JPS60107898A - Cooling structure of electronic device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a cooling structure for electronic equipment, and particularly to a cooling structure for electronic equipment using an outside air circulation method.

[Background of the invention]

In electronic devices, heat generation in device units is an unavoidable problem, and how to suppress the temperature rise inside the device due to heat generation greatly affects the reliability of the device.

FIG. 1 is an external view of a conventional small electronic device.

In this type of equipment, other equipment is placed closely on both sides, and there is a high possibility that documents, etc. are placed on the top surface, so the air intake used to cool the inside of the equipment,
The installation location of the outlet is limited to the front, rear, and bottom of one device. Furthermore, since discharging the heated exhaust gas from the front causes discomfort to the operator and is undesirable, the discharge port is usually provided at the rear. Therefore, in order to lengthen the circulation path of cooling air inside the equipment and increase the cooling effect, the air intake 2
is provided on the front door l.

However, if the air intake port 2 is provided on the front door 1, the aesthetic appearance is spoiled, so as shown in FIG. 2, devices have also appeared in which the air intake port 5 is provided on the bottom surface.

Note that 6 is a cooling fan, 23 is an air outlet, 24 is an equipment unit, and arrows indicate air circulation paths.

Incidentally, recently, there has been an increase in the number of electronic devices in which the electronic device housing is divided vertically into a plurality of parts, and a heating element is disposed on each divided floor. - FIGS. 3 and 4 are sectional views showing a conventional small disk device with a two-story structure.

The electronic device housing is divided into a first floor and a second floor by a partition plate 7, and a power supply section 3 is disposed on the first floor and a disk unit 4 is disposed on the second floor. Since both the power supply section 3 on the first floor and the disk unit 4 on the second floor are heat generating bodies, it is necessary to provide cooling means on both the first and second floors.

As the cooling means, the examples shown in FIG. 3 and FIG.
Cooling fans 6 are provided separately for the power supply unit 3 on the first floor and the disk unit 4 on the second floor.

However, in FIG. 3, the air intake port 5 is provided only on the lower surface of the first floor, and air to the second floor is taken in through a vent hole 8 provided in the partition plate 7. In addition, the discharge port 9 is located at the rear of the second floor.
Only one is provided. For this reason, cooling air from outside the equipment is directly blown onto the power supply section 3 on the first floor by the cooling fan 6, which has a great cooling effect, but the cooling air on the second floor is used for cooling on the first floor and warmed up. Since the air that has been removed is sent in, the cooling effect on the disk units 4 on the second floor is impaired.

In addition, in FIG. 4, the cooling air for the first floor and the second floor is taken in separately through the air intake port 5 provided on the bottom surface of the equipment and the air intake port ■o provided on the front SL, respectively. Since the air is discharged separately from the exhaust ports 11 and 12 provided at the rear, the cooling effect is not impaired on the first and second floors, but the air intake port 10 on the second floor is provided on the front door 1. It spoils the beauty. Another disadvantage is that the noise generated by the plurality of cooling fans 6 and disk units 4 is radiated toward the operator at the front of the equipment through the air intake port 1.0 on the second floor.

[Purpose of the invention]

The purpose of the present invention is to eliminate the above-mentioned drawbacks of the prior art, and to improve the cooling effect equally on each floor in electronic equipment having heating elements on multiple floors, without impairing the aesthetic appearance or emitting noise. The objective is to provide a cooling structure for electronic equipment.

[Summary of the invention]

In order to achieve the above object, the present invention includes a door that covers the front;
It has a plurality of floors divided into upper and lower sections, and all of the plurality of floors,
Alternatively, in an electronic device housing having a heating element in a part thereof, an air intake port is provided on the lower surface of the door, and an air flow path leading from the air intake port to the plurality of floors is formed in the door. There is.

[Embodiments of the invention]

An embodiment of the present invention will be described below based on the drawings.

FIG. 5 is a sectional view of an embodiment of the present invention applied to a small disk device.

The small disk device is divided into two floors (upper and lower) by a partition plate 7.
The first and second floors are separated from each other. The power supply section 3 of the device is arranged on the first floor, and the disk unit 4 is arranged on the second floor, and cooling fans 6 are individually attached to them. Additionally, the first and second floors are each provided with their own outlets 11 and 12.

The cooling air to be supplied to the first floor is taken in from the air intake port 5 provided on the bottom of the device as shown by the arrow, and is blown onto the power supply unit 3 by the cooling fan 6. After cooling the power supply unit 3, It is discharged from the discharge port 11 on the first floor. Power supply section 3
generates more heat than other units, but the power supply section 3
The cooling air intake port 5 for cooling is provided on the bottom of the device, so there is no need to worry about aesthetics or air intake noise.
The air intake port 5 can be relatively large, and even if the amount of heat generated is large, a corresponding cooling effect can be obtained.

Cooling air for cooling the disk units 4 on the second floor is taken in through an opening 13 made in the lower surface of a door 1 for maintenance and inspection attached to the front of the device. The cooling air passes through an air flow path 14 formed in the door 1, and is passed through a delivery opening I provided at a position corresponding to the cooling fan 6 on the second floor.
5 flows into the second floor. The cooling air flowing into the second floor is
The air is blown onto the disk unit 4 by the fan 6 and discharged to the outside from the outlet 12.

In this example, the first floor and second floor are completely shut off, and cooling air is taken in separately for each floor, so that the warmed air used for cooling on the first floor is used as cooling air for the second floor. Since this configuration with poor cooling efficiency has been eliminated, the cooling effect on the second floor will not be impaired. In addition, the air intake and exhaust ports should be placed on the bottom of the device, which is difficult for the operator to see.
And since it is placed at the rear of the device, it does not spoil the aesthetics.

Furthermore, since the airflow passage is formed within the door, it does not interfere with maintenance and inspection.

Next, the airflow passage 14 inside the door 1 will be explained using FIGS. 6 and 7.

FIG. 6 is an exploded view showing one embodiment of the door l shown in FIG. 5. An opening 13 for intake of cooling air is provided on the lower surface of the frame 16 for the door 1, and a partition material 17.1 is provided above the opening 13.
It is surrounded by 8. An exterior plate 19 (the part indicated by hatching in the figure) whose surface has been aesthetically treated is attached to one side of the frame 16. When the back plate 21 provided with the delivery opening 20 is attached to the frame 16, the opening 1
3 as an inlet and a delivery opening 20 as an outlet.
is formed. Note that the size of the opening 13 is increased or decreased depending on the amount of cooling air required.

Further, the positions of the partition material 18 and the delivery opening 20 are 2
Needless to say, this corresponds to the position of the cooling fan 6 on the floor.

FIG. 7 is an exploded view showing another embodiment of the door 1 shown in FIG.

As in the previous embodiment, an aesthetically treated exterior plate 19 is attached to one side of the frame 16.

Instead of providing the partition members 17 and 18 as in the previous example, a plate-shaped foamed polymer material 22 having sound absorbing properties is fitted into the frame 16, with a portion that will become an air flow path cut out in advance. By sealing this with a back plate 21 having a delivery opening 20, an air flow passage 14 is formed.

In this case, it is lighter than the sheet metal structure shown in FIG. Furthermore, because of its simple structure, it can be manufactured at low cost. In addition, the inside of the door other than the air flow passage 14 is made of sound absorbing material (foamed polymer material 2
2), a sound insulation effect is produced, and the foamable polymer material 22 suppresses the vibration of the door l itself, thereby preventing the generation of vibration noise.

Although the embodiment described above was an electronic device with a two-story configuration,
The present invention is not limited to this, but can also be applied to electronic equipment with a multi-story structure of two or more floors. In this case, it is necessary to provide a delivery opening for each floor (which may be limited to floors that require cooling). Further, the air flow passage does not have to have a uniform size between the lower floor and the upper floor, and may have a shape that becomes smaller toward the upper floor, for example.

〔Effect of the invention〕

As explained above, according to the cooling structure for electronic equipment according to the present invention, an air intake port is provided on the lower surface of the door, and an air flow passageway communicating with a plurality of floors from the air intake port is formed in the door. By doing so, it is possible to improve the cooling effect equally on each floor without spoiling the aesthetics or emitting noise.

[Brief explanation of drawings]

Figure 1 is an external view of an electronic device using a conventional cooling structure, Figure 2 is a sectional view of Figure 1, and Figures 3 and 4 are cross sections showing a conventional cooling structure for electronic equipment with a two-story configuration. 5 are sectional views showing a cooling structure for an electronic device according to an embodiment of the present invention, and FIGS. 6 and 7 are exploded views showing different embodiments of the door shown in FIG. 5, respectively. ■ = door, 5: air intake, 6: cooling fan, 7: partition plate, 11.12: discharge port, 13: opening, 14: air flow path, 15: delivery opening. Figure 1 Figure 2 Figure 3 Figure 4

Claims (2)

[Claims] (1) In an electronic device case that has a door covering the front and a plurality of floors partitioned vertically, and a heating element in all or part of the plurality of floors, an air intake is provided on the bottom surface of the door. 1. A cooling structure for electronic equipment, characterized in that an air flow path communicating from the air intake port to the plurality of floors is formed in the door. (2) The electronic device according to claim 1, wherein the air flow path is formed by cutting out a part of a sound-absorbing member filled in the door. Equipment cooling structure.