of the drawing]

FIG. 1a, FIG. 11), and FIG. 1C are diagrams showing examples of preferred embodiments of a buffer body, a bag body for storing a packaged object, and a packaging material that integrates these, respectively, used in the present invention. , a and C are shown partially removed; FIG. 2 is a partially cutaway perspective view of a preferred embodiment of the package of the present invention; FIGS. 3 and 4 are FIG. 2 is a view similar to FIG. 2, showing another preferred embodiment of the package of the present invention. (Main reference numbers) 1: Buffer body, 2: Cushioning material, 3: Covering material, 4.6: Heat sealing part, 5: Bag body, 7: Container, 8: Container lid, 9: Container body, lO: Heat-sealing part, l Figure 1C

Claims (9)

[Claims] (1) A cushioning body composed of a cushioning material and a heat-sealable flexible plastic coating covering the entire surface of the cushioning material, a bag for storing the packaged object, and these cushioning bodies and the bag. A semiconductor characterized in that it is constituted by containers that are housed in an alternately arranged or stacked state, a dry inert gas that fills a space inside the containers, and a sealing means that seals the containers. , wafer, chip packaging. (2) The package according to claim 1, wherein the container is subjected to a light shielding treatment. (3) The package according to claim 2, wherein the light-shielding treatment is metal vapor deposition or compounding of a light-shielding pigment. (4) The container includes a lid and a container body, and the sealing means is a heat-sealable flange provided at a contact portion between these parts. The package according to item 1. (5) The package according to any one of claims 1 to 3, wherein the sealing means is a heat-sealable flexible plastic film, sheet, or bag. (6) The package according to any one of claims 1 to 5, wherein the buffer body and the bag body are each independent. (7) The package according to any one of claims 1 to 5, wherein the buffer body and the bag body are integrated by heat welding. (8) The package according to claim 7, wherein the buffer body and the bag body have a binding margin and are bound together with the binding margin to form a book shape. (9) The cushioning body and the bag body have a binding margin, and when the cushioning body and the bag body are combined and folded in the vertical or horizontal direction, they are arranged or overlapped alternately. A packaging body according to claim 7 characterized by: