JPS58218145A - Positioning method of sintered body - Google Patents
Positioning method of sintered bodyInfo
- Publication number
- JPS58218145A JPS58218145A JP10094882A JP10094882A JPS58218145A JP S58218145 A JPS58218145 A JP S58218145A JP 10094882 A JP10094882 A JP 10094882A JP 10094882 A JP10094882 A JP 10094882A JP S58218145 A JPS58218145 A JP S58218145A
- Authority
- JP
- Japan
- Prior art keywords
- sintered body
- guide hole
- center
- positioning
- fitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract description 14
- 239000000919 ceramic Substances 0.000 abstract description 9
- 238000005245 sintering Methods 0.000 abstract description 8
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Furnace Charging Or Discharging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
（ａ） 発明の技術分野
本発明は焼結体の位置決め方体←≠恰雫労噌つに関する
ものであり、特に半導体集積回路装置である小型のリー
ドのないチップキャリア（Ｌｅａ、ｄ−１ｅ８Ｓ ｃｈ
：ｔｐ Ｃａｒｒｉｅｒ略してＬＣＣ）などの焼結体部
品の位置決め方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a positioning box for sintered bodies, and in particular to a small leadless chip carrier that is a semiconductor integrated circuit device. (Lea, d-1e8S ch
The present invention relates to a method for positioning sintered parts such as tp carrier (LCC).
（ト）技術の背景
最近電子装置の小型化、あるいは取扱い上の便利さから
小型のＬ・ＣＣｆ？盃要が増加の傾向にあり、かつ最近
セラミックパッケージの製作工数を削減するだめに複数
のセラミックパッケージを同様にられている。(g) Technical Background Recently, electronic devices have become smaller, or due to convenience in handling, small L/CCf? The demand for cups is increasing, and recently, in order to reduce the number of steps required to manufacture ceramic packages, multiple ceramic packages are being made in the same way.
（０） 従来技術と問題点
一般に半導体装置などに使用されるセラミックパッケー
ジはアルミナ（Ａ／ｇＯａ）と焼結助剤の二酸化硅素（
Ｓｉｎ２） 、酸化マグネシウム（ＭｇＯ）等の粉末を
有機溶剤に溶かし、軟い板状に成形したグリーンシート
に所要の眠気的に接続する回路網をメタライジングし複
数枚重ね合せ焼結して作られる。(0) Prior art and problems Generally, ceramic packages used for semiconductor devices, etc. are made of alumina (A/gOa) and sintering aid silicon dioxide (
Sin2) is made by dissolving powder such as magnesium oxide (MgO) in an organic solvent, forming a green sheet into a soft plate shape, metallizing a circuit network to connect it in a desired manner, and stacking and sintering multiple sheets. .
従来例として焼結体の位置決め方法に使用される４個連
続したリードレス・チップ・キャリアを。A conventional example is four consecutive leadless chip carriers used in the positioning method of sintered bodies.
第１図に示す。図において（ａ）は平面図、（至）は一
部側断面図、（Ｃ）は一部断面を示す正面図で１はり−
ドレス・チップ・キャリア、１１はグリーンシートを焼
台して成る層、１２はガイド穴、１８は破断用溝、１４
は半導体素子接着部、１５はワイヤボンデング部、１６
はキャップ封止部を示す。Shown in Figure 1. In the figure, (a) is a plan view, (to) is a partially sectional side view, and (C) is a front view partially sectional.
Dress chip carrier, 11 is a layer formed by baking a green sheet, 12 is a guide hole, 18 is a breaking groove, 14
15 is a semiconductor element adhesion part, 15 is a wire bonding part, 16 is
indicates the cap sealing part.
所要のガイド穴１２を用いてグリーンシーＨ１を三層に
重ね合せて、約１５００１；の温度で焼結しリードレス
チップキャリアＬが製作される。A leadless chip carrier L is manufactured by stacking three layers of Green Sea H1 using the required guide holes 12 and sintering them at a temperature of about 15,000 liters.
しかしこのようなセラミックパッケージに、焼を取りつ
ける場合、一般に穴を有する連続帯状体の位置を決める
方式として二つの穴を選んで位置決め基準とすることが
□掟来より行われている。However, when attaching a ceramic package to such a ceramic package, it has traditionally been customary to select two holes and use them as positioning standards to determine the position of a continuous strip having holes.
従来の焼結体位置法案機構の断面図を第２図に示す。図
において前図と同等の部分については同一符号を付して
いる。２１は下型位置合せ治具、２２は上型位置合せ治
具用嵌合ビン、２３はリードレスチップキャリア位置決
め用嵌合ビン、２４１１□
は上型位置合せ治具、２４１はスタッド位置決め用穴、
２５はスタッド、２６はロウ併用銀銅合金を示す。A cross-sectional view of a conventional sintered body position adjustment mechanism is shown in FIG. In the figure, parts that are equivalent to those in the previous figure are given the same reference numerals. 21 is a lower mold positioning jig, 22 is a fitting bin for the upper mold positioning jig, 23 is a fitting bin for leadless chip carrier positioning, 2411□ is an upper mold positioning jig, 241 is a stud positioning hole ,
25 is a stud, and 26 is a silver-copper alloy combined with brazing.
下型位置合せ治具２１に設けられたリードレス１チップ
キャリア位置決め用嵌合ビン２３にリードレスチップギ
ヤリアとの積層用ガイド穴１２を利用してはめ込む。こ
の場合半導体素子部を下側に向けてはめ込むのは当然で
あるが最適のガイド穴“ １
２個を利用してリードレスチップキャリアｌの位置決め
基準とする。次いで上型位置合せ治具２４を下型の上型
位置合せ治具用嵌合ピン２２にはめ込み、前記位置合せ
治具２４に設けられたスタッド位置決め用穴２４１に放
熱用のスタッド２５を挿入してロウ付は用銀銅合金２６
を用いてリードレスチップキャリアとの裏面の所定の位
置にロウ付けされる。The leadless chip carrier is fitted into the fitting pin 23 for positioning the leadless chip carrier provided on the lower die positioning jig 21 using the guide hole 12 for stacking with the leadless chip gear. In this case, it is natural to fit the semiconductor element part facing downward, but the optimum guide holes "12" are used as a reference for positioning the leadless chip carrier l.Next, the upper mold positioning jig 24 is inserted. The silver-copper alloy 26 for brazing is fitted into the fitting pin 22 for the upper mold positioning jig of the lower mold, and the heat dissipation stud 25 is inserted into the stud positioning hole 241 provided in the positioning jig 24.
It is brazed to a predetermined position on the back side of the leadless chip carrier using a leadless chip carrier.
しかしながら上述したリードレスチップキャリアｌは製
造工程にセいて約１５００℃の焼結温度で加熱されるた
め約′２０％±１％の収縮が起シ変形し、寸法精度が必
ず八良くない。したがって１％以上の精度しか要求され
ない場合はよいが、リード １゜ル
スナップキャリアＬのように増々小型化され１％以下の
寸法精度が要求される場合、従来の焼結体の位置決め方
法で正確な位置決めは困難であシ製作上大きな障害とな
っていた。。However, since the leadless chip carrier 1 described above is heated at a sintering temperature of about 1500 DEG C. during the manufacturing process, it shrinks and deforms by about 20%±1%, and its dimensional accuracy is always poor. Therefore, it is fine in cases where an accuracy of 1% or more is required, but in cases where a dimensional accuracy of 1% or less is required due to the miniaturization of the lead 1° snap carrier L, conventional sintered body positioning methods can be used to accurately position the sintered body. Positioning was difficult and a major obstacle in production. .
（■ 発明の目的
本発明の目的は焼結体の位置決め方法において、焼結体
のガイド穴の位置と形状を収縮現象に対して最も影響の
受けない位置を選定し、かつ影響を受けても精密に位置
決め可能な形状に加工し、それに対応した位置合せ治具
を用いて精密に位置決めすることが可能な焼結体の位置
決め方法の提供にある。(■ Purpose of the Invention The purpose of the present invention is to provide a method for positioning a sintered body, in which the position and shape of the guide hole in the sintered body are selected to be the least affected by shrinkage phenomena, and also to An object of the present invention is to provide a method for positioning a sintered body that can be processed into a shape that allows precise positioning and can be precisely positioned using a corresponding positioning jig.
（ｆ３） 発明の構成
本発明は焼結体の中心に円形のガイド穴及び周辺部に該
ガイド穴を通る直線上に複数個の長円ガイド穴を設け、
前記円形のガイド穴と所要の前記長円ガイド穴とを、嵌
合ピンを具備する位置合せ治具の該嵌合ビンにはめ合せ
ることにより焼結体の位置を規定することを特徴として
いる。(f3) Structure of the Invention The present invention provides a circular guide hole in the center of a sintered body and a plurality of oval guide holes in the periphery on a straight line passing through the guide hole,
The present invention is characterized in that the position of the sintered body is defined by fitting the circular guide hole and the required oblong guide hole into the fitting bin of a positioning jig provided with a fitting pin.
（０発明の実施−
以下本発明の一実施例を図面を参照して具体的に説明す
る。(0 Implementation of the Invention--An embodiment of the present invention will be specifically described below with reference to the drawings.
第３図は本発明による焼結体の位置決め方法に使用され
る４個連続したリードレスチップキャリアを示す。図に
おいて（ａ）は平面図、（ｂ）は一部断面を示す正面図
で、前図と同等の部分については同一符号を付している
。ｌはリードレスチップキャリア、３１は円形のガイド
穴、３２は長円ガイド穴を示す。FIG. 3 shows four consecutive leadless chip carriers used in the sintered body positioning method according to the invention. In the figures, (a) is a plan view, and (b) is a partially sectional front view, in which the same parts as in the previous figure are designated by the same reference numerals. 1 is a leadless chip carrier, 31 is a circular guide hole, and 32 is an oblong guide hole.
焼結工程において最も収縮現象の影響を受けない焼結体
即ちリードレスチップキャリアｌの中心に円形のガイド
穴８１を設け、周辺部に円形のガイド穴３１の中心を通
る直線上、即ち収縮方向にそってＸ軸上に２個、Ｙ軸上
に２個の長円形のガイド穴３２が設けられている。A circular guide hole 81 is provided at the center of the sintered body that is most susceptible to the shrinkage phenomenon in the sintering process, that is, the leadless chip carrier l, and a circular guide hole 81 is provided at the periphery on a straight line passing through the center of the circular guide hole 31, that is, in the direction of shrinkage. Two oval guide holes 32 are provided along the X axis and two oval guide holes 32 are provided on the Y axis.
次に本発明による焼結体の位置決め機構の断面図を第４
図に示すが前図と同等の部分については同一符号を伺し
ている。図において４１は下型位置合せ治具、４２は上
型位置合ν治具用嵌合ピン、４３はり一ドレスチップキ
ャリア位置決め用嵌合ビン、４４は上型位置合せ治具、
４４１はスタッド位置決め用穴を示す。Next, a sectional view of the sintered body positioning mechanism according to the present invention is shown in the fourth figure.
As shown in the figure, parts that are equivalent to those in the previous figure are given the same reference numerals. In the figure, 41 is a lower die positioning jig, 42 is a fitting pin for the upper die positioning jig, 43 is a fitting pin for beam dress chip carrier positioning, 44 is an upper die positioning jig,
441 indicates a stud positioning hole.
下型位置合せ治具４１に設けられたリードレスチップキ
ャリア位置決め用嵌合ビン４３にリードレスチップキャ
リアｌの中心に設けられた円形のガイド穴３１を回転自
在にはめ合せることにより、リードレスチップキャリア
ｌのセンター位置を規定する。By rotatably fitting the circular guide hole 31 provided at the center of the leadless chip carrier l into the fitting pin 43 for leadless chip carrier positioning provided on the lower die positioning jig 41, the leadless chip Define the center position of carrier l.
さらに周辺部に設けられた長円ガイド穴８２の４個の中
から前もって光学的に素子（図示していない）との相関
を調べて最適位置にある長円ガイド穴３２を選定して嵌
合ピン４３にはめ合せることにより角度を規定する。）
次いで、上型位置合せ治具４４を下型の上型位置合せ治
具用嵌合ピン４２にはめ込み、前記位置合せ治具４４に
設けられた”スタッド位置決め用穴４４１に放熱用のス
タッド２５を挿入して、ロウ併用銀銅合金２６を用いて
り゛ニドレスチップキャリ以上第３図及び第４図（で説
明した本発明の焼結体の位置決め方法においては、焼結
体の焼結工程における収縮現象の最も影響を受けない中
心部に回転自在の円形ガイド穴及び中心を通る直線上の
周辺部に長円形のガイド穴を設け、それに対応した位置
合せ治具を用いることによって極めて精密に位置決めす
ることが可能となる。Furthermore, from among the four oval guide holes 82 provided at the periphery, the correlation with the element (not shown) is optically examined in advance, and the oval guide hole 32 in the optimal position is selected and fitted. The angle is defined by fitting the pin 43. ) Next, the upper mold positioning jig 44 is fitted into the upper mold positioning jig fitting pin 42 of the lower mold, and the heat radiation stud 25 is inserted into the "stud positioning hole 441" provided in the positioning jig 44. In the method for positioning a sintered body of the present invention described in FIGS. 3 and 4, the sintering of the sintered body is A rotatable circular guide hole is provided in the center, where it is least affected by shrinkage phenomena during the process, and an oval guide hole is provided in the periphery on a straight line passing through the center, and a corresponding alignment jig is used to achieve extremely high precision. It becomes possible to position the
＠ 発明の効果、゛
以上Ｕセラミックパッケージにスタッドを取りつける実
施例で説明したがこのように焼結後に付属部品を取シつ
ける場合、本発明にかかる位置決め方法を用いると、所
要の位置合せ治具への嵌め込みも問題がなく、かつ精度
よく取りつけることができる。＠ Effects of the invention, ゛As explained above in the example of attaching a stud to a ceramic package, when attaching accessory parts after sintering, if the positioning method according to the present invention is used, the required alignment jig can be used. There is no problem with fitting it in, and it can be installed with high accuracy.
したがって本発明によれば、高精度のセラミックパッケ
ージを作業性よく形成することができるものである。
−
尚本発明の位置決め方法は部品取りつけのみなラス、個
々のセラミツ、クパッケージに分割する場、・ト
合にも利用でき・ｌｑ、様］朽精度よく作製７きるもの
′ｔ
である。Therefore, according to the present invention, a highly accurate ceramic package can be formed with good workability.
- The positioning method of the present invention can be used not only for attaching parts, but also for dividing into laths, individual ceramics, packages, and assembling.It can be manufactured with high precision.
第１図（ａ）は従来の焼結体の位置決め方法に使用され
るリードレスチップキャリアの平面図、（至）は一部側
断面図、鋏）は一部断面図を示す正面図、第２図は従来
の焼結体の位置決め機構の断面図、第３図（ａ）は本発
明による焼結体の位置決め方法に使用されるリードレヌ
チツプキャリ／の平面図、（ｔ））は一部断面図を示す
正面図、第４図は本発明しこよる焼結体の位置決め方法
機構の断面図である。
ア、１２はガイド穴、２１・４・ｌは下型位置合せ治具
、２２・４２は−Ｌ型位置合せ治具用嵌合ビン、２３
ｔ４は上型位置合せ治具、８１は円形のガイド穴、３２
は長円ガイド穴。
第１図
（Ｑ） ｃｂ）
第３図
（０）
（ｂ）
第４図
２らFIG. 1(a) is a plan view of a leadless chip carrier used in the conventional method for positioning a sintered body, (to) is a partially sectional side view, FIG. 1(a) is a front view partially sectional, and FIG. FIG. 2 is a sectional view of a conventional sintered body positioning mechanism, FIG. FIG. 4 is a front view showing a partial sectional view, and FIG. 4 is a sectional view of a method and mechanism for positioning a sintered body according to the present invention. A, 12 is a guide hole, 21.4.l is a lower mold positioning jig, 22.42 is a fitting pin for -L type positioning jig, 23
t4 is an upper mold positioning jig, 81 is a circular guide hole, 32
is an oblong guide hole. Figure 1 (Q) cb) Figure 3 (0) (b) Figure 4 2 etc.
Claims (1)
を規定するに際し、該焼結体の中心に円形のガイド及び
周辺部に該ガイド穴の中心を通る直線上に複数個の長円
ガイド穴を設け、前記円形のガイド穴と所要の前記長円
ガイド穴とを、前記嵌合８°′と悴め合せることによシ
焼結体の位置を規定することを特徴とする焼結体の位置
決め方法。When defining the position of a sintered body using a positioning jig equipped with a fitting pin, a circular guide is placed at the center of the sintered body and a plurality of holes are placed at the periphery on a straight line passing through the center of the guide hole. The sintered body is characterized in that the position of the sintered body is defined by providing an elliptical guide hole and aligning the circular guide hole and the required elliptical guide hole with the fitting 8°'. How to position the sintered body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10094882A JPS58218145A (en) | 1982-06-11 | 1982-06-11 | Positioning method of sintered body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10094882A JPS58218145A (en) | 1982-06-11 | 1982-06-11 | Positioning method of sintered body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58218145A true JPS58218145A (en) | 1983-12-19 |
| JPH0456459B2 JPH0456459B2 (en) | 1992-09-08 |
Family
ID=14287567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10094882A Granted JPS58218145A (en) | 1982-06-11 | 1982-06-11 | Positioning method of sintered body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58218145A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60207788A (en) * | 1984-03-29 | 1985-10-19 | 三菱電機株式会社 | Positioning device for industrial robot |
| US7266868B2 (en) | 2003-06-30 | 2007-09-11 | Brother Kogyo Kabushiki Kaisha | Method of manufacturing liquid delivery apparatus |
-
1982
- 1982-06-11 JP JP10094882A patent/JPS58218145A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60207788A (en) * | 1984-03-29 | 1985-10-19 | 三菱電機株式会社 | Positioning device for industrial robot |
| JPH0141477B2 (en) * | 1984-03-29 | 1989-09-05 | Mitsubishi Electric Corp | |
| US7266868B2 (en) | 2003-06-30 | 2007-09-11 | Brother Kogyo Kabushiki Kaisha | Method of manufacturing liquid delivery apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0456459B2 (en) | 1992-09-08 |
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