JPS59163844A - Cooling construction of lsi package - Google Patents
Cooling construction of lsi packageInfo
- Publication number
- JPS59163844A JPS59163844A JP3865083A JP3865083A JPS59163844A JP S59163844 A JPS59163844 A JP S59163844A JP 3865083 A JP3865083 A JP 3865083A JP 3865083 A JP3865083 A JP 3865083A JP S59163844 A JPS59163844 A JP S59163844A
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- heat
- boiling point
- low boiling
- point liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（１）発明の属する技術分野の説明
本発明はＬＳＩパッケージの冷却構造に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (1) Description of the technical field to which the invention pertains The present invention relates to a cooling structure for an LSI package.
（２）従来技術の説明
従来、この種のＬＳＩパッケージの冷却構造においては
、Ｔ、ＳＩ基板のＬＳＩ搭載面の裏側にヒートシンクが
取り付けられ、これを送風機により強制空冷するように
しており、ＬＳＩ （大規模集積回路）から発生する熱
はＬＳＩ基板を介してヒートシンクに伝導し、ヒートシ
ンクから空気中に放熱されている。(2) Description of the Prior Art Conventionally, in the cooling structure of this type of LSI package, a heat sink is attached to the back side of the LSI mounting surface of the T and SI board, and this is forcedly air-cooled by a blower. The heat generated from the large-scale integrated circuit (large-scale integrated circuit) is conducted to the heat sink via the LSI board, and is radiated from the heat sink into the air.
一般にＬＳＩには、その動作保証の点から厳しい温度制
限があり、ＬＳＩの温度はある限度以下に抑える必要が
ある。しかし、ＬＳＩの集積度が飛躍的に増大している
現在、その発熱量も増大する一方であり、送風機を大型
化するだけでは、ＬＳＩの温度を前記制限温度以下に抑
えられなくなってきている。Generally, LSIs have strict temperature limits in order to guarantee their operation, and the temperature of the LSI must be kept below a certain limit. However, as the degree of integration of LSIs is increasing dramatically, the amount of heat generated by them is also increasing, and it is no longer possible to keep the temperature of LSIs below the above-mentioned limit temperature simply by increasing the size of the blower.
（３）発明の詳細な説明
本発明の目的は冷却効果の大きいＬＳＩパッケージの冷
却構造を提供することにある。(3) Detailed Description of the Invention An object of the present invention is to provide a cooling structure for an LSI package that has a large cooling effect.
（４）発明の構成
本発明は、Ｔ、ＳＩ基板の一面にＬＳＩ等の電子部品を
、また他面に平板ヒートシンクをそれぞれ増刊けたＬＳ
Ｉパッケージを複数個搭載したＬＳＩカードと、相互間
を電気的に接続して該複数枚のＬＳＩカードを平行でか
つ直立状態に保持し、しかもＬＳＩカードに電気を供給
する電源バスを保持するＬＳＩボードと、前記ＬＳＩカ
ードを保持しだＴ、ＳＩボードを低沸点液体冷媒に浸漬
してこれを収納する容器と、該容器の上部空間を密閉し
、容器の上部空間に面する端面に複数の平板ヒートシン
クを備え且つ内部に冷水が流れる冷却モジュールとを有
することを特徴とするＬＳＩパッケージの冷却構造であ
る。(4) Structure of the Invention The present invention provides an LS with electronic components such as LSI on one side of a T and SI board and a flat heat sink on the other side.
An LSI that holds an LSI card equipped with a plurality of I packages, electrically connects them to each other to hold the plurality of LSI cards in a parallel and upright state, and also holds a power supply bus that supplies electricity to the LSI card. A board, a container for holding the LSI card, a container for storing the SI board immersed in a low-boiling liquid refrigerant, and a container having an upper space sealed and a plurality of This is a cooling structure for an LSI package characterized by having a flat heat sink and a cooling module through which cold water flows.
（５）この発明の詳細な説明
次に本発明の一実施例について図面を参照して詳細に説
明する。(5) Detailed Description of the Invention Next, one embodiment of the invention will be described in detail with reference to the drawings.
第１図において、本発明の冷却構造はＬＳＩ基板２の一
面にＬＳＩ １を、まだ他面にヒートシンク３をそれぞ
れ取付けだＬＳＩパッケージ４を多数搭載したＬＳＩカ
ード５と、相互間を電気的に接続して該複数枚のＬＳＩ
カード５．・・・・・・を平行でかつ直立状態に保持し
、しかもＬＳＩカード５．・・・・・・に電力を供給す
る電源バス６を保持するＬＳＩボード７と、前記ＬＳＩ
カード５を保持したＬＳＩボード７を低沸点液体冷媒８
に浸漬してこれを収納する容器９と、該容器９の上部空
間を密閉し、容器９の」二部空間に面する端面に複数の
平板ヒートシンク１０．・・・・・・を備え、内部に冷
水が流れる冷却モジュール１１とを有するものである。In FIG. 1, the cooling structure of the present invention has an LSI 1 mounted on one surface of an LSI board 2 and a heat sink 3 mounted on the other surface. An LSI card 5 having a large number of LSI packages 4 mounted thereon is electrically connected to each other. and the plurality of LSIs
Card 5. . . . in a parallel and upright state, and LSI card 5. An LSI board 7 holding a power supply bus 6 that supplies power to .
The LSI board 7 holding the card 5 is transferred to the low boiling point liquid refrigerant 8
A container 9 is immersed in water to store it, and the upper space of the container 9 is sealed, and a plurality of flat heat sinks 10. . . , and a cooling module 11 in which cold water flows.
ＬＳＩパッケージ４が実装される電子計算機等の電子装
置は、ＬＳ：［１の高集積化を背景に高密度化及び小型
化が急激に進行しており、最近では超大型電子計算機等
においてもその論理装置部分及び主記憶装置部分は、前
記ＬＳＩカード５が１０枚程度で構成されるＪ：うにな
ってきている。このような高密度化、小型化に伴って冷
却効率が良いものが要求される。実施例において、Ｔ、
ＳＩ １から発生した熱はＬＳＩ基板２を介してヒート
シンク３に伝導され、ヒートシンク３の表面からフロン
等の不活性な低沸点液体冷媒８の気化熱によって奪われ
、さらに気化した低沸点液体冷媒８は容器９の上部空間
内に上昇し、常時流れている冷水によって低沸点液体冷
媒８の沸点以下に冷却されている冷却モジュール１１の
平板ヒートシンク１０に接触することによって冷却され
、液体になって滴下する。Electronic devices such as computers in which LSI packages 4 are mounted are rapidly increasing in density and becoming smaller due to the high integration of LS: The logical device portion and the main storage device portion are now composed of about 10 LSI cards 5. With such high density and miniaturization, there is a demand for something with good cooling efficiency. In the example, T,
The heat generated from the SI 1 is conducted to the heat sink 3 via the LSI board 2, and is removed from the surface of the heat sink 3 by the heat of vaporization of an inert low boiling point liquid refrigerant 8 such as Freon, and further vaporized low boiling point liquid refrigerant 8. The liquid rises into the upper space of the container 9 and is cooled by contacting the flat plate heat sink 10 of the cooling module 11, which is cooled to below the boiling point of the low boiling point liquid refrigerant 8 by constantly flowing cold water, and is turned into a liquid and drips. do.
上述した熱の放熱経路を第１の経路とする。一方、ＬＳ
Ｉ １を覆う保護用のキャップ１２を通して低沸点液体
冷媒８に伝達される第２の経路があり、この両方から放
熱される。しかし、第２の経路の場合、ＬＳＩ １とキ
ャップ１２との間は普通、空気又は熱伝導率のあまり良
くない充填剤によって埋められているため、他の部分に
比較して熱抵抗が大きく、Ｔ、ＳＩ １の発生した熱は
主に第１の経路を通して放熱される。The heat dissipation path described above is defined as the first path. On the other hand, L.S.
There is a second path to the low boiling liquid refrigerant 8 through the protective cap 12 covering the I 1 and heat is dissipated from both. However, in the case of the second route, the space between the LSI 1 and the cap 12 is usually filled with air or a filler with poor thermal conductivity, so the thermal resistance is large compared to other parts. The heat generated by T, SI 1 is mainly radiated through the first path.
一般に本発明のような沸騰冷却方式を採用した場合のＴ
、ＳＩ １の温度Ｔｊは次式で表わされる。In general, T when adopting a boiling cooling method like the present invention
, SI 1 is expressed by the following equation.
Ｔｊ ＝ Ｔｃ十△Ｔ’ｃ−ｈ＋△Ｔｈ−ｊ ・・
−・−・−（１）ここで、ＴＣ：低沸点液体冷媒８の沸
点△Ｔｃ−ｈ： 低沸点冷媒８からヒートシンク３！
ｆ、での沸騰熱伝達に基づく温
度差
△Ｔｈ−，ｊ ＝ヒートシンク３からＴ、ＳＩ １丑で
の熱伝導に基づく温度差
とのＴｊをＬＳＩの制限温度以下に抑える必要があるが
、前述の」：うにＬＳＩ １の発生した熱は熱伝導率の
大きな固体中を伝導していくので、△Ｔｈ−ｊは非常に
小さく、寸た相変化を伴う気化熱は非常に大きいので、
△Ｔｃ−ｈは小さい。ＴＣは定数であるが、５０℃前後
の低沸点のものが市販されており、さらに低沸点のもの
も製造可能である。従って、ＬＳｌｌの温度Ｔｊはその
発熱量が非常に増大しても、前記制限温度以下に充分抑
えることができる。Tj = Tc+△T'c-h+△Th-j ・・
-・-・-(1) Here, TC: Boiling point of low boiling point liquid refrigerant 8 △Tc-h: From low boiling point refrigerant 8 to heat sink 3!
Temperature difference △Th-,j due to boiling heat transfer at f, = Tj from heat sink 3 to temperature difference based on heat conduction at T, SI 1. It is necessary to suppress Tj to below the limit temperature of the LSI, but as mentioned above ': The heat generated by Uni LSI 1 is conducted through a solid with high thermal conductivity, so △Th-j is very small, and the heat of vaporization that accompanies a small phase change is very large.
ΔTc-h is small. Although TC is a constant, those with a low boiling point of around 50°C are commercially available, and those with even lower boiling points can be manufactured. Therefore, the temperature Tj of LSll can be kept sufficiently below the above-mentioned limit temperature even if its calorific value increases significantly.
本発明において、Ｔ、ＳＩ基板２にヒートシンク３を取
付けだ構成は沸騰冷却の場合、非常に効果がある。すな
わち、ヒートシンク３の有無による熱の拡がりは第３図
に示すように、ヒートシンク３がない場合にはＬＳＩ基
板２の表面から低沸点液体冷媒８に伝達される熱抵抗が
非常に小さいため、ＬＳＩ基板２の中ではあ捷り拡がら
ず、第３図に示す短い太線Ｌ１の部分からのみ低沸点液
体冷媒８に熱伝達される。そこで、大量の熱量を小さい
温度差で伝導できる程度の厚さくたとえば３〜５〔朋〕
位）を持った銅又はアルミニウム等熱伝導率の優れた金
属をヒートシンク３として付けることによゆ、第４図に
太線Ｌ２で示すように熱伝達面をＴ、ＳＩ基板２の全面
程度にまで拡大できる。この拡大率は５〜１０倍にも達
し、その部分の熱抵抗を１〜Ｘ１０
にすることができる。さらにヒートシンク３は平板であ
るため、高さが高くならないので、ＬＳＩカード５の実
装間隔を狭めることができ、装置の高密度化に適してい
る。またＬＳＩカード５を垂直にすることは低沸点液体
冷媒８の気泡の上昇を容易にするので冷却上効果がある
。In the present invention, the configuration in which the heat sink 3 is attached to the T, SI substrate 2 is very effective in the case of boiling cooling. In other words, as shown in FIG. 3, heat spreads depending on the presence or absence of the heat sink 3. In the absence of the heat sink 3, the thermal resistance transferred from the surface of the LSI board 2 to the low boiling point liquid coolant 8 is extremely small. The heat does not spread in the substrate 2, and the heat is transferred to the low-boiling liquid refrigerant 8 only from the short thick line L1 shown in FIG. Therefore, the thickness should be thick enough to conduct a large amount of heat with a small temperature difference, for example, 3 to 5.
By attaching a metal with excellent thermal conductivity, such as copper or aluminum, which has a Can be expanded. This magnification can reach as much as 5 to 10 times, and the thermal resistance of that part can be 1 to X10. Furthermore, since the heat sink 3 is a flat plate, its height does not increase, so the mounting interval of the LSI cards 5 can be narrowed, and it is suitable for increasing the density of the device. Furthermore, vertically positioning the LSI card 5 facilitates the rise of bubbles in the low-boiling liquid refrigerant 8, which is effective in terms of cooling.
（６）発明の詳細な説明
本発明は以上説明したようにＬＳＩの熱を低沸点液体冷
媒の気化熱によって奪ってこれを放熱するようにしたの
で、ＬＳＩパッケージに対する冷却能力を向上すること
ができ、ＬＳＩの集積度の増加に伴なうその発熱量の増
大に十分に対処できる効果を有するものである。(6) Detailed Description of the Invention As explained above, the present invention removes heat from an LSI using the heat of vaporization of a low-boiling liquid refrigerant and radiates the heat, thereby improving the cooling capacity for the LSI package. This has the effect of being able to sufficiently cope with the increase in heat generation due to the increase in the degree of integration of LSI.
第１同は本発明の一実施例を示す正面図、第２図は第１
図のＡ部の拡大断面図、第３図、第４図は熱拡散図であ
る。
１・・・Ｔ、ＳＩ （大規模集積回路）、２・・・ＬＳ
Ｉ基板、３・・・ヒートシンク、４・・・ＬＳＩパッケ
ージ、５・・・ＬＳＩカード、６・・・電源バス、７・
・・ＬＳＩボード、８・・・低沸点液体冷媒、９・・・
容２Ｋ、１０・・・平板ヒートシンク、１１・・・冷却
モジュール
特許出願人 日本電気株式会社Fig. 1 is a front view showing one embodiment of the present invention, and Fig. 2 is a front view showing an embodiment of the present invention.
The enlarged sectional view of part A in the figure, FIGS. 3 and 4 are thermal diffusion diagrams. 1...T, SI (Large Scale Integrated Circuit), 2...LS
I board, 3... Heat sink, 4... LSI package, 5... LSI card, 6... Power bus, 7...
...LSI board, 8...Low boiling point liquid refrigerant, 9...
2K, 10... Flat plate heat sink, 11... Cooling module patent applicant NEC Corporation
Claims (1)
他面に平板ヒートシンクをそれぞれ取付けたＬＳＩパッ
ケージを複数個搭載したＴ、ＳＩカードと、相互間を電
気的に接続して該複数枚のＴ、ＳＩカードを平行で、か
つ直立状態に保持し、しかもＬＳＩカードへの電力供給
用電源バスを保持するＬＳＩボードと、前記ＬＳＩカー
ドを保持したＬＳＩボードを低沸点液体冷媒に浸漬して
これを収納する容器と、該容器の上部空間を密閉し、容
器の上部空間に面する端面に複数の平板ヒートシンクを
備え内部に冷水が流れる冷却モジュールとを有すること
を特徴とすルＴ、ＳＩパッケージの冷却構造。(1) A T/SI card is equipped with a plurality of LSI packages each having an electronic component such as an LSI on one side of the LSI board and a flat heat sink attached to the other side, and the plurality of LSI packages are electrically connected to each other. The LSI board holding the power supply bus for supplying power to the LSI card and the LSI board holding the LSI card are immersed in a low boiling point liquid refrigerant. and a cooling module that seals the upper space of the container, has a plurality of flat heat sinks on the end face facing the upper space of the container, and allows cold water to flow inside. Cooling structure of SI package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3865083A JPS59163844A (en) | 1983-03-09 | 1983-03-09 | Cooling construction of lsi package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3865083A JPS59163844A (en) | 1983-03-09 | 1983-03-09 | Cooling construction of lsi package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59163844A true JPS59163844A (en) | 1984-09-14 |
Family
ID=12531125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3865083A Pending JPS59163844A (en) | 1983-03-09 | 1983-03-09 | Cooling construction of lsi package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59163844A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5006925A (en) * | 1989-11-22 | 1991-04-09 | International Business Machines Corporation | Three dimensional microelectric packaging |
-
1983
- 1983-03-09 JP JP3865083A patent/JPS59163844A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5006925A (en) * | 1989-11-22 | 1991-04-09 | International Business Machines Corporation | Three dimensional microelectric packaging |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI722408B (en) | Server tray package and method for cooling heat generating devices in data center | |
| US5826643A (en) | Method of cooling electronic devices using a tube in plate heat sink | |
| US5049982A (en) | Article comprising a stacked array of electronic subassemblies | |
| Bar-Cohen | Thermal management of air-and liquid-cooled multichip modules | |
| KR100866918B1 (en) | Low-profile thermosyphon-based cooling system for computers and other electronic devices | |
| US20130139998A1 (en) | Cooling system, electronic equipment, and method for cooling heating element | |
| US5933323A (en) | Electronic component lid that provides improved thermal dissipation | |
| US20110214904A1 (en) | Heat Sink, Cooling Module And Coolable Electronic Board | |
| JP2624415B2 (en) | Electronic element mounting cooling system | |
| US5812372A (en) | Tube in plate heat sink | |
| GB2449143A (en) | Electronic circuit modules cooling | |
| US11742259B2 (en) | Circuit board with phase change material | |
| US20050088823A1 (en) | Variable density graphite foam heat sink | |
| JPH05335454A (en) | Cooler for electronic apparatus | |
| US6000125A (en) | Method of heat dissipation from two surfaces of a microprocessor | |
| JPH09213851A (en) | Heat radiation method and heat radiation means for ic device | |
| GB2342152A (en) | Plate type heat pipe and its installation structure | |
| JPS59163844A (en) | Cooling construction of lsi package | |
| JPH02114597A (en) | Method of cooling electronic device | |
| JP2002261481A (en) | Cooler for electronic component which generates heat | |
| JP2023503012A (en) | heatsink for liquid cooling | |
| JPH0320070B2 (en) | ||
| GB2422726A (en) | Thermally conductive cover with cooling liquid | |
| JPS59208761A (en) | Electronic part cooling mechanism | |
| JP2567980Y2 (en) | Heat pipe studs and heat pipe stud integrated circuit components |