JPS59134853A - Manufacture of enclosure with earth lead - Google Patents

Abstract

PURPOSE:To obtain an earth lead which has high connecting strength by forming a recess by pressing at the periphery of a mount of a base for forming an enclosure, and providing an earth lead projected from the back surface of the base corresponding to the bottom of the recess. CONSTITUTION:A header 10 of copper having 1.6mm. thick is placed on a die 12 which has a die hole 11 of 0.5mm. of bore and 2.1mm. of depth. The position of the die 12 is on the back surface of the header 10 under the peripheral region 13 of a mount 17. When a punch 14 is pressed to form a recess 15, the quantity corresponding to the volume of the recess 15 is projected into the hole 11 to form an earth lead 16. Since the lead is formed integrally with the same member as the header, the connecting strength is high, and the lead can be formed in simple steps, the manufacturing cost is remarkably reduced.

Description

[Detailed description of the invention] The present invention relates to a method of manufacturing an envelope with a ground lead.

A ground lead is formed on the lower surface of a header constituting an envelope to which a semiconductor element is mounted, in order to establish an electrical connection with the semiconductor element.

The ground lead is formed by connecting the header 1 as shown in Figure 1.
This is done by resistance welding between the bottom surface of the ground lead 2 and the ground lead 2 prepared separately. With such resistance welding, there is a large variation in adhesive strength, so an accident in which the welded earth lead 2 comes off easily occurs. Resistance welding requires a lot of man-hours and has poor workability, resulting in high manufacturing costs.

Further, as shown in FIG. 2, an earth lead 2 is attached to the lower surface of the header 1 via a silver soldering member 3. If silver soldering is used, the production cost will be high because silver soldering is expensive. Furthermore, silver brazing also requires a large number of man-hours and has poor workability.

The present invention has been made in view of the above-mentioned problems.The present invention has been made in view of the above-mentioned problems.The present invention has been made in view of the above-mentioned problems. The present invention provides a method for manufacturing.

Embodiments of the present invention will be described below with reference to the drawings.

First, as shown in FIG. 3(4), an envelope forming base 10 (hereinafter referred to as a header) made of, for example, floating 1.6n copper is prepared. This header 10 has an inner diameter of 0.5
Die 1 with die hole 11 of MIn + depth 2.1n
Place it on 2. The die 12 is located on the back surface side of the header 10 corresponding to the lower part of the peripheral area 13 of the pellet mount section 17 of the header IO. Next, the peripheral area 13 of the pellet mount part 17 is pressed from above with the punch 14 to form a recess 15 with an inner diameter of 0.85 iMm and a depth of 0.75 mm, as shown in the figure).
form. At this time, on the back side of the header 10, a header forming member in an amount corresponding to the volume of the recess 15 protrudes into the die hole 11, and an earth lead 16 is formed. Therefore, there is no need to attach a ground lead again, and the manufacturing process can be simplified. Moreover, since the recess 15 and the ground lead 16 are formed by press working, the number of necessary parts can be reduced and workability can be improved.

Since the ground lead 16 and the header 10 are integrally formed using the same part, the connection strength between the two is extremely high. In addition, the process is simple and workability can be improved, so manufacturing costs can be significantly reduced.

In the embodiment, the inner diameter of the recess 15 is also the same as that of the die hole 11.
The inner diameter of the ground may be made small to form an elongated ground. Moreover, the shape of the four parts 15 and the shape of the earth lead 16 may be any shape.

In addition, in the case of a stem that requires a large protruding length of the ground lead 16, this can be used as a ground wire for bonding a separately prepared ground lead wire (not shown) by welding, silver soldering, nickel soldering, etc. Can be a lead contact.

As explained above, according to the method for manufacturing an envelope with a ground lead according to the present invention, it is possible to reduce the number of parts and obtain an envelope having a ground lead with high connection strength through a simple process at a low cost. It has such remarkable effects.

[Brief explanation of drawings]

Figure 1 is an explanatory diagram showing an envelope with a ground lead formed by resistance welding, Figure 2 is an explanatory diagram showing an envelope with a ground lead formed by silver brazing, and Figure 3 (A ) and ) of the same figure are explanatory diagrams showing the method of the present invention in the order of steps. lO...Henogu, 11...Dice hole, 12...
Die, 13...Bellet mount portion formation area, 1
4... Punch, 15... Recess, 16... Earth lead, 17... Pellet mount part. Applicant's agent Patent attorney Takehiko Suzue Figure 1
Figure 2 (A) (B)

Claims (1)

[Claims] A concave portion is formed by press processing in the peripheral area of the Ω-bellet mount portion of the base body for forming an envelope, and a region corresponding to the floor surface of the concave portion is protruded to the back side of the base body for forming an envelope to connect an earth lead or ground. A method for manufacturing an envelope with a ground lead, characterized by forming a lead contact.