JPS5978584A - Light emitting diode sheet and manufacturing device therefor - Google Patents
Light emitting diode sheet and manufacturing device thereforInfo
- Publication number
- JPS5978584A JPS5978584A JP57189809A JP18980982A JPS5978584A JP S5978584 A JPS5978584 A JP S5978584A JP 57189809 A JP57189809 A JP 57189809A JP 18980982 A JP18980982 A JP 18980982A JP S5978584 A JPS5978584 A JP S5978584A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- sheet
- emitting diode
- emitting diodes
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 238000009413 insulation Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract 1
- 238000004804 winding Methods 0.000 description 3
- 241000669003 Aspidiotus destructor Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は絶縁シート上に多数の発光ダイオードを配列し
た発光ダイオードとその製造装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a light emitting diode in which a large number of light emitting diodes are arranged on an insulating sheet, and an apparatus for manufacturing the same.
第１図は発光ダイオードによりパーグラフを表示する表
示装置を示すもので、図中１・・・は発光ダイオードで
ある。これらの発光ダイオ−トド・・はセラミックまた
はエポキシ樹脂等よりなる絶縁基板２上に一列に配列さ
れている。またこれらの発光ダイオ−トド・・は第２図
に示す如くワイヤボンディング３・・・により順次接続
されるとともに、それぞれがワイヤボンディング３・・
・により絶縁基板２上の端子４・・・に接続されている
。そしてそれらの発光ダイオ−トド・・上には透光性の
目盛板５がはり付けである。そこで、始端位置および任
意位置の発光ダイオード１゜１に対応する２つの端子４
，４闇に所定の電圧を印加することによりその闇のすべ
ての発光ダイオードト・・が発光し、パーグラフ表示が
なされることになる。FIG. 1 shows a display device that displays a par graph using light emitting diodes, and in the figure, numerals 1, . . . indicate light emitting diodes. These light emitting diodes are arranged in a line on an insulating substrate 2 made of ceramic or epoxy resin. In addition, these light emitting diodes... are sequentially connected by wire bonding 3... as shown in FIG.
・It is connected to the terminal 4 on the insulating substrate 2 by. A transparent scale plate 5 is pasted onto these light emitting diodes. Therefore, two terminals 4 corresponding to the light emitting diode 1°1 at the starting position and at an arbitrary position are connected.
, 4 By applying a predetermined voltage to the darkness, all the light emitting diodes in the darkness will emit light, and a pergraph display will be made.
ところで、このような表示装置を作成するにあたっては
、発光ダイオ−トド・・全絶縁基板２に直接取付けたの
ち、それら全ワイヤボンディング３により接続していた
ため、作成には手間がかかり、特に、少量生産の場合は
コスト高となる不具合がめった。By the way, in creating such a display device, the light emitting diodes were directly attached to the fully insulated substrate 2, and then all of them were connected by wire bonding 3, so it was time-consuming to create, especially in small quantities. In the case of production, defects that led to high costs were common.
また、パーグラフに限らず、発光ダイオードの配列によ
って、文字、図形等を任意に表示することができるが、
いずれの場合にも上記の不具合が生じていた。In addition, not only pergraphs but also characters, figures, etc. can be displayed arbitrarily by arrangement of light emitting diodes.
In either case, the above-mentioned problem occurred.
そこで第１の発明は、発光ダイオードを用いて文字、図
形その他の表示を行なう載承装置等全容易かつ安価に作
成するための発光ダイオードシート全提供すること全目
的とする。Therefore, the object of the first invention is to provide a light emitting diode sheet for easily and inexpensively producing a mounting device for displaying characters, figures, and other information using light emitting diodes.
まｆｃ第２の発明は、そのような発光ダイオードシート
を容易かつ安価に製造できる製慎装置會提供することを
目的とする。The object of the second invention is to provide a slicing device that can easily and inexpensively manufacture such a light emitting diode sheet.
第１の発明に係る発光ダイオードシートは、可撓性會有
する絶縁シート上に複数の発光ダイオード？配列し、そ
れらを順次接続してその上から透光性の絶縁コーティン
グを施してなるものである。The light emitting diode sheet according to the first invention includes a plurality of light emitting diodes on an insulating sheet having flexibility. They are arranged, connected in sequence, and then coated with a transparent insulating coating.
そこで、この発光ダイオードシートを任意の大きさに切
って基板面にはり付けるだけで表示装置！’に容易かつ
安価に作成することができる。Therefore, you can create a display by simply cutting this light emitting diode sheet to any size and gluing it to the board surface! 'Can be easily and inexpensively created.
また第２の発明に係る製造装置は、テープ状の絶縁シー
ト全供給リールより引出して発光ダイオードの供給、ワ
イヤボンディングによる接続および透光性の絶縁コーテ
ィングを順次施して巻取リールに巻取るように構成され
ている。Further, the manufacturing apparatus according to the second invention is configured to pull out the tape-shaped insulating sheet from the entire supply reel, supply the light emitting diodes, connect it by wire bonding, and sequentially apply a transparent insulating coating, and then wind it onto the take-up reel. It is configured.
したがって、テープ状の発光ダイオードシート全連続的
に、容易かつ安価に製造することができるものである。Therefore, the tape-shaped light emitting diode sheet can be manufactured completely continuously easily and inexpensively.
まず第１０発明を、実施例にもとづいて説明する。 First, the tenth invention will be explained based on an example.
第３図ないし第５図は、その一実施例における発光ダイ
オードシート１０ｆ示すもので、図中１１は可撓性を有
するテープ状の絶縁シート、１２・・・はこの絶縁シー
ト１１上に一列に配列された発光ダイオードである。そ
してこれらの発光ダイオード１２・・・はワイヤボンデ
ィング１３・・・により順次接続されるとともに、シー
ト１１の一側縁に設けられた端子１４・・・にそれぞれ
ワイヤボンディング１３・・・により接続されている。3 to 5 show a light emitting diode sheet 10f in one embodiment. In the figures, 11 is a flexible tape-shaped insulating sheet, and 12... are arranged in a row on this insulating sheet 11. It is an array of light emitting diodes. These light emitting diodes 12... are sequentially connected by wire bonding 13..., and are also connected to terminals 14... provided on one side edge of the sheet 11 by wire bonding 13... There is.
また第４図に示す如くそれらの発光ダイオード１２・・
・の上から透光性の絶縁コーチ−ｆフグ１５を施しであ
る。そしてこのような構成の発光ダイオードシートＬＡ
は第５図に示す如くリール１６に巻装されている。In addition, as shown in FIG. 4, those light emitting diodes 12...
・A translucent insulation coach-f puffer 15 is applied from above. And a light emitting diode sheet LA with such a configuration
is wound on a reel 16 as shown in FIG.
そこで、このように構成された発光ダイオードシート１
０ｆ用いてバーグラフ全表示する表示装置全作成するに
は、発光ダイオードシート１０ｆ所望の長ちに切り、こ
れを第６因の如く絶縁基板１７にはり付け、さらにその
上に目盛板１Ｂ’ｆ、はり付けるようにすればよい。な
お、発光ダイオードシートド１０−の各端子１４・・・
は絶縁基板１７に設けられた接続端子１９・・・に接続
するものとする。Therefore, the light emitting diode sheet 1 configured in this way
To create a display device that displays the entire bar graph using 0f, cut the light emitting diode sheet 10f to the desired length, paste it on the insulating substrate 17 as in the sixth factor, and then attach the scale plate 1B'f on top of it. , just glue it on. In addition, each terminal 14 of the light emitting diode sheet 10-...
are connected to connection terminals 19 provided on the insulating substrate 17.
したがって、表示装置の作成は発光ダイオードシートｌ
Ｏｆ使用することにより容易かつ安価になる。Therefore, the creation of the display device is made of light emitting diode sheets l
Of use, it becomes easier and cheaper.
また、バーグラフ以外の文字、固形等も、第７図ないし
第９図に示すように任意に作成することができる。Furthermore, characters other than bar graphs, solid shapes, etc. can be arbitrarily created as shown in FIGS. 7 to 9.
第１０図は第１の発明における他の実施例を示すもので
、この実施例の発光ダイオードシート２０は、幅の広い
足形の絶縁シート２１上じ発光ダイオード１２・・・を
複数列に配列し、各列ごとに前記実施例と同様のワイヤ
ボンディングおよび絶縁コーティング金族してなるもの
である。FIG. 10 shows another embodiment of the first invention, and the light emitting diode sheet 20 of this embodiment has light emitting diodes 12 arranged in multiple rows on a wide foot-shaped insulating sheet 21. , each row is formed by wire bonding and insulating coating metal as in the previous embodiment.
そこで、この実施例の発光ダイオードシート２０は発光
ダイオード１２・・・全−列ずつ切離すことによって前
記実施例と同様に使用できるほか、発光ダイオード１２
・・・會仮数列並べて使用することもできる便オリさか
ある。Therefore, the light-emitting diode sheet 20 of this embodiment can be used in the same manner as in the previous embodiment by cutting out the light-emitting diodes 12 . . . every row.
...There is also the convenience of being able to use the mantissa sequences side by side.
次に第２の発明について、その−実施例上第１１図にも
とづいて説明する。Next, the second invention will be explained based on an embodiment thereof and FIG. 11.
第１１図は、前記第３図ないし第５図のようなテープ状
の発光ダイオードシートｌＯｆ製造する装置を示すもの
であって、図中２２はテープ状の絶縁シート１１が巻装
された供１１Ｊ−ル、２３は第５図のり−ル１６に相当
する巻取り一ルである。そして供給リール２２と巻取リ
ール２３との間には、供給リール２２側より巻取リール
２３に回って発光ダイオード供給装置２４、ワイヤボン
ディング装置２５、照度試験器２６およびコーティング
装置２７が順次設置されている。FIG. 11 shows an apparatus for manufacturing a tape-shaped light emitting diode sheet 1Of as shown in FIGS. The roll 23 is a winding roll corresponding to the roll 16 in FIG. Between the supply reel 22 and the take-up reel 23, a light emitting diode supply device 24, a wire bonding device 25, an illuminance tester 26, and a coating device 27 are installed in order from the supply reel 22 side to the take-up reel 23. ing.
そこで、供給リール２２より引出された絶縁シート１１
上にはまず発光ダイオ−Ｖ供給装置２４より発光ダイオ
ード１２が１個ずつ供給され、シート１ノの走行により
一定間隔で配列する。次にワイヤボンディング装置２５
により発光ダイオード１２・・・が順次接続烙れる。そ
して各発光ダイオード１２に電圧が印加され、照度試験
器２６により照度試験が行なわれる。この試験は発光ダ
イオード１２が不良品であったり、ワイヤボンディング
による接続が確実になされていないときこれを検出する
ために行なわれるものである。次にコーティング装置２
７において透光性の絶縁コーティングが施されて巻取り
−ル２３に順次巻取られる。Therefore, the insulating sheet 11 pulled out from the supply reel 22
First, the light emitting diodes 12 are supplied one by one from the light emitting diode V supply device 24, and arranged at regular intervals as the sheet 1 runs. Next, the wire bonding device 25
As a result, the light emitting diodes 12 . . . are connected in sequence. Then, a voltage is applied to each light emitting diode 12, and an illuminance test is performed by the illuminance tester 26. This test is performed to detect if the light emitting diode 12 is defective or if the connection by wire bonding is not secure. Next, coating device 2
At step 7, a light-transmitting insulating coating is applied, and the film is sequentially wound onto a winding wheel 23.
したがって、この発光ダイオードシート製造装置によれ
はテープ状の発光ダイオードシート１０を連続的に谷易
かっ安価に製造することができる。Therefore, with this light emitting diode sheet manufacturing apparatus, the tape-shaped light emitting diode sheet 10 can be manufactured continuously and easily and at low cost.
なおこの装置では、１唱の広い絶縁シートを用い、発光
ダイオード供給装置２４より発光ダイオード１２を複数
個ずつ供給することによって発光ダイオード１２が複数
列配列された発光ダイオードシートを製造することも可
能である。In addition, with this device, it is also possible to manufacture a light-emitting diode sheet in which multiple rows of light-emitting diodes 12 are arranged by using a wide insulating sheet and supplying a plurality of light-emitting diodes 12 from the light-emitting diode supply device 24. be.
以上詳述したように、第１の発明により、発光ダイオー
ドを用いて、文字、図形その他の表示を行なう表示装置
等全容易かつ安価に作成するための発光ダイオードシー
ト全提供することができる。As detailed above, according to the first invention, it is possible to provide a light emitting diode sheet for easily and inexpensively producing a display device for displaying characters, figures, etc. using light emitting diodes.
また第２の発明により、そのような発光ダイオード全容
易かつ安価に製造できる発光ダイオードシート製造装置
全提供することがで港る。Further, according to the second invention, it is possible to provide a light emitting diode sheet manufacturing apparatus that can easily and inexpensively manufacture such light emitting diodes.
第１区および第２図は背景技術を説明するためのパーグ
ラフによる表示装置の斜視図およびその部分拡大図、第
３図ないし第５図は第１の発明についての一実施例を示
すもので、第３因は平■図、第４図は第３図のＩＶ −
ＩＶ緑に沿う断面図、第５因は斜視図、第６図ないし第
９図は発光ダイオードシートの使用例を示すもので、第
６図はバーグラフによる表示装置への使用例を示す斜視
図、第７図ないし第９図に文字、図形等の衣示例を示す
平面図、第１０図は第１の発明についての他の実施例を
示す斜視図、第１１図は第２の実施例についての一実施
例を示す概略何曲図である。
１０．２０・・・発光ダイオードシート、１１゜２１・
・・絶縁シート、１２・・・発光ダイオード、１３・・
・ワイヤボンディング、１４・・・端子、１５・・・絶
縁コーティング、２２・・・供給リール、２３・・・巻
取り−ル、２４・・・発光ダイオード供給装置、２５・
・・ワイヤボンディング装置、２６・・・照明試験器、
２７・・・コーティング装置。
出願人代理人 弁理士 鈴 江 武 彦第１図
第３図
第４図
１］
８５図
第６１！ｌ
第８５！ｌ ＠９ 図
第１０図
第１１図Section 1 and FIG. 2 are perspective views and partially enlarged views of a display device using a pergraph for explaining the background art, and FIGS. 3 to 5 show an embodiment of the first invention, The third factor is the flat ■ figure, and the fourth figure is the IV − of figure 3.
IV A cross-sectional view along the green line, the fifth factor is a perspective view, Figures 6 to 9 show examples of use of light emitting diode sheets, and Figure 6 is a perspective view of an example of use in a bar graph display device. , FIGS. 7 to 9 are plan views showing examples of displaying characters, figures, etc., FIG. 10 is a perspective view showing another embodiment of the first invention, and FIG. 11 is a second embodiment. 1 is a schematic diagram showing an example of the number of songs. 10.20... Light emitting diode sheet, 11°21.
...Insulating sheet, 12...Light emitting diode, 13...
- Wire bonding, 14... Terminal, 15... Insulating coating, 22... Supply reel, 23... Winding reel, 24... Light emitting diode supply device, 25.
...Wire bonding equipment, 26...Lighting tester,
27...Coating device. Applicant's Representative Patent Attorney Takehiko Suzue Figure 1 Figure 3 Figure 4 Figure 1] Figure 85 Figure 61! l No. 85! l @9 Figure 10 Figure 11
Claims (2)
ードを配列し、それらを順次接続し、その上から透光性
の絶縁コーティングを施してなることを特徴とする発光
ダイオードシート。(1) A light-emitting diode sheet characterized by arranging a plurality of light-emitting diodes on a flexible insulating sheet, sequentially connecting them, and applying a light-transmitting insulating coating thereon.
供給リールと、この供給リールより引出された絶縁シー
ト上に発光ダイオード’ｋ 一定間隔で供給する発光ダ
イオード供給装置と、絶縁シート上に供給された発光ダ
イオード金順次接続するワイヤボンディング装置と、接
続された発光ダイオードの上から透光性の絶縁コーティ
ングを施すコーティング装置と、絶縁コーティングの施
された絶縁シートを巻取る巻取リールと全具備したこと
を特徴とする兄元ダイオードシートの製造装置。(2) A supply reel wrapped with a flexible tape-shaped insulating sheet, a light emitting diode supply device that supplies light emitting diodes at regular intervals onto the insulating sheet pulled out from the supply reel, and a light emitting diode supply device that supplies light emitting diodes at regular intervals onto the insulating sheet. A wire bonding device that sequentially connects the light-emitting diodes supplied to the diodes, a coating device that applies a transparent insulation coating over the connected light-emitting diodes, and a take-up reel that winds up the insulation sheet coated with the insulation coating. This is a manufacturing device for diode sheets that is characterized by being fully equipped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57189809A JPS5978584A (en) | 1982-10-28 | 1982-10-28 | Light emitting diode sheet and manufacturing device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57189809A JPS5978584A (en) | 1982-10-28 | 1982-10-28 | Light emitting diode sheet and manufacturing device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5978584A true JPS5978584A (en) | 1984-05-07 |
Family
ID=16247564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57189809A Pending JPS5978584A (en) | 1982-10-28 | 1982-10-28 | Light emitting diode sheet and manufacturing device therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5978584A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63300284A (en) * | 1987-05-29 | 1988-12-07 | タツタ電線株式会社 | Manufacture of segment display device |
| JPH01100173U (en) * | 1987-12-22 | 1989-07-05 | ||
| WO2002017405A1 (en) * | 2000-08-23 | 2002-02-28 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| WO2005052779A2 (en) * | 2003-11-24 | 2005-06-09 | Tyco Electronics Corporation | Method of manufacturing touch sensor with switch tape strips |
| JP2012009622A (en) * | 2010-06-24 | 2012-01-12 | Citizen Electronics Co Ltd | Semiconductor light-emitting device |
| US9171884B2 (en) | 2010-09-16 | 2015-10-27 | Osram Opto Semiconductors Gmbh | Method for combining LEDS in a packaging unit and packaging unit having a multiplicity of LEDS |
| JP2016173381A (en) * | 2015-03-16 | 2016-09-29 | 日本イーエルコスミック株式会社 | Display device |
-
1982
- 1982-10-28 JP JP57189809A patent/JPS5978584A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63300284A (en) * | 1987-05-29 | 1988-12-07 | タツタ電線株式会社 | Manufacture of segment display device |
| JPH01100173U (en) * | 1987-12-22 | 1989-07-05 | ||
| WO2002017405A1 (en) * | 2000-08-23 | 2002-02-28 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| JP2004507114A (en) * | 2000-08-23 | 2004-03-04 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Optoelectronic component, method of manufacturing the same, module with a plurality of optoelectronic components, and device with such a module |
| US7446347B2 (en) | 2000-08-23 | 2008-11-04 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| WO2005052779A2 (en) * | 2003-11-24 | 2005-06-09 | Tyco Electronics Corporation | Method of manufacturing touch sensor with switch tape strips |
| WO2005052779A3 (en) * | 2003-11-24 | 2005-12-01 | Elo Touchsystems Inc | Method of manufacturing touch sensor with switch tape strips |
| JP2012009622A (en) * | 2010-06-24 | 2012-01-12 | Citizen Electronics Co Ltd | Semiconductor light-emitting device |
| US9171884B2 (en) | 2010-09-16 | 2015-10-27 | Osram Opto Semiconductors Gmbh | Method for combining LEDS in a packaging unit and packaging unit having a multiplicity of LEDS |
| JP2016173381A (en) * | 2015-03-16 | 2016-09-29 | 日本イーエルコスミック株式会社 | Display device |
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