JPS5919394A - Method of soldering multiterminal element - Google Patents
Method of soldering multiterminal elementInfo
- Publication number
- JPS5919394A JPS5919394A JP12919082A JP12919082A JPS5919394A JP S5919394 A JPS5919394 A JP S5919394A JP 12919082 A JP12919082 A JP 12919082A JP 12919082 A JP12919082 A JP 12919082A JP S5919394 A JPS5919394 A JP S5919394A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- legs
- leg
- terminal element
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は工０等の多数の端子を有する素子をプリント配
線基板の端子上にハンダ付する多端子素子のハンダ付方
法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multi-terminal element soldering method for soldering an element having a large number of terminals, such as a multi-terminal element, onto terminals of a printed wiring board.
第１乃至第４図は従来の多端子素子１をプリント配線基
板２にハンダ付する方法を示すもので、第２図示のよう
に多端子素子１の脚３，３・・・・・・をプレスによシ
フランク状に折曲げ、その脚３の下端部３ａの下面を融
点１２℃〜１５０℃のクリームハンダ５を介してベーク
、フェノール、耐熱ガラス。1 to 4 show a conventional method of soldering a multi-terminal element 1 to a printed wiring board 2. As shown in the second figure, the legs 3, 3, etc. of the multi-terminal element 1 are soldered. The lower end portions 3a of the legs 3 are bent into a cylindrical shape using a press, and the lower surfaces of the legs 3 are coated with cream solder 5 having a melting point of 12° C. to 150° C., and then baked with phenol and heat-resistant glass.
エポキシ等よシなるプリント配線基板２上の鋼プリント
よシなる端子４，４・旧・・上に置き、これを加熱炉内
において下方よシ２１０℃に加熱してクリームハンダ５
を溶かし、脚３，３・・・・・・を端子４゜４・・・・
・・上にハンダ付していた。Place the terminals 4, 4, made of steel printed on the printed wiring board 2 made of epoxy, etc., and heat this downward to 210°C in a heating furnace and apply cream solder 5.
Melt the legs 3, 3... and connect them to the terminals 4゜4...
...It was soldered on top.
しかし実際には第４図示のように脚３の下端部３ａは完
全に水平にはならず、第４図の左側３ｂに示すように下
方に傾斜したシ、右側３Ｃに示すように上方に傾斜した
シする。これによシ脚３は１点す、ｃでしか接しないの
でハンダのつきが悪く、脚３と端子間の接続が不充分と
なシ抵抗が増大したシ、剥離したシする欠点がある。However, in reality, the lower end 3a of the leg 3 is not completely horizontal as shown in Figure 4, but is inclined downward as shown on the left side 3b of Figure 4, and upward as shown on the right side 3C. I did it. As a result, the legs 3 are in contact only at one point (a) and (c), resulting in poor solder adhesion, resulting in insufficient connection between the legs 3 and the terminals, resulting in increased resistance and peeling.
本発明はかかる欠点を除去するもので、以下第５図乃至
第７図につきその一実施例を第１図乃至第３図と同じ部
分は同じ符号を用いて詳細に説明する。The present invention aims to eliminate such drawbacks, and one embodiment thereof will be described in detail below with reference to FIGS. 5 to 7, using the same reference numerals for the same parts as in FIGS. 1 to 3.
第５図示のように多端子素子１の脚３，３・・・・・・
の中間部３ｄをプレスによＪＵ字に折曲げ、更比その先
端３ｅを長く延長する。これを第６図示のようにクリー
ムハンダ５を介して端子４，４上に置き、これを加熱す
る。これによって先づ脚３が加熱され、次にクリームハ
ンダ５が加熱されてりリームハンダ５は融け、その表面
張力によシ第７図示のようにその中間部３ｄの両側に付
着し、脚３．３・・・・・・を強固に端子４，４・・・
・・・に接着するものである。As shown in the fifth diagram, the legs 3, 3 of the multi-terminal element 1...
The intermediate portion 3d of the wafer is bent into a JU shape using a press, and the tip 3e of the wafer is further extended. This is placed on the terminals 4, 4 via cream solder 5 as shown in the sixth figure, and heated. As a result, first the leg 3 is heated, and then the cream solder 5 is heated, and the ream solder 5 melts and adheres to both sides of the intermediate portion 3d due to its surface tension, as shown in Figure 7, and the leg 3. 3. Firmly connect terminals 4, 4...
It is attached to...
以上のように本発明によれば多端子素子の脚の中間部を
Ｕ字状に折曲げて端子上におＡているのでハンダはその
表面張力によシその両側に付着するものであるが、特に
本発明にお匹ては脚の先端を長く延長しているので、そ
の熱容量が大きく、したがってその温度差によシ融けた
ハンダを先端の方に吸引するので、ハンダの付きがよく
なシ、脚を強固に安定よく小抵抗で接着するものである
。As described above, according to the present invention, the middle part of the leg of the multi-terminal element is bent into a U-shape and placed on the terminal, so the solder adheres to both sides of the leg due to its surface tension. In particular, in accordance with the present invention, since the tip of the leg is extended long, its heat capacity is large, and the melted solder is sucked toward the tip due to the temperature difference, so that the solder sticks well. The legs are firmly and stably bonded with low resistance.
第１図は従来の多端子素子をハンダ付したプリント配線
基板の平面図、第２図乃至第４図はそのハンダ付順序を
示す説明図、第５図乃至第７図は本発明のハンダ付順序
を示す説明図である。
１・・・・・・・・・多端子素子、３・・・・・自・・
脚、３θ・・・・・・・・・先端、４・・・・・・・・
・端子、５・・・・・・・・・クリームハンダ。
代理人弁理士 Ｅ −；、：、；ｒ５゜第１図
第２図
第３図
４４６FIG. 1 is a plan view of a conventional printed wiring board to which multi-terminal elements are soldered, FIGS. 2 to 4 are explanatory diagrams showing the soldering order, and FIGS. 5 to 7 are soldering diagrams of the present invention. FIG. 2 is an explanatory diagram showing the order. 1...Multi-terminal element, 3...Self...
Leg, 3θ...Tip, 4...
・Terminal, 5...Cream solder. Representative Patent Attorney E -;, :, ;r5゜Figure 1 Figure 2 Figure 3 446
Claims (1)
げると共にその先端を長く延長させ、これをクリームハ
ンダを介して端子上に置き、加熱してなる多端子素子の
ハンダ付方法。A method for soldering a multi-terminal element by bending the middle part of the leg of the multi-terminal element into a fin-shape using a press, elongating the tip thereof, placing it on the terminal via cream solder, and heating it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12919082A JPS5919394A (en) | 1982-07-23 | 1982-07-23 | Method of soldering multiterminal element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12919082A JPS5919394A (en) | 1982-07-23 | 1982-07-23 | Method of soldering multiterminal element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5919394A true JPS5919394A (en) | 1984-01-31 |
Family
ID=15003364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12919082A Pending JPS5919394A (en) | 1982-07-23 | 1982-07-23 | Method of soldering multiterminal element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5919394A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6790747B2 (en) | 1997-05-12 | 2004-09-14 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
-
1982
- 1982-07-23 JP JP12919082A patent/JPS5919394A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6790747B2 (en) | 1997-05-12 | 2004-09-14 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
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