JPS59202038A - Manufacture of temperature sensor - Google Patents

Manufacture of temperature sensor

Info

Publication number
JPS59202038A
JPS59202038A JP7710683A JP7710683A JPS59202038A JP S59202038 A JPS59202038 A JP S59202038A JP 7710683 A JP7710683 A JP 7710683A JP 7710683 A JP7710683 A JP 7710683A JP S59202038 A JPS59202038 A JP S59202038A
Authority
JP
Japan
Prior art keywords
thermistor
resin
temperature sensor
case
inner diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7710683A
Other languages
Japanese (ja)
Inventor
Hiroshi Yamaoka
宏 山岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP7710683A priority Critical patent/JPS59202038A/en
Publication of JPS59202038A publication Critical patent/JPS59202038A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

PURPOSE:To obtain a temperature sensor with complete characteristics with an accurate positioning made possible by a method wherein leads are connected axially at both ends of a thermistor, after one lead is bent in U-shape to parallel the other, a resin is fastened on both the leads and the assembly is inserted into a case. CONSTITUTION:One of leads 1 and 2 connected to both ends of a thermistor 3, for example, the lead 1 is bent in U-shape and a resin 5 is fastened the leads 1 and 2 by injection molding. The resin 5 is so roughly equal to the inner diameter of a large inner diameter section 41 of a case 4 to be insertable thereinto. Then, the tip 43 of the case 4 is filled with an insulation oil, silicone rubber or the like and after the thermistor 3 is inserted thereinto, the rear end of the resin 5 is fixed with a resin 6 or the like. In this manner, a temperature sensor excellent in the durability suitable for automobiles can be formed with a high yield as such with complete characteristics without positional deviation in the thermistor, dispensing with a defoaming process or the like for bubbles as generated when the resin 5 is injected and hardened afterwards.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、例えば自動車用の水温計、油温計または空気
温針等に使用するのに好適な温度センサの製造方法に関
する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a temperature sensor suitable for use in, for example, a water temperature gauge, an oil temperature gauge, or an air temperature needle for automobiles.

従来技術 第1図(a)〜(C)はこの種の温度センサの従来の製
造方法を示す図である。まず、第1図(a)に示すよう
に、両端の軸方向にリード線l及び2を導出したガラス
封止型サーミスタ3の、前記リード線1及び2の一方、
例えばリード線1を折曲げてU状等の適当な形にフォー
ミングしだ後、第1図(b)に示すように、熱伝導性の
良好な金属材料で構成されたケース4の内径部41内に
、サーミスタ3側を先端側にして挿入する。次に第1図
(C)に示すように、ケース4の内径部41内に挿入さ
れたサーミスタ3及びリード線l、2のまわりに、絶縁
樹脂5を注入充填して硬化させる。前記絶縁樹脂5は、
サーミスタ3及びそのリード線1.2をケース4内に支
持する支持部材となる。前記ケース4の外周面は先端に
向う程小径となる段付状となっていて、中間の段部の外
周に取付用のネジ部42を設け、先端部43にサーミス
タ3を位置させる構造となっている。また、内径部41
のサーミスタ3の位置する先端部分は、ケース4からサ
ーミスタ3への熱伝導特性を向」−させるため、小径に
形成しである。44は取付位置決め用のフランジ部であ
る。
BACKGROUND OF THE INVENTION FIGS. 1A to 1C are diagrams showing a conventional manufacturing method of this type of temperature sensor. First, as shown in FIG. 1(a), one of the lead wires 1 and 2 of the glass-sealed thermistor 3 has lead wires 1 and 2 led out in the axial direction at both ends.
For example, after bending the lead wire 1 and forming it into an appropriate shape such as a U-shape, as shown in FIG. Insert the thermistor 3 side toward the tip side. Next, as shown in FIG. 1C, insulating resin 5 is injected and filled around the thermistor 3 and lead wires 1 and 2 inserted into the inner diameter portion 41 of the case 4 and hardened. The insulating resin 5 is
It serves as a support member that supports the thermistor 3 and its lead wires 1.2 within the case 4. The outer peripheral surface of the case 4 has a stepped shape in which the diameter becomes smaller toward the tip, and a threaded portion 42 for mounting is provided on the outer periphery of the intermediate step, and the thermistor 3 is positioned at the tip 43. ing. In addition, the inner diameter portion 41
The tip portion where the thermistor 3 is located is formed to have a small diameter in order to improve the heat conduction characteristics from the case 4 to the thermistor 3. Reference numeral 44 represents a flange portion for determining the mounting position.

従来技術の欠点 しかしながら、上述する従来の製造方法には次のような
欠点がある。
Disadvantages of the Prior Art However, the conventional manufacturing method described above has the following drawbacks.

(イ)ケース4の内径部41内にサーミスタ3及びリー
ド線1.2を挿入した後、絶縁樹脂5を注入充填するま
で、サーミスタ3及びそのリード線1.2を所定位置に
固定することが困難で、サーミスタ3及びリード線1.
2が非常に位置ズレを起し易い。このため、ケース4の
内壁面に対するサーミスタ3の位置ズレにより、ケース
4からサーミスタ3への熱伝導特性、それによる温度検
出特性が個々の温度検出センサにおいて変動してしまい
、特性の揃ったものを歩留り良く製造することが困難で
あった。
(a) After inserting the thermistor 3 and the lead wire 1.2 into the inner diameter part 41 of the case 4, the thermistor 3 and its lead wire 1.2 can be fixed in a predetermined position until the insulating resin 5 is injected and filled. Difficult, thermistor 3 and lead wire 1.
2 is very likely to cause misalignment. Therefore, due to the misalignment of the thermistor 3 with respect to the inner wall surface of the case 4, the heat conduction characteristics from the case 4 to the thermistor 3 and the resulting temperature detection characteristics vary in each temperature detection sensor, making it difficult to use sensors with uniform characteristics. It was difficult to manufacture with good yield.

(ロ)ケース4の内径部41が出口のない袋状空間とな
っていて、絶縁樹脂5を注入充填する際の空気抜き孔が
存在しないため、絶縁樹脂5の注入充填時に絶縁樹脂5
中に泡が発生し、この泡により絶縁樹脂5の熱伝導特性
が変動してしまう難点もあった。
(b) The inner diameter part 41 of the case 4 is a bag-like space without an outlet, and there is no air vent hole when injecting and filling the insulating resin 5.
There was also the problem that bubbles were generated inside the insulating resin 5, and the heat conduction characteristics of the insulating resin 5 were changed due to the bubbles.

(ハ)この泡による問題は脱泡工程を伺加することによ
り解決できるが、この場合は工程数が多くなる欠点を生
じる。
(c) This problem caused by foam can be solved by adding a defoaming step, but this has the disadvantage of increasing the number of steps.

(ニ)サーミスタ3による温度検出動作の面だけから見
れば、被検温対象たる水、油または空気等に直接接触さ
せる構造、つまりサーミスタ3のまわりには絶縁樹脂5
を充填せずに、被検温対象の流通する空間とするのが最
良である。ところが、従来のものでは、ケース4の内径
部41の全部に絶縁樹脂5が充填されてしまうため、か
かる構造を採ることは不可能であり、検出感度の向上に
限界かあった。
(d) From the perspective of the temperature detection operation by the thermistor 3, it has a structure that allows it to come into direct contact with the temperature to be measured, such as water, oil, or air.
It is best to leave the space where the temperature to be measured flows through without filling it. However, in the conventional device, since the entire inner diameter portion 41 of the case 4 is filled with the insulating resin 5, it is impossible to adopt such a structure, and there is a limit to the improvement in detection sensitivity.

(ホ)小型の温度センサを得ようとすると、当然にケー
ス4及υその内径部41も小型化されるため、絶縁樹脂
5の注入充填が困難になる。
(E) When trying to obtain a small temperature sensor, the case 4 and its inner diameter portion 41 are naturally reduced in size, making it difficult to inject and fill the insulating resin 5.

本発明の目的 本発明は」二連する従来からの技術的課題を解決し、サ
ーミスタを、位置スレを生じることなく、ケース内の所
定位置に確実に挿入位置決めすることが可能で、しかも
絶縁樹脂中における泡の発生の余地がなく、脱泡工程等
が不要で、小型のものでも、特性の揃った温度センサを
、高歩留りで能率良く製造することの可能な製造方法を
提供することを目的とする。
Purpose of the Invention The present invention solves two conventional technical problems, and makes it possible to reliably insert and position a thermistor at a predetermined position in a case without causing any positional scratches, and to use an insulating resin. The purpose of the present invention is to provide a manufacturing method that can efficiently manufacture temperature sensors with uniform characteristics at a high yield, even if they are small, with no room for bubbles to form inside, and without the need for a defoaming process. shall be.

本発明の構成 上記目的を達成するため、本発明の製造方法は、サーミ
スタの少なくともリード線に樹脂を固着させた後、この
サーミスタをケースの内径部内に挿着することを特徴と
する。
Structure of the Invention In order to achieve the above object, the manufacturing method of the invention is characterized in that after resin is fixed to at least the lead wire of the thermistor, the thermistor is inserted into the inner diameter of the case.

実施例 第2図(a)〜(d)は本発明に係る温度センサの製造
方法の工程を示す図である。まず第2図(a)に示すよ
うに、両端の軸方向にリード線1及び2を導出したガラ
ス封止型サーミスタ3を、前記リード線1及び2が適当
な間隔をおいて平行する如く、U状形にフォーミングし
た後、第2図(b)に示すように、リード線1及び2の
中間部分に絶縁樹脂5を固着させる。この絶縁樹脂5は
射出成形等の手段によって固着形成される。
Embodiment FIGS. 2(a) to 2(d) are diagrams showing steps of a method for manufacturing a temperature sensor according to the present invention. First, as shown in FIG. 2(a), a glass-sealed thermistor 3 with lead wires 1 and 2 led out in the axial direction at both ends is placed so that the lead wires 1 and 2 are parallel to each other with an appropriate distance between them. After forming into a U-shape, an insulating resin 5 is fixed to the intermediate portion of the lead wires 1 and 2, as shown in FIG. 2(b). This insulating resin 5 is fixedly formed by means such as injection molding.

また絶縁樹脂5としては、例えばエポキシ樹脂、ナイロ
ン、ポリエチレン樹脂、シリコン樹脂、ガラスエポキシ
樹脂、ポリブチレンテレフタレート(PBT)、  ポ
リエチレンテレフタレート (PET)、ポリフェニレ
ンサルファイド(PPS)、またはポリカーボネート等
が適当である。これにより第2(C)に示すように、後
述するケースの内径に適合する円形状等の絶縁樹脂5を
、リード線1及び2の中間部に固着したサーミスタが得
られる。
Suitable examples of the insulating resin 5 include epoxy resin, nylon, polyethylene resin, silicone resin, glass epoxy resin, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), or polycarbonate. As a result, as shown in FIG. 2(C), a thermistor is obtained in which an insulating resin 5 having a circular shape or the like that fits the inner diameter of the case described later is fixed to the intermediate portion of the lead wires 1 and 2.

−に述のように、本発明は、フォーミングされたサーミ
スタ3のリードlit及び2に対して予め絶縁樹脂5を
固着させる構造であるから、リード線1.2及びサーミ
スタ3に対する絶縁樹脂5の相対位置関係を所定の一定
値に保ったまま、確実に固着させることができる。
- As described in , the present invention has a structure in which the insulating resin 5 is fixed in advance to the leads lit and 2 of the formed thermistor 3. It is possible to securely fix the material while maintaining the positional relationship at a predetermined constant value.

次に第2図(d)に示すように、熱伝導性の良好な金属
材料で構成されたケース4の内径部41内に、サーミス
タ3側を先端側にして挿入する。
Next, as shown in FIG. 2(d), the thermistor 3 is inserted into the inner diameter portion 41 of the case 4 made of a metal material with good thermal conductivity, with the thermistor 3 facing toward the tip.

ケース4の内径部41は、絶縁樹脂5の外径と略等しい
内径を有する内径部分411と、この内径部分4↓1よ
り小径の内径部分412とを段状に連設させた構造とな
っていて、前記内径部分411に絶縁樹脂5を圧入嵌合
させた場合に、前記内径部分412にサーミスタ3が位
置するように組立てられる。この圧入組立工程において
、絶縁樹脂5の先端面51が内径部分411と412と
の間に形成される段面413に当接し、内径部分412
におけるサーミスタ3の位置決めがなされる。前記絶縁
樹脂5の後端は樹脂6で固定する。
The inner diameter portion 41 of the case 4 has a structure in which an inner diameter portion 411 having an inner diameter approximately equal to the outer diameter of the insulating resin 5 and an inner diameter portion 412 having a smaller diameter than the inner diameter portion 4↓1 are connected in a stepped manner. When the insulating resin 5 is press-fitted into the inner diameter portion 411, the thermistor 3 is assembled so as to be located at the inner diameter portion 412. In this press-fitting assembly process, the tip end surface 51 of the insulating resin 5 comes into contact with the stepped surface 413 formed between the inner diameter portions 411 and 412, and the inner diameter portion 412
The thermistor 3 is positioned at. The rear end of the insulating resin 5 is fixed with a resin 6.

またサーミスタ3の収納される内径部分412には、熱
伝導性の良好な充填物7、例えば油、シリコンゴム、樹
脂、コンパウンド等を充填しておいてもよい。
Further, the inner diameter portion 412 in which the thermistor 3 is accommodated may be filled with a filler 7 having good thermal conductivity, such as oil, silicone rubber, resin, compound, or the like.

上述のように、本発明においては、予め、リード線1.
2及びサーミスタ3に対する相対位置関係が所定の一定
値になるように、絶縁樹脂5を固着させたものを、ケー
ス4内に挿入して位置決めしつつ組立てる工程を採るか
ら、従来と異なって1組立工程における位置ズレな生じ
る余地がなく、ケース4の内径部41の内面に対するサ
ーミスタ3の相対的位置関係が一定に保たれ、個々の温
度センサにおいても、バラツキのない安定した温度検出
特性が得られ、歩留りが向上する。
As described above, in the present invention, the lead wire 1.
2 and thermistor 3 to a predetermined constant value, the insulating resin 5 is fixed and inserted into the case 4, and the assembling process is performed while positioning. There is no room for misalignment during the process, the relative positional relationship of the thermistor 3 to the inner surface of the inner diameter portion 41 of the case 4 is kept constant, and stable temperature detection characteristics without variations can be obtained even for individual temperature sensors. , yield is improved.

また、ケース4の内径部41に対して絶縁樹脂を注入充
填する工程が不要であるから、泡の発生、それによる温
度検出特性の変動等がなく、脱泡工程も不要になる。
Further, since the step of injecting and filling the inner diameter portion 41 of the case 4 with insulating resin is not necessary, there is no generation of bubbles and fluctuations in temperature detection characteristics due to the generation of bubbles, and a defoaming step is also not necessary.

更に絶縁樹脂の注入充填工程がなく、予めサーミスタ3
のリード線1.2に絶縁樹脂5を固着させたものを、ケ
ース4の内径部41内に挿入するだけでよいので、例え
ば第3図に示すように、サーミスタ3の位置する先端部
にスリ7ト8を設け、サーミスタ3を被検温雰囲気に直
接接触させる構造を採り、熱検出感度を向上させること
も可能である。
Furthermore, there is no insulating resin injection filling process, and the thermistor 3 is pre-filled.
It is only necessary to insert the lead wire 1.2 with the insulating resin 5 fixed into the inner diameter part 41 of the case 4. For example, as shown in FIG. It is also possible to improve the heat detection sensitivity by providing a structure in which the thermistor 3 is brought into direct contact with the temperature-tested atmosphere.

第4図(a)、(b)は本発明の別の実施例における製
造工程を示す図である。この実施例の特徴は、リード線
l及び2のフォーミングの後、リード線1及び2のみな
らず、サーミスタ3をも含む声うに絶縁樹脂5を固着さ
せ、これをケース4の内径部41内に圧入したことであ
る。
FIGS. 4(a) and 4(b) are diagrams showing manufacturing steps in another embodiment of the present invention. The feature of this embodiment is that after forming the lead wires 1 and 2, an insulating resin 5 is fixed to the body including not only the lead wires 1 and 2 but also the thermistor 3, and this is placed inside the inner diameter part 41 of the case 4. It was press-fitted.

上記実施例では、絶縁樹脂5を略円形状に形成したもの
を示したが、絶縁樹脂5の外形状はケース4の内径部4
1の形状と併せて種々の形状を採ることができる。例え
ば第5図に示すように、絶縁樹脂5の外周面及びこの絶
縁樹脂5の挿入される内径部分411の内周面にテーパ
を持たせ、絶縁樹脂5の挿入を簡単化することもできる
。この場合は絶縁樹脂5の後端を樹脂6で固定する代り
にバネ等で押圧する構造を採ることも可能である。更に
第6図に示すように、リード線1または2をジグザグに
屈曲9させることにより、リード線l、2と絶縁樹脂5
との間の接合強度を向上させる構造を採ることも可能で
ある。
In the above embodiment, the insulating resin 5 is formed into a substantially circular shape, but the outer shape of the insulating resin 5 is
In addition to the shape of 1, various shapes can be taken. For example, as shown in FIG. 5, the outer circumferential surface of the insulating resin 5 and the inner circumferential surface of the inner diameter portion 411 into which the insulating resin 5 is inserted may be tapered to simplify the insertion of the insulating resin 5. In this case, instead of fixing the rear end of the insulating resin 5 with the resin 6, it is also possible to adopt a structure in which it is pressed with a spring or the like. Furthermore, as shown in FIG.
It is also possible to adopt a structure that improves the bonding strength between the two.

本発明の効果 以上述べたように、本発明に係る温度センサの製造方法
は、サーミスタの少なくともリート線に樹脂を固着させ
た後、このサーミスタをケースの内径部内に挿着するこ
とを特徴とする特許サーミスタを、位置ズレを生じるこ
となく、ケース内の所定位置に確実に挿入位置決めする
ことが可能で、しかも絶縁樹脂中における泡の発生の余
地がなく、脱泡工程等が不要で、小型のものでも、特性
の揃った温度センサな、高歩留りで能率良く製造するこ
との可能な製造方法を提供することができる。
Effects of the Present Invention As described above, the method for manufacturing a temperature sensor according to the present invention is characterized by fixing resin to at least the Riet wire of the thermistor, and then inserting the thermistor into the inner diameter of the case. It is possible to securely insert and position the patented thermistor in the specified position within the case without causing positional deviation, and there is no room for bubbles to occur in the insulating resin, eliminating the need for a degassing process, etc., and making it compact. It is possible to provide a manufacturing method that can efficiently manufacture temperature sensors with uniform characteristics at a high yield.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)〜(C)は従来の温度センサの製造工程を
示す図、第2図(a)〜(d)は本発明に係る製造方法
の工程を概略的に示す図、第3図は同じく別の実施例に
おける最終工程での断面図、第4図(a)及び(b)は
同じく別の実施例における工程を概略的に示す図、第5
図は更に別の実施例における最終工程での断面図、第6
図は更に別の実施例における要部の断面図である。 l、2・・・リード線  3@Φ・サーミスタ4・・・
内洞      5・・・絶縁樹脂第1図 43   4z 第4図
FIGS. 1(a) to (C) are diagrams showing the manufacturing process of a conventional temperature sensor, FIGS. 2(a) to (d) are diagrams schematically showing the steps of the manufacturing method according to the present invention, and FIG. The figure is a sectional view at the final step in another embodiment, FIGS. 4(a) and 4(b) are diagrams schematically showing the steps in another embodiment, and FIG.
The figure is a sectional view at the final step in yet another embodiment, No. 6
The figure is a sectional view of essential parts in yet another embodiment. l, 2...Lead wire 3@Φ・Thermistor 4...
Inner cavity 5... Insulating resin Fig. 1 43 4z Fig. 4

Claims (6)

【特許請求の範囲】[Claims] (1)  サーミスタの少なくともリード線に樹脂を固
着させた後、このサーミスタをケースの内径部内に挿着
することを特徴とする温度センサの製造方法。
(1) A method for manufacturing a temperature sensor, which comprises fixing resin to at least the lead wire of the thermistor, and then inserting the thermistor into the inner diameter of the case.
(2) 前記リード線は前記サーミスタの軸方向の両端
に接続された一対のもので構成され、その一方をU状に
折曲げて同一方向に平行に導出し、その中間部に前記樹
脂を固着させることを特徴とする特許請求の範囲第1項
に記載の温度センサの製造方法。
(2) The lead wires are composed of a pair connected to both ends of the thermistor in the axial direction, one of which is bent into a U shape and led out in parallel in the same direction, and the resin is fixed to the middle part thereof. A method of manufacturing a temperature sensor according to claim 1, characterized in that:
(3) 前記ケースの前記サーミスタを位置させる部分
に、外部に通じる通孔を有することを特徴とする特許請
求の範囲第1項または第2項に記載の温度センサの製造
方法。
(3) The method of manufacturing a temperature sensor according to claim 1 or 2, wherein a portion of the case in which the thermistor is located has a through hole communicating with the outside.
(4) 前記リード線は前記サーミスタの軸方向の両端
に接続された一対のもので構成され、その一方をU状に
折曲げて同一方向に平行に導出し、前記サーミスタを含
んで前記リード線に前記樹脂を固着させることを特徴と
する特許請求の範囲第1項に記載の温度センサの製造方
法。
(4) The lead wire is composed of a pair connected to both ends of the thermistor in the axial direction, one of which is bent into a U shape and led out in parallel in the same direction, and the lead wire including the thermistor is 2. The method of manufacturing a temperature sensor according to claim 1, wherein the resin is fixed to the substrate.
(5) 前記樹脂の外周面及び該樹脂の外周面に当接す
る前記ケースの内周面は、テーパを有することを特徴と
する特許請求の範囲第1項、第2項、第3項または第4
項に記載の温度センサの製造方法。
(5) The outer circumferential surface of the resin and the inner circumferential surface of the case that abuts the outer circumferential surface of the resin have a taper. 4
2. Method for manufacturing the temperature sensor described in section.
(6) 前記リード線の前記樹脂を固着させる部分を、
ジグザグに屈曲させたことを特徴とする特許請求の範囲
第1項、第2項、第3項、第4項または第5項に記載の
温度センサの製造方法。
(6) A portion of the lead wire to which the resin is fixed,
The method for manufacturing a temperature sensor according to claim 1, 2, 3, 4, or 5, characterized in that the temperature sensor is bent in a zigzag manner.
JP7710683A 1983-05-01 1983-05-01 Manufacture of temperature sensor Pending JPS59202038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7710683A JPS59202038A (en) 1983-05-01 1983-05-01 Manufacture of temperature sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7710683A JPS59202038A (en) 1983-05-01 1983-05-01 Manufacture of temperature sensor

Publications (1)

Publication Number Publication Date
JPS59202038A true JPS59202038A (en) 1984-11-15

Family

ID=13624523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7710683A Pending JPS59202038A (en) 1983-05-01 1983-05-01 Manufacture of temperature sensor

Country Status (1)

Country Link
JP (1) JPS59202038A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4955980A (en) * 1985-10-02 1990-09-11 Omron Corporation Thermometer probe
WO1991020065A2 (en) * 1990-06-19 1991-12-26 Dylec Ltd. Status-reporting device
JPH053954U (en) * 1991-06-28 1993-01-22 株式会社クラベ Thermistor temperature detector
JP2006126067A (en) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd Method for manufacturing temperature sensor
JP2020067349A (en) * 2018-10-24 2020-04-30 三菱電機株式会社 Temperature sensor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4955980A (en) * 1985-10-02 1990-09-11 Omron Corporation Thermometer probe
WO1991020065A2 (en) * 1990-06-19 1991-12-26 Dylec Ltd. Status-reporting device
US5463375A (en) * 1990-06-19 1995-10-31 Dylec Ltd. Status-reporting device for reporting a predetermined temperature state, temperature sensor suitable for such a status-reporting device, and process for the production of such a temperature sensor
JPH053954U (en) * 1991-06-28 1993-01-22 株式会社クラベ Thermistor temperature detector
JP2006126067A (en) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd Method for manufacturing temperature sensor
JP2020067349A (en) * 2018-10-24 2020-04-30 三菱電機株式会社 Temperature sensor device
US11402274B2 (en) 2018-10-24 2022-08-02 Mitsubishi Electric Corporation Temperature sensor device

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