JPS5840834A - Tie bar metal mold for resin sealing of semiconductor device - Google Patents

Tie bar metal mold for resin sealing of semiconductor device

Info

Publication number
JPS5840834A
JPS5840834A JP13988781A JP13988781A JPS5840834A JP S5840834 A JPS5840834 A JP S5840834A JP 13988781 A JP13988781 A JP 13988781A JP 13988781 A JP13988781 A JP 13988781A JP S5840834 A JPS5840834 A JP S5840834A
Authority
JP
Japan
Prior art keywords
resin
punch
tie bar
burrs
burr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13988781A
Other languages
Japanese (ja)
Inventor
Seiji Takemura
竹村　誠次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13988781A priority Critical patent/JPS5840834A/en
Publication of JPS5840834A publication Critical patent/JPS5840834A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/02—Deburring or deflashing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the abrasion of a punch and securely deburr, by constituting a metal mold used for a lead forming process of a resin cut punch and of burr receiving blocks which clamp burrs generated on a resin part therebetween and fall in interlocking with the punch fall. CONSTITUTION:A lead frame 1 which is finished forming is supplied onto a resin cut die 7, a resin cut punch 6 is lowered, and thus burrs 5 generated on both sides of the resin part 2 are clamped by the punch and burr receiving blocks 8 provided in the die 7. Next, burrs 5 are punched in clamping by further lowering the punch 6, and simultaneously the burr receiving blocks 8 are lowered in interlocking therewith. Thereafter, only the punch 6 is raised, and the frame 1 completed in resin cut is took out. Next, blocks 8 are raised, and burrs 5 which are separated off are removed preparing for a next deburring.

Description

【発明の詳細な説明】 この発明は、樹脂封止半導体装置の製造方法におけるリ
ードフォーミング工程に使用するタイバー金型に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a tie bar mold used in a lead forming step in a method of manufacturing a resin-sealed semiconductor device.

従来、この種の装置においては、第１図に示す樹脂成形
の完了したリードフレーム１のタイバー３とアウターリ
ード４と樹脂部２に囲まれたバリ５を、第２図のごとく
除去しくレジンカットと呼ばれている）、さらＫ、第３
図のごとくタイバー３を除去（タイバーカットと呼ばれ
ている）し、最後に第４図のごとくアラ）−リード４を
曲げ（リードペンドと呼ばれている）て、最、層形状に
する構造を持っている。Conventionally, in this type of device, the burr 5 surrounded by the tie bar 3, outer lead 4, and resin part 2 of the lead frame 1 that has been resin molded as shown in FIG. 1 is removed by resin cutting as shown in FIG. ), Sara K, 3rd
Remove the tie bar 3 as shown in the figure (this is called a tie bar cut), and finally bend the lead 4 (this is called a lead bend) as shown in Figure 4 to create a layered structure. have.

この発明は、上記したレンジカット工程（バリ５を除去
する工程）Ｋ関するものである。The present invention relates to the above-mentioned range cutting process (process of removing burrs 5) K.

レジンカット工程におけるタイバー金型の構造は、第５
図に示すよう罠なっている。すなわち、樹脂成形の完了
したリードフレーム１は、レジンカットダイア上にセッ
トされ、上からレジンカットパンチ６が下降しバリ５を
抜くものである。このときの動きは、油圧、空圧等が用
いられ、また、他の工程と同一型内にこの機構が構成さ
れていることが多い。The structure of the tie bar mold in the resin cutting process is the fifth
As shown in the figure, it is a trap. That is, the lead frame 1 which has been resin molded is set on a resin cut diamond, and the resin cut punch 6 is lowered from above to remove the burr 5. Hydraulic pressure, pneumatic pressure, etc. are used for this movement, and this mechanism is often constructed in the same mold as other processes.

上記従来のタイバー金型の構造では、上からレジンカッ
トパンチ６で抜くだけのため、■レジンカットバンチ６
の摩耗が激しい。■抜くときの喰い込み量が同一型内の
他の工程に影響され多くとれない。■抜くだけでは、バ
リ５が割れたりしてうまく抜けず、樹脂部２に斜めに残
ったりすることがある。等の欠点がある。In the structure of the conventional tie bar mold mentioned above, only the resin cut punch 6 is used to punch out from above, so ■ the resin cut bunch 6
Severe wear. ■The amount of penetration when punching out is affected by other processes within the same mold and cannot be removed much. (2) If the burr 5 is simply removed, the burr 5 may crack or may not be removed properly, and may remain diagonally on the resin part 2. There are drawbacks such as.

この発明は、上記のような従来のものの欠点を除去する
ためＫなされたもので、バリ抜き時（レジンカット時）
にバリをクランプして抜くことによってレジンカットバ
ンチの摩耗を防ぎ、かつ、バリな確実に抜けるレジンカ
ット機構を提供することを目的としている。以下、この
発明について説明する。This invention was made in order to eliminate the drawbacks of the conventional products as described above, and it
The purpose of the present invention is to provide a resin cutting mechanism that prevents wear of a resin cut bunch by clamping and removing burrs, and also allows burrs to be removed reliably. This invention will be explained below.

第６図（ａ）〜（ｇ）はこの発明の一実施例を示すもの
で、第５図の従来例にこの発明による機構を設けた場合
の断面Ａ−Ａを各段階の動きととに示したものである。FIGS. 6(a) to (g) show an embodiment of the present invention, and the cross section A-A when the mechanism according to the present invention is provided in the conventional example shown in FIG. 5 is shown for each stage of movement. This is what is shown.

これらの図で、８はパリ受はブロックで、レジンカット
パンチ６と連動し、バリ５なレジンカットパンチ６との
間にはさんだまま下降するように構成されている。In these figures, reference numeral 8 denotes a block, which is configured to move in conjunction with the resin cut punch 6 and descend while being sandwiched between the resin cut punch 6 and the burr 5.

第６図（ａ）に示すように、レジンカットダイア上に成
形の完了したリード７レム１が供給される。As shown in FIG. 6(a), the molded lead 7 rem 1 is supplied onto the resin cut diamond.

次に、第６図（ｂ）　Ｋ示すように、レジンカットパン
チ６が下降し、バリ５をパリ受はブロック８とでクラン
プする。Next, as shown in FIG. 6(b), the resin cut punch 6 descends and the burr 5 is clamped with the burr block 8.

その後、第６図（ｃ）に示すようＫ、さらに、レジンカ
ットパンチ８が下降し、クランプしながらバリ５−Ｉｔ
抜く。このＥき、レジンカットパンチ６の下降圧連動し
てパリ受はブロック８も下降する。Then, as shown in FIG. 6(c), the resin cut punch 8 is further lowered and the burr 5-It is clamped.
Pull it out. At this time, in conjunction with the descending pressure of the resin cut punch 6, the block 8 of the pallet receiver also descends.

次に１第６図（ｄ）　Ｋ示すように、レジンカットパン
チ６のみ上昇する。Next, as shown in FIG. 6(d) K, only the resin cut punch 6 is raised.

次いで、第６図（ｅ）Ｋ示すようＫ、レジンカットの完
了したリードフレーム１を除去する。Next, as shown in FIG. 6(e), the resin-cut lead frame 1 is removed.

次に、第６図（ｆ）に示すように、パリ受はブロック８
が上昇する。Next, as shown in FIG. 6(f), the Paris receiver is placed in block 8.
rises.

最後に１第６図輸）ＩＣ示すように、リードフレーム１
から切り離されたバリ５を除去する。Finally, as shown in Figure 6) IC, lead frame 1
The burr 5 separated from the burr 5 is removed.

以上詳細に説明したように、この発明は、レジンカット
パンチと連動するパリ受はブロックな設け、このパリ少
はブロックとレジンカットノくンチとの間にバリをクラ
ンプしながら抜くようＫしたので、レジンカットパンチ
の摩耗が減り、さらに１単に抜く場合に発生する抜きミ
ス等がなくなり、確実な作業を実現できる利点がある。As explained in detail above, in this invention, the burr support that interlocks with the resin cut punch is provided as a block, and the burr is removed while clamping the burr between the block and the resin cut punch. This has the advantage that wear of the resin cut punch is reduced, and punching errors that occur when punching only one punch are eliminated, making it possible to perform reliable work.

【図面の簡単な説明】[Brief explanation of drawings]

第１図〜第４図は従来の機構によるリードフォーミング
工程の加工順序を示す斜視図、第５＠は従来のレジンカ
ット方法を示す斜視図、第６図（ａ）〜（ｇ）はこの発
明の構成とレジンカット方法の加工順序を示す断面図で
ある。 図中、１は樹脂成形の完了したリードフレーム、２は樹
脂部、３はタイバー、４はアウターリード、５はバリ、
６はレジンカットパンチ、７はレジンカットダイ、８は
パリ受はグーツクである。なお、図中の同一符号は同一
または相当部分を示す。 代理人　葛　野　信　−（外１名） 第５図 特開昭５８−４０８３４（４） 第６図 （ａ） （ｅ） （９） ／６’／　　　？：３　／ ６図 （ｆ） ｊＦ５’／”６’／Figures 1 to 4 are perspective views showing the processing order of the lead forming process using a conventional mechanism, Figure 5 is a perspective view showing the conventional resin cutting method, and Figures 6 (a) to (g) are perspective views showing the processing order of the lead forming process using a conventional mechanism. FIG. 3 is a cross-sectional view showing the structure of the resin cutting method and the processing order of the resin cutting method. In the figure, 1 is a lead frame with resin molding completed, 2 is a resin part, 3 is a tie bar, 4 is an outer lead, 5 is a burr,
6 is a resin cut punch, 7 is a resin cut die, and 8 is a gasket. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Shin Kuzuno - (1 other person) Figure 5 Japanese Patent Application Laid-open No. 58-40834 (4) Figure 6 (a) (e) (9) /6'/? :3/6 figure (f) jF5'/"6'/

Claims (1)

【特許請求の範囲】[Claims] リードフレーム間にタイバーを介して形成された複数個
の７ウターリードを樹脂部で囲み、前記樹脂部に形成さ
れたバリをレジンカットした後前記タイバーを除去し、
その後、前記アウターリードを折り曲げる樹脂封止半導
体装置の製造方法において、前記レジンカットの工程に
用いるタイバー金型を、レジンカットパンチと、このレ
ジンカットパンチとの間に前記バリをクランプし前記レ
ジンカットパンチの下降と連動して下降するパリ受はグ
ρツ、りとで構成したことを特徴とする樹脂封止半導体
装置用タイバー金型。A plurality of seven outer leads formed between lead frames via tie bars are surrounded by a resin part, burrs formed on the resin part are cut with resin, and then the tie bars are removed;
Thereafter, in the method for manufacturing a resin-sealed semiconductor device in which the outer lead is bent, the tie bar mold used in the resin cutting step is clamped between the resin cut punch and the resin cut punch, and the burr is clamped between the tie bar mold and the resin cut punch. A tie bar mold for a resin-sealed semiconductor device, characterized in that a pawl holder that descends in conjunction with the descent of a punch is composed of a pair of grooves and a groove.
JP13988781A 1981-09-03 1981-09-03 Tie bar metal mold for resin sealing of semiconductor device Pending JPS5840834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13988781A JPS5840834A (en) 1981-09-03 1981-09-03 Tie bar metal mold for resin sealing of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13988781A JPS5840834A (en) 1981-09-03 1981-09-03 Tie bar metal mold for resin sealing of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5840834A true JPS5840834A (en) 1983-03-09

Family

ID=15255899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13988781A Pending JPS5840834A (en) 1981-09-03 1981-09-03 Tie bar metal mold for resin sealing of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5840834A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2580982A1 (en) * 1984-03-06 1986-10-31 Asm Fico Tooling SYSTEM AND METHOD FOR AUTOMATIC MOLDING WITH CONTINUOUS CYCLES

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2580982A1 (en) * 1984-03-06 1986-10-31 Asm Fico Tooling SYSTEM AND METHOD FOR AUTOMATIC MOLDING WITH CONTINUOUS CYCLES

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