JPS5852755Y2 - Shelf structure of electronic circuit unit - Google Patents

Shelf structure of electronic circuit unit

Info

Publication number
JPS5852755Y2
JPS5852755Y2 JP12545879U JP12545879U JPS5852755Y2 JP S5852755 Y2 JPS5852755 Y2 JP S5852755Y2 JP 12545879 U JP12545879 U JP 12545879U JP 12545879 U JP12545879 U JP 12545879U JP S5852755 Y2 JPS5852755 Y2 JP S5852755Y2
Authority
JP
Japan
Prior art keywords
unit
electronic circuit
circuit unit
shelf structure
shelf
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12545879U
Other languages
Japanese (ja)
Other versions
JPS5643976U (en
Inventor
公一 伊藤
正治 伊藤
昭夫 原田
博 寺崎
祐治 桧垣
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP12545879U priority Critical patent/JPS5852755Y2/en
Publication of JPS5643976U publication Critical patent/JPS5643976U/ja
Application granted granted Critical
Publication of JPS5852755Y2 publication Critical patent/JPS5852755Y2/en
Expired legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Telephone Exchanges (AREA)

Description

【考案の詳細な説明】 本考案は電話交換機等電子装置に於いて多数の電子回路
ユニット(以下単にユニットと呼ぶ)の装置架への実装
に関し熱放散機能あるいは冷却能力を強化した電子回路
ユニットのシェルフ構造の改良に関す。
[Detailed description of the invention] This invention is an electronic circuit unit with enhanced heat dissipation function or cooling capacity for mounting a large number of electronic circuit units (hereinafter simply referred to as units) on an equipment rack in electronic equipment such as telephone exchanges. Regarding improvements to the shelf structure.

第1図は従来のかかる装置架構成を示す簡略正面図であ
る。
FIG. 1 is a simplified front view showing such a conventional equipment rack configuration.

図によってその要部構成を説明する。The main configuration will be explained with reference to figures.

図に於いて1は果枝、2は左右両端が梁柱支持になる棚
、3は架棚2に並列して実装されるユニットでこれには
複数枚の電子回路パッケージ(以下単にパッケージと呼
ぶ)(第2図の8参照)が収納され、該ユニットは架実
装単位体をなしている。
In the figure, 1 is a fruit branch, 2 is a shelf whose left and right ends are supported by beams, and 3 is a unit mounted in parallel with the shelf 2, which includes multiple electronic circuit packages (hereinafter simply referred to as packages). (see 8 in FIG. 2) is housed therein, and the unit constitutes a rack mounting unit.

その前面側にはユニット動作に必要とする電源ケーブル
4がコネクタを介し接続される。
A power cable 4 necessary for unit operation is connected to the front side of the unit via a connector.

かかる架装置に於いてはユニット動作の安定化並に部品
・集積回路等の長寿命化をはかるため年間を通して動作
温度を例えばio〜50℃の範囲内に設定している。
In such rack systems, the operating temperature is set, for example, within a range of io to 50 DEG C. throughout the year in order to stabilize unit operation and extend the life of components, integrated circuits, etc.

このためパネル架の上部又は適切な場所(図示5)にて
架内の損失熱が効率よく外部空間に排出されるための対
流空間、必要なとき該部所にファンを併設するなうして
架内各種機能ユニットの冷却手段としていた。
For this purpose, a convection space is provided at the top of the panel rack or at an appropriate location (see figure 5) to efficiently exhaust the heat lost inside the rack to the outside space, and when necessary, a fan is installed at that location. It was used as a cooling means for various functional units within the system.

しかしこの様な画一的な方法では各ユニット体に対する
冷却能力が満足にとれず特に動作温度が高いユニットに
は架実装条件(設置位置等)との制約もあシ実装設計が
困難となって来ている。
However, such a uniform method does not provide sufficient cooling capacity for each unit, and especially for units with high operating temperatures, there are constraints on mounting conditions (installation position, etc.), making mounting design difficult. It is coming.

本考案の目的ばか様な欠点を除去するためなされたもの
で、以下提示の如き単位ユニット毎に相応の冷却能力を
付与せんとするものである。
The purpose of the present invention was to eliminate such disadvantages and to provide a corresponding cooling capacity to each unit as shown below.

その特徴とするところは架線実装になる電子回路ユニッ
ト単位で冷却用対流透導板もしくは該透導板と併せファ
ンモータを設けた電子ユニットのシェルフ構造である。
Its characteristic feature is a shelf structure of the electronic unit in which each electronic circuit unit mounted on an overhead wire is provided with a convection transparent plate for cooling or a fan motor in conjunction with the transparent plate.

以下、本考案になる要部構造を図面によって説明する。Hereinafter, the main structure of the present invention will be explained with reference to the drawings.

第2図は該ユニット斜視図であジ、又第3図は第2図構
成体の機能説明図である。
FIG. 2 is a perspective view of the unit, and FIG. 3 is a functional explanatory diagram of the structure shown in FIG.

各図共同−機能部処には同一番号を付しである。Common functional parts in each figure are given the same number.

又付与した矢印は循流の空気流路を示している。Further, the arrows shown indicate the air circulation paths.

図のイと口とは異なる収納パッケージ(図示8)数の要
部構成例である。
This is an example of a main part configuration of a different number of storage packages (8 shown in the figure) from A and A in the figure.

又対流透導板9の取付姿態も前又は後面と自由に変えら
れることを示す。
It is also shown that the mounting position of the convection-transmitting plate 9 can be freely changed to front or rear.

ユニット3の筐体板をなす底面6は広く窓あけした多数
の通風路Tを設け、又ユニット3の筐体上部は適宜傾度
になる対流透導板9並に流出開口面10を図示の如く筐
体と一体化して結合させる。
The bottom surface 6 forming the casing plate of the unit 3 is provided with a large number of ventilation passages T with wide openings, and the upper part of the casing of the unit 3 has a convection transparent plate 9 with an appropriate slope and an outflow opening surface 10 as shown in the figure. Integrate and combine with the casing.

かかる構成になるユニット3はパッケージ8を完全実装
した組立完了の状態では前後左右の面は密閉されること
から温度上昇に伴ない空気流は下方から上方へと流れ、
かつ第3図図示にある様に空気は対流透導板9の向きに
よって架の裏側から吸入させ架の前面側に流出させる構
成となっている。
When the unit 3 having such a configuration is fully assembled and the package 8 is fully mounted, the front, rear, left, and right sides are sealed, so as the temperature rises, the airflow flows from the bottom to the top.
As shown in FIG. 3, air is drawn in from the back side of the rack and discharged to the front side of the rack depending on the orientation of the convection plate 9.

又ユニット3の収納パッケージ動作温度が高くなる機能
であれば、第3図点線で示すファンモータ11を流出開
口面10の内部に設けるもよい。
Further, if the function is to increase the operating temperature of the housing package of the unit 3, a fan motor 11 shown by a dotted line in FIG. 3 may be provided inside the outflow opening surface 10.

尚ユニット巾12は収納パッケージ数で異なるも適宜標
準枚数を選定すれば対流誘導板等が規格化され製造上好
都合である。
Although the unit width 12 varies depending on the number of packages stored, if the standard number is selected appropriately, the convection guide plates etc. can be standardized, which is convenient for manufacturing.

説明に引用した実施例において多数の通風路Tの形状等
は一例である。
In the embodiments cited in the description, the shapes of the numerous ventilation passages T, etc. are merely examples.

以上詳述した本考案のシェルフ構造によれば電子回路ユ
ニットの実装機能を低下させることなくユニットに相応
した冷却能力が付与されると共に装置架実装設計の自由
度が増大し、今後の電子装置の要請に追従しうるユニー
クな構造であってその実用的効果大なるものがある。
According to the shelf structure of the present invention described in detail above, cooling capacity commensurate with the electronic circuit unit is provided without deteriorating the mounting function of the unit, and the degree of freedom in equipment rack mounting design is increased. It has a unique structure that can meet requests and has great practical effects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の架装置にかけるパネル簡略正面図、第2
図は本考案の要部構成を示す斜視図及び第3図は第2図
構成体の機能説明図である。 図中、3・・・・・・電子回路ユニット(ユニット)、
6・・・・・・ユニットの底板、T・・・・・・通風窓
、8・・・・・・ユニット収納になるパッケージ、9・
・・・・・対流誘導板、11・・・・・・ファンモータ
Figure 1 is a simplified front view of a panel mounted on a conventional racking device;
The figure is a perspective view showing the main structure of the present invention, and FIG. 3 is a functional explanatory diagram of the structure shown in FIG. In the figure, 3...Electronic circuit unit (unit),
6... Bottom plate of the unit, T... Ventilation window, 8... Package that stores the unit, 9.
...Convection induction plate, 11...Fan motor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の電子回路ユニットが架棚に並列して実装される電
子装置に於いて、架線実装になる前記ユニット単位で冷
却用対流透導板もしくは該透導板と併せファンモータを
設けてなることを特徴とする電子回路ユニットのシェル
フ構造。
In an electronic device in which a plurality of electronic circuit units are mounted in parallel on a shelf, each unit mounted on an overhead wire is provided with a cooling convection transparent plate or a fan motor in conjunction with the transparent plate. Features a shelf structure of the electronic circuit unit.
JP12545879U 1979-09-11 1979-09-11 Shelf structure of electronic circuit unit Expired JPS5852755Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12545879U JPS5852755Y2 (en) 1979-09-11 1979-09-11 Shelf structure of electronic circuit unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12545879U JPS5852755Y2 (en) 1979-09-11 1979-09-11 Shelf structure of electronic circuit unit

Publications (2)

Publication Number Publication Date
JPS5643976U JPS5643976U (en) 1981-04-21
JPS5852755Y2 true JPS5852755Y2 (en) 1983-12-01

Family

ID=29357347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12545879U Expired JPS5852755Y2 (en) 1979-09-11 1979-09-11 Shelf structure of electronic circuit unit

Country Status (1)

Country Link
JP (1) JPS5852755Y2 (en)

Also Published As

Publication number Publication date
JPS5643976U (en) 1981-04-21

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