JPS5954277A - Light emitting diode - Google Patents
Light emitting diodeInfo
- Publication number
- JPS5954277A JPS5954277A JP57164211A JP16421182A JPS5954277A JP S5954277 A JPS5954277 A JP S5954277A JP 57164211 A JP57164211 A JP 57164211A JP 16421182 A JP16421182 A JP 16421182A JP S5954277 A JPS5954277 A JP S5954277A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- resin
- light
- cation
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Abstract
Description
【発明の詳細な説明】
「発明の技術分野１
本ざと明は紫外線硬化ｉｊｌ能な（１１・ｌ ｌｉｔ’
！ （’ Ｊ’ｌ Ｉｔ ｌｊｌ、′を省、）Ｙ１タイ
Δ−ドに関りる。。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention 1.
! ('J'l It ljl, ' is omitted) This relates to the Y1 tie Δ-de. .
１発明の技術向背ビ１とその問題１’、ｌ ｌ従来／）
目ら発光タイＡ −１−４；Ｌ湿気＼゛）不純物に：、
ｔｒｉめ（敏感４「ため液状−１ボ″１−シ（かｌ
１ｌｔｉ ＃ｌｌ成物賓（樹脂エルされ（いる。1 Technical background of the invention 1 and its problems 1', l l Conventional/)
Eye-light-emitting tie A-1-4; L moisture ＼゛) Impurities:,
Tri-me (sensitive 4 "Liquid-1 Bo" 1-shi (Kal)
1lti #lli synthetic material (resin er).
樹脂月」１７′ノ法どしく’ ｔｅｌ、、透明容器内（
Ｊ８１ノ： ＩＡＩ脂組成物を注入した後、発光ダイΔ
−ド部品を所望の部分まＣ゛即設ｔ長、その後（Ｊ（］
の樹１１ｆｔ絹成物を加熱硬化さＵで一体化りるいわｌ
：Ｊｌ ；！、ｒボッｌイング法、！ＩＩＪ容器を用い
て臼杵に月１１ろ１１イ１−）１．、： １や、ＩＩＯ
型を（１なういわ１．ｊ、ｌる１１・スノｒン／）法、
４；；）ｌ脂絹成物中に発光ダイＡ−ト部品’ｉ凌（Ｃ
Ｉｌｙ （’ Ｌれを一亀引ぎ−１，＋Ｊ、ＩＩ盾した
樹脂を加熱１．ｊｌｊ化さ［」るい４′）ゆるデｒツビ
ング法、液状（ｚ）４脂組成物を＋ｉｌｉ ｆｆＦの部
分に滴１・さｌで−でのＩＩ： １： ｔυ化さく県イ
、）い、１）（つ）り）Ｉへ１」ツピング？人等があげ
られる。Resin Month"17' no law" tel,, inside a transparent container (
J81 No.: After injecting the IAI fat composition, the light emitting diode Δ
- Immediately install the code part to the desired part, then (J()
11ft of silk material is heat-cured and integrated with U.
:Jl ;! , rBolling method,! 1. Monthly 11 ro 11 ii 1-) 1. , : 1, IIO
Type (1.j, l11.snorn/) method,
4;;)l Light-emitting die parts 'i Ling (C
Ily ('L-1, +J, II-shielded resin is heated 1.jlj-ized ["rui 4')" Yuru Dertzbing method, liquid (z) 4 fat composition +ili ffF II with 1 drop on the part: 1: tυ conversion prefecture i,)i, 1) (tsu)ri)I to 1'' tsuping? People can be mentioned.
このＪ、うな樹１ｊ１１月庄に−ＩＴＪいＩう’Ｉ′＋
４＋ ＪＭＪ脂に（３Ｌ次のよう／Ｉ′ｉり能が必要と
きれ（いる。This J, Unagi 1j November Sho ni-ITJ Iu'I'+
4+ JMJ fat (3L) has the following /I'i ability when necessary.
す４１“Ｊ’）ｌ）
（１）ボッライング、：髪トスノ ｒン９′；・７のｌ
ｊ ｆ人の場合、低粘磨樹脂であっ′ＣＪ〜ｆ ＪＪ−
＋、二際し、 （、Ｉ’１７、し易く、（７かｂ脱泡か
り、ｆ＋ １１．１Ｒ’Ｊ （雪ｊλる０の（イ「（ノ
れ（，１ならない、。41 "J')l) (1) Bollaing, :hair tossun 9';・7 no l
j In the case of f people, low viscosity resin 'CJ~f JJ-
+, 2 times, (, I'17, easy to do, (7 or b defoaming, f+ 11.1R'J
（２））ｌｌＪ！化に際しＣａ）ＩＩＩＩＩ化収稲カ小
（＼イＬ）ノ（：’ ／、−ｉ（〕れ（」ならないつ硬
硬化線か人。＼い場合１．１． Ｊ・１止に際しくクラ
ックが’Ｉ−１； Ｉ：：す、じ−トシトン’／ ＋；
二Ｊ、る残留歪みに起因覆るクラックがｌ：＋ １；
／、−リ、あるいはボンディングされに一金線か１１Ｉ
々１ｌｌｉ ｌる′ｌｑの不都合が／４：？ｌ”る。(2))llJ! At the time of conversion, Ca) III rice yield is small (\iL)ノ(:' /, -i() is not a hard hardening line or a person. \If 1.1. Cracks occur when J.1 stops. ga'I-1;I::su,ji-toshiton'/+;
2J, cracks covered due to residual strain l: + 1;
/, -ri, or bonded gold wire or 11I
1lli l'lq's inconvenience /4:? l"ru.
（３） ｔ！？られた硬化物の電気絶紅１ノ１か、１く
、熱＋Ｖ：張係数が小さい（二と、。(3) t! ? The cured product has a small tensile coefficient (2 and 1).
（４） ’ｔ、’；ｊ ’られ／、二硬化物の耐ＩＢ％
１５＞ ｊｌｌが良θｊ”ｒ’； ｃｌ Ｌ。(4) 't,';j're/, IB resistance % of double cured product
15> jll is good θj”r'; cl L.
（！□５）熱劣化による変色の少１．［いｔ）の（ある
こと１゜等ひあり、こ°−トしらの問求性能を植ｊ足さ
１！るものどしζ１ｌＦｉ！（１酸無水物硬化型Ｉ、ポ
１シ樹脂を主成分とづる樹脂組成物が広く使用され（い
る。(!□5) Less discoloration due to thermal deterioration 1. [It)'s (one thing is 1 degree, etc.), and the required performance of these is added ζ 1 l Fi! (1 acid anhydride curing type I, 1 poly resin) Resin compositions with main components are widely used.
しかし４丁から、この樹脂は加熱硬化！、ｌ！Ｉて゛あ
るため、硬化に艮口）間を要し牛ρζｆＩ］に劣るとい
う勤Ｓ１”、ミがあった。However, from 4 guns onwards, this resin is cured by heating! ,l! Due to the high temperature, it took a long time to harden and was inferior to that of beef.
ｒＪすわｌ）、例えｌ；ｒ １’ ＩＩス゛フイング２
人を例【１あ０゛れは、１１；２八ｌ！ ｉｉＪ能なま
でに６０分稈ｌｔＦ、必１．ン（゛（１りる。rJSwal), example l;r 1' II SWIFING 2
For example, a person [1 a 0 is 11; 28 l! iiJ culm ltF for 60 minutes, must be 1. N(゛(1riru.
硬化時間をり、（１紺１１］Ｊ、・）とじＵＩゆ止剤を
増ｊ１）シたり、硬化温度を上げるという手段を用いる
こと０検訃１されているか、この、１、う４ｊ手Ｆ受に
、１、れば硬化ＩＩ？の内部光熱が人さくなり、これに
１゛１′つで様々＜’Ｌ ｌ・ラフルが４１−じＣいた
。Is it possible to increase the curing time, increase the binding UI detergent, or raise the curing temperature? If the F receiver is 1, is it hardening II? The internal light of the body became weak, and in this 1゛1' there were various <'L Rahul 41-C.
このような問題を克服づる方法としく、近日不飽和ポリ
ニスフール系、アクリル系８Ｌだ（３１メタクリル系等
の樹脂組成物に光Φ合間始剤を添加した紫外線硬化性低
粘度Ｊｕｌ ＩＩＨに１１成物を用いる試・／ｌか 部
に（１ｊい（なされ（いイ）、。As a way to overcome these problems, we are currently developing unsaturated polynisfur-based, acrylic-based 8L (31 methacrylic-based, etc.) resin compositions with ultraviolet curable low viscosity Jul IIH and 11 compositions, which are made by adding a photo-Φ initiator. Test using /l or part (1j (made (ii),.
しかしながら、この紫外線硬化ｔノＩ’、 Ｉｆ（Ｊｉ
！□１印樹脂組成物を１ｔｉｉ用した場合は、次のＪ、
−）イ「欠＋、ａか／１りるｌζめ、Ｊ、つＩごく実用
化が困ｆ１１（あるのが工（＋！状（゛あつ ｌこ 。However, this ultraviolet curing tnoI', If(Ji
! □When using 1tii resin composition with 1 mark, the following J,
-) I "lack +, a / 1 rir lζme, J, tsu I is extremely difficult to put into practical use f11 (there is a work (+! condition (゛ ATSU l ko).
す４１−わ７５閉気中の酸系に、］、す） ソ＋シ、
’ｒｊＬどＫ Ｆｌ！ｌ！ ＜Ｉる部分のΦ合阻害が起
こり（いわゆるｑ）合禁１１効宋）、その結ｆｆ！ ｌ
ｆ＋４脂人面がへたつさ、ｃ、−、、’１１．を改：’
ｊ ｉＪイ）ために光重合開始剤の含イｊＷを増大（＼
１ｊる）、変←１が名しくなり、発光タイＡ−１〜素ｒ
の斤光光線の光透過；おが悲くなって信頼・Ｉｌｌが１
１（１・ｉＪる−いう欠点か（（す） ７．Ｚ 。41-75 In an acid system in a closed atmosphere, ], s) So + Shi,
'rjLdoK Fl! l! Φ combination inhibition occurs in the <I part (so-called q) combination 11 effect Song), and the result is ff! l
f+4 fat face is tired, c, -,,'11. Revised:'
The content of photopolymerization initiator is increased (＼
1jru), change ← 1 becomes famous, luminous tie A-1 ~ elementary r
Light transmission of the ray of light; Oga becomes sad and trust/Ill is 1
1 (1・iJru - Is it a drawback? ((su) 7.Z.
また、ラジカルｆ＝Ｉ加！１１！の樹脂は本ｖ！Ｉ的に
硬化収縮が人さく ’＋ Ｊｌｉｌ什時にタラップが入
（〆）易＜ ｆ、Ｌ−）たり、内部歪みか残存してボン
７” （ンク１）−イーＩ−か破断されるいわゆるＡ−
ブン小良が牛してじ５１、）等の欠点があった。Also, the radical f=I addition! 11! The resin is a book v! In general, hardening shrinkage occurs when the ramp is easily inserted (<f, L-), or internal distortion remains and the so-called bond 7'' (Nk 1)-I-I- is broken. A-
There were shortcomings such as 51, ).
「ブを明の目的１
本発明者らはこのようｈ問題を解消ｃＪるため鋭意？ｔ
ｌｌ究を進めた結束、１ボー１シ１１ ＋１ｉｔ等の力
ｆ Ａン重合性右１幾物質どアリルオニウ１１１２．ｉ
系光ｊｌｉ合間ｌｌＡ剤との反応を弁光ダイＡ−トの樹
脂月１（３貢凶川りれば、１りれた効果が得られるこ、
′−を見出した。Purpose 1: The inventors have worked hard to solve this problem.
Unity that has been investigated, 1 Bo 1 C 11 + 1 It, etc. force f A and polymerizable right 1 Geometric substance Do allyl oniu 1112. i
If the reaction with the llA agent in the middle of the system light is carried out with the resin of Benko Dai-A-to (1), an even greater effect can be obtained.
′- was found.
？Ｉなわｌ）この反応は、従来のｉクリル系紫外わ：；
硬化型の反応系がいわゆる一巾結合にＪ：る、１１セ化
収縮を伴うラジカルイ；１加手合系であるのに夕・ｉじ
、本発明に用いられる反応系は力ｆＡン申含反応Ｃ゛あ
っ−（硬化収縮がなく、しか＝ｂ少吊の光ｆ１１含聞殆
剤τ重合Ｚ”′き、また開始剤にＪ、る成形品の友Ｑ５
が少４ｆいうえ、均 に１功化がｉｉｌ ｆｉｌ （あ
る雪の＋＋ｐ々の利点が得られることを見出した。? I) This reaction is carried out using the conventional iCrylic ultraviolet method:;
Although the curing type reaction system is a so-called one-width bond, a radical reaction with 11 cationic contraction; C゛ah-(There is no curing shrinkage, but = b little light f11 contains almost all the additives τ polymerization Z''', and the initiator is J, a friend of molded products Q5
It was found that the snow was less than 4f, and the benefits of the snow were evenly reduced to 1.
本発明は２二のよ−）な知、Ｑ （Ｊｊｉ４ ＝’、ｊ
’ イ（ｔ’Ｅ ２３１１ ／Ｊｔ）ので、硬化が７５
１７時間（−行なえ、変Ｃ１，や内部４゛・７）、クラ
ックパりのイ」′い光）にり（−Ａ−ドを１ｒｊ）供り
る（−どを目的とりる。The present invention is based on 22-) knowledge, Q (Jji4 =', j
'E (t'E 2311 /Jt), so the curing is 75
17 hours (-do, change C1, internal 4゛・7), bright light of the crack par) (-A-do 1rj) offer (-do).
［発明の（頑犬１
すｌ、ｒ、１つｌうＡ発明の発光タイΔ−Ｆは、１ボ１
シ樹脂：Ｉ：１：＝は他のカブΔン申合１／１イ１（代
物７′（どｊ７リルＡ−ラム塩系光市台聞始剤どを一１
成分どりる紫タト線硬化１ノ１低粘度樹脂組成物でブし
光り（Ａ−１−察Ｊ′ａ３よびリード部を樹脂Ｊ’ｌ止
しく４Ｉ？る（−とを特１敗とりる１゜
本ＶＮ明に使用りる紫外線硬化１ノ１但粘度樹脂絹成物
は、１−ボ１−シ（か１脂等の力ＬΔンｒ−１’ｉ ｉ
’−ｔ’ｌＩｌｌ幾物ｖりどノ′リルＡ−ウｌＸ’、１
晶系光１１）含聞殆ハ！ト１−を１成分どし、この他に
必要に応じて酸化菌１１剤や着色剤か添加されたもので
ある。[The invention's light-emitting tie Δ-F is 1 bo 1
Resin: I:1:= is the other turnip ∆ combination 1/1 1 (substitute 7')
Ingredients are purple Tato line curing 1 no 1 low viscosity resin composition and shining (A-1 - detection J'a 3 and lead part are resin J'l 4I? (- and special 1 loss) The ultraviolet curing resin silk composition used in 1° VN light has a viscosity of 1 to 1.
'-t'lIll geometry v ridono'ril A-UlX', 1
Crystal light 11) Implications are almost ha! In addition to this, 11 oxidizing bacteria and a coloring agent are added as necessary.
このｊ′リルオニウム塩系光十合開始剤（、Ｌ、一般式
（Δｒ）ｎ−△→ ・１３−
（但し代中Δ１゛；アリールＪｉｊ、、ｌｌニア−・Ｊ
）、△：１、Ｓ、Ｓｏ 、Ｆ３：Ｂ「ｎ 、ＰＩ＋：、
Ｓ１１ Ｉ−ｄ； 。This j′ lyluonium salt photoinitiator (,L, general formula (Δr)n−△→ ・13− (where Δ1゛; aryl Jij, llniar−・J
), △:1, S, So , F3:B'n, PI+:,
S11 I-d; .
△Ｓにら）で示される。ΔS leek).
このアリルオニウム塩系光千合開始剤は１１Ｌ来のシｊ
′ゾーウムＩｎ形重合間！ｔｒｉ 剤（１） Ｊ、ｌ＞
＋Ｌ ＩＩＩＩ！ｆｌｓ 物Ｍ ｌｆ？ｉ泡が起こつ
ｌこり、ｊＱＵ３したりりに）ｔ−、Ｉ （！、−，／
Ｊ＼イｊく、また配合（か１脂のボッ１−ラぞ〕も良θ
ｒ（゛あ０、さらにカーＩＡン重合ＣあるからＷａｌ＋
気中の１蔑素１．Ｌ、よる小合用害作用もないという刊
員を有しくいる、。This allyl onium salt-based photochemical initiator has been used since 11L.
'Zoum In-type polymerization! tri agent (1) J, l>
+LIII! fls thing M lf? i bubbles occur, jQU3, etc.) t-, I (!,-,/
J＼Good, and the combination (1 fat 1-razo) is also good θ
r(゛A0, there is also car IA polymerization C, so Wal+
1 derogatory element in the atmosphere 1. L, I have a publisher who says that there is no harmful effect when using a small combination.
な６３１〜１１ツビング法＼ゝ）ｊ゛イツピング法適用
？Ｊる場合は、無１幾７°ｉヂ１５填剤やブ）ソ剤る添
加りる。Ｊ、゛）にしくＴ ｆ）Ｊ、い１゜
１Σ〉、明の実施例１
次に本発明の実施例についｔ ＩＪ＋！明りる１、実施
例
図面はＡ発明の一実施例を示り１す１面図Ｃｉｌ’＋る
。。631-11 Tsubing method\ゝ)j゛Applying the Itsuping method? When using, add no filler or solvent. J, ゛) Nishishi T f) J, I1゜1Σ〉, Example 1 of the present invention Next, regarding the example of the present invention, t IJ+! Figure 1. Embodiment The drawings show an embodiment of the invention A and are a top view. .
図にＪ５い４反射板１１−゛には銀系ベースト′／）が
ノスベンリーにより目出２）れ−（おり、さＩら（５ニ
この１艮系ベースｌ” ２ ’７）十ににＬガリウムー
砒素系ｆツブ３がマウン１〜され（加熱ににり接着され
（いる３、接？゛１後ブッノ°３ど小ンデｒング側電極
４の間は金線１〕によって接続され（いる。In the figure, the J5-4 reflector plate 11-゛ has a silver-based base '/) made by Nosvenry2). L gallium-arsenic type f-tubes 3 are mounted (heated and bonded) (3, after bonding, gold wire 1 is connected between the lower electrodes 4). (There is.
次にＣＸ２２１ （チッソ株式会社製−１−ボ１シ樹脂
の商品名） １００Ｊｆｉｔ部、１〜リシウリル１−リ
ＪＡスフｊ・イＩ・１．０甲虫部、シフ１ニルニｌ−ｌ
’ ｆｆｆつ１ＸｊＩヘノノルＡ１１ボ１ノー１〜３．
０Φω部’ｔ：、−’＋’ｌ； ｆＡ＋！で３０分間攪
拌混合した樹脂にＩ ｔｌ相成物を成形用金型にＬ１人
し、前述し／ｊ素子をこの樹脂組成物中に浸漬さけた後
、８０ Ｗ ／ ｃｍの昌ｊ１水銀月３大Ｉ Ｃ４０秒
間紫外線を照射し硬化さし！た。光ｉｌｌ；！との距１
１はｉ ｂ （：＋ｌｌ （あ・２人＝３．【のｉ稔１
１（）す（１１，さ１↓る（−：、 （Ｊ ｊ、り樹脂
月１１（３，＼れＩご光尤／７でＡ する１１１冒、二
、１このＪ、うにしく製ノ１−１また弁光りｒΔ−１・
（・１１１成彫物の１゛１性（，１次表の通り（あり、
１分（、−ｊご月１（こ１ｉｉ４ンるｂ （１） ”Ｃ
（Ｉｊ）つＩ、５゜第１に
外 観 ’ｌｌｔ Ｌｌ’、透
明耐 湿 （’ｌ’、 ４０”ＣＸ
９！ｉ％ ＲＨＸ １０（ＨａｌｌＣ輝度劣化イ「シフ
耐 熱 １〕Ｉ １２！ｉ”（：ｘ
！１ｏ０１＋Ｃ’ ｆＩ′ｌｌ； Ｉｊ：１．劣化
４トシ耐 半 ［１１雇 ２６０°ＣＯ） ’
Ｉ’ Ｉｌｌ浴、２０．１’し間含格通７１ Ｗｌ；
１１１劣化１１１ ン、２ｖ −２！ｉｍ Ａ
Ｘ ＋７（ｌｉ７、帥ｊυ、劣化３０％
［発明の効！、Ｐ！］
以）説明し／；： Ｊ、・）にＡ＼什、明の樹１１ｉ７
ＩＩ・ｌ ＩＩ弁、 ）１１．タイＡ−トは、短時間
テ硬化がｌ１Ｊｆｉｔ； （あるのζ１１． ｉｌｉ”
ｆ’１が高く、しから成形品の内部歪カー１リクンツ
タ、弯色がなく、；ｋ ７；二師度の劣化も極め（少泡
い。し／）１も肉１９月Ｊｔ： ’ｔ’＞可能Ｃあると
いう利貞がある。Next, CX221 (trade name of -1-BO1 resin made by Chisso Corporation) 100Jfit part, 1~lisiuril 1-li JA Sufj・iI・1.0 beetle part, Schiff 1nilni l-l
' ffftsu1XjIhenonorA11bo1no1~3.
0Φω part't:, -'+'l; fA+! After stirring and mixing the resin for 30 minutes, the I tl phase composition was poured into a mold, and the above-mentioned /j element was immersed in this resin composition. Irradiate UV rays for 40 seconds to harden! Ta. Light ill;! distance 1
1 is i b (:+ll (A・2 people = 3. [i Minoru 1
1 ()su (11, 1↓ru (-:, 1-1 Also Bengikari rΔ-1・
(・111 completed carvings 1゛1 characteristics (, as per the first table (yes,
1 minute (, -j month 1 (ko1ii4nrub (1) ”C
(Ij) Tsu I, 5゜Firstly, the appearance 'llt Ll', transparent moisture resistant ('l', 40"CX
9! i% RHX 10 (Hall C brightness deterioration "Schiff heat resistance 1] I 12!i" (:x
! 1o01+C'fI'll; Ij:1. Degradation resistance 4 and a half [11 hours 260°CO)'
I' Ill bath, 20.1' between 71 Wl;
111 Deterioration 111 N, 2v -2! im A
X +7 (li7, 帥jυ, deterioration 30% [Efficacy of invention!, P!] Hereafter) Explain /;: J, ·) to A\you, Tree of Ming 11i7
II・l II valve, )11. The tie A-t can be hardened for a short time.
f'1 is high, there is no internal distortion of the molded product, there is no curved color; Toshisada says that there is a possibility C.
図面は本発明の発光タイＡ−１・の−実Ｍｌ１例４゛小
す断面図である。
１・・・・・・・・・・・・反射板
２・・・・・・・・・・・・銀系ベースＩ−１′３・・
・・・・・・・・・・Ｊツゾト・・・・・・・・・・・
ボンディング側’ｌｔ＆［う・・・・・・・・・・・・
金 線
６・・・・・・・・・・・・封止樹脂
代理人弁理−１須 １１１ 仏The drawing is a 4'' smaller sectional view of the light-emitting tie A-1 and M11 of the present invention. 1...Reflector plate 2...Silver base I-1'3...
・・・・・・・・・・・・J Tsuzoto・・・・・・・・・・・・
Bonding side'lt & [U......
Gold wire 6・・・・・・・・・Sealing resin agent patent attorney-1 111 France
Claims (1)
７リルΔ−ウム塩系光ｉｐ合聞始剤とを主成分と覆る紫
外線硬化性低粘度樹脂組成物て介）Ｙ；クイＡ−ド索子
（１３Ｊ、びリード部を樹脂ｌ’Ｊ ＋１シ１：なるこ
とを特徴とりる発光グイΔ−ド１゜(Ultraviolet curable low viscosity resin composition containing epoxy resin J or other turnip A Φ compound as main components and furyl Δ-um salt-based optical IP initiator) Y: A light-emitting guide Δ-1° characterized by the fact that the lead part is made of resin l'J +1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57164211A JPS5954277A (en) | 1982-09-21 | 1982-09-21 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57164211A JPS5954277A (en) | 1982-09-21 | 1982-09-21 | Light emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5954277A true JPS5954277A (en) | 1984-03-29 |
| JPH0462188B2 JPH0462188B2 (en) | 1992-10-05 |
Family
ID=15788773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57164211A Granted JPS5954277A (en) | 1982-09-21 | 1982-09-21 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5954277A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61203644A (en) * | 1985-03-06 | 1986-09-09 | Suriibondo:Kk | Manufacture of electronic component parts |
| US6617787B2 (en) | 2000-01-11 | 2003-09-09 | Toyoda Gosei Co., Ltd. | Light-emitting system with alicyclic epoxy sealing member |
| US6960878B2 (en) | 2001-01-24 | 2005-11-01 | Nichia Corporation | Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56135520A (en) * | 1980-02-29 | 1981-10-23 | Ciba Geigy Ag | Photopolymerizable mixture containing cation polymerizable compound and photopolymerization thereof |
| JPS58219781A (en) * | 1982-06-15 | 1983-12-21 | Showa Denko Kk | Sealing method for light emitting diode element |
| JPS5919381A (en) * | 1982-07-23 | 1984-01-31 | Hitachi Chem Co Ltd | Manufacture of resin-sealed light emitting diode |
-
1982
- 1982-09-21 JP JP57164211A patent/JPS5954277A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56135520A (en) * | 1980-02-29 | 1981-10-23 | Ciba Geigy Ag | Photopolymerizable mixture containing cation polymerizable compound and photopolymerization thereof |
| JPS58219781A (en) * | 1982-06-15 | 1983-12-21 | Showa Denko Kk | Sealing method for light emitting diode element |
| JPS5919381A (en) * | 1982-07-23 | 1984-01-31 | Hitachi Chem Co Ltd | Manufacture of resin-sealed light emitting diode |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61203644A (en) * | 1985-03-06 | 1986-09-09 | Suriibondo:Kk | Manufacture of electronic component parts |
| JPH0446449B2 (en) * | 1985-03-06 | 1992-07-30 | Three Bond Co Ltd | |
| US6617787B2 (en) | 2000-01-11 | 2003-09-09 | Toyoda Gosei Co., Ltd. | Light-emitting system with alicyclic epoxy sealing member |
| US6960878B2 (en) | 2001-01-24 | 2005-11-01 | Nichia Corporation | Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor |
| US7342357B2 (en) | 2001-01-24 | 2008-03-11 | Nichia Corporation | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| US7550096B2 (en) | 2001-01-24 | 2009-06-23 | Nichia Corporation | Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0462188B2 (en) | 1992-10-05 |
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