JPS59112700A - Waterproof device for printed board - Google Patents

Waterproof device for printed board

Info

Publication number
JPS59112700A
JPS59112700A JP22277782A JP22277782A JPS59112700A JP S59112700 A JPS59112700 A JP S59112700A JP 22277782 A JP22277782 A JP 22277782A JP 22277782 A JP22277782 A JP 22277782A JP S59112700 A JPS59112700 A JP S59112700A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
case
waterproof
boss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22277782A
Other languages
Japanese (ja)
Other versions
JPH043677B2 (en
Inventor
守記 福田
芳雄 中谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP22277782A priority Critical patent/JPS59112700A/en
Publication of JPS59112700A publication Critical patent/JPS59112700A/en
Publication of JPH043677B2 publication Critical patent/JPH043677B2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野  ・ 本発明はプリント基板の防水装置7に関し、例えば洗′
m機や自動車等に電子コントローラを塔載する場合に好
適に適用し得るものに関する。
[Detailed Description of the Invention] Industrial Application Field - The present invention relates to a waterproofing device 7 for printed circuit boards, for example,
The present invention relates to something that can be suitably applied when an electronic controller is mounted on a machine, an automobile, or the like.

9を一来例の構成とその問題点 例えは、洗濯機に電子コントローラを塔載する・靜には
、l1図に示す様に、紙エポキシ等のプリント基板(1
)に電子部品を実装しfc後、チクソトロピック性を付
与した溶剤型アクリル系樹脂■にディッピングして電子
部品の端子(3)ヲ含めてプリント基板(1)全体を完
全に樹脂■でコーティングし、第2図に示す様に、プリ
ント基板(1)に設けられた取付穴(小を介して洗濯機
のトップマーク(化粧箱)(51に設けられた取付用ボ
ス(6)に取付ねじ(7)で固定している。ところが、
第1図に示す様に電子部品の端子(Jのエツジを含めて
プリント基板(1)全体を樹脂■でコーティングするに
は、チクントロビック性のある溶剤型アクリル系樹脂Q
)を用いる必要があって粘度が23ポアズと高く、ディ
ッピング後すぐに乾燥すると溶剤により発泡してピンホ
ールができるたぬ、長時間室温放置した後、強制乾燥し
なければならなかった。このため、自動化が内靴であり
、大量生産も不可能であった。また、電子部品の端子(
31には20μm前後の薄い樹脂(2)の膜が形成され
ており、これが軟かいため、洗溜機に組込む隙に物にこ
すったりすると剥離するといった不良と生じ、さらには
溶剤型であるために粘度管理が必豊であったり、作業環
境を慾くするといつ1γ問題かあった。又、粘度が高い
ため、液面制御によるコーティングが困難であり、その
ため=を動部を有するスイッチの塔載が困Jであり、非
1’Hに高価なリードスイッチを使わねばならないとい
った側材もあった。
9 is an example of the previous configuration and its problems.As shown in Figure 1, an electronic controller is mounted on a washing machine.
) and after FC, the entire printed circuit board (1) including the terminals (3) of the electronic components is completely coated with resin ■ by dipping it in solvent-type acrylic resin ■ that has been given thixotropic properties. As shown in Fig. 2, insert the mounting screw (6) into the mounting boss (6) provided at the top mark (presentation case) (51) of the washing machine through the mounting hole (small) provided on the printed circuit board (1). 7) is fixed. However,
As shown in Figure 1, in order to coat the entire printed circuit board (1) including the terminals (J edges) of electronic components with resin ■, a solvent-based acrylic resin Q
), the viscosity was as high as 23 poise, and if it was dried immediately after dipping, the solvent would foam and form pinholes, so it had to be left at room temperature for a long time and then force-dried. For this reason, automation was a necessity, and mass production was impossible. In addition, the terminals of electronic components (
31 has a thin resin (2) film of around 20 μm formed on it, and because this is soft, it can cause defects such as peeling if it is rubbed against an object while being installed in a washer, and furthermore, because it is a solvent type. If viscosity control is necessary or the work environment is unfavorable, 1γ problems may occur. In addition, due to the high viscosity, it is difficult to coat by controlling the liquid level, which makes it difficult to mount a switch with moving parts, and it is necessary to use an expensive reed switch for non-1'H side materials. There was also.

発明の目的 本発明は、従来のかかる問題点に鑑み、量産性、高品質
を確保することができ、しかも液面:t++l taが
容易にできて実装上の制限!大巾に取除くことができる
プリント基板の防水装置を提供することを目的とする。
OBJECTS OF THE INVENTION In view of the conventional problems, the present invention can ensure mass productivity and high quality, and can easily achieve a liquid level of t++l ta, eliminating any limitations on implementation! The purpose of the present invention is to provide a waterproofing device for a printed circuit board that can be easily removed.

発明の構成 本発明は、この目的を達成するため、−側が開口し、た
ケースの内部に、電子部品る実装されたプリント基板を
配置し、このケースには前記プリント基板に設けられた
取付穴を先端部が貫通し、基部がこのプリン)A板に係
合するボス部を設けると共にこのボス部に取付ねじが貫
通する貫通穴を設け、す[j記ケース内に前記プリント
基板と実装さ才また電子部品の少くとも導体部を埋入さ
せる防水性充填材を充填したプリント基板の防水装置を
提供する。
Structure of the Invention In order to achieve this object, the present invention arranges a printed circuit board on which electronic components are mounted inside a case whose negative side is open, and the case has mounting holes provided in the printed circuit board. A boss part is provided in which the tip part passes through and the base part engages with the printed circuit board A), and a through hole is provided in this boss part through which the mounting screw passes; To provide a waterproof device for a printed circuit board filled with a waterproof filler in which at least a conductor part of an electronic component is embedded.

実施例の説明 以下本発明の一実施例を第3図乃至第5図に基づいて説
明する。(8)は脅威樹脂成形品から成るケースであり
、その内部に可動させるブツシュスイッチ00%LED
(発光素子) [111及びマイコン俄等の電子部品を
実装されたプリント基板(1)が配置されている。この
プリント基板(1)は前記ケース(g内に底面から突設
し、た4個のボス(9)にてケース8)底面に接触しな
い様にかつプリント基板(1)及び電子部品の少くとも
導体部がケース開口端より突出しない様に支持されてい
る。すなわち、ボス(9)は、その先端部がプリント基
板(1)の取付穴(4)よりも小径に形成されてこの取
付穴(4)を貫通し、基部は取付穴(4)よりも大径に
形成されてプリント基板(1)に係合する様に形成され
ている。また、このボス(9)にはプリント基板(1)
の数句ねじ(7)が貫通ずる貫通穴(9a)が形成され
ている。この様にプリント基板(1)を内部に収容支持
したケース(1)内に、與4図に示す様に防水用樹脂や
ホットメルト、ワックス等の防水性充填材(13)が充
填硬化され、この防水i生充填相f131中にプリント
基板(1)及島それIt(実装上れた。b、子部品の少
くとも導体部が埋入している。こうして、ケース(81
と防水性充填材(13)で防水処ツされたプリント基板
(1)は、第5図に示す様に、先イ′ζAωのトップマ
ーク(化粧箱)(5)に設けられ斤取付用ボス(6)に
取付ねじ(7)にて固定される。すなわち、取付用ボス
(6)にケース(8)のボス(9)を対接させ、ボス■
)ニ設ケら才tた貫通穴(9a)を介してタッピングね
じからなる取付ねじ(71を取付用ボス(6)に螺入さ
せることによりプリント基板(1)を装置するのである
DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 3 to 5. (8) is a case made of plastic molded product, with a movable bush switch 00% LED inside.
(Light Emitting Element) [111] A printed circuit board (1) on which electronic components such as a microcomputer and the like are mounted is arranged. This printed circuit board (1) is provided in the case (g) protruding from the bottom surface, and is provided with four bosses (9) so as not to contact the bottom surface of the case 8, and at least as far as possible between the printed circuit board (1) and the electronic components. The conductor portion is supported so as not to protrude beyond the opening end of the case. That is, the tip of the boss (9) is formed with a smaller diameter than the mounting hole (4) of the printed circuit board (1) and passes through the mounting hole (4), and the base is larger than the mounting hole (4). It is formed to have a diameter and is formed to engage with the printed circuit board (1). Also, this boss (9) has a printed circuit board (1).
A through hole (9a) is formed through which the screw (7) passes through. In the case (1) in which the printed circuit board (1) is housed and supported in this way, a waterproof filler (13) such as waterproof resin, hot melt, wax, etc. is filled and hardened, as shown in Figure 4. The printed circuit board (1) Oishima It (mounted) is mounted in this waterproof i raw filling phase f131.b, at least the conductor part of the child component is embedded.
As shown in Fig. 5, the printed circuit board (1) waterproofed with the waterproof filler (13) is attached to the top mark (decorative box) (5) of the first A'ζAω and the boss for mounting the base. (6) is fixed with the mounting screw (7). In other words, the boss (9) of the case (8) is brought into contact with the mounting boss (6), and the boss ■
) The printed circuit board (1) is mounted by screwing a mounting screw (71) consisting of a tapping screw into the mounting boss (6) through the through hole (9a).

この様にし、てプリント基板(1)ト取付ければ、洸伺
機のトップマーク(化粧箱)(5)内に水が侵入したり
、風呂場等の高湿度雰囲気中での使用により結露する様
なことがあっても、電子コントローラが誤動作したり、
故障したりするのを完全に防止でき、かつ少ない設備役
付でtL所性を確保することができる。
If the printed circuit board (1) is attached in this way, water will not get into the top mark (vanity box) (5) of the machine or condensation will occur if it is used in a high humidity atmosphere such as a bathroom. Even if the electronic controller malfunctions or
Breakdowns can be completely prevented, and tL stability can be ensured with less equipment use.

発明の効果 本発明のプリント基板の防水装置によれば、以上の説明
から明らかな様に、プリント基板及びそれに実装された
電子部品の少くとも導体部にケースと防水性充填材とに
より完全に防水でき、しかもピンホール防止のための複
雑な塗布方法、硬化条件の1511約や、チクントロビ
ック性、ポットライフ、低粘度といった樹脂の制約が除
かれ、高品質でしかも自動化による量産性が図れる。又
、防水性充填材を目動計量注入することにより、液面制
御も容易となり、OT動部を有するブツシュスイッチや
LED(発光素子)をマスキングする必伎もなく、全体
として大巾なコスト低減を図ることができる。
Effects of the Invention According to the printed circuit board waterproofing device of the present invention, as is clear from the above description, at least the conductor portions of the printed circuit board and electronic components mounted thereon are completely waterproofed by the case and the waterproof filler. In addition, it eliminates resin constraints such as complicated coating methods to prevent pinholes, curing conditions, chikuntorobic properties, pot life, and low viscosity, and allows for high quality and mass production through automation. In addition, by manually metering and injecting the waterproof filler, liquid level control becomes easy, and there is no need to mask bush switches or LEDs (light emitting elements) that have OT moving parts, which significantly reduces costs overall. It is possible to reduce the

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は従来例を示し、汀f1図はプリント
基板に防水コーティングを施し′に然態の断1図、第2
図は取付状態の断面図、熾3図乃至第5図は本発明の一
実71IQ V/jlを示し、第3図はケース内にプリ
ント基板を配置I−7′i!−状嘘を一部欠醪して示し
、た斜視図、第4図は縦断正面図、m51シ1け取付状
態の断面ド1である。 (1)はプリント基板、μ)は取付穴、(81けケース
、(9)はボス、(9a)ld貫通穴、(In+は防水
性光填材。 特許出細人代理人 弁理士 山 木   孝 )iラ ノ Lと1 市2図 第3図 「 ・   第 4tlJ
Figures 1 and 2 show conventional examples;
The figure is a sectional view of the installed state, Figures 3 to 5 show the 71IQ V/jl, which is a part of the present invention, and Figure 3 shows the printed circuit board placed inside the case. - Figure 4 is a perspective view with a part of the side cut out, a longitudinal sectional front view, and a cross-sectional view of the M51 seat 1 installed. (1) is printed circuit board, μ) is mounting hole, (81 case, (9) is boss, (9a) LD through hole, (In+ is waterproof optical filler material. Patent attorney Yamaki) Takashi) I La No L and 1 City 2 Figure 3 ・ 4th tlJ

Claims (1)

【特許請求の範囲】[Claims] 一仙が開口したケースの内部に1%子部品を実装された
プリント基板を配置し、このケースに一前記プリント基
板に設けられた取付穴を先端部が貝通し、基部がこのプ
リント基板に係会するボス部を設けると共にこのボス部
に取けねじが4遇する貫通穴を設け、前記ケース内に前
記プリント基板と実装された′電子部品の少くとも導体
部を埋入させる防水性充填材を充填したプリント基板の
防水装M0
A printed circuit board with a 1% sub-component mounted thereon is placed inside a case with an open opening, and the tip part passes through the mounting hole provided on the printed circuit board, and the base part engages with this printed circuit board. a waterproof filler for embedding at least a conductor portion of the electronic component mounted on the printed circuit board in the case, by providing a boss portion that meets the user, and providing through holes in the boss portion for receiving four mounting screws; Waterproof coating M0 for printed circuit board filled with
JP22277782A 1982-12-17 1982-12-17 Waterproof device for printed board Granted JPS59112700A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22277782A JPS59112700A (en) 1982-12-17 1982-12-17 Waterproof device for printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22277782A JPS59112700A (en) 1982-12-17 1982-12-17 Waterproof device for printed board

Publications (2)

Publication Number Publication Date
JPS59112700A true JPS59112700A (en) 1984-06-29
JPH043677B2 JPH043677B2 (en) 1992-01-23

Family

ID=16787724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22277782A Granted JPS59112700A (en) 1982-12-17 1982-12-17 Waterproof device for printed board

Country Status (1)

Country Link
JP (1) JPS59112700A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0477883U (en) * 1990-11-19 1992-07-07
DE19818452B4 (en) * 1997-04-28 2004-03-25 Yazaki Corp. Electronic circuit with a circuit board embedded in cast resin and process for its production
US7221339B2 (en) 1997-02-17 2007-05-22 Seiko Epson Corporation Display apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54151816A (en) * 1978-05-20 1979-11-29 Toshiba Corp Plastic chassis structure
JPS572954U (en) * 1980-06-04 1982-01-08
JPS5713812U (en) * 1980-06-27 1982-01-23

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54151816A (en) * 1978-05-20 1979-11-29 Toshiba Corp Plastic chassis structure
JPS572954U (en) * 1980-06-04 1982-01-08
JPS5713812U (en) * 1980-06-27 1982-01-23

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0477883U (en) * 1990-11-19 1992-07-07
US7221339B2 (en) 1997-02-17 2007-05-22 Seiko Epson Corporation Display apparatus
DE19818452B4 (en) * 1997-04-28 2004-03-25 Yazaki Corp. Electronic circuit with a circuit board embedded in cast resin and process for its production

Also Published As

Publication number Publication date
JPH043677B2 (en) 1992-01-23

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