JPS6015914A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable to attain automatic recognition and automatic production of a minute size semiconductor device by making informations of a large quantity to be held in a minute area by a method wherein dot type recesses and projections are formed at a part of the surface of an element chip to express a code according to the recesses and the projections thereof. CONSTITUTION:Element pellets 2 are formed reticulately in a semiconductor wafer 1 to form gate arrays, for example. The element pellet 2 thereof is constructed with bits 5 to indicate the kind of itself and other informations at a part of the surface formed with circuit elements 3 and electrode pads 5, etc. The bits 5 thereof consist of minute recess parts 6 formed in length and width, and arrangement of the minute recess parts 6 are differed to each other in accordance with contents of the respective informations.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a semiconductor device, and relates to a semiconductor device suitable for automatic production by automatically recognizing products within 1%.

[Background technology]

In recent years, in the field of semiconductor technology, there has been an increase in the number of high-mix, low-volume semiconductor devices such as gate arrays (master slices), while efforts are being made to automate production processes to improve productivity. For this reason, production equipment has been proposed in which the production equipment is provided with a wide variety of functions to make the equipment general-purpose, thereby making it possible to produce a wide variety of semiconductor devices with a single equipment. However, even when using this type of equipment, the operator must input into the equipment the types of semiconductor devices currently being produced. It is not possible to automatically produce this when supplying it to a device.

In order to eliminate such problems, the present inventor first attempted to automatically recognize the semiconductor type by attaching a bar code to a part of the semiconductor device and having the device automatically read the bar code. I've been considering it. However, as is well known, barcodes are large in width and length and require a large area. It is difficult to apply this to minute objects such as pellets, and the problem arises that they cannot be put to practical use in production equipment for assembling element pellets.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device that can automatically recognize the type of a device pellet as well as a packaged device, and can automatically produce the semiconductor device.

Another object of the present invention is to provide a novel identification garment capable of displaying the product type in a minute space and an automatic recognition device used therefor.

The above and other objects and novel features of the present invention include:
It will be clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief summary of typical inventions disclosed in this application is as follows.

In other words, dot-like depressions and protrusions are formed on a part of one surface.

By configuring the code to be displayed using these concavities and convexities, a large amount of information can be stored in a small area, which enables automatic recognition and automatic production of micro/J% sized semiconductor devices such as element pellets. The aim is to achieve improvements in productivity.

〔Example〕

1 and 2 show one embodiment of the present invention.

This is an example in which the present invention is applied to a semiconductor element pellet.

That is, FIG. 1 shows a semiconductor wafer 1 in which element pellets 2 are formed in a grid pattern, forming, for example, a gate array. The element pellet 2 has a bit 5 indicating its own type and other information on a part of the surface on which the circuit element 3, electrode pad 4, etc. are formed. As shown in FIG. 2, this bit 5 is formed vertically and horizontally and consists of one minute recess 6, and the arrangement of the minute recesses 6 is varied depending on the content of each piece of information.

FIG. 3 shows a device for forming said bit 5 and reading it. As shown in the figure, this device has a laser beam generating section 12 consisting of a laser generator 10 and a lens system 11, and a laser beam 14 reflected by a prism 13 is directed onto a writing position 16 by an imaging lens system 15. It is possible to form an image on the surface of the element 2A. This imaging lens system 15 can be scanned in the X and Y directions by an actuator 17 to minutely change the imaging position, and by this scanning and the timing operation of the laser beam generating section 12, laser energy can be used to locate the desired position. A bit 5 consisting of recesses 6 in a predetermined arrangement is formed by baking recesses 6 on the pellet surface.
can be formed.

On the other hand, two semi-transparent prisms 18 and 19 are arranged in front of the laser beam generating section 12, and one of the prisms 19
By arranging the objective lens 20 facing each other, the recognition Flt
Beret 2B set to fc (read) position 21
A laser beam is projected onto pit 5 of table 1m. The other prism 18 is provided with a lens 22 and a photodetector 23 such as a CCD, which receives the reflected light from the bit 5 and determines 50 pits (the arrangement of the recesses 6) based on the difference in the reflected light. detection. This photodetector 23 is connected to a control circuit 24, and the laser generator 10 and actuator 17 are connected to this control circuit 24 to exchange signals with each other. Furthermore, this control circuit 24 is configured to send a signal to a control circuit 26 for the next process via an automatic recognition section 25.

According to the above structure, normally, at the same time as forming each element pellet 2 on the semiconductor wafer 1, the bits 5 in the required arrangement of 6 concave portions are formed on each pellet 2 using etching technology. Then, when separating each pellet by tericing and assembling each pellet individually, each pellet is recognized at the position 2.
1, and the laser beam from the laser beam generator 12 is projected onto the bit 5 via the prism 18, 19 and objective lens 20. At the same time, the reflected light passes through a prism 18° lens 22 and forms an image on a photodetector 23.

The photodetector 23 detects the light reflectance of each concave portion 6 of the bit 5 in a scanning manner, and detects the arrangement of the concave portions 6 from the difference in the reflectance. Then, the control circuit 24 converts the presence or absence of each recess into a binary signal, detects this as a digital signal representing one pit, and reads the information entered into the pit 5 from this, and the automatic recognition section 25 identifies the product type, etc. recognize. Therefore, based on this recognition result pressure, the control circuit 2 of the next process
If a recognition signal is sent to 6, assembly work can be automatically performed according to the type of pellet. This results in
The same function as a conventional barcode can be performed using pits with a minute area, and automatic recognition and automatic production of minute semiconductor devices such as pellets become possible.

Furthermore, in the above embodiment, new information (
For example, if you want to add inspection information (inspection information) to the pit 5, place the pellet 2 at the writing position 16 on the left side of the figure, and place the prism 13 and imaging lens system 15 in the margin of the focus space.
Then, the actuator 17 projects a laser beam as a spot. As a result, the laser beam projection section is burnt out, a new recess is formed there, and the amount of information about focus is increased.

Here, instead of moving the actuator 17 in X and Y directions, the stage that supports the pellet may be moved in X and Y directions. Further, the recess 6 constituting the pit 5 is formed by a pellet 20.
They may be arranged in a straight line along the sides.

〔effect〕

(1) By forming pits consisting of an array of minute concavities and convexities on the surface of a semiconductor device, and by optically detecting this concave and convex array, it is possible to read digitized information. Even small semiconductor devices can retain information such as product type, and automatic recognition and production can be performed using this information.

(21) By projecting a laser beam onto the margins of a semiconductor device to form concavities and convexities, information can be added to the pits, making it possible to advantageously perform automatic recognition and automatic assembly of the semiconductor device.

(3) It is also possible to form pits (write information) using a part of the reading device that uses a laser beam, and it is possible to simplify the configuration of the automatic recognition device and the entire production device.

(4) Since a laser beam is used, by utilizing the narrow luminous flux of the laser beam, the amount of information can be increased compared to using normal light, and the space used for it can also be reduced.

Although the invention made by the present inventor has been specifically explained above based on examples, it goes without saying that the present invention is not limited to the above examples and can be modified in various ways without departing from the gist thereof. Nor. For example, a relative convex portion may be used instead of a one-point concave portion. Further, it is also possible to form one of the pellets as a pit 5A as shown in FIG. 1 to perform recognition of one wave unit, and furthermore, as shown in FIG. 5B may be formed.

Furthermore, the configuration of the reading device can be modified in various ways.

[Application field]

In the above description, the invention made by the present inventor is mainly applied to an element pellet such as a gate array, which is the background field of application of the invention, but the invention is not limited thereto.

It can be applied to various products such as transistors and diodes.

[Brief explanation of the drawing]

FIG. 1 is an overall view of a semiconductor wafer to which the present invention is applied. FIG. 2 is an enlarged plan view of the element pellet. FIG. 3 is an overall configuration diagram of the reading device (writing device). FIG. 4 is a perspective view of essential parts of another embodiment. DESCRIPTION OF SYMBOLS 1... Semiconductor wafer, 2, 2A, 2B... Bullet, 5, 5A, 5B... Focus, 6... Recessed part, 7...
...Semiconductor device, 10...Laser generator, 15...
Imaging lens system, 16... Writing position, 17... Actuator, 20... Objective lens, 21... Recognition (reading) position, 22... Lens, 23 peak photodetector, 24 peak control Circuit, 25... Automatic recognition section, 26...
Control circuit for the next process. ”\ ・′1.)

Claims (1)

[Scope of Claims] 1. A bit consisting of concave and convex portions encoding the type and other information of the semiconductor device is formed on a part of the surface of the semiconductor device after completion of the element pellet or pancage. Semiconductor equipment. 2. The semiconductor device according to claim 1, wherein the bits are formed in a desired arrangement of minute dot-shaped recesses. 3. The semiconductor device according to claim 1 or 2, wherein the semiconductor device is configured to project a laser beam onto the bit and detect and observe the arrangement of the recesses from the opposite state.